Laser processing device

Abstract

The utility model discloses a laser processing device which comprises a first laser, a second laser, a first light splitting assembly, a second light splitting assembly, a third light splitting assembly, a scanning head and a controller, the first light splitting assembly is arranged on an emergent light path of the first laser, and the second light splitting assembly is arranged on an emergent light path of the second laser. The second light splitting assembly is further located on a reflection light path of the first light splitting assembly, the third light splitting assembly is arranged on an emergent light path of the second light splitting assembly, the scanning head is arranged on a reflection light path of the third light splitting assembly, and the controller is connected with the first laser, the second laser and the scanning head. The advantages that different samples are processed through different laser pulse widths are combined, laser light source combinations with different pulse widths are selected, the limitation that the types of samples capable of being processed by traditional laser processing equipment are single is broken through, a certain laser light source can be independently selected for processing, two light sources can also be used for processing the same sample at the same time, and the application range is wide.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing device. Background Art

[0002] Laser processing technology is a processing technology that uses the characteristics of the interaction between laser beam and matter to cut, weld, surface treat, punch and micro-process materials. At present, laser processing has been widely used in the field of PCB board processing.

[0003] However, the laser processing equipment currently on the market usually uses a single pulse width laser light source, which can process a small number of samples and has great limitations. For example, when customers process flexible circuit boards covered with cover films, they can use picosecond lasers to cut the cover films, but picosecond lasers cannot cut copper foil; when processing copper foil, they can use nanosecond lasers to cut copper foil, but nanosecond lasers cannot cut cover films (poor cutting, severe carbonization, and low efficiency), which cannot achieve one machine for multiple scenarios. Customers need to use at least two machines to complete the corresponding material layer cutting. Utility Model Content

[0004] In order to overcome the problems existing in the above-mentioned prior art, the main purpose of the present application is to provide a laser processing device that can use laser processing products with different pulse widths and has a wide range of applications.

[0005] In order to achieve the above objectives, this application specifically adopts the following technical solutions:

[0006] The present application provides a laser processing device, the laser processing device comprising:

[0007] A first laser, used to emit a first laser beam;

[0008] A second laser, used to emit a second laser beam, wherein the pulse width of the second laser beam is greater than or less than the pulse width of the first laser beam;

[0009] A first light splitting component, which is disposed on an outgoing light path of the first laser and is used to split the first laser beam;

[0010] A second beam splitter component, which is disposed on an outgoing light path of the second laser and is also located on a reflected light path of the first beam splitter component, and is used to split the second laser beam and also to transmit the laser beam emitted by the first beam splitter component;

[0011] A third light splitting component, the third light splitting component is arranged on the output light path of the second light splitting component, and is used to split the laser light emitted by the second light splitting component;

[0012] A scanning head, which is arranged on the reflected light path of the third beam splitting component and is used for processing the workpiece based on the laser emitted by the third beam splitting component;

[0013] A controller, the controller is connected to the first laser, the second laser and the scanning head respectively, and is used to control the operation of the first laser, the second laser and the scanning head;

[0014] When the first laser beam is required for processing, the controller is used to control the first laser to emit the first laser beam, so that the scanning head can process the workpiece to be processed based on the first laser beam; when the second laser beam is required for processing, the controller is used to control the second laser to emit the second laser beam, so that the scanning head can process the workpiece to be processed based on the second laser beam; when the first laser beam and the second laser beam are required for processing at the same time, the controller is used to control the first laser to emit the first laser beam and the second laser to emit the second laser beam, so that the scanning head can process the workpiece to be processed based on the first laser beam and the second laser beam at the same time.

[0015] In some embodiments, the first beam splitter component includes a beam splitter and a first 1 / 2 wave plate, the beam splitter is arranged on the output light path of the first laser, the first 1 / 2 wave plate is arranged on the reflection light path of the beam splitter, and the second beam splitter component is located on the transmission light path of the first 1 / 2 wave plate.

[0016] In some embodiments, the second beam splitter component includes a second 1 / 2 wave plate and a first polarization beam splitter, the second 1 / 2 wave plate is arranged on the output light path of the second laser, the first polarization beam splitter is arranged on the transmission light path of the second 1 / 2 wave plate, and the first polarization beam splitter is also located on the transmission light path of the first 1 / 2 wave plate, and the third beam splitter component is arranged on the output light path of the first polarization beam splitter.

[0017] In some embodiments, the third beam splitter component includes a third 1 / 2 wave plate and a second polarization beam splitter, the third 1 / 2 wave plate is arranged on the output light path of the first polarization beam splitter, the second polarization beam splitter is arranged on the transmission light path of the third 1 / 2 wave plate, and the scanning head is arranged on the output light path of the second polarization beam splitter.

[0018] In some embodiments, the third beam splitter assembly further includes a first reflector, the first reflector is disposed on an outgoing light path of the first polarization beam splitter, and the third 1 / 2 wave plate is disposed on a reflected light path of the first reflector.

[0019] In some embodiments, the laser processing device further includes a third beam expander, wherein the third beam expander is disposed on the reflection light path of the first reflection mirror, and the third 1 / 2 wave plate is disposed on the output light path of the third beam expander.

[0020] In some embodiments, the scanning head includes a first scanning head and a second scanning head, the third spectroscopic component also includes a second reflector, the second reflector is arranged on the transmission light path of the second polarization spectrometer, the first scanning head is arranged on the reflection light path of the second polarization spectrometer, and the second scanning head is arranged on the reflection light path of the second reflector.

[0021] In some embodiments, the laser processing device also includes a first processing table and a second processing table, the first processing table is located below the first scanning head, and the second processing table is located below the second scanning head, and the controller is connected to the first processing table and the second processing table respectively, for controlling the movement of the first processing table and the second processing table.

[0022] In some embodiments, the laser processing device also includes a first beam expander and a second beam expander, wherein the first beam expander is arranged on the optical path between the first laser and the beam splitter, and the second beam expander is arranged on the optical path between the second laser mirror and the second 1 / 2 wave plate.

[0023] In some embodiments, the laser processing device further includes a first power detection module and a second power detection module, wherein the first power detection module is disposed on the transmission light path of the beam splitter, and the second power detection module is disposed on the transmission light path of the first polarization beam splitter.

[0024] In some embodiments, the first laser is configured as a picosecond laser, and the second laser is configured as a nanosecond laser; or

[0025] The first laser is a femtosecond laser, and the second laser is a nanosecond laser; or

[0026] The first laser is set to be a femtosecond laser, and the second laser is set to be a picosecond laser;

[0027] The first laser and the second laser are respectively used to process workpieces of different materials, wherein the workpiece includes a first material and a second material covering and attached to the first material, the first material includes copper foil, and the second material includes a covering film.

[0028] Compared with the prior art, the laser processing device of the present application includes a first laser, a second laser, a first beam splitter component, a second beam splitter component, a third beam splitter component, a scanning head and a controller, wherein the first beam splitter component is arranged on the outgoing light path of the first laser, the second beam splitter component is arranged on the outgoing light path of the second laser, and the second beam splitter component is also arranged on the reflected light path of the first beam splitter component, the third beam splitter component is arranged on the outgoing light path of the second beam splitter component, the scanning head is arranged on the reflected light path of the third beam splitter component, and the controller is connected to the first laser, the second laser and the scanning head respectively. The present application combines the advantages of processing different samples with different laser pulse widths, and selects a combination of laser light sources with different pulse widths, breaking the limitation that the types of samples that can be processed by traditional laser processing equipment are relatively single, and a certain laser light source can be selected for processing alone, or two light sources can be used at the same time to process the same sample, and the application range is wide. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 A schematic diagram of the structure of a laser processing device provided in an embodiment of the present application.

[0031] Figure 2 A schematic structural diagram of a laser processing device provided in another embodiment of the present application.

[0032] Figure ID:

[0033] 1. The first laser; 2. The second laser; 3. The first beam splitter component; 31. The beam splitter; 32. The first 1 / 2 wave plate; 4. The second beam splitter component; 41. The second 1 / 2 wave plate; 42. The first polarization beam splitter; 5. The third beam splitter component; 51. The third 1 / 2 wave plate; 52. The second polarization beam splitter; 53. The first reflector; 54. The second reflector; 6. The first scanning head; 7. The second scanning head; 8. The controller; 9. The first beam expander; 10. The second beam expander; 11. The first power detection module; 12. The second power detection module; 13. The first processing table; 14. The second processing table; 15. The third beam expander. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0035] In the description of this application, unless otherwise clearly specified and limited, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more, and the term "multiple" refers to two or more; the terms "connected", "fixed", etc. should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] In the description of this specification, it should be understood that the directional words such as "upper" and "lower" described in the embodiments of the present application are described at the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element.

[0037] Reference Figure 1 As shown, an embodiment of the present application discloses a laser processing device, which includes a first laser 1, a second laser 2, a first beam splitter component 3, a second beam splitter component 4, a third beam splitter component 5, a scanning head, a processing table and a controller 8. The first laser 1 is used to emit a first laser beam, and the second laser 2 is used to emit a second laser beam. The first laser beam and the second laser beam can be lasers with the same wavelength and different pulse widths. The first beam splitter component 3 is arranged on the outgoing light path of the first laser 1, the second beam splitter component 4 is arranged on the outgoing light path of the second laser 2, and the second beam splitter component 4 is also located on the reflected light path of the first beam splitter component 3. The third beam splitter component 5 is arranged on the outgoing light path of the second beam splitter component 4. The scanning head is arranged on the reflected light path of the third beam splitter component 5. The controller 8 is connected to the first laser 1, the second laser 2, the scanning head and the processing table respectively, and is used to control the operation of the first laser 1, the second laser 2, the scanning head and the processing table. For example, the controller 8 can be used to control the light emission timing of the first laser 1 and the second laser 2, the scanning path of the scanning head, and the moving direction and distance of the processing table.

[0038] In this embodiment, the first laser 1 and the second laser 2 can be any pulse width laser combination of the same wavelength, such as ultraviolet nanosecond laser + ultraviolet picosecond laser, green nanosecond laser + green femtosecond laser, infrared picosecond laser + infrared femtosecond laser, etc., and the wavelengths of the two sets of lasers can be consistent, such as the laser wavelength can be 355nm, 532nm, 1064nm, etc. In this embodiment, lasers with different pulse widths can be equipped on the same device, which expands the application range of the device and improves the market competitiveness of the product. Exemplarily, the laser processing device can be used to cut workpieces of different materials, and the workpieces to be processed can be flexible printed circuit boards (full name in English: Flexible Printed Circuit, abbreviated as: FPC), or the workpieces to be processed can include a first material and a second material covered and attached to the first material, the first material includes copper foil, etc., and the second material includes a covering film, etc. Specifically, a workpiece to be processed can contain different materials, or different workpieces to be processed have different materials.

[0039] The scanning head includes a scanning galvanometer and an F-Theta mirror. The scanning galvanometer is equipped with high-speed motors in the X and Y directions, and a reflector is installed on the high-speed motor. The scanning galvanometer is used to scan different processing patterns, and the F-Theta mirror is used to focus the incident light beam on the processing table.

[0040] During processing, the PCB board (the workpiece to be processed) is placed on the processing table, and the processing table is controlled to move to a preset position by the controller 8. If the first laser 1 is to be used for processing, the corresponding parameters of the first laser 1 are set, and the first laser 1 is controlled to be turned on, so that the first laser 1 emits a first laser beam, and the first laser beam is sequentially injected into the scanning head through the first beam splitting component 3, the second beam splitting component 4 and the third beam splitting component 5, so that the scanning head can process the PCB board placed on the processing table based on the first laser beam. If the second laser 2 is to be used for processing, the corresponding parameters of the second laser 2 are set, and the second laser 2 is controlled to be turned on, so that the second laser 2 emits a second laser beam, and the second laser beam is sequentially injected into the scanning head through the second beam splitting component 4 and the third beam splitting component 5, so that the scanning head can process the PCB board placed on the processing table based on the second laser beam. If the first laser 1 and the second laser 2 are required to be processed simultaneously, the corresponding parameters of the first laser 1 and the second laser 2 are set, and the first laser 1 and the second laser 2 are controlled to be turned on, so that the first laser 1 emits a first laser beam and the second laser 2 emits a second laser beam. At this time, the first laser beam is sequentially emitted into the scanning head through the first beam splitting component 3, the second beam splitting component 4 and the third beam splitting component 5, and the second laser beam is sequentially emitted into the scanning head through the second beam splitting component 4 and the third beam splitting component 5, thereby achieving the purpose of using the first laser beam and the second laser beam to simultaneously process the PCB board placed on the processing table.

[0041] This embodiment can select a combination of lasers with different pulse widths according to the needs. When in use, the two sets of lasers can be controlled to emit light separately, so that the same device can process multiple samples, with a wide range of applications. Alternatively, the two sets of lasers can be controlled to emit light at the same time, and appropriate process parameters can be selected, and lasers with different pulse widths can be applied to the same sample. In addition, after the two laser beams are combined and re-split, dual-axis dual-table processing can be achieved, doubling the efficiency.

[0042] Continue to refer to Figure 1 As shown, the scanning head includes a first scanning head 6 and a second scanning head 7, the first beam splitter component 3 includes a beam splitter 31 and a first 1 / 2 wave plate 32, the second beam splitter component 4 includes a second 1 / 2 wave plate 41 and a first polarization beam splitter 42, and the third beam splitter component 5 includes a third 1 / 2 wave plate 51, a second polarization beam splitter 52, a first reflector 53 and a second reflector 54. During installation, the beam splitter 31 is arranged on the outgoing light path of the first laser 1, and the first 1 / 2 wave plate 32 is arranged on the reflected light path of the beam splitter 31. The second 1 / 2 wave plate 41 is arranged on the outgoing light path of the second laser 2, the first polarization beam splitter 42 is arranged on the transmitted light path of the second 1 / 2 wave plate 41, and the first polarization beam splitter 42 is also located on the transmitted light path of the first 1 / 2 wave plate. The first reflector 53 is disposed on the outgoing light path of the first polarization beam splitter 42, the third 1 / 2 wave plate 51 is disposed on the reflected light path of the first reflector 53, the second polarization beam splitter 52 is disposed on the transmitted light path of the third 1 / 2 wave plate 51, and the second reflector 54 is disposed on the transmitted light path of the second polarization beam splitter 52. The first scanning head 6 is disposed on the reflector light path of the second polarization beam splitter 52, and the second scanning head 7 is disposed on the reflected light path of the second reflector 54. The controller 8 is connected to the first scanning head 6 and the second scanning head 7, respectively.

[0043] Specifically, the beam splitter 31 can be an energy beam splitter, and the ratio of its reflection and transmission is 99:1. The first reflector 53 and the second reflector 54 are used to deflect the propagation direction of the laser beam. The first 1 / 2 wave plate 32, the second 1 / 2 wave plate 41 and the third 1 / 2 wave plate 51 are used to change the polarization direction of the laser, and the first polarization beam splitter 42 and the second polarization beam splitter 52 are used to separate the different polarization components of the incident polarized light. The 1 / 2 wave plate and the polarization beam splitter are used together. By rotating the 1 / 2 wave plate, the ratio of the laser energy in the transmission direction and the reflection direction of the polarization beam splitter can be changed. The first polarization beam splitter 42 and the second polarization beam splitter 52 can be polarization beam splitter plates or polarization beam splitter cubes. Exemplarily, the characteristic of the polarization beam splitter is to transmit P polarized light while reflecting S polarized light. By adjusting the angle of the first 1 / 2 wave plate 32, the polarization direction of the laser emitted by the first laser 1 can be adjusted to the horizontal direction. By adjusting the angle of the second 1 / 2 wave plate 41, the polarization direction of the laser emitted by the second laser 2 can be adjusted to the vertical direction, so that most of the laser beam incident on the first polarization beam splitter 42 of the first laser 1 is transmitted, and most of the laser beam incident on the first polarization beam splitter 42 of the second laser 2 is reflected. The transmitted beam of the first laser 1 and the reflected beam of the second laser 2 are combined after passing through the first polarization beam splitter 42, and share the same optical path system. The second polarization beam splitter 52 and the third 1 / 2 wave plate 51 form a beam splitting system. The polarization direction of the laser can be changed by adjusting the angle of the third 1 / 2 wave plate 51, so that the laser energy incident on the second polarization beam splitter 52 is evenly distributed to the first scanning head 6 and the second scanning head 7.

[0044] In order to adjust the laser spot size emitted by the first laser 1 and the second laser 2, the laser processing device also includes a first beam expander 9 and a second beam expander 10. The first beam expander 9 is arranged on the optical path between the first laser 1 and the beam splitter 31, and is used to expand the spot size of the laser emitted by the first laser 1 and compress the divergence angle of the laser beam emitted by the first laser 1. The second beam expander 10 is arranged on the optical path between the second laser 2 and the second 1 / 2 wave plate 42, and is used to expand the spot size of the laser emitted by the second laser 2 and compress the divergence angle of the laser beam emitted by the second laser 2. Among them, the first beam expander 9 and the second beam expander 10 can be fixed-magnification beam expanders or variable-magnification beam expanders.

[0045] In some embodiments, when the beam expansion magnifications required for the two optical paths are different, two sets of beam expanders can be selected and placed at the output ends of the two lasers respectively, and the two sets of beam expanders can be adjusted to the required beam expansion magnifications. When the beam expansion magnifications required for the two optical paths are the same, only one set of beam expanders can be selected, and the beam expander can be placed on the reflection optical path of the first reflector 53.

[0046] The laser processing device further includes a first power detection module 11 and a second power detection module 12. The first power detection module 11 is arranged on the transmission light path of the beam splitter 31, and is used to receive a small portion of the transmitted light of the laser emitted by the first laser 1 after passing through the beam splitter 31. The second power detection module 12 is arranged on the transmission light path of the first polarization beam splitter 42, and is used to receive a small portion of the reflected light of the laser emitted by the first laser 1 after passing through the first polarization beam splitter 42 and a small portion of the transmitted light of the laser emitted by the second laser 2 after passing through the first polarization beam splitter 42. The two sets of power detection modules can be used to detect tiny laser powers, so that by monitoring the power values ​​at this location, it can be detected whether the power of the first laser 1, the second laser 2, or the devices of this section of the optical path are normal.

[0047] The processing platform includes a first processing platform 13 and a second processing platform 14. The first scanning head 6 is located above the first processing platform 13, and the second scanning head 7 is located above the second processing platform 14. The controller 8 is connected to the first processing platform 13 and the second processing platform 14 respectively.

[0048] In a specific application scenario, the PCB board is placed on the first processing table 13 and the second processing table 14, and the first processing table 13 and the second processing table 14 are controlled by the controller 8 to move to a preset position. If the first laser 1 is required for processing, the corresponding parameters of the first laser 1 are set, and the first laser 1 is controlled to be turned on by the controller 8, so that the first laser 1 emits a first laser beam, and the first laser beam is sequentially emitted to the first polarization beam splitter 42 through the first beam expander 9, the beam splitter 31 and the first 1 / 2 wave plate. After being split by the first polarization beam splitter 42, a part of the first laser beam is transmitted by the first polarization beam splitter 42 and then sequentially emitted to the second polarization beam splitter 52 through the first reflector 53 and the third 1 / 2 wave plate 51. After being split by the second polarization beam splitter 52, part of the first laser beam is reflected by the second polarization beam splitter 52 to the first scanning head 6, and part of the first laser beam is transmitted by the second polarization beam splitter 52 to the second reflector 54, and then reflected by the second reflector 54 to the second scanning head 7, so that the first scanning head 6 and the second scanning head 7 can process the PCB boards placed on the first processing table 13 and the second processing table 14 based on the first laser beam. If the second laser 2 is required for processing, the corresponding parameters of the second laser 2 are set, and the second laser 2 is controlled to be turned on by the controller 8, so that the second laser 2 emits a second laser beam. The second laser beam is sequentially incident on the first polarization beam splitter 42 through the second beam expander 10 and the second 1 / 2 wave plate 41. After being split by the first polarization beam splitter 42, a part of the second laser beam is reflected by the first polarization beam splitter 42 and then sequentially incident on the second polarization beam splitter 52 through the first reflector 53 and the third 1 / 2 wave plate 51. After being split by the second polarization beam splitter 52, part of the second laser beam is reflected by the second polarization beam splitter 52 to the first scanning head 6, and part of the second laser beam is transmitted by the second polarization beam splitter 52 to the second reflector 54, and then reflected by the second reflector 54 to the second scanning head 7, so that the first scanning head 6 and the second scanning head 7 can process the PCB boards placed on the first processing table 13 and the second processing table 14 based on the second laser beam.If the first laser 1 and the second laser 2 are to be used for processing at the same time, the corresponding parameters of the first laser 1 and the second laser 2 are set, and the first laser 1 and the second laser 2 are controlled to be turned on by the controller 8, so that the first laser 1 emits a first laser beam and the second laser 2 emits a second laser beam. At this time, the first laser beam is sequentially emitted to the first polarization beam splitter 42 through the first beam expander 9, the beam splitter 31 and the first 1 / 2 wave plate, and the second laser beam is sequentially emitted to the first polarization beam splitter 42 through the second beam expander 10 and the second 1 / 2 wave plate 41. After being split by the first polarization beam splitter 42, a part of the first laser beam and the second laser beam are sequentially emitted to the first polarization beam splitter 42 through the first reflector 53. The third 1 / 2 wave plate 51 is irradiated toward the second polarization beam splitter 52. After being split by the second polarization beam splitter 52, part of the first laser beam and the second laser beam are reflected by the second polarization beam splitter 52 to the first scanning head 6, and part of the first laser beam and the second laser beam are transmitted by the second polarization beam splitter 52 to the second reflector 54, and then reflected by the second reflector 54 to the second scanning head 7, so that the first scanning head 6 and the second scanning head 7 can process the PCB boards placed on the first processing table 13 and the second processing table 14 based on the first laser beam and the second laser beam, thereby achieving the purpose of using the first laser beam and the second laser beam to simultaneously process the PCB boards placed on the processing tables.

[0049] This embodiment combines the advantages of different laser pulse widths when processing different samples and selects different laser combinations, breaking the limitation of traditional laser processing equipment that the types of samples that can be processed are relatively single. A certain laser light source can be selected for processing alone, or two light sources can be used at the same time to process the same sample, which has a wide range of applications.

[0050] Based on the above embodiment, the present application also discloses another specific implementation mode. The difference between this embodiment and the above embodiment is that, referring to Figure 2 As shown, in this embodiment, the laser processing device also includes a third beam expander 15, which is arranged on the optical path between the first reflector 53 and the third 1 / 2 wave plate 51, and the third beam expander 15 is used to expand the spot size of the laser reflected by the first reflector 53 and compress the divergence angle of the laser beam reflected by the first reflector 53.

[0051] In a specific application scenario, the PCB board is placed on the first processing table 13 and the second processing table 14, and the first processing table 13 and the second processing table 14 are controlled by the controller 8 to move to a preset position. If the first laser 1 is required for processing, the corresponding parameters of the first laser 1 are set, and the first laser 1 is controlled to be turned on by the controller 8, so that the first laser 1 emits a first laser beam, and the first laser beam is sequentially emitted to the first polarization beam splitter 42 through the beam splitter 31 and the first 1 / 2 wave plate. After being split by the first polarization beam splitter 42, a part of the first laser beam is transmitted by the first polarization beam splitter 42 and then sequentially emitted to the second polarization beam splitter 52 through the first reflector 53, the third beam expander 15, and the third 1 / 2 wave plate 51. After being split by the second polarization beam splitter 52, part of the first laser beam is reflected by the second polarization beam splitter 52 to the first scanning head 6, and part of the first laser beam is transmitted by the second polarization beam splitter 52 to the second reflector 54, and then reflected by the second reflector 54 to the second scanning head 7, so that the first scanning head 6 and the second scanning head 7 can process the PCB boards placed on the first processing table 13 and the second processing table 14 based on the first laser beam. If the second laser 2 is required for processing, the corresponding parameters of the second laser 2 are set, and the second laser 2 is controlled to be turned on by the controller 8, so that the second laser 2 emits a second laser beam, and the second laser beam is sequentially incident on the first polarization beam splitter 42 through the second 1 / 2 wave plate 41. After being split by the first polarization beam splitter 42, a part of the second laser beam is reflected by the first polarization beam splitter 42 and then sequentially incident on the second polarization beam splitter 52 through the first reflector 53, the third beam expander 15, and the third 1 / 2 wave plate 51. After being split by the second polarization beam splitter 52, part of the second laser beam is reflected by the second polarization beam splitter 52 to the first scanning head 6, and part of the second laser beam is transmitted by the second polarization beam splitter 52 to the second reflector 54, and then reflected by the second reflector 54 to the second scanning head 7, so that the first scanning head 6 and the second scanning head 7 can process the PCB boards placed on the first processing table 13 and the second processing table 14 based on the second laser beam.If the first laser 1 and the second laser 2 are used for processing at the same time, the corresponding parameters of the first laser 1 and the second laser 2 are set, and the first laser 1 and the second laser 2 are controlled to be turned on by the controller 8, so that the first laser 1 emits a first laser beam and the second laser 2 emits a second laser beam. At this time, the first laser beam is sequentially emitted to the first polarization beam splitter 42 through the beam splitter 31 and the first 1 / 2 wave plate, and the second laser beam is sequentially emitted to the first polarization beam splitter 42 through the second 1 / 2 wave plate 41. After being split by the first polarization beam splitter 42, a part of the first laser beam and the second laser beam are sequentially emitted to the first reflector 53, the third beam expander 15, The third 1 / 2 wave plate 51 is irradiated toward the second polarization beam splitter 52. After being split by the second polarization beam splitter 52, part of the first laser beam and the second laser beam are reflected by the second polarization beam splitter 52 to the first scanning head 6, and part of the first laser beam and the second laser beam are transmitted by the second polarization beam splitter 52 to the second reflector 54, and then reflected by the second reflector 54 to the second scanning head 7, so that the first scanning head 6 and the second scanning head 7 can process the PCB boards placed on the first processing table 13 and the second processing table 14 based on the first laser beam and the second laser beam, thereby achieving the purpose of using the first laser beam and the second laser beam to simultaneously process the PCB boards placed on the processing tables.

[0052] The above is only a preferred specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A laser processing device, characterized in that: include: A first laser, used to emit a first laser beam; A second laser, used to emit a second laser beam, wherein the pulse width of the second laser beam is greater than or less than the pulse width of the first laser beam; A first light splitting component, which is disposed on an outgoing light path of the first laser and is used to split the first laser beam; A second beam splitter component, which is disposed on an outgoing light path of the second laser and is also located on a reflected light path of the first beam splitter component, and is used to split the second laser beam and also to transmit the laser beam emitted by the first beam splitter component; A third light splitting component, the third light splitting component is arranged on the output light path of the second light splitting component, and is used to split the laser light emitted by the second light splitting component; A scanning head, which is arranged on the reflected light path of the third beam splitting component and is used for processing the workpiece based on the laser emitted by the third beam splitting component; A controller, the controller is connected to the first laser, the second laser and the scanning head respectively, and is used to control the operation of the first laser, the second laser and the scanning head; When the first laser beam is required for processing, the controller is used to control the first laser to emit the first laser beam, so that the scanning head can process the workpiece to be processed based on the first laser beam; when the second laser beam is required for processing, the controller is used to control the second laser to emit the second laser beam, so that the scanning head can process the workpiece to be processed based on the second laser beam; when the first laser beam and the second laser beam are required for processing at the same time, the controller is used to control the first laser to emit the first laser beam and the second laser to emit the second laser beam, so that the scanning head can process the workpiece to be processed based on the first laser beam and the second laser beam at the same time.

2. The laser processing device according to claim 1, characterized in that: The first beam splitter assembly includes a beam splitter and a first 1 / 2 wave plate, the beam splitter is arranged on the outgoing light path of the first laser, the first 1 / 2 wave plate is arranged on the reflected light path of the beam splitter, and the second beam splitter assembly is located on the transmitted light path of the first 1 / 2 wave plate.

3. The laser processing device according to claim 2, characterized in that: The second beam splitter component includes a second 1 / 2 wave plate and a first polarization beam splitter, the second 1 / 2 wave plate is arranged on the output light path of the second laser, the first polarization beam splitter is arranged on the transmission light path of the second 1 / 2 wave plate, and the first polarization beam splitter is also located on the transmission light path of the first 1 / 2 wave plate, and the third beam splitter component is arranged on the output light path of the first polarization beam splitter.

4. The laser processing device according to claim 3, characterized in that: The third beam splitter assembly includes a third 1 / 2 wave plate and a second polarization beam splitter, the third 1 / 2 wave plate is arranged on the outgoing light path of the first polarization beam splitter, the second polarization beam splitter is arranged on the transmitted light path of the third 1 / 2 wave plate, and the scanning head is arranged on the outgoing light path of the second polarization beam splitter.

5. The laser processing device according to claim 4, characterized in that: The third beam splitter assembly further includes a first reflector, which is disposed on the outgoing light path of the first polarization beam splitter, and the third 1 / 2 wave plate is disposed on the reflected light path of the first reflector.

6. The laser processing device according to claim 5, characterized in that: The laser processing device also includes a third beam expander, which is arranged on the reflection light path of the first reflection mirror, and the third 1 / 2 wave plate is arranged on the output light path of the third beam expander.

7. The laser processing device according to claim 4, characterized in that: The scanning head includes a first scanning head and a second scanning head, the third beam splitter component also includes a second reflector, the second reflector is arranged on the transmission light path of the second polarization beam splitter, the first scanning head is arranged on the reflection light path of the second polarization beam splitter, and the second scanning head is arranged on the reflection light path of the second reflector.

8. The laser processing device according to claim 7, characterized in that: The laser processing device also includes a first processing table and a second processing table. The first processing table is located below the first scanning head, and the second processing table is located below the second scanning head. The controller is connected to the first processing table and the second processing table respectively, and is used to control the movement of the first processing table and the second processing table.

9. The laser processing device according to claim 3, characterized in that: The laser processing device also includes a first beam expander and a second beam expander. The first beam expander is arranged on the optical path between the first laser and the beam splitter, and the second beam expander is arranged on the optical path between the second laser mirror and the second 1 / 2 wave plate.

10. The laser processing device according to claim 3, characterized in that: The laser processing device further includes a first power detection module and a second power detection module. The first power detection module is arranged on the transmission light path of the beam splitter, and the second power detection module is arranged on the transmission light path of the first polarization beam splitter.

11. The laser processing device according to any one of claims 1 to 10, characterized in that: The first laser is a picosecond laser, and the second laser is a nanosecond laser; or The first laser is a femtosecond laser, and the second laser is a nanosecond laser; or The first laser is set to be a femtosecond laser, and the second laser is set to be a picosecond laser; The first laser and the second laser are respectively used to process workpieces of different materials, wherein the workpiece includes a first material and a second material covering and attached to the first material, the first material includes copper foil, and the second material includes a covering film.

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