Automobile seat based on semiconductor temperature control

Abstract

The utility model provides an automobile seat based on semiconductor temperature control, which comprises a main body and an air outlet area, the air outlet area used for ventilating the seat is arranged in the front end of the main body, the lower end of the main body is provided with a temperature control component used for controlling the ventilation temperature, and the main body is an automobile ventilation seat. The main body is fixedly connected with the temperature control component through a bolt, an air inlet groove used for ventilation is formed in the bottom of the temperature control component, and a dust blocking net used for blocking dust is arranged in the air inlet groove. Compared with the prior art, the motor cooling device has the advantages that the temperature control component is used for adjusting and controlling the air temperature in the air guide pipe, the connecting base and the clamping base are used for conducting limiting connection on the motor, and the semiconductor chilling plate and the temperature conducting base are used for conducting the temperature of the semiconductor chilling plate; the cross sectional area and the release area of low-temperature conduction are enlarged by using the temperature conduction wing seat, so that the efficiency of low-temperature conduction is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of automobile seats and relates to an automobile seat based on semiconductor temperature control. Background Art

[0002] A car ventilated seat is a car seat that uses ventilation technology. It installs a ventilation device inside the seat to allow air to circulate, thereby effectively reducing the surface temperature of the seat and improving the comfort of riding. The principle of a ventilated seat is to install a ventilation device in the seat cushion and backrest. This device usually consists of a fan and a ventilation duct. When the fan is working, it draws air into the ventilation duct and discharges the air through the air holes on the surface of the seat, thus forming a ventilation effect. This makes the seat surface more breathable, effectively reduces the surface temperature of the seat, reduces sweat accumulation, and improves riding comfort. However, if the ventilation air cannot be quickly regulated and cooled during use, a series of problems will arise.

[0003] In hot weather or after prolonged exposure to the sun, the seat temperature may be very high. If the ventilation system cannot cool down quickly, passengers will feel burning when touching the seat, which not only affects the riding experience but may also have negative effects on physical health, such as causing skin diseases.

[0004] If the ventilated seats cannot be cooled down quickly, the driver may feel uncomfortable due to the high seat temperature, which may cause the driver's attention to be distracted and the reaction speed while driving to be slower, thereby increasing the risk of traffic accidents.

[0005] In addition, the inability of ventilated seats to cool down quickly may also affect the service life of the seats. Long-term high temperature environment may accelerate the aging and damage of seat materials, causing premature wear and deformation of seats, which not only affects the aesthetics of the seats, but also may reduce the performance of the seats. Therefore, there is an urgent need for a car seat based on semiconductor temperature control to solve the above problems. Utility Model Content

[0006] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a car seat based on semiconductor temperature control to solve the problems raised in the above background technology.

[0007] The utility model is realized by the following technical scheme: a car seat based on semiconductor temperature control, comprising: a main body, a temperature control component and an air outlet area, wherein the front end of the main body is provided with an air outlet area for the ventilation function of the seat;

[0008] A temperature control component for controlling ventilation temperature is provided at the lower end of the main body, the main body is a car ventilated seat, the main body and the temperature control component are connected and fixed by bolts, an air inlet slot for ventilation is provided at the bottom of the temperature control component, and a dust blocking net for blocking dust is provided inside the air inlet slot;

[0009] The air outlet area includes air outlet holes and an air duct. The air outlet holes are opened inside the front side of the main body, and the interiors of several groups of air outlet holes are interconnected with the interior of the air duct. The interior of the air duct is interconnected with the interior of the temperature control component. The air temperature inside the air duct can be adjusted and controlled by using the temperature control component.

[0010] As a preferred embodiment, the temperature control component includes a limiting shell, a semiconductor cooling plate and a wire. A motor for driving a rotary seat to rotate is provided on the inner side of the lower end of the limiting shell, and a rotary seat is provided on the outer side of the motor.

[0011] As a preferred embodiment, the outer side of the rotary seat is provided with an air-guiding rotor blade for performing air-guiding operations, the lower end of the outer side of the limiting shell is provided with several groups of clamping seats for connecting with the connecting seat, and the lower end of the clamping seat is provided with a connecting seat to improve the connection effect, and the motor can be limitedly connected by using the connecting seat and the clamping seat.

[0012] As a preferred embodiment, a buffer seat for slowly releasing motor vibration is provided at the lower end of the connecting seat, and a supporting foot for connecting and fixing with the bottom of the temperature control component is provided at the lower end of the buffer seat, and a thermal conductive base for improving the thermal conductive effect is provided on the inner side of the four groups of supporting feet.

[0013] As a preferred embodiment, a semiconductor refrigeration plate for cooling air is provided in the middle position inside the thermal conductive base, and a wire for energizing the semiconductor refrigeration plate is provided at the lower end of the semiconductor refrigeration plate, so that the temperature of the semiconductor refrigeration plate can be conducted by using the semiconductor refrigeration plate and the thermal conductive base.

[0014] As a preferred embodiment, a heat conducting base for expanding the conduction temperature is provided at the upper end of the heat conducting base, and an embedding groove for engaging with a semiconductor cooling plate is provided at the middle position inside the heat conducting base.

[0015] As a preferred embodiment, four groups of connecting feet are provided on the outer side of the heat conducting base, and the four groups of connecting feet are respectively connected and fixedly engaged with one group of supporting feet;

[0016] A temperature conducting column is provided at the upper end of the temperature conducting base, and the temperature conducting column is embedded in the embedding groove, and the upper end of the temperature conducting base is fitted with the lower end of the temperature conducting wing seat. The temperature conducting wing seat and the temperature conducting base are both made of a metal copper material. The cross-sectional area and release area of ​​low-temperature conduction can be expanded by using the temperature conducting wing seat, thereby improving the efficiency of low-temperature conduction.

[0017] After adopting the above technical scheme, the beneficial effects of the utility model are: by using the temperature control component to adjust and control the air temperature inside the air duct, by using the connecting seat and the clamping seat to limit the connection of the motor, by using the semiconductor refrigeration plate and the thermal conductive base to conduct the temperature of the semiconductor refrigeration plate, by using the thermal conductive wing seat to expand the cross-sectional area and release area of ​​the low-temperature conduction, thereby improving the efficiency of the low-temperature conduction. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] Figure 1 This is a schematic diagram of the right oblique front view of a car seat based on semiconductor temperature control according to the utility model;

[0020] Figure 2 This is a schematic diagram of the front side top view of the limit shell in a car seat based on semiconductor temperature control according to the utility model;

[0021] Figure 3 This is a front side top view of the structure of a thermal conductive wing seat in a car seat based on semiconductor temperature control according to the utility model;

[0022] Figure 4 This is a bottom view of the structure of the thermal conductive base of a car seat based on semiconductor temperature control according to the utility model;

[0023] In the figure: 100-main body, 110-temperature control component, 120-air outlet area;

[0024] 11a-limiting shell, 11b-motor, 11c-rotating seat, 11d-wind guide rotor blade, 11e-clamping seat, 11f-connecting seat, 11g-buffer seat, 11h-support foot, 11i-thermal conduction wing seat, 11j-embedded groove, 11k-thermal conduction base, 11l-semiconductor cooling sheet, 11m-wire. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1-Figure 4 , a car seat based on semiconductor temperature control, comprising: a main body 100, a temperature control component 110 and an air outlet area 120, wherein the front end of the main body 100 is provided with an air outlet area 120 for the seat ventilation function;

[0027] A temperature control component 110 for controlling the ventilation temperature is provided at the lower end of the main body 100. The main body 100 is a car ventilated seat. The main body 100 and the temperature control component 110 are connected and fixed by bolts. An air inlet slot for ventilation is provided at the bottom of the temperature control component 110. A dust-blocking net for blocking dust is provided inside the air inlet slot.

[0028] The air outlet area 120 includes air outlet holes and an air duct. The air outlet holes are opened inside the front side of the main body 100, and the interiors of several groups of air outlet holes are interconnected with the interior of the air duct. The interior of the air duct is interconnected with the interior of the temperature control component 110. The air temperature inside the air duct can be adjusted and controlled by using the temperature control component 110.

[0029] The temperature control component 110 includes a limiting shell 11a, a semiconductor cooling sheet 11l and a wire 11m. A motor 11b for driving a rotating seat 11c to rotate is disposed inside the lower end of the limiting shell 11a, and a rotating seat 11c is disposed outside the motor 11b.

[0030] An air-guiding rotor blade 11d for guiding air is provided on the outside of the rotary seat 11c, and a plurality of clamping seats 11e for connecting with the connecting seat 11f are provided on the lower end of the outer side of the limiting shell 11a. A connecting seat 11f for improving the connection effect is provided on the lower end of the clamping seat 11e, and the motor 11b can be limitedly connected by using the connecting seat 11f and the clamping seat 11e.

[0031] A buffer seat 11g is provided at the lower end of the connecting seat 11f for slowly releasing the vibration of the motor 11b. A supporting foot 11h is provided at the lower end of the buffer seat 11g for connecting and fixing with the bottom of the temperature control component 110. A thermal conductive base 11k is provided inside the four groups of supporting feet 11h for improving the thermal conductive effect.

[0032] A semiconductor refrigeration plate 111 for cooling the air is provided in the middle position inside the thermal conductive base 11k, and a wire 11m for energizing the semiconductor refrigeration plate 111 is provided at the lower end thereof. The temperature of the semiconductor refrigeration plate 111 can be conducted by using the semiconductor refrigeration plate 111 and the thermal conductive base 11k.

[0033] A heat conducting base 11k for expanding the conduction temperature is provided at the upper end of the heat conducting base 11k, and an embedding groove 11j for embedding with the semiconductor cooling plate 11l is provided at the middle position inside the heat conducting base 11k.

[0034] Four sets of connecting feet are arranged on the outside of the heat conducting base 11k, and the four sets of connecting feet are respectively connected and fixed with a set of supporting feet 11h;

[0035] A temperature conducting column is provided at the upper end of the temperature conducting base 11k, which is embedded in the embedding groove 11j, and the upper end of the temperature conducting base 11k is fitted with the lower end of the temperature conducting wing seat 11i. The temperature conducting wing seat 11i and the temperature conducting base 11k are both made of a metal copper material. The use of the temperature conducting wing seat 11i can expand the cross-sectional area and release area of ​​low-temperature conduction, thereby improving the efficiency of low-temperature conduction.

[0036] See also Figure 1-Figure 4 , as the first embodiment of the utility model: in order to solve the problem that the seat temperature may be very high in hot weather or after long-term exposure to the sun, if the ventilation system cannot cool down quickly, the passengers will feel burning when touching the seat, which not only affects the riding experience, but may also have a negative impact on physical health. First, when the staff needs to ventilate the air outlet area 120 inside the main body 100, the external power supply is transmitted to the end of the semiconductor refrigeration plate 11l through the wire 11m, and a cooling effect is generated on the semiconductor refrigeration plate 11l. Since a semiconductor refrigeration plate 11l for cooling air is provided in the middle position inside the thermal conductive base 11k, the semiconductor refrigeration plate 11l can fully conduct the cooling effect to the thermal conductive base 11k and the thermal conductive wing seat 11i, and conduct the cooling effect of the semiconductor refrigeration plate 11l to the thermal conductive wing seat 11i and the thermal conductive base 11k, thereby expanding the cross-sectional area and release area of ​​the low-temperature conduction, thereby improving the efficiency of the low-temperature conduction.

[0037] See also Figure 1-Figure 4 , as the second embodiment of the utility model: based on the description in the above embodiment, further, after the motor 11b drives the rotary seat 11c and the air guide vane 11d to rotate, the air guide vane 11d rotates to introduce external air from the bottom of the temperature control component 110, and mixes the cooling effect of the semiconductor refrigeration plate 11l with the air entering from the outside through the temperature conductive base 11k and the temperature conductive wing seat 11i, thereby reducing the air temperature and conducting it to the air outlet area 120. At the same time, since a buffer seat 11g for slowly releasing the vibration of the motor 11b is provided at the lower end of the connecting seat 11f, and a supporting foot 11h for connecting and fixing to the bottom of the temperature control component 110 is provided at the lower end of the buffer seat 11g, when the motor 11b is in use, the buffer seat 11g and the connecting seat 11f can slowly release the vibration generated by the motor 11b, thereby keeping the equipment running smoothly.

[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A car seat based on semiconductor temperature control, comprising: A main body (100), a temperature control component (110) and an air outlet area (120), characterized in that: an air outlet area (120) for seat ventilation is provided inside the front end of the main body (100); A temperature control component (110) for controlling ventilation temperature is provided at the lower end of the main body (100); the main body (100) is a ventilated seat for an automobile; the main body (100) and the temperature control component (110) are connected and fixed by bolts; an air inlet groove for ventilation is provided at the bottom of the temperature control component (110); a dust blocking net for blocking dust is provided inside the air inlet groove; The air outlet area (120) includes air outlet holes and an air duct, wherein the air outlet holes are arranged inside the front side of the main body (100), and the interiors of several groups of the air outlet holes are interconnected with the interior of the air duct, and the interior of the air duct is interconnected with the interior of the temperature control component (110).

2. The automobile seat based on semiconductor temperature control according to claim 1, characterized in that: The temperature control component (110) comprises a limiting shell (11a), a semiconductor cooling plate (11l) and a wire (11m); a motor (11b) for driving a rotating seat (11c) to rotate is provided on the inner side of the lower end of the limiting shell (11a); and a rotating seat (11c) is provided on the outer side of the motor (11b).

3. The automobile seat based on semiconductor temperature control according to claim 2, characterized in that: The outer side of the rotary seat (11c) is provided with an air guiding rotary blade (11d) for performing air guiding operations, the lower end of the outer side of the limiting shell (11a) is provided with a plurality of groups of clamping seats (11e) for connecting with the connecting seat (11f), and the lower end of the clamping seat (11e) is provided with a connecting seat (11f) for improving the connection effect.

4. The automobile seat based on semiconductor temperature control according to claim 3, characterized in that: The lower end of the connecting seat (11f) is provided with a buffer seat (11g) for slowly releasing the vibration of the motor (11b); the lower end of the buffer seat (11g) is provided with a supporting foot (11h) for connecting and fixing with the bottom of the temperature control component (110); and the inner sides of the four groups of supporting feet (11h) are provided with a thermal conductive base (11k) for improving the thermal conductive effect.

5. The automobile seat based on semiconductor temperature control according to claim 4, characterized in that: A semiconductor cooling plate (111) for cooling air is provided at the middle position inside the temperature conducting base (11k), and a wire (11m) for energizing the semiconductor cooling plate (111) is provided at the lower end of the semiconductor cooling plate (111).

6. The automobile seat based on semiconductor temperature control according to claim 5, characterized in that: The upper end of the thermal conductive base (11k) is provided with a thermal conductive base (11k) for increasing the conduction temperature, and the middle position inside the thermal conductive base (11k) is provided with an embedding groove (11j) for embedding with a semiconductor cooling plate (11l).

7. The automobile seat based on semiconductor temperature control according to claim 6, characterized in that: Four groups of connecting feet are arranged on the outside of the heat conducting base (11k), and the four groups of connecting feet are respectively engaged, connected and fixed with a group of supporting feet (11h); The upper end of the heat conducting base (11k) is provided with a heat conducting column, the heat conducting column and the embedding groove (11j) are mutually embedded, and the upper end of the heat conducting base (11k) and the lower end of the heat conducting wing seat (11i) are mutually abutted, and the heat conducting wing seat (11i) and the heat conducting base (11k) are both made of a metal copper material.

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