Full-automatic ferric iron copper dissolving circulation intelligent control system

Abstract

The utility model relates to a full-automatic ferric iron copper dissolving circulation intelligent control system which comprises a copper dissolving tank, a high-concentration copper temporary storage tank and an electroplating reaction tank. The device further comprises an auxiliary tank and a low-concentration copper temporary storage tank. An adding pipeline is mounted on one side of the top of the copper dissolving tank, a high-concentration copper temporary storage tank is arranged on the left side of the copper dissolving tank, a copper basket tank is mounted in the copper dissolving tank, a plurality of copper baskets are sequentially and uniformly mounted in the copper basket tank from left to right, and a plurality of copper balls are sequentially and uniformly placed in the copper baskets from top to bottom. According to the utility model, the concentrations of Cu < 2 + > and Fe < 3 + > in the solution are monitored on line in real time in the tank body, the liquid supply speed, namely the flow, of the pump is controlled, the concentrations of Cu < 2 + > and Fe < 3 + > in the solution are dynamically regulated and controlled, and the concentrations of Cu < 2 + > and Fe < 3 + > in the system are ensured to be in dynamic balance.

Description

Technical Field

[0001] The utility model relates to the technical field related to trivalent iron copper dissolution, and in particular to a full-automatic trivalent iron copper dissolution circulation intelligent control system. Background Art

[0002] The copper plating process is mainly divided into two types: soluble anode and insoluble anode. As the electroplating proceeds, the copper ions in the electroplating solution are continuously consumed, and the copper plating effect decreases accordingly, thus affecting the electroplating effect. Therefore, copper ions need to be supplemented in the electroplating solution. There are many ways to supplement copper ions. For example, phosphor copper balls are used as soluble anodes to supplement the copper ions in the electroplating solution by dissolving the phosphor copper balls. However, anode mud will be produced during the dissolution of the phosphor copper balls, which requires regular line shutdown for cleaning, consuming a lot of manpower and time, and has a low degree of automation.

[0003] Insoluble anodes use copper oxide powder as a supplement for electroplating copper ions. Copper oxide powder dissolves slowly, and the coating is prone to produce particles after electroplating, affecting product quality. At the same time, the powder is prone to leakage during the addition process, causing environmental pollution. In addition, the cost of converting copper into copper oxide powder is high, the process is long, and it will pollute the air environment.

[0004] Current electroplating production line Fe 3+ In the copper dissolving control, only a pump is used for circulation and delivery, and there is no real-time online monitoring. In addition, in the existing technology that can control the concentration of trivalent iron entering the copper dissolving tank, a pumping function structure or a motor is used to drive the screw rod to reciprocate to achieve liquid inlet and outlet and Fe 3+ The structure is complex and the actual control is difficult.

[0005] The copper dissolving system is the front-end process of the electroplating equipment. 2+ Concentration is critical to subsequent electroplating processes.

[0006] After massive search, it was found that the prior art publication number is CN217997399U, which discloses a trivalent iron copper dissolving circulation system, including a copper dissolving tank and a copper tank, wherein the copper tank has a cathode part and a symmetrically arranged anode part, and a first nozzle and a second nozzle are respectively arranged on both sides of the anode part, and a filter and a circulation pump are arranged between the copper dissolving tank and the copper tank, and a spray pump is arranged on the copper tank. The filter removes Fe 2+ and Cu 2+ The solution is pumped into the copper tank and sprayed toward the anode by the first nozzle to react with the oxygen near the anode. The spray pump draws the solution from the bottom of the copper tank and sprays it toward the cathode from the second nozzle to complete the electroplating. The circulation pump draws the solution containing Fe from both sides of the copper tank. 3+ The solution is returned to the copper dissolving tank and reacts with copper to form Fe 2+ and Cu 2+, and recycled. This solution first sprays the solution in the copper dissolving tank to the vicinity of the anode, so that it reacts with oxygen and consumes oxygen, thereby reducing the adverse effects of oxygen on the electroplating process.

[0007] In summary, the existing technology for controlling the concentration of trivalent iron in the copper dissolving tank uses a pumping function structure or a motor to drive the screw rod to reciprocate to achieve liquid inlet and outlet and Fe 3+ The structure is complex and the actual control is difficult.

[0008] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a fully automatic trivalent iron copper dissolving circulation intelligent control system to make it more valuable for industrial use. Utility Model Content

[0009] In order to solve the above technical problems, the purpose of the utility model is to provide a fully automatic ferric iron copper dissolving circulation intelligent control system.

[0010] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0011] A fully automatic trivalent iron copper dissolving circulation intelligent control system, comprising a copper dissolving tank, a high-concentration copper temporary storage tank and an electroplating reaction tank;

[0012] It also includes a secondary tank and a low-concentration copper temporary storage tank;

[0013] An adding pipeline is installed on one side of the top of the copper dissolving tank, a high-concentration copper temporary storage tank is arranged on the left side of the copper dissolving tank, a copper basket tank is installed in the copper dissolving tank, a plurality of copper baskets are evenly installed from left to right in the copper basket tank, and a plurality of copper balls are evenly placed in the copper basket from top to bottom;

[0014] A high-concentration copper delivery main pipeline is installed on one side of the bottom of the high-concentration copper temporary storage tank, the high-concentration copper delivery main pipeline is connected to the bottom of the copper dissolving tank through a first high-concentration copper delivery branch pipeline, the high-concentration copper delivery main pipeline is connected to the bottom of the auxiliary tank through a second high-concentration copper delivery branch pipeline, the top side of the auxiliary tank is connected to the electroplating reaction tank through a third high-concentration copper delivery branch pipeline, the bottom side of the electroplating reaction tank is connected to the auxiliary tank through a second reflux pipeline, the electroplating reaction tank is connected to the low-concentration copper temporary storage tank on the left through a first low-concentration copper delivery branch pipeline, and the bottom side of the low-concentration copper temporary storage tank is connected to the copper dissolving tank through a second low-concentration copper delivery branch pipeline;

[0015] Fe is installed in both the high-concentration copper temporary storage tank and the low-concentration copper temporary storage tank. 3+ Concentration monitoring sensor, with Cu installed in the auxiliary tank 2+ Concentration monitoring sensors;

[0016] Liquid level sensors are installed in the high-concentration copper temporary storage tank, the auxiliary tank, the electroplating reaction tank and the low-concentration copper temporary storage tank.

[0017] As a further improvement of the utility model, an air inlet pipe on one side outside the copper dissolving tank is connected to the bottom of the copper basket.

[0018] As a further improvement of the utility model, an air knife is installed at the connection between the air inlet duct and the bottom of the copper basket.

[0019] As a further improvement of the utility model, an overflow channel is arranged between the copper dissolving tank and the high-concentration copper temporary storage tank, and the right side of the overflow channel is arranged close to the top opening and the left side is arranged close to the bottom opening.

[0020] As a further improvement of the utility model, a first row of waste pipes is installed at the bottom of the high-concentration copper temporary storage tank, and a second row of waste pipes is installed at the bottom of the low-concentration copper temporary storage tank.

[0021] As a further improvement of the utility model, a first reflux pipeline is further connected between the bottom of the copper dissolving tank and the high-concentration copper temporary storage tank.

[0022] As a further improvement of the utility model, an overflow plate is installed on one side of the copper basket, and an overflow port is opened on the top of the overflow plate.

[0023] As a further improvement of the utility model, mutual-beaming sensors are installed on both left and right sides of the top of the copper basket for use in conjunction with each other.

[0024] As a further improvement of the utility model, a pressure sensor is installed at the bottom of the copper basket.

[0025] As a further improvement of the present invention, the number of auxiliary tanks and electroplating reaction tanks are both several.

[0026] By means of the above scheme, the utility model has at least the following advantages:

[0027] The utility model can be used to treat Cu in the solution in the tank. 2+ and Fe 3+ Real-time online monitoring of concentration, control of the pump's liquid supply speed, i.e. flow rate, and dynamic regulation of Cu in the solution 2+ and Fe 3+ concentration, ensuring that the Cu 2+ and Fe 3+ The concentration is in dynamic equilibrium.

[0028] The utility model can satisfy the electroplating production line that there is enough Cu 2+ , in order to save labor costs and improve control efficiency and production efficiency.

[0029] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 This is a structural schematic diagram of a fully automatic trivalent iron copper dissolving cycle intelligent control system of the utility model;

[0032] Figure 2 yes Figure 1 Schematic diagram of the structure of the medium copper basket trough.

[0033] The meanings of the various reference numerals in the figures are as follows.

[0034] Copper dissolving tank 1, high-concentration copper temporary storage tank 2, auxiliary tank 3, electroplating reaction tank 4, low-concentration copper temporary storage tank 5, adding pipeline 6, liquid level sensor 7, air intake pipeline 8, copper basket tank 9, first waste pipe 10, high-concentration copper conveying main pipeline 11, first reflux pipeline 12, first high-concentration copper conveying branch pipeline 13, second high-concentration copper conveying branch pipeline 14, third high-concentration copper conveying branch pipeline 15, second reflux pipeline 16, first low-concentration copper conveying branch pipeline 17, second low-concentration copper conveying branch pipeline 18, second waste pipe 19, copper basket 20, copper ball 21, wind knife 22, overflow plate 23, overflow port 24. DETAILED DESCRIPTION

[0035] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0036] In order to make the technical personnel in the technical field better understand the scheme of the utility model, the technical scheme in the embodiment of the utility model will be clearly and completely described below in combination with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, rather than all the embodiments. The components of the embodiment of the utility model usually described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the utility model provided in the drawings is not intended to limit the scope of the utility model for protection, but only represents the selected embodiment of the utility model. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the utility model.

[0037] Example

[0038] like Figure 1-2 As shown,

[0039] A fully automatic trivalent iron copper dissolving circulation intelligent control system comprises a copper dissolving tank 1, a high-concentration copper temporary storage tank 2, a sub-tank 3, an electroplating reaction tank 4 and a low-concentration copper temporary storage tank 5, wherein the number of the sub-tanks 3 and the electroplating reaction tanks 4 are both several.

[0040] An addition pipe 6 is installed on one side of the top of the copper dissolving tank 1, a high-concentration copper temporary storage tank 2 is arranged on the left side of the copper dissolving tank 1, a copper basket tank 9 is installed in the copper dissolving tank 1, a plurality of copper baskets 20 are evenly installed in the copper basket tank 9 from left to right, and a plurality of copper balls 21 are evenly placed in the copper basket 20 from top to bottom.

[0041] In addition, an overflow plate 23 is installed on one side of the copper basket 20, and an overflow port 24 is opened on the top of the overflow plate 23. On both sides of the top of the copper basket 20, there are mounted corresponding sensors for use with each other, and at the bottom of the copper basket 20, there is a pressure sensor.

[0042] A high-concentration copper delivery main pipeline 11 is installed on one side of the bottom of the high-concentration copper temporary storage tank 2. The high-concentration copper delivery main pipeline 11 is connected to the bottom of the copper dissolving tank 1 through a first high-concentration copper delivery branch pipeline 13. The high-concentration copper delivery main pipeline 11 is connected to the bottom of the auxiliary tank 3 through a second high-concentration copper delivery branch pipeline 14. The top side of the auxiliary tank 3 is connected to the electroplating reaction tank 4 through a third high-concentration copper delivery branch pipeline 15. The bottom side of the electroplating reaction tank 4 is connected to the auxiliary tank 3 through a second reflux pipeline 16. The electroplating reaction tank 4 is connected to the low-concentration copper temporary storage tank 5 on the left through a first low-concentration copper delivery branch pipeline 17. The bottom side of the low-concentration copper temporary storage tank 5 is connected to the copper dissolving tank 1 through a second low-concentration copper delivery branch pipeline 18.

[0043] A first reflux pipe 12 is also connected between the bottom of the copper dissolving tank 1 and the high-concentration copper temporary storage tank 2 .

[0044] The air inlet pipe 8 on one side outside the copper dissolving tank 1 is connected to the bottom of the copper basket 20 , and an air knife 22 is installed at the connection between the air inlet pipe 8 and the bottom of the copper basket 20 .

[0045] The high-concentration copper temporary storage tank 2 and the low-concentration copper temporary storage tank 5 are both equipped with Fe 3+ Concentration monitoring sensor, a Cu 2+ Concentration monitoring sensors;

[0046] Liquid level sensors 7 are installed in the high-concentration copper temporary storage tank 2 , the auxiliary tank 3 , the electroplating reaction tank 4 and the low-concentration copper temporary storage tank 5 .

[0047] An overflow channel is arranged between the copper dissolving tank 1 and the high-concentration copper temporary storage tank 2, and the right side of the overflow channel is arranged close to the top opening and the left side is arranged close to the bottom opening.

[0048] A first row of waste pipes 10 is installed at the bottom of the high-concentration copper temporary storage tank 2 , and a second row of waste pipes 19 is installed at the bottom of the low-concentration copper temporary storage tank 5 .

[0049] The technical solution of the utility model is as follows:

[0050] The control scheme includes a copper dissolving tank 1, a high-concentration copper temporary storage tank 2, a secondary tank 3, an electroplating reaction tank 4 and a low-concentration copper temporary storage tank 5.

[0051] Copper dissolving tank 1: multiple rows of copper baskets 20 filled with copper balls, adding Fe 3+ Reacts with copper to produce Fe 2+ and the required Cu 2+ ;

[0052] High-concentration copper temporary storage tank 2: temporarily stores high-concentration copper solution from copper dissolving tank 1 and provides high-concentration copper solution for auxiliary tank 3;

[0053] Sub-tank 3: Main tank body, providing sufficient Cu for electroplating copper reaction tank 4 2+ ; When the concentration of auxiliary tank 3 is lower than the set value, it can be replenished from the high-concentration copper temporary storage tank 2;

[0054] Electroplating reaction tank 4 (main tank): This tank is used for electroplating, and the cathode consumes Cu 2+ At the same time, the anode converts Fe 2+ Oxidized to Fe 3+ The low-concentration copper solution produced after the reaction flows to the low-concentration copper temporary storage tank 5, while the high-concentration copper solution is continuously supplied from the auxiliary tank 3.

[0055] The low-concentration copper temporary storage tank 5 receives the solution after the reaction from each electroplating reaction tank 4, and continuously delivers the low-concentration copper solution to the copper dissolving tank 1 for copper dissolving.

[0056] Fe 3+ Concentration monitoring sensor: monitors the Fe3+ concentration in the high-concentration copper temporary storage tank 2 after copper dissolution to determine whether the copper is fully dissolved. At the same time, monitors the Fe3+ concentration in the low-concentration copper temporary storage tank 5. 3+ Conduct monitoring.

[0057] Cu 2+ Concentration monitoring sensor: mainly used to monitor the Cu in the auxiliary tank 3 2+ Concentration provides a determination parameter for solution circulation and circulation flow rate.

[0058] The specific control method of the utility model is as follows:

[0059] (1) As the electroplating reaction tank 4 continues to electroplating, the Cu in the auxiliary tank 3 2+ The Cu in the auxiliary tank 3 is continuously consumed. 2+ The concentration monitoring sensor monitors the Cu in the auxiliary tank 3 2+ If the fluctuation of Cu 2+ If the concentration is within the set range, it will not affect the efficiency and effect of electroplating. At this time, only the auxiliary tank 3 and the electroplating reaction tank 4 are circulating the solution. That is, the pump of the auxiliary tank 4 continuously supplies liquid from the auxiliary tank 3 to the electroplating reaction tank 4, and the filter barrel filters and removes impurities from the solution. The hand valve is always open, and the flow meter monitors the flow. The flow can be controlled by the pump frequency conversion or the hand valve. After the electroplating, the solution in the electroplating reaction tank is Cu 2+ A portion of it is consumed and flows back into the auxiliary tank 3 for mixing circulation.

[0060] (2) If Cu 2+ The concentration monitoring sensor detects the Cu 2+ When the concentration is lower than the set threshold, the electric ball valve (or pneumatic ball valve or electric / pneumatic diaphragm valve or other automatic valves) between the high-concentration copper temporary storage tank 2 and the auxiliary tank 3 is opened, and the solution in the high-concentration copper temporary storage tank 2 is transported to the auxiliary tank 3 through the pump, so that the Cu in the auxiliary tank 3 2+ At the same time, the low-concentration copper electroplating solution in the electroplating reaction tank 4 is no longer circulated to the auxiliary tank 3, but by opening the electric ball valve (or pneumatic ball valve or electric / pneumatic diaphragm valve and other automatic valves) between the electroplating reaction tank 4 and the low-concentration copper temporary storage tank 5, the low-concentration copper solution in the electroplating reaction tank 4 flows into the low-concentration copper temporary storage tank 5 through the height difference. When the solution in the low-concentration copper temporary storage tank 5 reaches a certain amount, the pump between the low-concentration copper temporary storage tank 5 and the copper dissolving tank 1 is started to transport the low-concentration copper solution to the copper dissolving tank 1 for copper dissolving. The flow rate is controlled by the pump to make the solution in the low-concentration copper temporary storage tank 5 flow into the copper dissolving tank 1 at a certain flow rate, so that the Fe in the solution3+ There is enough time for the copper ball to contact and react. The high copper concentration solution after the reaction enters the high concentration copper temporary storage tank 2 for temporary storage. The Fe 3+ The concentration monitoring sensor will detect the Fe 3+ The concentration is monitored in real time. If the high concentration copper temporary storage tank 2 is detected, Fe 3+ If the concentration is higher than the set threshold, the electric ball valve (or pneumatic ball valve or other automatic valves such as electric / pneumatic diaphragm valve) between the high-concentration copper storage tank 2 and the copper dissolving tank 1 will be opened, and the pump will pump the solution back to the copper dissolving tank 1 for copper dissolving, and the test will close or reduce the liquid supply from the low-concentration copper storage tank 5 to the copper dissolving tank 1.

[0061] (3) During the copper dissolution process, the copper balls will dissolve and tiny copper particles will fall off and sink to the bottom of the copper basket. After a long period of accumulation, it will be difficult to clean up. At this time, CDA (i.e., air inlet pipe 8) is needed to lift the tiny copper particles from the bottom and separate them from the Fe 3+ Reaction, in control, the pressure state is determined by the pressure sensor at the CDA outlet. When the pressure is greater than the set value, the flow rate of CDA is increased, and when the pressure is less than the set value, the flow rate of CDA is reduced.

[0062] (4) A cross-beam sensor is installed on both sides of the copper basket. The copper basket is a mesh basket to facilitate contact between the solution and the copper balls. Holes are opened on the copper basket. When the copper balls are consumed for a long time and fall below the set position, the sensor alarms. At this time, the copper basket needs to be taken out to replenish the copper balls. A pressure sensor can also be installed at the bottom of the copper basket. When the pressure sensor value is lower than the set value, the copper balls can be replenished.

[0063] (5) The HH in the liquid level sensor 7 in the auxiliary tank 3 is used to monitor the highest liquid level of the tank body to prevent the liquid in the auxiliary tank 3 from exceeding the tank body and flowing out to cause waste and pollution. The LL in the liquid level sensor 7 in the auxiliary tank 3 is used to monitor the lowest liquid level to prevent the liquid level in the auxiliary tank 3 from being too low to supply the electroplating reaction tank 4. When the HH in the liquid level sensor 7 in the auxiliary tank 3 alarms, the electric ball valve (or pneumatic ball valve or other automatic valves such as electric / pneumatic diaphragm valve) between the concentrated copper temporary storage tank and the auxiliary tank is closed. When the LL in the liquid level sensor 7 in the auxiliary tank 3 alarms, it is necessary to open the electric ball valve (or pneumatic ball valve or other automatic valves such as electric / pneumatic diaphragm valve) between the high-concentration copper temporary storage tank 2 and the auxiliary tank 3 in time to replenish the solution in the auxiliary tank 3.

[0064] (6) HH in the liquid level sensor 7 in the electroplating reaction tank 4 (main tank) is used to monitor the highest liquid level to prevent the liquid in the electroplating reaction tank 4 from exceeding the tank body and flowing out to cause waste and pollution. WL in the liquid level sensor 7 in the electroplating reaction tank 4 is the working liquid level, which is used to ensure that the parts to be plated are completely immersed in the solution. During operation, the liquid level in the electroplating reaction tank 4 can be kept stable at the working liquid level. If certain position factors cause the liquid level to be too high, the HH in the liquid level sensor 7 in the electroplating reaction tank 4 will alarm, and the pump can be controlled to reduce the supply flow to restore the solution in the electroplating reaction tank to the working liquid level. When the liquid level is lower than the working liquid level, the pump between the auxiliary tank and the electroplating reaction tank is controlled to increase the flow rate to restore the liquid level to the working liquid level and maintain it.

[0065] (7) The HH in the liquid level sensor 7 in the low-concentration copper temporary storage tank 5 is mainly used to prevent the liquid in the tank from exceeding the tank body and flowing out to cause waste and pollution. If the volume of the low-concentration copper temporary storage tank is sufficient to accommodate all the solution, the HH in the liquid level sensor 7 in the low-concentration copper temporary storage tank 5 can be cancelled. When the LL in the liquid level sensor 7 in the low-concentration copper temporary storage tank 5 alarms, the pump is turned off to prevent dry pumping and damage to the pump.

[0066] (8) The HH in the liquid level sensor 7 in the high-concentration copper temporary storage tank 2 is mainly used to prevent the liquid in the tank from exceeding the tank body and flowing out to cause waste and pollution. If the volume of the temporary storage tank is sufficient to accommodate all the solutions, the HH in the liquid level sensor 7 in the high-concentration copper temporary storage tank 2 can be cancelled. When the LL in the liquid level sensor 7 in the high-concentration copper temporary storage tank 2 alarms, the pump is turned off to prevent dry pumping and damage to the pump.

[0067] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly referring to the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0068] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection: it can be a mechanical connection, an electrical connection, a direct connection, an indirect connection through an intermediate medium, or the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0069] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as within the protection scope of the present invention.

Claims

1. A fully automatic ferric iron copper dissolving circulation intelligent control system, comprising a copper dissolving tank (1), a high-concentration copper temporary storage tank (2) and an electroplating reaction tank (4); Features: It also includes a secondary tank (3) and a low-concentration copper temporary storage tank (5); An addition pipe (6) is installed on one side of the top of the copper dissolving tank (1), a high-concentration copper temporary storage tank (2) is arranged on the left side of the copper dissolving tank (1), a copper basket tank (9) is installed in the copper dissolving tank (1), a plurality of copper baskets (20) are evenly installed in sequence from left to right in the copper basket tank (9), and a plurality of copper balls (21) are evenly placed in sequence from top to bottom in the copper basket (20); A high-concentration copper transport main pipeline (11) is installed on one side of the bottom of the high-concentration copper temporary storage tank (2); the high-concentration copper transport main pipeline (11) is connected to the bottom of the copper dissolving tank (1) through a first high-concentration copper transport branch pipeline (13); the high-concentration copper transport main pipeline (11) is connected to the bottom of the auxiliary tank (3) through a second high-concentration copper transport branch pipeline (14); the top side of the auxiliary tank (3) is connected to the electroplating reaction tank (4) through a third high-concentration copper transport branch pipeline (15); the bottom side of the electroplating reaction tank (4) is connected to the auxiliary tank (3) through a second reflux pipeline (16); the electroplating reaction tank (4) is connected to the low-concentration copper temporary storage tank (5) on the left side through a first low-concentration copper transport branch pipeline (17); and the bottom side of the low-concentration copper temporary storage tank (5) is connected to the copper dissolving tank (1) through a second low-concentration copper transport branch pipeline (18); The high-concentration copper temporary storage tank (2) and the low-concentration copper temporary storage tank (5) are both equipped with Fe 3+ A concentration monitoring sensor is installed in the auxiliary tank (3) with a Cu 2+ Concentration monitoring sensors; Liquid level sensors (7) are installed in the high-concentration copper temporary storage tank (2), the auxiliary tank (3), the electroplating reaction tank (4) and the low-concentration copper temporary storage tank (5).

2. A fully automatic ferric iron copper dissolving cycle intelligent control system as claimed in claim 1, characterized in that: An air inlet pipe (8) on one side outside the copper dissolving tank (1) is connected to the bottom of the copper basket (20).

3. A fully automatic ferric iron copper dissolving cycle intelligent control system as claimed in claim 2, characterized in that: An air knife (22) is installed at the connection between the air inlet pipe (8) and the bottom of the copper basket (20).

4. A fully automatic ferric iron copper dissolving cycle intelligent control system as claimed in claim 1, characterized in that: An overflow channel is arranged between the copper dissolving tank (1) and the high-concentration copper temporary storage tank (2), and the right side of the overflow channel is arranged close to the top opening and the left side is arranged close to the bottom opening.

5. A fully automatic ferric iron copper dissolving cycle intelligent control system as claimed in claim 1, characterized in that: A first waste discharge pipe (10) is installed at the bottom of the high-concentration copper temporary storage tank (2), and a second waste discharge pipe (19) is installed at the bottom of the low-concentration copper temporary storage tank (5).

6. A fully automatic ferric iron copper dissolving cycle intelligent control system as claimed in claim 1, characterized in that: A first reflux pipeline (12) is also connected between the bottom of the copper dissolving tank (1) and the high-concentration copper temporary storage tank (2).

7. A fully automatic ferric iron copper dissolving cycle intelligent control system as claimed in claim 1, characterized in that: An overflow plate (23) is also installed on one side of the copper basket (20), and an overflow port (24) is opened on the top of the overflow plate (23).

8. A fully automatic ferric iron copper dissolving cycle intelligent control system as claimed in claim 1, characterized in that: On both sides of the top of the copper basket (20), there are mounted opposite-radiation sensors for use in conjunction with each other.

9. A fully automatic ferric iron copper dissolving cycle intelligent control system as claimed in claim 1, characterized in that: A pressure sensor is installed at the bottom of the copper basket (20).

10. A fully automatic ferric iron copper dissolving cycle intelligent control system as claimed in claim 1, characterized in that: The number of the auxiliary tanks (3) and the number of the electroplating reaction tanks (4) are both several.

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