Testing device and testing system
By introducing test devices of switch modules, fault simulation modules and gate modules into the battery management system, the battery failure is simulated and automated control is carried out, and the problem of insufficient test completeness of the battery management system is solved, improving the accuracy and reliability of the test results reduces the cost and difficulty of testing.
Patent Information
- Application Number
- CN202420150592.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-22
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-01-22
AI Technical Summary
The existing battery management system has insufficient test completeness during the testing process, resulting in large errors in the test results and actual results, increasing the testing cost and reducing the reliability of the equipment.
Provide a test device, including a switch module, a fault simulation module and a gate module. The fault simulation module can simulate the fault type of the switch module, and test it by connecting it with the object to be tested, so as to improve the accuracy and reliability of the test results, and through The controller and the host computer realize automated control and fault signal configuration.
It improves the accuracy and reliability of the test results of the tested object, makes the test results closer to the actual assembly effect, reduces the difficulty and cost of testing, and enhances the functional completeness and reliability of the battery management system.
Smart Images

Figure CN222189400U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of battery technology, and in particular to a testing device and a testing system. Background Art
[0002] Battery management systems are widely used in electronic devices, such as electric cars, electric airplanes, electric ships, and electric tools. Battery management systems can be used to manage, monitor, and protect batteries. A battery is a device that stores energy and releases it when needed. The task of a battery management system is to extend the life of the battery by controlling the charging and discharging of the battery and to ensure that it is safe and reliable.
[0003] In the development of battery technology, battery management systems usually need to be tested before they can be installed in electronic equipment for use. How to improve the testing completeness of battery management systems has always been a research direction in battery technology. Utility Model Content
[0004] In view of the above problems, the present application provides a testing device and a testing system, which can improve the testing completeness of the object under test.
[0005] In a first aspect, the present application provides a test device. The test device includes a switch module, a fault simulation module and a first gating module. The switch module includes a control unit. The fault simulation module is used to simulate the fault type of the switch module. The first gating module is used to selectively connect one of the control unit of the switch module and the fault simulation module to a test object.
[0006] In the above scheme, it includes a switch module, a fault simulation module and a first selection module. The fault simulation module can simulate the fault of the switch module, so that the object under test can adjust the battery based on the simulated fault, which is beneficial to improve the accuracy of the test results of the object under test. In addition, the object under test can also be connected to the switch module, so that the test results are closer to the actual measured results in the electrical device, thereby improving the reliability of the object under test.
[0007] In some embodiments, the fault simulation module includes a plurality of sub-simulation modules, and the plurality of sub-simulation modules are used to simulate a plurality of fault types of the switch module. The test device further includes a second gating module. The second gating module is used to selectively connect one of the plurality of sub-simulation modules to the first gating module.
[0008] In the above scheme, multiple sub-simulation modules are provided to realize multiple fault types, thereby reducing the difficulty of making each sub-simulation module, improving the accuracy of the test results of the object under test, and further improving the reliability of the object under test.
[0009] In some embodiments, the testing device further includes a controller, and the controller is used to control the first gating module and the fault simulation module.
[0010] In the above scheme, a controller is provided to realize automatic control of the test device, thereby reducing the test difficulty and improving the test efficiency.
[0011] In some embodiments, the test device further comprises a host computer, which is used to configure the fault signal. The controller is used to receive the fault signal and control the first gating module and the fault simulation module according to the fault signal.
[0012] In the above scheme, by setting up a host computer, the test device can adjust the fault simulation module according to the test needs to obtain more test structures and further improve the reliability of the object under test.
[0013] In some embodiments, the fault simulation module includes multiple sub-simulation modules, the sub-simulation modules include a first sub-simulation module, the first sub-simulation module includes a first resistor, the first end of the first resistor and the first end of the control part of the switch module are selectively connected to the first end of the object under test through a first selection module, and the second end of the first resistor and the second end of the control part of the switch module are both connected to the second end of the object under test.
[0014] In the above scheme, the first sub-simulation module is set to obtain the test result when the tested object generates current anomaly on the switch module, thereby improving the accuracy of the tested object in detecting the service life of the switch module when the switch module generates current anomaly.
[0015] In some embodiments, the first resistor includes an adjustable resistor.
[0016] In the above solution, by setting the adjustable resistor, the fault simulation module can simulate the fault types at different fault currents, thereby further improving the accuracy of the test results of the object under test.
[0017] In some embodiments, the fault simulation module includes a plurality of sub-simulation modules, the sub-simulation modules include a second sub-simulation module, and the second sub-simulation module is used to simulate at least one of a ground fault, a short power fault, and an open circuit fault. The ground fault includes a control unit of the switch module shorting the ground terminal, the short power fault includes a control unit of the switch module shorting the power supply, and the open circuit fault includes a control unit of the switch module shorting the open circuit terminal.
[0018] The second sub-simulation module includes a first power supply module and a third gating module. The first end of the first power supply module and one end of the control unit of the switch module are selectively connected to the first end of the object under test through the first gating module, and the second end of the control unit of the switch module is connected to the second end of the object under test. The third gating module is used to selectively connect one of the second end of the first power supply module and the open circuit end to the second end of the object under test.
[0019] In the above scheme, by providing the first power supply module and the third gating module, the second sub-simulation module can simulate multiple fault types, thereby reducing the number of sub-simulation modules to be arranged and improving the integration of the test device.
[0020] In some embodiments, the first power module is used to provide a voltage of 0V to 60V.
[0021] In the above solution, different fault types are simulated by adjusting the voltage value provided by the first power supply module, and the redundancy setting of the first power supply is reduced, thereby reducing the cost of the first power supply and further reducing the manufacturing cost of the test device.
[0022] In some embodiments, the fault simulation module includes a plurality of sub-simulation modules, the sub-simulation modules include a third sub-simulation module, and the third sub-simulation module is used to simulate at least one of a sticking fault and a failure fault. The sticking fault includes the switch module remaining turned on, and the failure fault includes the switch module remaining turned off.
[0023] The third sub-simulation module includes a second resistor and a second power supply module. The first end of the second resistor and the first end of the control unit of the switch module are selectively connected to the first end of the object under test through the first gating module, and the second end of the second resistor and the second end of the control unit of the switch module are both connected to the second end of the object under test. The second power supply module is connected to the first end and the second end of the control unit of the switch module.
[0024] In the above scheme, the second resistor and the second power module are provided to simplify the simulation difficulty, thereby reducing the manufacturing cost. In addition, the second resistor can simulate the on and off states of the control end of the switch module, so that the battery management unit detects whether the control end of the switch module executes the on or off instruction, thereby avoiding the influence of ground fault, short power fault and open circuit fault on the simulation adhesion fault and simulation failure fault.
[0025] In some embodiments, the resistance value of the second resistor is equal to the resistance value of the control part of the switch module.
[0026] In the above scheme, the above settings are used to improve the simulation effect, thereby improving the accuracy of the test results of the object under test and further improving the reliability of the object under test.
[0027] In some embodiments, the testing device further includes a third power supply module, and the third power supply module is connected to the switch module.
[0028] In the above scheme, the third power supply module can simulate a battery in an electrical device, and the object under test can be connected to the third power supply module through a switch module so that the object under test can control the power of the third power supply module, thereby simplifying the way in which the test results of the object under test are expressed and improving test efficiency.
[0029] In some embodiments, the switch module includes a relay.
[0030] In the above scheme, it is beneficial to improve the detection accuracy of the relay by the object under test and reduce the risk of damage to the electrical device or even safety hazards caused by the relay losing control.
[0031] In a second aspect, an embodiment of the present application provides a testing system, including a battery management system and a testing device in any of the aforementioned embodiments.
[0032] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0034] Figure 1 is a structural schematic diagram of a testing device provided in an embodiment of the present application;
[0035] Figure 2 is a structural schematic diagram of another testing device provided in an embodiment of the present application;
[0036] Figure 3 is a structural schematic diagram of another testing device provided in an embodiment of the present application;
[0037] Figure 4 is a structural schematic diagram of another testing device provided in an embodiment of the present application;
[0038] Figure 5 It is a structural schematic diagram of another testing device provided in an embodiment of the present application.
[0039] Marking Description
[0040] 100. Testing device; 200. Battery management system;
[0041] 10. Switch module; 11. Control unit;
[0042] 20, fault simulation module; 21, sub-simulation module; 22, first sub-simulation module; 221, first resistor; 23, second sub-simulation module; 231, open end; 232, first power supply module; 233, third gating module; 24, third sub-simulation module; 241, second resistor; 242, second power supply module
[0043] 31. A first gating module; 32. A second gating module;
[0044] 40. Controller;
[0045] 50, host computer; 51, fault signal; 511, fault parameter; 512, fault type; 52, fault enable signal;
[0046] 60. The third power supply module. DETAILED DESCRIPTION
[0047] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.
[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.
[0049] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.
[0050] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0051] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.
[0052] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).
[0053] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.
[0054] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.
[0055] With the development of battery technology, the object under test plays an increasingly important role in electronic devices. Nowadays, with the development of the object under test, the demand for testing the object under test is becoming more and more urgent.
[0056] However, the object under test does not have corresponding test equipment during the research and development stage, and installing it in an electrical device for actual testing will not only increase the test cost, but also some test conditions cannot be configured accordingly, resulting in some test conditions being unable to be implemented, causing large errors between the test results and actual effects of the object under test, resulting in poor test completeness of the object under test.
[0057] Based on the above technical problems, the present application provides a technical solution, which includes a switch module, a fault simulation module and a first selection module. The fault simulation module can simulate the fault of the switch module, so that the object under test can regulate the battery based on the simulated fault, and the object under test can be tested without being connected to a real battery, thereby ensuring the functional reliability and completeness of the object under test before the object under test is actually assembled, and the object under test can also be connected to the switch module, so that the test results are closer to the actual measured results in the electrical device, thereby improving the reliability of the object under test.
[0058] Figure 1 It is a structural schematic diagram of a testing device provided in an embodiment of the present application. Figure 2 It is a structural diagram of another test device provided in the embodiment of the present application. It should be noted that: Figures 2 to 4 The thick line connected to the switch module is part of the circuit line of the circuit where the switch module is located.
[0059] See also Figure 1 and Figure 2 , an embodiment of the present application provides a test device 100. The test device 100 includes a switch module 10, a fault simulation module 20 and a first gating module 31. The switch module 10 includes a control unit 11. The fault simulation module 20 is used to simulate the fault type 512 of the switch module 10. The first gating module 31 is used to selectively connect one of the control unit 11 of the switch module 10 and the fault simulation module 20 to the object under test.
[0060] The test device 100 includes a switch module 10, a fault simulation module 20, and a first gating module 31. The switch module 10 can be used to control the on and off of the circuit, and the control unit 11 of the switch module 10 can control the on and off of the switch module 10. Exemplarily, when the control unit 11 of the switch module 10 controls the switch module 10 to be turned on, as the switch module 10 is turned on, the circuit forms a closed circuit. When the control unit 11 of the switch module 10 controls the switch module 10 to be turned off, as the switch module 10 is turned off, the circuit forms an open circuit.
[0061] The fault simulation module 20 is used to simulate the fault type 512 of the switch module 10. Optionally, the fault simulation module 20 itself can simulate the fault type 512 of the switch module 10. Of course, the fault simulation module 20 can be used in conjunction with the switch module 10 to simulate the fault type 512 of the switch module 10.
[0062] Optionally, the number of fault types 512 that can be simulated by the fault simulation module 20 may include one or more types.
[0063] Optionally, the number of the fault simulation modules 20 may be set to match the number of the switch modules 10 .
[0064] As an example, a fault simulation module 20 simulates a fault type 512 of a switch module 10 .
[0065] Optionally, the switch module 10 can implement different functions in the circuit. The switch modules 10 with different functions can all be simulated with fault types 512 by the corresponding fault simulation modules 20 .
[0066] The first gating module 31 is used to selectively connect one of the control unit 11 of the switch module 10 and the fault simulation module 20 to the object under test. The "selectivity" here refers to selecting one of them to be connected to the object under test. Exemplarily, the first gating module 31 can choose to connect the control unit 11 of the switch module 10 to the object under test, or the first gating module 31 chooses to connect the fault simulation module 20 to the object under test. Optionally, the object under test may include a battery management system or other circuit management devices. The embodiments of the present application are described below by taking the object under test as a battery management system 200 as an example.
[0067] It is understandable that when the first gating module 31 can choose to connect the control unit 11 of the switch module 10 and the battery management system 200, the data of the switch module 10 detected by the battery management system 200 is the data when the switch module 10 is in normal use. When the first gating module 31 chooses to connect the fault simulation module 20 to the battery management system 200, the data detected by the battery management system 200 is the fault data corresponding to the fault type 512.
[0068] Furthermore, when the battery management system 200 detects fault data, the feedback results provided to the battery and the electrical devices in the test device 100 can be used as the test results of the battery management system 200 to determine whether the battery management system 200 has the processing capability to deal with the corresponding fault and the quality of the processing capability.
[0069] The test device 100 provided in the embodiment of the present application includes a switch module 10, a fault simulation module 20 and a first selection module 31. The fault simulation module 20 can simulate the fault of the switch module 10, so that the object under test can regulate the battery based on the simulated fault, so that the object under test can be tested without being connected to a real battery, thereby ensuring the functional reliability and completeness of the object under test before the object under test is actually assembled, and the object under test can also be connected to the switch module 10, so that the test results are closer to the actual measured results in the electrical device, thereby improving the reliability of the object under test.
[0070] In some optional embodiments, see Figure 1 and Figure 2The fault simulation module 20 includes a plurality of sub-simulation modules 21, and the plurality of sub-simulation modules 21 are used to simulate a plurality of fault types 512 of the switch module 10. The test device 100 further includes a second gating module 32. The second gating module 32 is used to selectively connect one of the plurality of sub-simulation modules 21 to the first gating module 31.
[0071] Optionally, each sub-simulation module 21 may simulate only one fault type 512. Alternatively, each sub-simulation module 21 may simulate multiple fault types 512.
[0072] Optionally, a plurality of sub-simulation modules 21 may be connected in parallel, and the second gating module 32 selects one of the sub-simulation modules 21 to be connected to the first gating module 31 .
[0073] In these optional embodiments, multiple sub-simulation modules 21 are set to simulate various fault types 512 such as current fault, ground fault, short power fault, switch module mechanical fault, etc., thereby improving the test completeness of the test object, improving the accuracy of the test results of the test object, and further improving the reliability of the test object.
[0074] In some optional embodiments, see Figure 1 and Figure 2 The testing device 100 further includes a controller 40 , and the controller 40 is used to control the first gating module 31 and the fault simulation module 20 .
[0075] Optionally, the controller 40 may control the first selection module 31 to select the line, and may also control the fault simulation module 20 so that the fault simulation module 20 starts to simulate the corresponding fault type 512 .
[0076] Optionally, the controller 40 may also control the second gating module 32 to select the sub-simulation module 21 that can implement the corresponding fault type 512 .
[0077] Optionally, the controller 40 may be integrated with the switch module 10 , the fault simulation module 20 and the first gating module 31 in one cabinet to reduce the overall volume of the testing device 100 .
[0078] In these optional embodiments, the controller 40 is provided to realize automatic control of the testing device 100, thereby reducing the testing difficulty and improving the testing efficiency.
[0079] In some optional embodiments, see Figure 1 and Figure 2 The test device 100 further includes a host computer 50, which is used to configure a fault signal 51. The controller 40 is used to receive the fault signal 51, and control the first gating module 31 and the fault simulation module 20 according to the fault signal 51.
[0080] Optionally, the host computer 50 may input a fault parameter 511 and a fault type 512 to configure the fault signal 51 .
[0081] As an example, the fault parameter 511 may include one or a combination of a fault voltage value and a fault current value. Each fault parameter 511 corresponds to a fault type 512 , for example, a fault voltage value corresponds to a fault type 512 .
[0082] Optionally, the host computer 50 may also output a fault enable signal 52 to the controller 40 , and the host computer 50 controls whether the fault simulation module 20 starts to connect to the battery management system 200 through the first gating module 31 and the second gating module 32 .
[0083] After receiving the fault signal 51 , the controller 40 may perform different actions on the first gating module 31 and the fault simulation module 20 according to different fault signals 51 , so as to simulate different fault types 512 of the switch module 10 .
[0084] In these optional embodiments, by providing the host computer 50, the test device 100 can adjust the fault simulation module 20 according to the test requirements to obtain more test structures, thereby further improving the reliability of the object under test.
[0085] In some optional embodiments, see Figure 1 and Figure 2 The fault simulation module includes multiple sub-simulation modules, the sub-simulation module 21 includes a first sub-simulation module 22, the first sub-simulation module 22 includes a first resistor 221, the first end of the first resistor 221 and the first end of the control part 11 of the switch module 10 are selectively connected to the first end of the object under test through the first selection module 31, and the second end of the first resistor 221 and the second end of the control part 11 of the switch module 10 are both connected to the second end of the object under test.
[0086] When the battery management system 200 needs to test the data of the switch module 10 , the first end of the control unit 11 of the switch module 10 is connected to the first end of the battery management system 200 through the first gating module 31 .
[0087] When the battery management system 200 needs to test the data of the fault type 512, the first end of the first resistor 221 is connected to the first end of the battery management system 200 through the first gating module 31. Further, the resistance value of the first resistor 221 can be different from the resistance value of the control unit 11 of the switch module 10, and the data of the battery management system 200 testing the fault type 512 is compared with the data of the test switch module 10, so as to verify whether the battery management system 200 can detect this fault type 512 when the switch module 10 generates this fault type 512. And judge whether the battery management system 200 can take action on the battery and other components based on the abnormal data. Optionally, the data tested by the battery management system 200 may include the current value, and the fault type 512 is the current abnormality of the switch module 10.
[0088] In these optional embodiments, the first sub-simulation module 22 is set to obtain the test result of the battery management system 200 when the switch module 10 generates current abnormality, thereby improving the accuracy of the battery management system 200 in detecting the service life of the switch module 10 when the switch module 10 generates current abnormality.
[0089] In some optional embodiments, see Figure 1 and Figure 2 , the first resistor 221 includes an adjustable resistor.
[0090] Optionally, the adjustable resistor can be adjusted manually or automatically.
[0091] As an example, the fault signal 51 input by the host computer 50 to the controller 40 may include a preset current value and a corresponding fault type 512. The controller 40 calculates the target resistance value of the adjustable resistor according to the preset current value, and adjusts the resistance value of the adjustable resistor based on the target resistance value so that the resistance value of the adjustable resistor reaches the target resistance value. Optionally, the controller 40 may include a calculation model. Optionally, the preset current value may be a fault current value.
[0092] In these optional embodiments, by setting an adjustable resistor, the fault simulation module 20 can simulate the fault type 512 at different fault currents, thereby further improving the accuracy of the test results of the battery management system 200 .
[0093] Figure 3 It is a structural schematic diagram of another testing device provided in an embodiment of the present application. Figure 4 It is a structural schematic diagram of another testing device provided in an embodiment of the present application.
[0094] In some optional embodiments, see Figure 1 , Figure 3 as well as Figure 4The fault simulation module includes a plurality of sub-simulation modules, and the sub-simulation module 21 includes a second sub-simulation module 23, and the second sub-simulation module 23 is used to simulate at least one of a ground fault, a short power fault, and an open circuit fault. The ground fault includes that the control unit 11 of the switch module 10 shorts the ground terminal, the short power fault includes that the control unit 11 of the switch module 10 shorts the power supply, and the open circuit fault includes that the control unit 11 of the switch module 10 shorts the open circuit terminal 231. Among them, the second sub-simulation module 23 includes a first power module 232 and a third gating module 233. The first end of the first power module 232 and one end of the control unit 11 of the switch module 10 are selectively connected to the first end of the object under test through the first gating module 31, and the second end of the control unit 11 of the switch module 10 is connected to the second end of the object under test. The third gating module 233 is used to selectively connect one of the second end of the first power module 232 and the open circuit terminal 231 to the second end of the object under test.
[0095] In some examples, the second sub-simulation module 23 is used to simulate any one of a ground fault, a short power fault and an open circuit fault. In other examples, the second sub-simulation module 23 is used to simulate a combination of two or three of the ground fault, the short power fault and the open circuit fault.
[0096] When simulating a ground fault and a short power fault, the voltage and current values collected by the battery management system 200 are compared with the reference voltage and current values in the battery management system 200, and corresponding actions are taken. According to the corresponding actions taken, it is determined whether the battery management system 200 can handle the ground fault and the short power fault.
[0097] Optionally, the ground terminal may include the earth, a ground point of other components, or other components.
[0098] Optionally, the short-circuited power supply may be a low-voltage power supply or a high-voltage power supply.
[0099] It should be noted that the short power failure refers to the switch module control circuit being damaged and exposed, which short-circuits the power supply in the battery management system. Of course, the short power failure can also refer to the short circuit in the internal circuit of the battery management system.
[0100] When simulating an open circuit fault, the battery management system 200 can detect whether there is current in the switch module 10 and take corresponding actions, and determine whether the battery management system 200 can handle the open circuit fault based on the detection result and the corresponding action.
[0101] The second sub-simulation module 23 includes a first power supply module 232. The first power supply module 232 may include a low-voltage power supply. Optionally, the low-voltage power supply includes a low-voltage adjustable power supply.
[0102] When the battery management system 200 needs to test the data of the switch module 10, the first end of the control unit 11 of the switch module 10 is connected to the first end of the battery management system 200 through the first selection module 31, and the second end of the control unit 11 of the switch module 10 is connected to the second end of the battery management system 200.
[0103] like Figure 1 and Figure 3 As shown, when the battery management system 200 needs to test the data of the ground fault and the short power fault, the first end of the first power module 232 is connected to the first end of the battery management system 200 through the first gating module 31, and the second end of the first power module 232 is connected to the second end of the battery management system 200 through the third gating module 233. Further, the fault signal 51 input by the host computer 50 to the controller 40 may include a preset voltage value and a corresponding fault type 512. The controller 40 selects the second sub-simulation module 23 according to the preset voltage value and the corresponding fault type 512, and controls the first power module 232 and the third gating module 233 to simulate the ground fault or the short power fault.
[0104] like Figure 1 and Figure 4 As shown, when the battery management system 200 needs to test the data of the open circuit fault, the first end of the first power module 232 is connected to the first end of the battery management system 200 through the first gating module 31, and the open circuit end 231 is connected to the second end of the battery management system 200 through the third gating module 233. Further, the fault signal 51 input by the host computer 50 to the controller 40 may include a corresponding fault type 512, and the controller 40 selects the second sub-simulation module 23 according to the corresponding fault type 512, and controls the third gating module 233 and connects the open circuit end 231 to the second end of the battery management system 200 to simulate the open circuit fault.
[0105] In these optional embodiments, the second sub-simulation module 23 is set to obtain the detection results of the object under test facing a ground fault, a short circuit fault and an open circuit fault. The first power supply module 232 and the third selection module 233 are set so that the second sub-simulation module 23 can simulate multiple fault types 512, increase the simulation working conditions that the test device 100 can provide, improve the test range of the object under test, and further improve the reliability of the object under test.
[0106] In some optional embodiments, the first power module 232 is used to provide a voltage of 0V to 60V.
[0107] Optionally, the first power module 232 can provide 0V, 0.1V, 0.5V, 1V, 5V, 10V, 20V, 30V, 40V, 50V or 60V.
[0108] When the first power module 232 provides a voltage of 0V, the second sub-simulation module 23 can simulate a ground fault type 512. When the first power module 232 provides a voltage greater than 0V, the second sub-simulation module 23 can simulate a short power fault type 512. Of course, in some other examples, the voltage value of the simulated ground fault can also be other voltage values, and the voltage value of the simulated short power fault can also be 0V.
[0109] In these optional embodiments, different fault types 512 are simulated by adjusting the voltage value provided by the first power supply module 232, and the redundant setting of the first power supply module 232 is reduced, thereby reducing the cost of the first power supply module 232 and further reducing the manufacturing cost of the test device 100.
[0110] Figure 5 It is a structural schematic diagram of another testing device provided in an embodiment of the present application.
[0111] In some optional embodiments, see Figure 1 and Figure 5 , the fault simulation module includes a plurality of sub-simulation modules, the sub-simulation module 21 includes a third sub-simulation module 24, and the third sub-simulation module 24 is used to simulate at least one of a sticking fault and a failure fault. The sticking fault includes that the switch module 10 remains turned on, and the failure fault includes that the switch module 10 remains turned off. Among them, the third sub-simulation module 24 includes a second resistor 241 and a second power supply module 242. The first end of the second resistor 241 and the first end of the control unit 11 of the switch module 10 are selectively connected to the first end of the object under test through the first gating module 31, and the second end of the second resistor 241 and the second end of the control unit 11 of the switch module 10 are both connected to the second end of the object under test. The second power supply module 242 connects the first end and the second end of the control unit 11 of the switch module 10.
[0112] Adhesion fault means that when other components send on and off instructions to the switch module 10, the switch module 10 remains in the on state. Further, when the third sub-simulation module 24 simulates the adhesion fault, the battery management system 200 collects the voltage value of the circuit at both ends of the switch module and determines whether the voltage difference is zero, so as to determine whether the battery management system 200 can collect the adhesion fault.
[0113] Failure fault refers to the switch module 10 remaining in the disconnected state when other components send on and off commands to the switch module 10. Further, when the third sub-simulation module 24 simulates a failure fault, the battery management system 200 collects the voltage value of the circuit at both ends of the switch module and determines whether the voltage difference is a reference voltage difference, so as to determine whether the battery management system 200 can collect a sticking fault.
[0114] In some examples, the third sub-simulation module 24 is used to simulate any one of a sticking fault and a failure fault. In other examples, the third sub-simulation module 24 is used to simulate a sticking fault and a failure fault.
[0115] In these optional embodiments, a third sub-simulation module 24 is provided to determine whether the object under test can identify simulated adhesion faults and failure faults, and to prompt the operator to perform maintenance actions on the switch module 10, thereby improving the detection accuracy of the switch module 10 by the object under test and improving the reliability of the object under test.
[0116] Optionally, the number of the second resistor 241 may include one or more.
[0117] When the battery management system 200 needs to test the data of the switch module 10, the first end of the control unit 11 of the switch module 10 is connected to the first end of the battery management system 200 through the first selection module 31, and the second end of the control unit 11 of the switch module 10 is connected to the second end of the battery management system 200.
[0118] It should be noted that the battery management system 200 can control the switch module 10 through the control circuit, and can collect the switch state of the switch module according to the control circuit. The battery management system can also collect the voltage value of the circuit at both ends of the switch module 10 through the collection circuit, and the battery management system analyzes and determines the working condition of the switch module 10 through the data collected by the control circuit and the collection circuit. When the test device 100 simulates an adhesion fault or a failure fault, it is necessary for the battery management system 200 to detect that the data in the control circuit of the switch module 10 is data that can normally turn on and off the switch module 10, and detect the voltage value of the circuit at both ends of the switch module 10. In order to realize the above-mentioned simulation working condition, the third sub-simulation module 24 uses the second resistor 241 to replace the control end of the switch module 10, and the battery management system 200 energizes the control end of the switch module (that is, controls the switch module 10 to be turned on), instead of energizing the second resistor, and the battery management system 200 de-energizes the control end of the switch module (that is, controls the switch module 10 to be disconnected), instead of de-energizing the second resistor. The second power module 242 is used to provide voltage to both ends of the switch module, so that the voltage value in the circuit at both ends of the switch module collected by the battery management system 200 is the voltage value provided by the second power module 242 .
[0119] When the battery management system 200 needs to test the data of the fault type 512, the first end of the second resistor 241 is connected to the first end of the battery management system 200 through the first gating module 31, and the second end of the second resistor 241 is connected to the second end of the battery management system 200. In addition, the second power module 242 is connected to the first end and the second end of the control unit 11 of the switch module 10, and the second power module 242 controls the conduction and disconnection of the switch module 10.
[0120] As an example, when the second power module 242 supplies power to the switch module 10, the switch module 10 is in the on state. At this time, when the external component sends a disconnection instruction to the switch module 10, the switch module 10 is still in the on state, thereby simulating a sticking fault.
[0121] Furthermore, the fault signal 51 input by the host computer 50 to the controller 40 may include a preset voltage and a corresponding fault type 512 , and the controller 40 controls the second power supply module 242 to continuously supply power to the switch module 10 .
[0122] As an example, when the second power module 242 does not supply power to the switch module 10, the switch module 10 is in an off state. At this time, when an external component sends a turn-on instruction to the switch module 10, the switch module 10 is still in an off state, thereby simulating a failure.
[0123] Furthermore, the fault signal 51 input by the host computer 50 to the controller 40 may include a preset voltage and a corresponding fault type 512 , and the controller 40 controls the second power module 242 to stop supplying power to the switch module 10 .
[0124] In these optional embodiments, the second resistor 241 and the second power module 242 are provided to simplify the simulation difficulty, thereby reducing the manufacturing cost. In addition, the second resistor 241 can simulate the on and off states of the control end of the switch module 10, so that the battery management unit detects whether the control end of the switch module 10 executes the on or off instruction, thereby avoiding the ground fault, short power fault and open circuit fault affecting the simulated adhesion fault and simulated failure fault.
[0125] In some optional embodiments, the resistance value of the second resistor 241 is equal to the resistance value of the control unit 11 of the switch module 10 .
[0126] It can be understood that the resistance value of the second resistor 241 and the resistance value of the control part 11 of the switch module 10 being equal may mean that the resistance value of the second resistor 241 and the resistance value of the control part 11 of the switch module 10 are approximately equal.
[0127] In these optional embodiments, the above settings are used to improve the simulation effect, thereby improving the accuracy of the test results of the object under test and further improving the reliability of the object under test.
[0128] In some optional embodiments, see Figure 1 The testing device 100 further includes a third power supply module 60 , which is connected to the switch module 10 .
[0129] Optionally, the third power module 60 may include a high voltage power supply and a low voltage power supply. For example, the third power module 60 may include a high voltage programmable power supply.
[0130] Optionally, the controller may also control the voltage of the third power supply module.
[0131] The third power supply module 60 can simulate a battery in an electrical device. The object under test can be connected to the third power supply module 60 through the switch module 10 so that the object under test can control the power of the third power supply module 60. The test results can be reflected by the adjustment of the power of the third power supply module 60 by the object under test, which facilitates the analysis and evaluation of the test results and improves the test accuracy.
[0132] In some optional embodiments, the switch module 10 includes a relay.
[0133] Optionally, the relay may include a positive relay, a negative relay, a pre-charge relay, a fast-charge positive relay, a fast-charge negative relay, a boost relay or other relays.
[0134] The above-mentioned configuration in the embodiment of the present application is helpful to improve the detection accuracy of the relay by the detected object and reduce the risk of damage to the electrical device or even safety hazards caused by the loss of control of the relay.
[0135] In a second aspect, an embodiment of the present application provides a testing system, including a battery management system and a testing device 100 in any of the aforementioned embodiments.
[0136] It should be noted that the test system provided in the embodiment of the present application has the beneficial effects of the test device 100 in any of the aforementioned embodiments. For specific details, please refer to the aforementioned description of the beneficial effects of the test device 100, and the embodiment of the present application will not be repeated here.
[0137] According to some embodiments of the present application, please refer to Figures 1 to 5 The test device 100 includes a switch module 10, a fault simulation module 20 and a first gating module 31. The switch module 10 includes a control unit 11. The fault simulation module 20 is used to simulate the fault type 512 of the switch module 10. The first gating module 31 is used to selectively connect one of the control unit 11 of the switch module 10 and the fault simulation module 20 to the object under test.
[0138] The fault simulation module 20 includes a plurality of sub-simulation modules 21, and the plurality of sub-simulation modules 21 are used to simulate a plurality of fault types 512 of the switch module 10; the test device 100 also includes a second gating module 32, which is used to selectively connect one of the plurality of sub-simulation modules 21 to the first gating module 31. The sub-simulation module 21 includes a first sub-simulation module 22, a second sub-simulation module 23, and a third sub-simulation module 24. The first sub-simulation module 22 includes an adjustable resistor, and the first end of the adjustable resistor and the first end of the control unit 11 of the switch module 10 are selectively connected to the first end of the object under test through the first gating module 31, and the second end of the adjustable resistor and the second end of the control unit 11 of the switch module 10 are both connected to the second end of the object under test. The second sub-simulation module 23 is used to simulate a ground fault, a short power supply fault, and an open circuit fault; a ground fault includes the control unit 11 of the switch module 10 shorting the ground terminal, a short power supply fault includes the control unit 11 of the switch module 10 shorting the power supply, and an open circuit fault includes the control unit 11 of the switch module 10 shorting the open circuit end 231. The second sub-simulation module 23 includes a first power module 232 and a third gating module 233. The first end of the first power module 232 and one end of the control unit 11 of the switch module 10 are selectively connected to the first end of the object under test through the first gating module 31, and the second end of the control unit 11 of the switch module 10 is connected to the second end of the object under test. The third gating module 233 is used to selectively connect the second end of the first power module 232 and one of the open circuit end 231 to the second end of the object under test. The third sub-simulation module 24 is used to simulate adhesion faults and failure faults. The adhesion fault includes that the switch module 10 remains turned on, and the failure fault includes that the switch module 10 remains disconnected. The third sub-simulation module 24 includes a second resistor 241 and a second power module 242. The first end of the second resistor 241 and the first end of the control unit 11 of the switch module 10 are selectively connected to the first end of the object under test through the first gating module 31, and the second end of the second resistor 241 and the second end of the control unit 11 of the switch module 10 are both connected to the second end of the object under test. The resistance value of the second resistor 241 is equal to the resistance value of the control unit 11 of the switch module 10 .
[0139] The second power module 242 is connected to a first end and a second end of the control unit 11 of the switch module 10 .
[0140] The test device 100 further includes a controller 40 and a host computer 50. The host computer 50 is used to configure a fault signal 51. The controller 40 is used to receive the fault signal 51 and control the first gating module 31 and the fault simulation module 20 according to the fault signal 51.
[0141] The testing device 100 further includes a third power supply module 60, and the third power supply module 60 is connected to the switch module 10. The switch module 10 includes a relay.
[0142] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.
Claims
1. A testing device, characterized in that: include: A switch module, including a control unit; A fault simulation module, used to simulate the fault type of the switch module; The first gating module is used to selectively connect one of the control unit of the switch module and the fault simulation module to the object under test.
2. The testing device according to claim 1, characterized in that: The fault simulation module includes a plurality of sub-simulation modules, and the plurality of sub-simulation modules are used to simulate a plurality of fault types of the switch module; The testing device also includes: The second gating module is used for selectively connecting one of the plurality of sub-simulation modules to the first gating module.
3. The testing device according to claim 1, characterized in that: The testing device further includes a controller, and the controller is used to control the first gating module and the fault simulation module.
4. The testing device according to claim 3, characterized in that: The test device also includes a host computer, which is used to configure the fault signal; The controller is used for receiving the fault signal and controlling the first gating module and the fault simulation module according to the fault signal.
5. The testing device according to any one of claims 1 to 4, characterized in that: The fault simulation module includes multiple sub-simulation modules, the sub-simulation modules include a first sub-simulation module, the first sub-simulation module includes a first resistor, the first end of the first resistor and the first end of the control part of the switch module are selectively connected to the first end of the object under test through the first gating module, and the second end of the first resistor and the second end of the control part of the switch module are both connected to the second end of the object under test.
6. The testing device according to claim 5, characterized in that: The first resistor includes an adjustable resistor.
7. The testing device according to any one of claims 1 to 4, characterized in that: The fault simulation module includes a plurality of sub-simulation modules, wherein the sub-simulation modules include a second sub-simulation module, wherein the second sub-simulation module is used to simulate at least one of a ground fault, a short power fault, and an open circuit fault; the ground fault includes the control unit of the switch module short-circuiting the ground terminal, the short power fault includes the control unit of the switch module short-circuiting the power supply, and the open circuit fault includes the control unit of the switch module short-circuiting the open circuit terminal; Wherein, the second sub-simulation module includes a first power supply module and a third gating module; The first end of the first power module and one end of the control unit of the switch module are selectively connected to the first end of the object under test through the first gating module, and the second end of the control unit of the switch module is connected to the second end of the object under test; The third gating module is used to selectively connect one of the second end of the first power supply module and the open end to the second end of the object under test.
8. The testing device according to claim 7, characterized in that: The first power supply module is used to provide a voltage of 0V to 60V.
9. The testing device according to any one of claims 1 to 4, characterized in that: The fault simulation module includes a plurality of sub-simulation modules, wherein the sub-simulation modules include a third sub-simulation module, wherein the third sub-simulation module is used to simulate at least one of a sticking fault and a failure fault; the sticking fault includes the switch module remaining turned on, and the failure fault includes the switch module remaining turned off; Wherein, the third sub-simulation module includes a second resistor and a second power supply module; The first end of the second resistor and the first end of the control unit of the switch module are selectively connected to the first end of the object under test through the first gating module, and the second end of the second resistor and the second end of the control unit of the switch module are both connected to the second end of the object under test; The second power supply module is connected to a first end and a second end of the control part of the switch module.
10. The testing device according to claim 9, characterized in that: The resistance value of the second resistor is equal to the resistance value of the control part of the switch module.
11. The testing device according to any one of claims 1 to 4, characterized in that: The testing device further comprises a third power supply module, and the third power supply module is connected to the switch module.
12. The testing device according to claim 1, characterized in that: The switch module includes a relay.
13. A testing system, characterized in that: The invention comprises a battery management system and a testing device as claimed in any one of claims 1 to 12.
