Semiconductor packaging equipment

Abstract

The utility model discloses semiconductor packaging equipment, and belongs to the technical field of semiconductor packaging. The device mainly comprises a base; the switching mechanism is provided with a workbench suitable for rotating, and the workbench is provided with at least two sets of molds; the device comprises a dispensing mechanism, a pressing mechanism, a discharging mechanism and a collecting mechanism, the collecting mechanism comprises a first inclined block, and the first inclined block is installed in a mold; the second inclined block is mounted in the mold; the third inclined block is mounted in the mold; the fourth inclined block is mounted in the mold; and the collecting boxes are installed on the workbench, connecting pipes are arranged on the collecting boxes, and the connecting pipes penetrate through the mold. According to the semiconductor packaging equipment provided by the invention, the glue overflowing during semiconductor press-fit packaging is collected through the collecting mechanism, and the glue is prevented from overflowing and staining the workbench and the semiconductor, so that the production quality is ensured, and the effect of collecting the overflowing glue is achieved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and specifically to a semiconductor packaging device. Background Art

[0002] Semiconductor is a material whose electrical conductivity is between that of conductors (such as metals) and insulators (such as plastics or ceramics). This intermediate property makes semiconductor materials important in electronics and electronic devices. Semiconductor packaging is the process of processing tested wafers into independent chips according to product models and functional requirements.

[0003] During the production process of semiconductors, they need to be packaged to ensure the use of the chips in the later stage;

[0004] For example, the patent with publication number CN218535384U specifically discloses a semiconductor packaging device, which places a workpiece on a lower mold on a turntable, and then moves a substrate with a chip to the bottom of a glue dispensing part through the turntable for glue dispensing;

[0005] After the substrate is glued, the cover needs to be bonded to the substrate to complete the semiconductor packaging;

[0006] However, when the cover plate is bonded to the substrate, the glue on the substrate will overflow due to extrusion, and then flow onto the lower mold or the turntable, thereby affecting the product quality. In addition, the staff is required to frequently clean the glue on the turntable, which greatly increases the labor intensity of the staff. Therefore, the overflowed glue needs to be collected and processed;

[0007] Therefore, it is necessary to provide a semiconductor packaging device to solve the above problems.

[0008] It should be noted that the above information disclosed in this background technology section is only for understanding the background technology of the present application concept, and therefore, it may contain information that does not constitute the prior art. Summary of the invention

[0009] Based on the above problems existing in the prior art, the problem to be solved by the present application is: to provide a semiconductor packaging device to achieve the effect of collecting overflowed glue.

[0010] The technical solution adopted by the present application to solve its technical problems is: a semiconductor packaging device, including a base; a switching mechanism, which is suitable for switching the processing position of the semiconductor, the switching mechanism is installed on the base, the switching mechanism has a workbench suitable for rotation, and the workbench has at least two groups of molds; a dispensing mechanism, which is suitable for dispensing operations of semiconductors, and the dispensing mechanism is installed on the base; a pressing mechanism, which is suitable for pressing and packaging operations of semiconductors, and the pressing mechanism is installed on the base; a feeding mechanism, which is suitable for feeding operations of semiconductors, and the feeding mechanism is installed on the base; a collecting mechanism, which is suitable for collecting glue overflowed during pressing, and the collecting mechanism is installed on the switching mechanism, and the collecting mechanism includes: a first inclined block, the first inclined block is installed inside the mold; a second inclined block, the second inclined block is installed inside the mold; a third inclined block, the third inclined block is installed inside the mold; a fourth inclined block, the fourth inclined block is installed inside the mold; at least two groups of collecting boxes, the collecting boxes are installed on the workbench, and a connecting pipe is provided on the collecting box, and the connecting pipe runs through the mold; wherein: inclined grooves are provided on the inclined surfaces of the first inclined block, the second inclined block, the third inclined block and the fourth inclined block.

[0011] Furthermore, the switching mechanism includes a driving motor fixedly installed inside the base, a rotating shaft is fixedly installed at the output end of the driving motor, an end of the rotating shaft away from the driving motor is connected to the workbench, and the mold is installed on the workbench.

[0012] Furthermore, the glue dispensing mechanism includes a three-axis driving part fixedly mounted on the base, and a glue dispensing part is arranged on the three-axis driving part.

[0013] Furthermore, the pressing mechanism includes a mounting frame fixedly mounted on the base, a servo motor is fixedly mounted on the mounting frame, a rotating rod is fixedly mounted on the output end of the servo motor, and a pressing plate is fixedly sleeved on the rotating rod.

[0014] Furthermore, at least two groups of air holes are provided on the pressing plate.

[0015] The beneficial effect of the present application is that the present application provides a semiconductor packaging device which collects the glue overflowing during the semiconductor press packaging through a collecting mechanism, thereby preventing the glue from overflowing and contaminating the workbench and the semiconductor, thereby ensuring the production quality and achieving the effect of collecting the overflowed glue.

[0016] In addition to the above-described purposes, features and advantages, the present application also has other purposes, features and advantages. The present application will be further described in detail with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0018] Figure 1 It is an overall schematic diagram of a semiconductor packaging device in this application;

[0019] Figure 2 for Figure 1 A schematic cross-sectional view of the whole;

[0020] Figure 3 for Figure 2 The enlarged schematic diagram of point A in the middle;

[0021] Among them, the reference numerals in the figure are:

[0022] 1. Base; 2. Glue dispensing mechanism; 21. Three-axis driving unit; 22. Glue dispensing unit; 3. Pressing mechanism; 31. Mounting frame; 32. Pressing plate; 33. Servo motor; 4. Unloading mechanism; 5. Switching mechanism; 51. Workbench; 52. Mold; 6. Collecting mechanism; 61. First inclined block; 62. Connecting pipe; 63. Collecting box; 64. Third inclined block; 65. Fourth inclined block. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0025] like Figure 1 As shown, the present application provides a semiconductor packaging device, including a base 1, on which a switching mechanism 5 is provided, and the switching mechanism 5 is used to switch the processing position of the semiconductor;

[0026] like Figure 1 As shown, the switching mechanism 5 includes a driving motor (not shown in the figure) fixedly installed inside the base 1, a rotating shaft is fixedly installed at the output end of the driving motor, and a workbench 51 is fixedly installed at one end of the rotating shaft away from the driving motor, and multiple groups of molds 52 are fixedly installed on the workbench 51 along the circumferential direction. The rotating shaft drives the workbench 51 to rotate under the drive of the driving motor, thereby driving the substrate with the chip in the mold 52 to rotate, so as to switch its processing position;

[0027] At the same time, a dispensing mechanism 2 is fixedly installed on the base 1, and the dispensing mechanism 2 is used for dispensing operation of semiconductors.

[0028] like Figure 1 As shown, the dispensing mechanism 2 includes a three-axis driving part 21 fixedly mounted on the base 1. The three-axis driving part 21 is an existing three-axis moving mechanism. The specific structure and principle are not described in detail here. A dispensing part 22 is arranged on the three-axis driving part 21. It should be noted that the dispensing part 22 can be a dispensing structure driven by a pressure pump. Specifically, the dispensing structure includes a glue container, a pressure pump is connected to the outlet pipe of the glue container, the output end of the pressure pump is connected to the dispensing head through a pipe, and the pipe is controlled to be on and off by a valve in the pipe to realize the dispensing operation;

[0029] Driven by the three-axis driving unit 21, the glue dispensing unit 22 can move in a three-dimensional space, and the glue dispensing unit 22 can perform glue dispensing operations on the semiconductor to be packaged that rotates to the bottom of the glue dispensing unit 22;

[0030] At the same time, a pressing mechanism 3 is fixedly installed on the base 1, and the pressing mechanism 3 is used for pressing and packaging operations of semiconductors;

[0031] like Figure 1-Figure 2 As shown, the pressing mechanism 3 includes a mounting frame 31 fixedly mounted on the base 1, a servo motor 33 is fixedly mounted on the mounting frame 31, a rotating rod is fixedly mounted on the output end of the servo motor 33, and a pressing plate 32 is fixedly sleeved on the rotating rod. The pressing plate 32 is provided with multiple groups of air holes, and is connected to an external adsorption device through the air holes to adsorb and fix the cover plate of the semiconductor, so that the cover plate on the pressing plate 32 is rotated to the upper end of the semiconductor to be packaged under the drive of the servo motor 33, and the semiconductor that has been completed by dispensing is packaged;

[0032] At the same time, a collecting mechanism 6 is fixedly installed on the switching mechanism 5, and the collecting mechanism 6 is used to collect the glue overflowed during the pressing;

[0033] like Figure 2-Figure 3 As shown, the collecting mechanism 6 includes a first inclined block 61 fixedly installed in the mold 52, and a second inclined block (not shown in the figure), a third inclined block 64 and a fourth inclined block 65 are respectively fixedly installed in the mold 52 to form a rectangle, and inclined grooves are provided on the inclined surfaces of the second inclined block, the third inclined block 64 and the fourth inclined block 65. When the glue overflows to the surroundings due to extrusion, the glue flowing to the second inclined block and the fourth inclined block 65 flows to the first inclined block 61 through the inclined grooves, and the glue flowing to the third inclined block 64 flows to the first inclined block 61 through the inclined grooves of the third inclined block 64 and the second inclined block;

[0034] At the same time, a plurality of collection boxes 63 are detachably installed along the circumferential direction on the workbench 51. The collection boxes 63 are provided with connecting pipes 62, which penetrate the mold 52 and connect with the inclined groove of the first inclined block 61, so that the glue flowing to the first inclined block 61 flows to the collection box 63 through the connecting pipes 62 for collection. It should be noted that the collection box 63 is made of heat-insulating materials, such as rubber and plastic heat-insulating cotton and rock wool, so as to slow down the solidification speed of the glue in the collection box 63;

[0035] A material unloading mechanism 4 is fixedly mounted on the base 1, and the material unloading mechanism 4 is used for unloading operations of semiconductors, specifically:

[0036] like Figure 1 As shown, the unloading mechanism 4 is used to absorb the packaged semiconductor. The unloading mechanism 4 is composed of a manipulator and a suction cup. When unloading, the manipulator sucks the packaged semiconductor through the suction cup and moves it to the unloading area for unloading;

[0037] To sum up, when performing semiconductor packaging, the substrate with the chip is placed in the mold 52 and transported to the bottom of the dispensing mechanism 2 through the switching mechanism 5 for dispensing operation. Then the switching mechanism 5 transports the substrate after dispensing to the bottom of the pressing mechanism 3 for pressing and packaging. At the same time, the collecting mechanism 6 collects the glue overflowing during pressing to prevent the overflowing glue from affecting the production quality. Finally, the switching mechanism 5 transports the packaged substrate to the bottom of the unloading mechanism 4 for unloading operation.

[0038] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A semiconductor packaging device, characterized in that: include: Base (1); A switching mechanism (5), the switching mechanism (5) being suitable for switching a processing position of a semiconductor, the switching mechanism (5) being mounted on the base (1), the switching mechanism (5) having a worktable (51) suitable for rotation, the worktable (51) having at least two groups of molds (52); A glue dispensing mechanism (2), the glue dispensing mechanism (2) being suitable for glue dispensing operations on semiconductors, the glue dispensing mechanism (2) being mounted on the base (1); A pressing mechanism (3), the pressing mechanism (3) being suitable for a pressing packaging operation of a semiconductor, the pressing mechanism (3) being mounted on the base (1); A material unloading mechanism (4), the material unloading mechanism (4) being suitable for unloading operations of semiconductors, the material unloading mechanism (4) being mounted on the base (1); A collecting mechanism (6), the collecting mechanism (6) being adapted to collect glue overflowing during pressing, the collecting mechanism (6) being mounted on the switching mechanism (5), and the collecting mechanism (6) comprising: A first inclined block (61), the first inclined block (61) being installed inside the mold (52); a second inclined block, the second inclined block being installed inside the mold (52); a third inclined block (64), the third inclined block (64) being installed inside the mold (52); a fourth inclined block (65), the fourth inclined block (65) being installed inside the mold (52); at least two groups of collecting boxes (63), the collecting boxes (63) being mounted on the workbench (51), the collecting boxes (63) being provided with connecting tubes (62), the connecting tubes (62) penetrating the mold (52); Wherein: the inclined surfaces of the first inclined block (61), the second inclined block, the third inclined block (64) and the fourth inclined block (65) are all provided with inclined grooves.

2. A semiconductor packaging device according to claim 1, characterized in that: The switching mechanism (5) comprises a driving motor fixedly mounted inside the base (1), a rotating shaft fixedly mounted on the output end of the driving motor, an end of the rotating shaft away from the driving motor being connected to the workbench (51), and the mould (52) being mounted on the workbench (51).

3. The semiconductor packaging device according to claim 1, characterized in that: The glue dispensing mechanism (2) comprises a three-axis driving part (21) fixedly mounted on the base (1), and a glue dispensing part (22) is provided on the three-axis driving part (21).

4. The semiconductor packaging device according to claim 1, characterized in that: The pressing mechanism (3) comprises a mounting frame (31) fixedly mounted on the base (1), a servo motor (33) fixedly mounted on the mounting frame (31), a rotating rod fixedly mounted on the output end of the servo motor (33), and a pressing plate (32) fixedly sleeved on the rotating rod.

5. A semiconductor packaging device according to claim 4, characterized in that: The pressing plate (32) is provided with at least two groups of air holes.

Images