Mounting head module of full-automatic light splitting and chip mounting all-in-one machine

Abstract

The utility model is suitable for the technical field of chip mounting, and provides a mounting head module of a full-automatic light splitting and chip mounting all-in-one machine, which comprises a turret motor, a turret seat and a suction nozzle assembly, the turret motor is installed on the turret base, the output end of the turret motor is connected with the main shaft through a coupler, the main shaft is of a hollow structure and is in air channel communication with the vacuum connector and the positive pressure connector through a converging block, a suction nozzle installation base is installed at the end of the main shaft, and a plurality of suction nozzle assemblies are installed on the suction nozzle installation base at equal included angles. The rotary tower base is further provided with a downward-pressing suction device and a downward-pressing attaching device, and the downward-pressing suction device and the downward-pressing attaching device are used for driving the suction nozzle assembly to move downwards when the suction nozzle assembly moves to the suction station and the attaching station respectively. The automation degree is high, and the chip mounting efficiency is greatly improved.

Description

Technical Field

[0001] The utility model belongs to the field of patch technology, and in particular relates to a mounting head module of a full-automatic spectroscopic patch integrated machine. Background Art

[0002] The LED patch machine in the prior art includes a feeding device and a patch device. The vibration plate conveys the patch components to the feeding device in sequence through vibration. The patch components are selected and adjusted by the feeding device and then weaved into the weaving component of the patch device. The patch device absorbs the patch components on the weaving component and attaches the patch components to the corresponding positions of the board to be pasted, thereby completing the patch operation.

[0003] However, due to the existing process technology, the existing LED placement machines first use the splitter and tape machine to weave the LED into the carrier tape, and then the placement machine absorbs the LED from the carrier tape. The LED placement machine requires manual placement of the board to be mounted on the carrier table for the placement operation, which limits the placement rate of the LED placement machine. Utility Model Content

[0004] The purpose of the embodiment of the utility model is to provide a mounting head module of a fully automatic spectroscopic chip mounting machine, aiming to solve the technical problems existing in the prior art mentioned in the background technology.

[0005] The embodiment of the utility model is implemented as follows: a mounting head module of a fully automatic spectroscopic chip mounting integrated machine, the mounting head module comprising a turret motor, a turret seat and a nozzle assembly;

[0006] The turret motor is installed on the turret seat, and the output end of the turret motor is connected to the main shaft through a coupling. The main shaft is a hollow structure, and the main shaft maintains air communication with the vacuum joint and the positive pressure joint through a manifold. A nozzle mounting seat is installed at the end of the main shaft, and a plurality of nozzle assemblies are installed at equal angles on the nozzle mounting seat. Each of the nozzle assemblies is connected to the main shaft through an air path structure. A switching valve connected to its internal air path is installed on the nozzle assembly, and a gas sealing assembly is installed at the end of the main shaft;

[0007] A nozzle rotating motor is also installed on the turret seat through a motor plate, and the nozzle rotating motor is used to drive the nozzle assembly to rotate through a driving structure;

[0008] A downward-pressing suction device and a downward-pressing laminating device are also installed on the turret seat. The downward-pressing suction device and the downward-pressing laminating device are respectively used to drive the suction nozzle assembly downward when the suction nozzle assembly moves to the suction station and the laminating station.

[0009] Preferably, the driving structure includes a connecting sleeve, a small gear and a large gear. The connecting sleeve is connected to the nozzle rotating motor through a synchronous belt. The large gear is fixed on the connecting sleeve, and the large gear is connected to the small gear installed on the nozzle assembly.

[0010] Preferably, the downward pressure suction device includes a material taking motor and a pressure arm, the output end of the material taking motor is equipped with a gear, the pressure arm is slidably installed on the turret seat, and the rack at the end of the pressure arm is meshed with the gear for transmission.

[0011] Preferably, the downward pressing bonding device comprises a patch motor and a pressing arm, a gear is installed at the output end of the patch motor, the pressing arm is slidably installed on the turret seat, and the rack at the end of the pressing arm is meshed with the gear for transmission.

[0012] Preferably, the suction nozzle assembly includes a long spline shaft, a spline sleeve and a suction nozzle, the long spline shaft is slidably fitted in the spline sleeve, a locking nut ring is installed at the bottom opening of the spline sleeve, the long spline shaft is a hollow structure and is connected to the air hole opened on the spline sleeve, the bottom of the long spline shaft is connected to the suction nozzle through a silicone gasket, a spring seat is installed at the top of the long spline shaft, a spring seat is provided at the top of the spline sleeve, and a spring is provided between the spring seat and the spring seat.

[0013] Preferably, a bearing sleeve and a bearing are further provided on the outside of the spline sleeve, and the bearing cooperates with a mounting hole in the suction nozzle mounting seat.

[0014] Preferably, a prism seat and a camera assembly corresponding to the position of the prism seat are also mounted on the turret seat.

[0015] The beneficial effects of the utility model are: the automatic bonding operation of the lamp beads and the substrate can be realized continuously and efficiently, the degree of automation is high, and the patch efficiency is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the structure of a mounting head module of a fully automatic spectroscopic chip mounting machine provided by an embodiment of the utility model;

[0017] Figure 2 A cross-sectional view of a mounting head module of a fully automatic spectroscopic chip mounting machine provided by an embodiment of the utility model;

[0018] Figure 3 A cross-sectional view from another perspective of a mounting head module of a fully automatic spectroscopic chip mounting machine provided by an embodiment of the utility model;

[0019] Figure 4 A schematic structural diagram of a nozzle assembly in a placement head module of a fully automatic spectroscopic placement machine provided in an embodiment of the utility model.

[0020] In the figure: 1-turret motor, 2-coupling, 3-spindle, 4-turret seat, 5-vacuum joint, 6-positive pressure joint, 7-convective block, 8-switching valve, 9-nozzle assembly, 901-long spline shaft, 902-spline sleeve, 903-spring seat, 904-spring, 905-spring holder, 906-bearing, 907-bearing sleeve, 908-locking nut ring, 909-silicone gasket, 910-nozzle, 10-prism seat, 11-connecting sleeve, 12-gas sealing assembly, 13-nozzle rotating motor, 14-motor plate, 15-camera assembly, 16-pinion, 17-feeding motor, 18-pressing arm, 19-patch motor. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0022] It can be understood that the terms "first", "second", etc. used in the present application can be used in this article to describe various elements, but unless otherwise specified, these elements are not limited by these terms. These terms are only used to distinguish the first element from another element.

[0023] like Figure 1-3 As shown, in one embodiment, a placement head module of a fully automatic spectroscopic placement machine is proposed, and the placement head module includes a turret motor 1, a turret seat 4 and a nozzle assembly 9;

[0024] The turret motor 1 is installed on the turret seat 4, and the output end of the turret motor 1 is connected to the main shaft 3 through the coupling 2. The main shaft 3 is a hollow structure. The main shaft 3 maintains gas communication with the vacuum joint 5 and the positive pressure joint 6 through the manifold 7. A nozzle mounting seat is installed at the end of the main shaft 3. A plurality of nozzle assemblies 9 are installed at equal angles on the nozzle mounting seat. Each of the nozzle assemblies 9 is connected to the main shaft 3 through the gas path structure. A switching valve 8 connected to the internal gas path thereof is installed on the nozzle assembly 9. A gas sealing assembly 12 is installed at the end of the main shaft 3;

[0025] A nozzle rotating motor 13 is also installed on the turret seat 4 through a motor plate 14, and the nozzle rotating motor 13 is used to drive the nozzle assembly 9 to rotate through a driving structure;

[0026] The turret seat 4 is also equipped with a downward-pressing suction device and a downward-pressing bonding device, which are respectively used to drive the suction nozzle assembly 9 downward when the suction nozzle assembly 9 moves to the suction station and the bonding station.

[0027] During actual application of the embodiment of the utility model, when the nozzle assembly 9 moves to the position of the lamp bead (main BIN) that has passed the test, the suction device is pressed down to move, driving the nozzle assembly 9 downward, and then the switching valve 8 controls the nozzle assembly 9 to generate negative pressure to absorb the lamp bead below. After that, the turret motor 1 drives the nozzle assembly 9 to rotate to the bonding station, and the bonding device is pressed down to move, driving the nozzle assembly 9 downward to bond the lamp bead to the substrate. The above process is repeated to realize automatic patch operation.

[0028] like Figure 2 and 3 As shown, as a preferred embodiment of the utility model, the driving structure includes a connecting sleeve 11, a small gear 16 and a large gear. The connecting sleeve 11 is connected to the nozzle rotating motor 13 through a synchronous belt. A large gear is fixed on the connecting sleeve 11, and the large gear is connected to the small gear 16 installed on the nozzle assembly 9.

[0029] In the embodiment of the utility model, when the nozzle rotating motor 13 outputs power, the connecting sleeve 11 is driven to rotate by the action of the synchronous belt, and then the nozzle assembly 9 is rotated by the meshing action between the teeth.

[0030] like Figure 3 As shown, as another preferred embodiment of the utility model, the downward pressure suction device includes a material picking motor 17 and a pressure arm 18, the output end of the material picking motor 17 is equipped with a gear, the pressure arm 18 is slidably installed on the turret seat 4, and the rack at the end of the pressure arm 18 is meshed with the gear for transmission.

[0031] During actual application of the embodiment of the utility model, when the material taking motor 17 is powered on, it will drive the gear to rotate, and then realize the downward movement of the pressing arm 18 through the meshing action between the teeth. Similarly to the above, the downward pressing bonding device includes a patch motor 19 and a pressing arm 18. A gear is installed at the output end of the patch motor 19. The pressing arm 18 is slidably installed on the turret seat 4, and the rack at the end of the pressing arm 18 meshes with the gear for transmission.

[0032] like Figure 4 As shown, as another preferred embodiment of the utility model, the suction nozzle assembly 9 includes a long spline shaft 901, a spline sleeve 902 and a suction nozzle 910, the long spline shaft 901 is slidably fitted in the spline sleeve 902, a locking nut ring 908 is installed at the bottom opening of the spline sleeve 902, the long spline shaft 901 is a hollow structure and is connected to the air hole opened on the spline sleeve 902, the bottom of the long spline shaft 901 is connected to the suction nozzle 910 through a silicone gasket 909, a spring seat 905 is installed at the top of the long spline shaft 901, a spring seat 903 is provided at the top of the spline sleeve 902, and a spring 904 is provided between the spring seat 903 and the spring seat 905.

[0033] In the embodiment of the utility model, the spline sleeve 902 and the long spline shaft 901 can form a spline pair, which limits the long spline shaft 901 to only linear motion relative to the spline sleeve 902. In addition, the setting of the spring 904 can realize the automatic reset of the suction nozzle 910. Preferably, the outside of the spline sleeve 902 is also provided with a bearing sleeve 907 and a bearing 906, and the bearing 906 cooperates with the mounting hole in the suction nozzle mounting seat.

[0034] like Figure 1 and 2 As shown, as another preferred embodiment of the present utility model, a prism seat 10 and a camera assembly 15 corresponding to the position of the prism seat 10 are also installed on the turret seat 4.

[0035] In the embodiment of the utility model, the camera assembly 15 and the prism seat 10 can visually recognize the movement of the suction nozzle 910 and the posture of the lamp beads to improve the degree of automation.

[0036] The above embodiment of the utility model discloses a mounting head module of a fully automatic spectroscopic chip mounting integrated machine, which can continuously and efficiently realize the automatic bonding operation of lamp beads and substrates, has a high degree of automation, and greatly improves the chip mounting efficiency.

[0037] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0038] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

[0039] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A mounting head module of a fully automatic spectroscopic chip mounting machine, characterized in that: The mounting head module comprises a turret motor (1), a turret seat (4) and a suction nozzle assembly (9); The turret motor (1) is mounted on a turret seat (4); the output end of the turret motor (1) is connected to the main shaft (3) via a coupling (2); the main shaft (3) is a hollow structure; the main shaft (3) is connected to the vacuum joint (5) and the positive pressure joint (6) via a manifold (7); a nozzle mounting seat is mounted at the end of the main shaft (3); a plurality of nozzle assemblies (9) are mounted at equal angles on the nozzle mounting seat; each nozzle assembly (9) is connected to the main shaft (3) via an air path structure; a switching valve (8) connected to its internal air path is mounted on the nozzle assembly (9); and a gas sealing assembly (12) is mounted at the end of the main shaft (3); A nozzle rotating motor (13) is also mounted on the turret seat (4) via a motor plate (14), and the nozzle rotating motor (13) is used to drive the nozzle assembly (9) to rotate via a driving structure; The turret seat (4) is also provided with a downward pressure suction device and a downward pressure bonding device, and the downward pressure suction device and the downward pressure bonding device are respectively used to drive the suction nozzle assembly (9) downward when the suction nozzle assembly (9) moves to the suction station and the bonding station.

2. The mounting head module of the fully automatic spectroscopic chip mounting machine according to claim 1, characterized in that: The driving structure comprises a connecting sleeve (11), a small gear (16) and a large gear; the connecting sleeve (11) is connected to a nozzle rotating motor (13) via a synchronous belt; a large gear is fixed on the connecting sleeve (11), and the large gear is connected to a small gear (16) mounted on a nozzle assembly (9).

3. The mounting head module of the fully automatic spectroscopic chip mounting machine according to claim 1, characterized in that: The downward pressure suction device comprises a material taking motor (17) and a pressure arm (18), the output end of the material taking motor (17) is equipped with a gear, the pressure arm (18) is slidably mounted on the turret seat (4), and the rack at the end of the pressure arm (18) is meshed with the gear for transmission.

4. The placement head module of the fully automatic spectroscopic chip placement machine according to claim 1, characterized in that: The downward pressing bonding device comprises a patch motor (19) and a pressing arm (18), the output end of the patch motor (19) is equipped with a gear, the pressing arm (18) is slidably mounted on the turret seat (4), and the rack at the end of the pressing arm (18) is meshed with the gear for transmission.

5. The mounting head module of the fully automatic spectroscopic chip mounting machine according to claim 1, characterized in that: The suction nozzle assembly (9) comprises a long spline shaft (901), a spline sleeve (902) and a suction nozzle (910); the long spline shaft (901) is slidably fitted in the spline sleeve (902); a locking nut ring (908) is installed at the bottom opening of the spline sleeve (902); the long spline shaft (901) is a hollow structure and is connected to the air hole opened on the spline sleeve (902); the bottom of the long spline shaft (901) is connected to the suction nozzle (910) via a silicone gasket (909); a spring holder (905) is installed at the top end of the long spline shaft (901); a spring seat (903) is provided at the top end of the spline sleeve (902); a spring (904) is provided between the spring seat (903) and the spring holder (905).

6. The placement head module of the fully automatic spectroscopic chip placement machine according to claim 5, characterized in that: The outside of the spline sleeve (902) is also provided with a bearing sleeve (907) and a bearing (906), and the bearing (906) cooperates with a mounting hole in the suction nozzle mounting seat.

7. The placement head module of the fully automatic spectroscopic chip placement machine according to claim 1, characterized in that: A prism seat (10) and a camera assembly (15) corresponding to the position of the prism seat (10) are also mounted on the turret seat (4).

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