Cleaning device for circuit board production
By introducing the sheet spacer structure and clamping structure into the circuit board cleaning device, the friction and collision problems of circuit boards during cleaning are solved, and a cleaner and safer cleaning effect is achieved.
Patent Information
- Application Number
- CN202420789580.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-17
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-04-17
AI Technical Summary
In existing circuit board cleaning devices, there is a lack of isolation structure between the circuit boards, which leads to easy friction and collision during the cleaning process and damage to electronic components.
A cleaning device for circuit board production including an ultrasonic cleaning machine and a cleaning tank is designed, and the internal spacer structure is provided with a placement frame and a sheet material spacer structure. The spacer structure consists of the first and second placement grooves, equipped with a detachable spacer plate and The clamping structure is connected by a telescopic spring and a connecting piece to ensure that the circuit board is effectively clamped and isolated during cleaning.
Through the design of the spacer structure and clamping structure, the circuit board is properly density when cleaned, avoiding collision and friction, ensuring the cleanliness and safety of the components.
Smart Images
Figure CN222198127U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board production, in particular to a cleaning device for circuit board production. Background Art
[0002] The production process of circuit boards includes cutting, drilling, copper plating, etching, solder mask, character printing, testing, etc. During the production of circuit boards, the circuit boards need to be cleaned. Ultrasonic cleaning is a common way to clean circuit boards.
[0003] In the prior art, circuit boards are placed in an ultrasonic cleaning device, and the circuit boards are stacked together. There is no isolation structure between the circuit boards, which makes the density of the circuit boards inside the placement frame relatively high, making the circuit boards less clean during cleaning. In particular, when the stacked circuit boards are cleaned, electronic components such as resistors and capacitors on the circuit boards are prone to rub or collide with each other, causing damage to the electronic components of the circuit boards during cleaning. Utility Model Content
[0004] The purpose of the utility model is to provide a cleaning device for circuit board production to solve the problems raised in the above background technology.
[0005] The purpose of the utility model can be achieved through the following technical solutions:
[0006] A cleaning device for circuit board production includes an ultrasonic cleaning machine and a cleaning tank, wherein the cleaning tank is opened in the middle of the ultrasonic cleaning machine, a placement frame is arranged inside the cleaning tank, the side walls and the bottom surface of the placement frame are provided with water-permeable grooves, a plate spacing structure for isolating circuit boards is arranged inside the placement frame, and the plate spacing structure includes a first placement tank and a second placement tank, the first placement tank is arranged vertically on the inner wall of the placement frame, the second placement tank is arranged horizontally on the inner wall of the placement frame, the first placement tank and the second placement tank are arranged perpendicular to each other, and a spacing plate is detachably installed inside the first placement tank and the second placement tank.
[0007] As a preferred technical solution of the utility model, the spacing between the two first placement grooves on the opposite surfaces is adapted to the length of the partition plate, the width of the second placement groove is adapted to the width of the partition plate, the thickness of the first placement groove and the second placement groove is adapted to the thickness of the partition plate, and an intermediate groove is opened on the surface of each partition plate.
[0008] As a preferred technical solution of the utility model, the distance between two adjacent first placement grooves is equal, and the partition plate is slidably connected to the inside of the first placement groove, and the distance between the two first placement grooves on the opposite sides is greater than the width of the inner wall of the placement frame.
[0009] As a preferred technical solution of the utility model, the intervals between two adjacent second placement grooves are equal, and the partition plate is slidably connected to the inside of the second placement groove, and the second placement groove runs through the inner wall of the placement frame.
[0010] As a preferred technical solution of the utility model, a clamping structure is arranged inside the placement frame and inside the first placement groove and the second placement groove, and the clamping structure includes a clamping plate, and two telescopic springs are connected between the clamping plate and the spacer plate, and connecting plates are welded at both ends of the telescopic springs, and the connecting plates are connected to the spacer plate and the clamping plate.
[0011] As a preferred technical solution of the utility model, a reserved groove is opened in the middle of each of the second placement grooves, and the position of the reserved groove is aligned with the pressing plate of the spacer plate.
[0012] As a preferred technical solution of the utility model, handles are provided on both sides of the placement frame, and the height of the handles is higher than the top surface of the ultrasonic cleaning machine.
[0013] Compared with the prior art, the beneficial effects of the utility model are:
[0014] A sheet material spacing structure is provided, and the circuit boards placed inside the placement frame can be placed horizontally or vertically as needed. Not only can the circuit boards be isolated by the spacing boards, but the spacing between the spacing boards can also be adjusted according to the thickness of the circuit boards. The density of the placed circuit boards is more reasonable, and the circuit boards are cleaner.
[0015] A clamping structure is provided, and the circuit board contact between the clamping plate and the spacer plate is utilized so that the clamping plate clamps the circuit board between the spacer plates and avoids large vibration of the circuit board when the ultrasonic cleaning machine is working. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings.
[0017] Figure 1 This is the main structure diagram of the utility model;
[0018] Figure 2 This is a schematic diagram of a placement frame of the utility model;
[0019] Figure 3 This is a schematic diagram of the plate spacing structure of the utility model;
[0020] Figure 4 It is a schematic diagram of the clamping structure of the utility model.
[0021] In the figure: 1. Ultrasonic cleaning machine; 2. Cleaning tank; 3. Placement frame; 4. Sheet spacing structure; 5. Clamping structure; 6. Handle; 41. First placement slot; 42. Second placement slot; 43. Spacer plate; 44. Middle slot; 51. Pressing plate; 52. Telescopic spring; 53. Connecting plate; 54. Reserved slot. DETAILED DESCRIPTION
[0022] The technical solution of the utility model will be described clearly and completely in conjunction with the embodiments below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] Embodiment 1:
[0024] See also Figure 1-Figure 4 As shown, a cleaning device for circuit board production includes an ultrasonic cleaning machine 1 and a cleaning tank 2. The cleaning tank 2 is opened in the middle of the ultrasonic cleaning machine 1. A placement frame 3 is arranged inside the cleaning tank 2. Handles 6 are arranged on both sides of the placement frame 3, and the height of the handles 6 is higher than the top surface position of the ultrasonic cleaning machine 1. A specific cleaning liquid is placed in the cleaning tank 2 inside the ultrasonic cleaning machine 1, and the produced circuit board is placed inside the placement frame 3. The ultrasonic cleaning machine 1 can be used to clean the circuit board placed inside the placement frame 3. The side wall and bottom surface of the placement frame 3 are both provided with water-permeable grooves, and the liquid can enter the interior of the placement frame 3. The interior of the placement frame 3 is provided with There is a sheet material spacing structure 4 for isolating circuit boards, and the sheet material spacing structure 4 includes a first placement groove 41 and a second placement groove 42. The first placement groove 41 is vertically arranged on the inner wall of the placement frame 3, and the second placement groove 42 is horizontally arranged on the inner wall of the placement frame 3. It can be placed inside the first placement groove 41 and the second placement groove 42 as needed. The first placement groove 41 and the second placement groove 42 are arranged perpendicular to each other. A spacing plate 43 is detachably installed inside the first placement groove 41 and the second placement groove 42. The spacing plate 43 can not only vertically place the circuit board inside the placement frame 3, but also horizontally place the circuit board inside the placement frame 3.
[0025] In this embodiment, the spacing between the two first placement grooves 41 on the opposite sides is adapted to the length of the spacer plate 43, the width of the second placement groove 42 is adapted to the width of the spacer plate 43, the thickness of the first placement groove 41 and the second placement groove 42 is adapted to the thickness of the spacer plate 43, and the spacer plate 43 is inserted into the interior of the first placement groove 41. The spacing of the spacer plates 43 can be adjusted according to the thickness of the circuit board, so that there will be no collision between the circuit boards. The surface of each spacer plate 43 is provided with an intermediate groove 44, and the intermediate groove 44 will not affect the liquid fluctuation inside the placement frame 3.
[0026] In this embodiment, the spacing between two adjacent first placement grooves 41 is equal, and the partition plate 43 is slidably connected to the inside of the first placement groove 41. The spacing between the two first placement grooves 41 on the opposite sides is greater than the width of the inner wall of the placement frame 3, and the partition plate 43 can be inserted into the first placement groove 41.
[0027] In this embodiment, the spacing between two adjacent second placement grooves 42 is equal, and the partition plate 43 is slidably connected to the inside of the second placement groove 42. The second placement groove 42 passes through the inner wall of the placement frame 3, and the partition plate 43 is inserted into the inside of the second placement groove 42.
[0028] In this embodiment, a clamping structure 5 is provided inside the placement frame 3 and inside the first placement groove 41 and the second placement groove 42. The clamping structure 5 includes a clamping plate 51. Two telescopic springs 52 are connected between the clamping plate 51 and the spacer plate 43. Connecting pieces 53 are welded at both ends of the telescopic spring 52. The connecting pieces 53 are connected to the spacer plate 43 and the clamping plate 51. The clamping plate 51 is brought into contact with the circuit board through the action of the telescopic spring 52, thereby pressing the circuit board against the other spacer plate 43 to prevent the circuit board from being loose.
[0029] In this embodiment, a reserved groove 54 is opened in the middle of each second placement groove 42, and the position of the reserved groove 54 is aligned with the clamping plate 51 of the partition plate 43. When the vertical partition plate 43 is placed from the first placement groove 41 to the second placement groove 42, the clamping plate 51 can be pressed and placed into the reserved groove 54, so that the partition plate 43 can be placed inside the second placement groove 42.
[0030] When the utility model is in use, a specific cleaning liquid is placed in the cleaning tank 2 inside the ultrasonic cleaning machine 1, and the produced circuit board is placed inside the placement frame 3. The ultrasonic cleaning machine 1 can be used to clean the circuit board placed inside the placement frame 3. The first placement tank 41 is arranged vertically on the inner wall of the placement frame 3, and the second placement tank 42 is arranged horizontally on the inner wall of the placement frame 3. The circuit board can be placed inside the first placement tank 41 and the second placement tank 42 as needed. The spacer 43 can not only vertically place the circuit board inside the placement frame 3, but also horizontally place the circuit board on the placement frame 3. Inside the frame 3, the spacing of the spacer plates 43 can be adjusted according to the thickness of the circuit board, so that some electronic components such as capacitors and resistors on the surface of the circuit board will not collide or rub, avoiding damage to the circuit board when cleaning. The telescopic spring 52 makes the clamping plate 51 contact with the circuit board, thereby pressing the circuit board against another spacer plate 43, thereby preventing the circuit board from being in a loose state. When the vertical spacer plate 43 is placed from the first placement groove 41 to the second placement groove 42, the clamping plate 51 can be pressed and placed in the reserved groove 54, so that the spacer plate 43 can be placed inside the second placement groove 42.
[0031] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.
Claims
1. A cleaning device for circuit board production, comprising an ultrasonic cleaning machine (1) and a cleaning tank (2), wherein the cleaning tank (2) is arranged in the middle of the ultrasonic cleaning machine (1); characterized in that: A placement frame (3) is arranged inside the cleaning tank (2), and water-permeable grooves are provided on the side walls and the bottom surface of the placement frame (3). A plate spacing structure (4) for isolating circuit boards is arranged inside the placement frame (3), and the plate spacing structure (4) comprises a first placement groove (41) and a second placement groove (42). The first placement groove (41) is arranged vertically on the inner wall of the placement frame (3), and the second placement groove (42) is arranged horizontally on the inner wall of the placement frame (3). The first placement groove (41) and the second placement groove (42) are arranged perpendicular to each other, and a spacing plate (43) is detachably installed inside the first placement groove (41) and the second placement groove (42).
2. A cleaning device for circuit board production according to claim 1, characterized in that: The distance between the two first placement grooves (41) on the opposite sides is matched with the length of the spacer plate (43), the width of the second placement groove (42) is matched with the width of the spacer plate (43), the thickness of the first placement groove (41) and the second placement groove (42) is matched with the thickness of the spacer plate (43), and the surface of each spacer plate (43) is provided with an intermediate groove (44).
3. A cleaning device for circuit board production according to claim 2, characterized in that: The distance between two adjacent first placement grooves (41) is equal, and the partition plate (43) is slidably connected to the inside of the first placement groove (41), and the distance between the two first placement grooves (41) on opposite sides is greater than the width of the inner wall of the placement frame (3).
4. A cleaning device for circuit board production according to claim 2, characterized in that: The spacing between two adjacent second placement grooves (42) is equal, and the partition plate (43) is slidably connected to the inside of the second placement groove (42), and the second placement groove (42) penetrates the inner wall of the placement frame (3).
5. A cleaning device for circuit board production according to claim 3 or 4, characterized in that: A clamping structure (5) is provided inside the placement frame (3) and inside the first placement groove (41) and the second placement groove (42), and the clamping structure (5) comprises a clamping plate (51), two telescopic springs (52) are connected between the clamping plate (51) and the spacer plate (43), and connecting pieces (53) are welded at both ends of the telescopic spring (52), and the connecting pieces (53) are connected to the spacer plate (43) and the clamping plate (51).
6. A cleaning device for circuit board production according to claim 5, characterized in that: A reserved groove (54) is provided in the middle of each of the second placement grooves (42), and the position of the reserved groove (54) is aligned with the pressing plate (51) of the spacer plate (43).
7. A cleaning device for circuit board production according to claim 5, characterized in that: Handles (6) are provided on both sides of the placement frame (3), and the height of the handles (6) is higher than the top surface of the ultrasonic cleaning machine (1).