Sucker polishing device capable of collecting sweeps

Abstract

The utility model relates to the technical field of sucker polishing devices, in particular to a sucker polishing device capable of collecting sweeps. The sucker polishing device capable of collecting the scraps aims at solving the technical problems that in the prior art, the scrap collecting function is not achieved, and the single-station polishing efficiency is low. According to the technical scheme, the suction cup polishing device capable of collecting the scraps comprises a polishing table; the polishing device further comprises a rotating control assembly, a vacuum pump, a pipeline, a vacuum suction cup, a limiting ring, a scrap collecting coaming, a locking assembly, a lifting control assembly, a second motor, a polishing disc, an annular groove and a scrap collecting box. Scraps generated by polishing are blocked through the enclosure device and prevented from drifting around, the cleaning difficulty of the scraps is reduced through centralized collection of the scraps, the whole working environment is guaranteed, the whole multi-station design is adopted, feeding, discharging and polishing are carried out at the same time, polishing operation can be carried out continuously, and the polishing efficiency is improved. And the polishing efficiency is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of sucker polishing devices, in particular to a sucker polishing device capable of collecting waste chips. Background Art

[0002] In order to remove burrs, wear and oxide layers on the surface of the workpiece and improve the surface roughness of the workpiece, the use of a polishing machine is indispensable. The polishing machine drives a sponge or wool polishing disc to rotate at high speed through an electric motor. Due to the joint action of the polishing disc and the polishing agent and the friction with the surface to be polished, the paint surface pollution, oxide layer and shallow marks can be removed. During the polishing process, the workpiece is fixed by a suction cup, but the existing polishing device generally does not have a waste chip collection function. The waste chips generated by polishing are scattered everywhere and are difficult to clean. In addition, the polishing device is generally designed for a single station, and loading and unloading takes a long time, and the polishing efficiency is low. Utility Model Content

[0003] In view of the deficiencies in the prior art, the purpose of the utility model is to provide a suction cup polishing device capable of collecting waste chips, which aims to solve the technical problems of the prior art lacking a waste chip collection function and low single-station polishing efficiency.

[0004] The technical solution of the utility model is: a suction cup polishing device capable of collecting waste chips, comprising a polishing table; further comprising a rotation control component, a vacuum pump and pipeline, a vacuum suction cup, a limit ring, a chip collecting plate, a locking component, a lifting control component, a second motor, a polishing disc, an annular groove and a chip collecting box; a rotation control component is installed on the inner side of the polishing table; the upper end of the rotation control component is fixedly connected with the vacuum pump and pipeline and the vacuum suction cup which are distributed in an annular manner and equidistantly from the inside to the outside; the upper end of the polishing table is fixedly connected with the limit ring; the inner side of the limit ring is movably connected with the chip collecting plate installed on the upper end of the polishing table; the upper end of the polishing table is fixedly connected with the locking components which are symmetrically distributed on the left and right; the lifting control component is installed on the right rear side of the upper end of the polishing table; the second motor is installed on the lower end of the left side of the lifting control component; the polishing disc is installed on the lower end of the output shaft of the second motor; an annular groove is provided on the inner side of the upper end of the polishing table; and the front end of the polishing table is movably connected with the chip collecting box.

[0005] Preferably, the polishing table is placed in a stable position, the lifting control assembly is rotated to move the second motor and the polishing disk away, then the chip collecting plate is placed in the limit ring, and the chip collecting plate is fixed by the locking assembly, the lifting control assembly is rotated again to move the second motor and the polishing disk back to their original positions, the workpiece to be polished is placed on the vacuum suction cup on the front side, the workpiece is adsorbed on the vacuum suction cup by the vacuum pump and the pipeline, the rotation control assembly is rotated 90° in the annular groove, and another workpiece to be polished is placed on the other vacuum suction cup. After the vacuum suction cup with the workpiece is aligned up and down with the polishing disk, the second motor is started to drive the polishing disk to rotate, the lifting control assembly drives the second motor and the polishing disk to descend, and the rotating polishing disk polishes the workpiece, and the waste chips rush to the inner wall of the chip collecting plate, and then enter the chip collection box under the action of gravity, and finally the chip collection box is pulled out to clean the waste chips in the chip collection box.

[0006] Preferably, the rotation control component includes a connecting plate; a first motor is fixedly connected to the upper end of the connecting plate; a center disk is fixedly connected to the upper end of the output shaft of the first motor; an annular equidistantly distributed support is fixedly connected to the outer side of the center disk; a slider is fixedly connected to the outer side of the support. By utilizing the design of multiple supports, multiple vacuum suction cups can be installed, thereby achieving continuous and uninterrupted polishing operations and higher work efficiency.

[0007] Preferably, the slider is slidably connected in the annular groove; the vacuum pump and pipeline and the vacuum suction cup are respectively installed on the central disc and the upper end of the support; the vacuum pump and pipeline are connected to the vacuum suction cup, and the air in the vacuum suction cup is extracted by the vacuum pump and pipeline, so that the air pressure in the vacuum suction cup is reduced, thereby generating an internal and external pressure difference, and this pressure difference causes the external atmospheric pressure to press the workpiece tightly against the vacuum suction cup, thereby achieving the adsorption and fixation of the object.

[0008] Preferably, the locking assembly includes a fixed seat; a threaded column is fixedly connected to the upper end of the fixed seat; a locking plate is sleeved on the outer side of the threaded column and abuts against the upper end of the chip collection enclosure; a locking nut for fixing the locking plate is threadedly connected to the outer side of the threaded column, and the position of the chip collection enclosure is fixed by the locking plate, thereby preventing the chip collection enclosure from shaking and ensuring that the working range of the chip collection enclosure remains unchanged.

[0009] Preferably, the lifting control assembly includes a lifting cylinder; the retractable end on the upper side of the lifting cylinder is fixedly connected to a connecting seat; the inner side of the left end of the connecting seat is rotatably connected to a rotating arm; the connecting seat and the rotating arm are rotatably connected by a pin, and the lifting and lowering of the polishing disc is controlled by the lifting cylinder, thereby realizing the polishing operation of the workpiece.

[0010] Preferably, both the connecting seat and the upper end of the rotating arm are provided with a socket; a plug block is inserted into the socket; the plug block and the upper end of another plug block are fixedly connected with a connecting block, and when the plug block is inserted into the socket, the rotating arm and the connecting seat are positioned to ensure their stability.

[0011] Preferably, the polishing disc and the vacuum suction cup on the rear side are aligned vertically to ensure the polishing effect of the polishing disc on the upper end of the vacuum suction cup.

[0012] Beneficial effects of the utility model:

[0013] 1. The waste chips generated by polishing are blocked by the enclosure device to prevent the waste chips from floating around. The centralized collection of waste chips reduces the difficulty of cleaning the waste chips and ensures the integrity of the working environment. The overall multi-station design allows loading and unloading and polishing to be carried out simultaneously, which can continuously and uninterruptedly, and the polishing efficiency is higher;

[0014] 2. Use the chip collecting plate to further block the waste chips generated by polishing, effectively limit the range of the waste chips, and then collect the falling waste chips through the chip collecting box, which can accommodate a large amount of waste chips and reduce the frequency of cleaning the waste chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The first three-dimensional structure schematic diagram of the suction cup polishing device capable of collecting waste chips of the utility model is shown;

[0016] Figure 2 The three-dimensional structure diagram of the rotary control assembly in the suction cup polishing device capable of collecting waste chips of the present invention is shown;

[0017] Figure 3 Shown is a schematic diagram of the three-dimensional structure of the chip collecting enclosure and the locking assembly in the suction cup polishing device capable of collecting waste chips of the utility model;

[0018] Figure 4 Shown is a three-dimensional structural schematic diagram of the lifting control component in the suction cup polishing device capable of collecting waste chips of the present invention.

[0019] Explanation of the reference numerals in the accompanying drawings: 1. Polishing table; 2. Rotation control assembly; 21. Connecting plate; 22. First motor; 23. Center disc; 24. Support; 25. Slider; 3. Vacuum pump and pipeline; 4. Vacuum suction cup; 5. Limiting ring; 6. Chip collecting plate; 7. Locking assembly; 71. Fixed seat; 72. Threaded column; 73. Locking plate; 74. Locking nut; 8. Lifting control assembly; 81. Lifting cylinder; 82. Connecting seat; 83. Rotating arm; 84. Latch; 85. Socket; 86. Insert block; 87. Connecting block; 9. Second motor; 10. Polishing disc; 11. Annular groove; 12. Chip collecting box. DETAILED DESCRIPTION

[0020] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0021] See also Figure 1The utility model provides an embodiment: a suction cup polishing device capable of collecting waste chips, comprising a polishing table 1; further comprising a rotation control component 2, a vacuum pump and pipeline 3, a vacuum suction cup 4, a limit ring 5, a chip collecting plate 6, a locking component 7, a lifting control component 8, a second motor 9, a polishing disc 10, an annular groove 11 and a chip collecting box 12; a rotation control component 2 is installed inside the polishing table 1; the upper end of the rotation control component 2 is fixedly connected with annular equidistantly distributed vacuum pumps and pipelines 3 and vacuum suction cups 4 in sequence from the inside to the outside; the polishing table 1 is provided with a plurality of vacuum pumps and pipelines 3, a plurality of vacuum suction cups 4, and a plurality of vacuum pumps 3, a plurality of vacuum pumps 3, a plurality of vacuum pumps 4, and a plurality of vacuum pumps 4. A limit ring 5 is fixedly connected to the end; a chip collecting plate 6 installed on the upper end of the polishing table 1 is movably connected to the inner side of the limit ring 5; a locking assembly 7 symmetrically distributed on the left and right is fixedly connected to the upper end of the polishing table 1; a lifting control assembly 8 is installed on the right rear side of the upper end of the polishing table 1; a second motor 9 is installed on the lower left end of the lifting control assembly 8; a polishing disc 10 is installed on the lower end of the output shaft of the second motor 9; an annular groove 11 is provided on the inner side of the upper end of the polishing table 1; a chip collecting box 12 is movably connected to the front end of the polishing table 1; the polishing disc 10 and the vacuum suction cup 4 on the rear side are aligned up and down.

[0022] See also Figure 2-3 In this embodiment, the rotation control component 2 includes a connecting plate 21; a first motor 22 is fixedly connected to the upper end of the connecting plate 21; a center disk 23 is fixedly connected to the upper end of the output shaft of the first motor 22; an annular equidistantly distributed support 24 is fixedly connected to the outer side of the center disk 23; a slider 25 is fixedly connected to the outer side of the support 24; the slider 25 is slidably connected in the annular groove 11; the vacuum pump and pipeline 3 and the vacuum suction cup 4 are respectively installed on the upper ends of the center disk 23 and the support 24; the vacuum pump and pipeline 3 are connected to the vacuum suction cup 4; the locking component 7 includes a fixed seat 71; a threaded column 72 is fixedly connected to the upper end of the fixed seat 71; a locking plate 73 that abuts against the upper end of the chip collecting plate 6 is sleeved on the outer side of the threaded column 72; a locking nut 74 for fixing the locking plate 73 is threadedly connected to the outer side of the threaded column 72.

[0023] See also Figure 4 In this embodiment, the lifting control assembly 8 includes a lifting cylinder 81; a connecting seat 82 is fixedly connected to the telescopic end on the upper side of the lifting cylinder 81; a rotating arm 83 is rotatably connected to the inner side of the left end of the connecting seat 82; the connecting seat 82 and the rotating arm 83 are rotatably connected through a pin 84; a socket 85 is provided at the upper end of the connecting seat 82 and the rotating arm 83; an insert block 86 is inserted into the socket 85; a connecting block 87 is fixedly connected to the upper end of the insert block 86 and another insert block 86.

[0024] When working, the polishing table 1 is placed in a stable position, the connecting block 87 is lifted up, the insert block 86 is moved out of the socket 85, and then the rotating arm 83 inside the connecting seat 82 is rotated to move the second motor 9 and the polishing disc 10 away, and then the chip collecting plate 6 is placed in the limiting ring 5, the locking plate 73 outside the threaded column 72 is rotated and the locking plate 73 is fixed by the locking nut 74, so as to limit the chip collecting plate 6, and the rotating arm 83 is rotated again to move the second motor 9 and the polishing disc 10 back to their original positions, and the insert block 86 is inserted into the socket 85, and the workpiece to be polished is placed on the vacuum suction cup 4 on the front side, and the workpiece is adsorbed on the vacuum suction cup through the vacuum pump and the pipeline 3. On the disk 4, the first motor 22 at the upper end of the connecting plate 21 is started, driving the central disk 23 and the support 24 to rotate, and the slider 25 rotates 90° in the annular groove 11, and another workpiece to be polished is placed on the other vacuum suction cup 4. After the vacuum suction cup 4 with the workpiece is aligned up and down with the polishing disk 10, the second motor 9 is started, driving the polishing disk 10 to rotate, and the lifting cylinder 81 drives the second motor 9 and the polishing disk 10 to descend. The rotating polishing disk 10 polishes the workpiece, and the waste chips rush to the inner wall of the chip collecting plate 6, and then enter the chip collecting box 12 under the action of gravity, and finally the chip collecting box 12 is pulled out to clean the waste chips in the chip collecting box 12.

[0025] Through the above steps, the waste chips generated by polishing are blocked by the enclosure device to prevent the waste chips from flying around. By centrally collecting the waste chips, the difficulty of cleaning the waste chips is reduced, and the integrity of the working environment is ensured. The overall multi-station design allows loading and unloading and polishing to be carried out simultaneously, and polishing operations can be carried out continuously and uninterruptedly, with higher polishing efficiency.

[0026] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. A suction cup polishing device capable of collecting waste chips, comprising a polishing table (1); characterized in that: The polishing table (1) further comprises a rotation control assembly (2), a vacuum pump and a pipeline (3), a vacuum suction cup (4), a limiting ring (5), a chip collecting plate (6), a locking assembly (7), a lifting control assembly (8), a second motor (9), a polishing disc (10), an annular groove (11) and a chip collecting box (12); the rotation control assembly (2) is installed on the inner side of the polishing table (1); the upper end of the rotation control assembly (2) is fixedly connected to the vacuum pump and pipeline (3) and the vacuum suction cup (4) which are distributed in an annular manner from the inside to the outside; the upper end of the polishing table (1) is fixedly connected to the limiting ring (5), a second motor (9), a polishing disc (10), an annular groove (11) and a chip collecting box (12); the rotation control assembly (2) is fixedly connected to the upper end of the polishing table (1) The limiting ring (5) is movably connected to a chip collecting plate (6) installed on the upper end of the polishing table (1); the upper end of the polishing table (1) is fixedly connected to locking components (7) symmetrically distributed on the left and right sides; a lifting control component (8) is installed on the right rear side of the upper end of the polishing table (1); a second motor (9) is installed on the lower left end of the lifting control component (8); a polishing disc (10) is installed on the lower end of the output shaft of the second motor (9); an annular groove (11) is provided on the inner side of the upper end of the polishing table (1); and a chip collecting box (12) is movably connected to the front end of the polishing table (1).

2. A suction cup polishing device capable of collecting waste chips according to claim 1, characterized in that: The rotation control assembly (2) comprises a connecting plate (21); the upper end of the connecting plate (21) is fixedly connected to a first motor (22); the upper end of the output shaft of the first motor (22) is fixedly connected to a center disk (23); the outer side of the center disk (23) is fixedly connected to annular supports (24) distributed at equal intervals; and the outer side of the supports (24) is fixedly connected to a slider (25).

3. A suction cup polishing device capable of collecting waste chips according to claim 2, characterized in that: The slider (25) is slidably connected in the annular groove (11); the vacuum pump and pipeline (3) and the vacuum suction cup (4) are respectively installed on the central disc (23) and the upper end of the support (24); the vacuum pump and pipeline (3) are connected to the vacuum suction cup (4).

4. The suction cup polishing device capable of collecting waste chips according to claim 1, characterized in that: The locking assembly (7) comprises a fixing seat (71); a threaded column (72) is fixedly connected to the upper end of the fixing seat (71); a locking plate (73) is sleeved on the outer side of the threaded column (72) and abuts against the upper end of the chip collecting plate (6); and a locking nut (74) for fixing the locking plate (73) is threadedly connected to the outer side of the threaded column (72).

5. The suction cup polishing device capable of collecting waste chips according to claim 1, characterized in that: The lifting control assembly (8) comprises a lifting cylinder (81); a connecting seat (82) is fixedly connected to the telescopic end on the upper side of the lifting cylinder (81); a rotating arm (83) is rotatably connected to the inner side of the left end of the connecting seat (82); and the connecting seat (82) and the rotating arm (83) are rotatably connected via a latch (84).

6. The suction cup polishing device capable of collecting waste chips according to claim 5, characterized in that: The upper ends of the connecting seat (82) and the rotating arm (83) are both provided with a socket (85); an inserting block (86) is inserted into the socket (85); and the upper ends of the inserting block (86) and another inserting block (86) are fixedly connected with a connecting block (87).

7. The suction cup polishing device capable of collecting waste chips according to claim 1, characterized in that: The polishing disc (10) and the vacuum suction cup (4) on the rear side are aligned up and down.

Images