Chip continuous extraction device for dry etching machine

Abstract

The invention discloses a chip continuous extraction device for a dry etching machine, and belongs to the technical field of semiconductor manufacturing equipment. Comprising a magnetic levitation conveying mechanism and a cleaning module, the magnetic levitation conveying mechanism comprises a track base plate, a motor stator module and a magnetic levitation and air floatation supporting plate, the motor stator module is arranged in the track base plate, the magnetic levitation and air floatation supporting plate is located above the motor stator module, and a limiting ring is arranged on the edge of the magnetic levitation and air floatation supporting plate; a multi-cavity air path structure is arranged in the magnetic suspension air floatation supporting plate, a permanent magnet array is arranged at the bottom of the magnetic suspension air floatation supporting plate, air floatation micropores are formed in the upper surface of the magnetic suspension air floatation supporting plate, and the cleaning module comprises an air supply module and an air return module. According to the invention, continuous and uninterrupted assembly line type extraction and on-line processing of chips from an etching machine to downstream equipment are realized, and the production efficiency, the positioning precision and the cleanliness are remarkably improved.

Description

A continuous chip extraction device for dry etching machine Technical Field

[0001] This invention relates to semiconductor manufacturing equipment technology, and more particularly to a continuous chip extraction device for a dry etching machine. Background Technology

[0002] In semiconductor manufacturing, after chip etching, high-precision handling and cleaning are required to ensure the processing quality of subsequent processes. However, existing technologies still have significant shortcomings in continuous chip extraction and efficient dust removal, making it difficult to meet the stringent requirements of modern semiconductor processes for production efficiency and cleanliness.

[0003] First, existing chip delivery technologies have the following problems in continuous extraction:

[0004] 1. Traditional conveying methods often use mechanical contact or unidirectional airflow to transport chips, which can easily introduce particulate contamination due to contact between the chips and the tray or track;

[0005] 2. The vibration and impact during the transportation process are significant, which can easily lead to chip misalignment or damage, making it difficult to achieve high-precision continuous handling;

[0006] 3. Unidirectional or intermittent delivery methods are difficult to meet the demands of high throughput and continuous processing in modern semiconductor manufacturing.

[0007] Secondly, existing cleanroom systems have the following shortcomings in terms of closed-loop cleaning and efficient dust removal:

[0008] 1. Most cleaning devices use open airflow or local purging methods, and the air path does not form a closed loop circulation, resulting in low cleaning efficiency and particles easily re-settling onto the chip surface;

[0009] 2. An unreasonable airflow design can easily generate lateral vortices or airflow disturbances, affecting the suspension stability of the tray and the positioning accuracy of the chip;

[0010] 3. Its ability to remove micron and submicron particles is limited, making it difficult to meet high cleanliness requirements.

[0011] In summary, how to achieve continuous, stable, and low-vibration chip extraction, while simultaneously constructing an efficient, closed-loop, and low-disturbance cleanroom dust removal system, has become a key technical problem that urgently needs to be solved in semiconductor chip manufacturing. Summary of the Invention

[0012] The purpose of this invention is to provide a continuous chip extraction device for dry etching machines, which achieves high-precision continuous handling and efficient cleaning of chips through magnetic levitation contactless conveying and a closed-loop air path system, solving the problems of low continuous handling and cleaning efficiency in the prior art.

[0013] To achieve the above objectives, the present invention provides the following technical solution:

[0014] A continuous chip extraction device for a dry etching machine includes a magnetic levitation conveying mechanism, comprising a track substrate, a motor stator module, and a magnetic levitation air-bearing support plate. The motor stator module is disposed inside the track substrate, and the magnetic levitation air-bearing support plate is located above the motor stator module. A limiting ring is provided along the edge of the magnetic levitation air-bearing support plate. A multi-cavity air passage structure is provided inside the magnetic levitation air-bearing support plate. A permanent magnet array is provided at the bottom of the magnetic levitation air-bearing support plate, and air-bearing micropores are provided on the upper surface of the magnetic levitation air-bearing support plate. A cleaning module includes an air supply module and a return air module. The air supply module includes an air supply unit installed on the upper side of the track substrate and a rectifier plate disposed on the lower side of the air supply unit. A pulse air knife is provided at the outlet of the air supply unit. The return air module includes a return air flat opening and a return air pipe arranged along both sides of the track substrate. The outlet of the return air pipe is connected to the air supply unit of the air supply module to form a closed-loop air passage.

[0015] Furthermore, the air flotation micropores are composed of multiple sections, each section being supplied with air by an independent micro-air chamber.

[0016] Furthermore, the return air inlet is a slit-like structure, and its bottom is connected to the return air duct via a flange. An adjustable return air valve is installed at the front end of the return air duct.

[0017] Furthermore, the stator module is mounted on the track substrate via a vibration isolation layer made of a high-temperature resistant elastic material.

[0018] Furthermore, the stator module includes a track slider and a positioning latch. The stator module is configured as a drawer-type installation structure, which can be pulled out or pushed in as a whole along the length direction of the track base plate.

[0019] Furthermore, it also includes a nitrogen supply module, which is connected to the outlet of the air supply module via a manifold.

[0020] Furthermore, lateral flow stabilizing grooves are provided on both sides of the track substrate along the conveying direction. The flow stabilizing grooves have a concave curved surface structure and are used to guide the airflow under the tray and suppress lateral eddies.

[0021] A through-type heat dissipation cavity is provided below the track base plate. Multiple heat sinks and guide channels are arranged inside the heat dissipation cavity to evenly dissipate heat from the stator module along the conveying direction.

[0022] Furthermore, the magnetic levitation air buoy plate is provided with an annular buffer air film groove, and the airflow inside the air film groove is ejected radially to form a thin buffer air film.

[0023] Furthermore, the upper surface of the magnetic levitation air-bearing plate is provided with a centrally positioned adsorption port with weak adsorption force in the central region of the wafer. The adsorption port provides a slight suction force of no more than 10 Pa through a micro negative pressure cavity.

[0024] Compared with the prior art, the present invention has the following significant advantages:

[0025] 1. Continuous chip extraction: The magnetic levitation air-floating pallet enables contactless levitation transport. The pallet can move smoothly and continuously along the track substrate, which significantly improves the continuity of chip handling and production efficiency.

[0026] 2. High-precision positioning: Through the micro-negative pressure center adsorption port and the annular buffer gas film groove, the wafer is accurately positioned and stably supported, reducing the impact of vibration and impact on the chip position.

[0027] 3. Highly efficient and clean dust removal: The closed-loop airflow system combined with the pulse air knife design can continuously and fully cover the wafer surface, forming a highly efficient circulating airflow, avoiding particle settling and improving cleanliness.

[0028] 4. Stable and reliable operation: The vibration isolation layer and lateral flow stabilizing groove design effectively suppress vibration and lateral eddy currents during the conveying process, ensuring that the pallet is suspended stably and that the chips are not disturbed during continuous handling. Attached Figure Description

[0029] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0030] Figure 1 is a schematic diagram of the device structure of the present invention;

[0031] Figure 2 is a schematic diagram of the maglev transport mechanism;

[0032] Figure 3 is a magnified view of M in Figure 2;

[0033] Figure 4 is a magnified view of N in Figure 3;

[0034] Figure 5 is a schematic diagram of the magnetic levitation air-float support plate structure;

[0035] Figure 6 is a schematic diagram of the device structure of the present invention.

[0036] The components include: 1. Maglev conveying mechanism; 11. Track base plate; 12. Motor stator module; 13. Maglev air-bearing support plate; 131. Limiting ring; 132. Multi-cavity air passage; 133. Permanent magnet array; 134. Air-bearing micropores; 2. Cleaning module; 21. Air supply module; 211. Air supply unit; 212. Rectifier plate; 213. Pulse air knife; 22. Return air module; 221. Return air flat nozzle; 222. Return air duct; 224. Adjustable return air valve; 125. Vibration isolation layer; 126. Track slider; 127. Positioning lock; 3. Nitrogen supply module; 31. Manifold; 111. Lateral flow stabilizing groove; 112. Heat dissipation cavity; 1121. Heat sink; 1122. Guide channel; 135. Annular buffer air film groove; 136. Thin-layer buffer air film; 137. Central positioning adsorption port. Detailed Implementation

[0037] In the following description, the terms "upper" and "lower" are used for descriptive purposes only, intended to clearly illustrate the differences between multiple similar parts or states, and should not be construed as indicating or implying any limitation on their relative importance, order, or quantity.

[0038] The following detailed description of each claim in the present invention, in conjunction with the accompanying drawings and specific embodiments, illustrates its technical features and its role in the overall solution.

[0039] Referring to Figures 1 to 6, a continuous chip extraction device for a dry etching machine according to the present invention includes a magnetic levitation conveying mechanism 1, comprising a track substrate 11, a motor stator module 12, and a magnetic levitation air levitation support plate 13. The motor stator module 12 is disposed inside the track substrate 11, and the magnetic levitation air levitation support plate 13 is located above the motor stator module 12. A limiting ring 131 is provided along the edge of the magnetic levitation air levitation support plate 13. A multi-cavity air passage 132 structure is provided inside the magnetic levitation air levitation support plate 13. A permanent magnet array 133 is provided at the bottom of the magnetic levitation air levitation support plate 13, and air levitation micropores 134 are provided on the upper surface of the magnetic levitation air levitation support plate 13. The cleaning module 2 includes the air supply module 21 and the return air module 22. The air supply module 21 includes the air supply unit 211 installed on the upper side of the track base plate 11 and the rectifier plate 212 disposed on the lower side of the air supply unit 211. The pulse air knife 213 is disposed at the outlet of the air supply unit 211. The return air module 22 includes the return air flat opening 221 and the return air pipe 222 arranged along both sides of the track base plate 11. The outlet of the return air pipe 222 is connected to the air supply unit 211 of the air supply module 21 to form a closed-loop air path.

[0040] The magnetic levitation conveying mechanism 1, as the core unit for continuous wafer handling, enables contactless levitation of wafers during the conveying process, avoids particle contamination caused by traditional mechanical contact, and reduces wafer surface damage. It is a fundamental condition for ensuring continuous chip extraction.

[0041] The track base plate 11 provides stable guidance and load-bearing support, ensuring that the magnetic levitation air-bearing pallet 13 moves continuously and smoothly along the predetermined track. Its precise design can reduce pallet swaying caused by track deviation and improve continuous handling accuracy.

[0042] The motor stator module 12 provides driving force for the magnetic levitation air-bearing support plate 13. By adjusting the current and magnetic field, it enables the support plate to move continuously and at a constant speed along the track base plate 11, which is the power basis for high-precision continuous handling.

[0043] The magnetic levitation air-bearing support plate 13, its limiting ring 131, the multi-cavity air passage 132 structure, and the permanent magnet array 133 are described as follows: The magnetic levitation air-bearing support plate 13 carries the wafer; the permanent magnet array 133 provides a stable magnetic force for levitation, limiting the vertical and lateral displacement of the support plate; the limiting ring 131 restricts edge movement, preventing the support plate from shifting or tilting; the multi-cavity air passage 132 structure cooperates with the air-bearing micropores 134 to form an air film buffer while the support plate is magnetically levitated, reducing the impact of micro-vibrations on the wafer. This combination ensures the stability of the support plate's levitation, enhances the smoothness during continuous handling, and prevents the wafer from shaking or shifting.

[0044] The air-float micropores 134 form a uniform air cushion below the magnetic levitation air-float support plate 13, achieving stable air-float support and further suppressing vibration and particle interference; combined with the multi-cavity air passage 132 structure, they form segmented controlled airflow to improve suspension accuracy.

[0045] The air supply module 21, the air supply unit 211, the rectifier plate 212, and the pulse air knife 213 provide continuous airflow and pulse airflow cleaning to ensure effective removal of particles from the wafer surface. The rectifier plate 212 distributes the airflow evenly to avoid excessive local wind speed or dead zones. It works in conjunction with the magnetic levitation air-bearing support plate 13 and the air-bearing micropores 134 to ensure efficient cleaning while the support plate is suspended and transported.

[0046] The return air module 22, the return air flat outlet 221, the return air duct 222, and the closed-loop air path: circulate and recover the airflow from the supply air module 21 to form a closed loop, achieving continuous and stable airflow circulation, preventing particle fallback, and improving cleanliness. Combined with the supply air module 21 and the pulse air knife 213, they form a closed-loop clean system, achieving efficient dust removal while ensuring the stability of the pallet during suspension and handling.

[0047] The magnetic levitation conveying mechanism 1, the track base plate 11, the motor stator module 12, the magnetic levitation air-float support plate 13, and their combined air-float and magnetic levitation structure enable continuous and stable movement of the support plate in a suspended state. The air-float micropores 134, the multi-cavity air passage 132, the air supply module 21, and the pulse air knife 213 work together to achieve continuous cleaning and minimize particulate contamination. The return air module 22 and the closed-loop air passage ensure clean air circulation and improve overall cleanliness. This allows the wafer to maintain high stability and high cleanliness during continuous handling, suspension, and cleaning, achieving a systematic technical effect of continuous chip extraction and closed-loop cleaning.

[0048] Referring to Figures 1 to 6, the continuous chip extraction device for a dry etching machine provided by this invention comprises multiple segments of air-floating micro-orifices 134, each segment being supplied with air by an independent micro-air chamber. The segments and independent micro-air chambers ensure uniform airflow distribution within the air-floating micro-orifices 134, achieving balanced suspension stability of the support plate. This structure, through segmented air supply, allows for precise control of airflow pressure, further suppressing lateral eddies and micro-vibrations of the suspended support plate. When used in conjunction with the magnetic levitation air-floating support plate 13, the multi-cavity air path 132 structure, and the air supply module 21, it can achieve high-precision stable suspension of the wafer during continuous transport, while maintaining smooth air film support and enhancing the reliability of continuous chip extraction.

[0049] Referring to Figures 1 to 6, according to the present invention, a continuous chip extraction device for a dry etching machine includes a return air inlet 221 with a slit-like structure. The bottom of the inlet is connected to the return air duct 222 via a flange. An adjustable return air valve 224 is installed at the front end of the return air duct 222. The slit structure of the return air inlet 221 ensures uniform return airflow into the return air duct 222, preventing excessive local wind speeds and resulting airflow turbulence. The adjustable return air valve 224 can adjust the return air volume, ensuring airflow balance in the closed-loop system and achieving stable circulation. When used in conjunction with the air supply module 21, the pulse air knife 213, and the air flotation micropore 134, it can maintain uniform clean airflow during continuous handling, improving closed-loop cleaning efficiency while ensuring stable suspension of the pallet.

[0050] Referring to Figures 1 to 6, according to the present invention, a continuous chip extraction device for a dry etching machine includes a stator module 12 mounted on a track substrate 11 via a vibration isolation layer 125. The vibration isolation layer 125 is made of a high-temperature resistant elastic material or a composite damping material. The vibration isolation layer 125 effectively isolates the vibration generated by the motor stator module 12, preventing the vibration from being transmitted to the magnetic levitation air-bearing support plate 13 and the track substrate 11, ensuring the stable levitation of the support plate during continuous transport, reducing wafer misalignment or surface damage caused by vibration, and, in conjunction with the magnetic levitation air-bearing support plate 13, the air-bearing micropores 134, and the multi-cavity air passage 132, further optimizing the suspension accuracy of the support plate and improving the stability of continuous chip extraction.

[0051] Referring to Figures 1 to 6, a continuous chip extraction device for a dry etching machine provided by the present invention includes a stator module 12 comprising a track slider 126 and a positioning latch 127, and configured as a drawer-type installation structure. The track slider 126 and the positioning latch 127 ensure precise positioning of the stator module 12 during installation or maintenance, preventing installation deviations from affecting the suspension of the pallet. The drawer-type installation structure facilitates the maintenance and replacement of the stator module, improving system maintainability. When used in conjunction with the motor stator module 12, the track substrate 11, and the magnetic levitation air-bearing pallet 13, it ensures the reliability and stability of the continuous transport system.

[0052] Referring to Figures 1 to 6, the continuous chip extraction device for a dry etching machine provided by the present invention further includes the nitrogen supply module 3, which is connected to the outlet of the air supply module 21 via the manifold 31. The nitrogen supply module 3 provides protective airflow for the closed-loop air path to prevent wafer oxidation and particulate contamination. When used in combination with the air supply module 21, the pulse air knife 213, and the return air module 22, it can further improve wafer cleanliness. This combination ensures high wafer surface cleanliness during continuous handling, achieving a synergistic effect of continuous chip extraction and efficient dust removal.

[0053] Referring to Figures 1 to 6, according to the present invention, a continuous chip extraction device for a dry etching machine includes lateral flow stabilizing grooves 111 on both sides of the track substrate 11 along the conveying direction, forming a concave curved surface structure. The lateral flow stabilizing grooves 111 guide the airflow below the magnetic levitation air-bearing support plate 13, reducing lateral eddies and turbulence. When used in conjunction with the air-bearing micropores 134 and the multi-cavity air passage 132 structure, they improve the suspension stability of the support plate, ensure the positional accuracy of the wafer during continuous transport, and achieve airflow stability and high transport reliability during continuous chip extraction.

[0054] Referring to Figures 1 to 6, according to the present invention, a continuous chip extraction device for a dry etching machine includes a heat dissipation cavity 112 below the track substrate 11, within which heat sinks 1121 are installed. The heat dissipation cavity 112 and its internal structure ensure that the motor stator module 12 maintains a uniform temperature during continuous operation, preventing thermal expansion or temperature fluctuations from affecting the levitation accuracy and continuous transport stability of the magnetic levitation air-bearing support plate 13. Working in conjunction with the vibration isolation layer 125 and the magnetic levitation air-bearing support plate 13, it ensures the stability and reliability of the system during continuous operation.

[0055] Referring to Figures 1 to 6, according to the present invention, a continuous chip extraction device for a dry etching machine includes a magnetic levitation air-bearing support plate 13 with an annular buffer gas film groove 135 forming a thin buffer gas film 136. The annular buffer gas film groove 135 and the thin buffer gas film 136 provide additional gas support and buffering during the suspension and movement of the support plate, reducing the impact of vibration and shock on the wafer. Together with the air-bearing micropores 134, the multi-cavity air passage 132 structure, and the magnetic levitation air-bearing support plate 13, they further improve the stability of the support plate suspension and the reliability of continuous chip extraction, ensuring wafer surface safety and smooth handling during continuous transport.

[0056] Referring to Figures 1 to 6, according to the present invention, a continuous chip extraction device for a dry etching machine includes a centrally positioned adsorption port 137 on the upper surface of the magnetic levitation air-bearing support plate 13 in the central region of the wafer, which provides slight suction through a micro-negative pressure cavity. The centrally positioned adsorption port 137 and the micro-negative pressure cavity ensure precise positioning of the wafer on the magnetic levitation air-bearing support plate 13, preventing displacement even during continuous transport and cleaning. Combined with the annular buffer air film groove 135, the air-bearing micropores 134, and the multi-cavity air passage 132, this structure achieves high stability of the wafer throughout the entire process of suspension, handling, and cleaning, ensuring simultaneous continuous chip extraction and closed-loop cleaning functions, and preventing positional errors and particulate contamination during handling.

[0057] Implementation process and principle explanation

[0058] In this embodiment, the wafer is first placed on the magnetic levitation air-bearing support plate 13. The magnetic levitation air-bearing support plate 13 generates magnetic levitation force through the permanent magnet array 133 and the motor stator module 12, causing the support plate to suspend above the track substrate 11 in a non-contact state, achieving stable initial support. Simultaneously, the multi-cavity air passage 132 structure, in conjunction with the air-bearing micropores 134, forms a uniform air film buffer below the support plate, providing stable air-bearing support and suppressing micro-vibrations and lateral displacement. The limiting ring 131 prevents lateral displacement of the support plate during transport, ensuring the safe placement and precise positioning of the wafer on the support plate.

[0059] When the system starts continuous transport mode, the motor stator module 12 provides driving force, causing the magnetic levitation air-bearing support plate 13 to move smoothly along the transport direction of the track base plate 11. The vibration isolation layer 125 effectively isolates the vibration generated by the stator module during the suspension of the support plate, ensuring that the wafer remains highly stable during continuous transport and avoiding wafer position displacement or surface damage caused by micro-vibrations. The drawer-type mounting structure and the track slider 126 and the positioning latch 127 assist in maintenance and module replacement, ensuring long-term stable operation of the system and facilitating maintenance.

[0060] During the handling process, the air supply unit 211 of the air supply module 21 generates a high-speed pulsed airflow through the pulse air knife 213 to continuously clean the wafer surface. Simultaneously, the rectifier plate 212 rectifies the airflow, ensuring uniform distribution and avoiding dead zones and excessive wind speed. The return air module 22's return air outlet 221 and return air duct 222 recover the supplied airflow and circulate it back through a closed-loop air path, creating a closed-loop flow of clean air, effectively reducing particle settling and achieving a highly efficient closed-loop cleaning system. The adjustable return air valve 224 can adjust the return air volume according to actual airflow requirements, ensuring flow balance in the closed-loop system, optimizing airflow distribution, and further improving cleaning efficiency and suspension handling stability.

[0061] To prevent wafer oxidation and particulate contamination from the air, the system also provides a protective airflow through the nitrogen supply module 3. The manifold 31 introduces nitrogen into the outlet of the air supply module 21, achieving a protective gas layer covering the wafer surface and preventing external contaminants from entering the airflow circulation. The lateral flow stabilizing groove 111 guides the airflow below the pallet along both sides of the track, suppressing lateral eddies and ensuring smooth suspension and movement of the pallet. The annular buffer gas film groove 135 generates a thin buffer gas film 136, providing additional gas support for the pallet, buffering external vibrations and impacts, and improving the stability of continuous handling.

[0062] During wafer levitation and transport, the centrally positioned adsorption port 137 provides a slight suction force through a micro-negative pressure chamber, ensuring precise positioning of the wafer in the center region of the tray, preventing deviation even under high-speed continuous transport and cleaning airflow. This precise positioning function, combined with the annular buffer gas film 135, the air-floating micropores 134, and the multi-cavity air passage 132, significantly improves the overall stability of the wafer levitation and transport system while ensuring the high precision requirements of continuous chip extraction.

[0063] During continuous operation of the system, the heat dissipation cavity 112 below the track base plate 11, the heat sink 1121 inside it, and the guide channel 1122 evenly dissipate the heat generated by the motor stator module 12, ensuring stable system temperature and preventing thermal expansion or temperature fluctuations from affecting the suspension accuracy of the pallet and the stability of continuous handling.

[0064] In summary, this device achieves continuous levitation and transport through the coordinated operation of the magnetic levitation air-bearing support plate 13 and the motor stator module 12. The air supply module 21 and the return air module 22 form a closed-loop high-efficiency cleaning system. The nitrogen supply module 3 provides protective airflow. The lateral flow stabilizing groove 111, the annular buffer air film groove 135, and the air-bearing micropores 134 provide stable air film support. The centrally positioned adsorption port 137 ensures precise wafer positioning, and the heat dissipation cavity 112 controls the temperature. All these technical features are combined to achieve continuous wafer transport, stable levitation, high-precision positioning, and efficient closed-loop cleaning, significantly improving the efficiency and reliability of continuous chip extraction.

[0065] The above embodiments detail each technical feature claimed in the claims of this patent, its specific role in solving the technical problem, and the beneficial effects it produces. Those skilled in the art can fully implement this invention based on these descriptions.

Claims

1. A continuous chip extraction device for a dry etching machine, characterized in that, The system includes a magnetic levitation conveying mechanism, comprising a track base plate, a motor stator module, and a magnetic levitation air buoyancy support plate. The motor stator module is disposed inside the track base plate, and the magnetic levitation air buoyancy support plate is located above the motor stator module. A limiting ring is provided along the edge of the magnetic levitation air buoyancy support plate. A multi-cavity air passage structure is provided inside the magnetic levitation air buoyancy support plate. A permanent magnet array is provided at the bottom of the magnetic levitation air buoyancy support plate, and air buoyancy micropores are provided on the upper surface of the magnetic levitation air buoyancy support plate. The system also includes a cleaning module, comprising an air supply module and a return air module. The air supply module includes an air supply unit installed on the upper side of the track base plate and a rectifier plate disposed on the lower side of the air supply unit. A pulse air knife is provided at the outlet of the air supply unit. The return air module includes a return air flat opening and a return air pipe arranged along both sides of the track base plate. The outlet of the return air pipe is connected to the air supply unit of the air supply module to form a closed-loop air passage.

2. The continuous chip extraction device for a dry etching machine according to claim 1, characterized in that, The air flotation micropores are composed of multiple sections, each of which is supplied with air by an independent micro air chamber.

3. The continuous chip extraction device for a dry etching machine according to claim 1, characterized in that, The return air inlet is a slit-shaped structure, and its bottom is connected to the return air duct via a flange. An adjustable return air valve is installed at the front end of the return air duct.

4. The continuous chip extraction device for a dry etching machine according to claim 1, characterized in that, The stator module is mounted on the track base plate via a vibration isolation layer, which is made of a high-temperature resistant elastic material.

5. The continuous chip extraction device for a dry etching machine according to claim 1, characterized in that, The stator module includes a track slider and a positioning lock. The stator module is configured with a drawer-type installation structure, which can be pulled out and pushed in as a whole along the length of the track base plate.

6. The continuous chip extraction device for a dry etching machine according to claim 1, characterized in that, It also includes a nitrogen supply module, which is connected to the outlet of the air supply module via a manifold.

7. The continuous chip extraction device for a dry etching machine according to claim 1, characterized in that, Lateral flow stabilizing grooves are provided on both sides of the track substrate along the conveying direction, and the flow stabilizing grooves have a concave curved surface structure.

8. The continuous chip extraction device for a dry etching machine according to claim 1, characterized in that, The track base plate has a through heat dissipation cavity underneath, and multiple heat dissipation fins are arranged inside the heat dissipation cavity.

9. The continuous chip extraction device for a dry etching machine according to claim 1, characterized in that, The magnetic levitation air buoy support plate is equipped with an annular buffer air film groove, and the airflow inside the air film groove is ejected radially to form a thin buffer air film.

10. A continuous chip extraction device for a dry etching machine according to claim 1, characterized in that, The magnetic levitation air-bearing plate has a centrally positioned adsorption port with weak adsorption force in the central region of the wafer on its upper surface. The adsorption port provides a slight suction force of no more than 10 Pa through a micro negative pressure cavity.

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