Compound semiconductor material swing slicing device

Abstract

The utility model discloses a compound semiconductor material swing slicing device which comprises a base, a support is arranged at one end of the top of the base, a swing slicing mechanism is arranged on the support, the swing slicing mechanism comprises a transmission box arranged on one side of the upper end of the support, a partition plate is arranged on the inner side of the transmission box, and the partition plate is arranged on the upper end of the support. A double-shaft motor is fixedly installed at the bottom of the partition plate, a fan-shaped end face gear is arranged on an output shaft at the top of the double-shaft motor, a bearing seat is arranged at the end, away from the support, of the top of the partition plate, and a transmission rod is rotationally connected between the bearing seat and the upper end of the support; the end, away from the bearing seat, of the transmission rod extends to the other side of the support and is fixedly connected with a swing arm. According to the swinging slicing device for the compound semiconductor material, through mutual cooperation of the double-shaft motor, the fan-shaped end face gear, the first bevel gear, the second bevel gear, the swinging arm and the transmission rod, reciprocating swinging of the wire cutting machine can be achieved, twice slicing can be achieved through one reciprocating, and efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor processing equipment, in particular to a compound semiconductor material swing slicing device. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity is between that of conductors and insulators at room temperature. Semiconductors are widely used in radios, televisions and temperature measurement. For example, diodes are devices made of semiconductors. Semiconductors refer to materials whose electrical conductivity can be controlled, ranging from that of insulators to conductors. Whether from the perspective of scientific and technological development or economic development, the importance of semiconductors is enormous.

[0003] At present, compound semiconductor materials are generally cut vertically during slicing. The cutting mechanism is driven up and down by a transmission mechanism to achieve cutting. One reciprocating motion of the cutting mechanism can only achieve one slice, which is inefficient. In addition, a separate driving source is required for continuous loading, which is less practical.

[0004] Therefore, it is necessary to propose a compound semiconductor material swing slicing device to solve the above problems. Utility Model Content

[0005] The main purpose of the utility model is to provide a compound semiconductor material swing slicing device, which can effectively solve the problems in the background technology.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A swing slicing device for compound semiconductor materials comprises a base, a bracket is provided at one end of the top of the base, a swing slicing mechanism is provided on the bracket, the swing slicing mechanism comprises a transmission box arranged on one side of the upper end of the bracket, a partition is provided on the inner side of the transmission box, a dual-axis motor is fixedly installed on the bottom of the partition, a fan-shaped end face gear is provided on the output shaft at the top of the dual-axis motor, a bearing seat is provided at the end of the top of the partition away from the bracket, a transmission rod is rotatably connected between the bearing seat and the upper end of the bracket, the end of the transmission rod away from the bearing seat extends to the other side of the bracket and is fixedly connected to a swing arm, a wire cutting machine is provided at the lower end of the swing arm, and a second bevel gear and a first bevel gear are provided on the outer side of the end of the transmission rod close to the bearing seat.

[0008] Preferably, the second bevel gear and the first bevel gear have the same specifications and are arranged opposite to each other, the fan-shaped end face gear corresponds to and adapts to the first bevel gear and the second bevel gear, and is configured so that the first bevel gear and the second bevel gear can alternately mesh with the fan-shaped end face gear when the fan-shaped end face gear rotates.

[0009] Preferably, an arc-shaped guide groove is provided on the side surface of the upper end of the bracket, the arc-shaped guide groove is coaxial with the transmission rod, and a guide wheel movably connected to the arc-shaped guide groove is provided on one side of the swing arm.

[0010] Preferably, a loading mechanism is provided at one end of the top of the base, and the loading mechanism includes a carrier arranged at one end of the top of the base, one end of the carrier corresponds to the motion trajectory of the wire cutting machine, a loading trough is provided at the middle part of the top of the carrier, and arc grooves are symmetrically provided on the front and rear sides of the loading trough close to one end of the wire cutting machine, the inner sides of the two arc grooves are rotatably connected with vertical shafts, the upper ends of the two vertical shafts extend to the inner side of the transmission box, and the first spur gear and the second spur gear are respectively fixed on one end of the two vertical shafts extending to the inner side of the transmission box, a third spur gear is provided on the output shaft at the bottom of the dual-axis motor, one end of the lower end of the inner cavity of the transmission box is rotatably connected with a fourth spur gear, and an elastic conveying member is provided on the outer side of the lower end of the vertical shaft.

[0011] Preferably, the first spur gear, the second spur gear and the fourth spur gear have the same specifications, the third spur gear is meshed with the second spur gear and the fourth spur gear, and the first spur gear is meshed with the fourth spur gear, so that when the third spur gear rotates, the first spur gear and the second spur gear rotate in opposite directions.

[0012] Preferably, the elastic conveying member includes a sleeve fixedly connected to the outer side of the lower end of the vertical shaft, and a loading cylinder with an inner diameter larger than the diameter of the sleeve is provided on the outer side of the sleeve, a plurality of springs are provided between the inner side of the loading cylinder and the outer side of the sleeve, and one end of the loading cylinder protrudes from the inner wall of the loading trough.

[0013] Preferably, a material discharge trough with an inclined bottom is provided on a side of the top of the base away from the carrier, and one end of the material discharge trough corresponds to the bottom of the wire cutting machine.

[0014] Beneficial Effects

[0015] Compared with the prior art, the utility model provides a compound semiconductor material swing slicing device, which has the following beneficial effects:

[0016] 1. The compound semiconductor material swing slicing device can realize the back and forth swing of the wire cutting machine through the cooperation of the dual-axis motor, the fan-shaped end face gear, the first bevel gear, the second bevel gear, the swing arm, and the transmission rod. Two slices can be achieved in one back and forth movement, which improves the efficiency. The setting of the guide wheel and the arc guide groove facilitates the increase of the stability of the swing arm.

[0017] 2. The compound semiconductor material swing slicing device can realize automatic loading of semiconductor materials through the cooperation of the carrier, loading trough, third spur gear, fourth spur gear, first spur gear, second spur gear, vertical shaft, loading barrel, sleeve and spring. One driving source can realize swing cutting and automatic loading, with high precision and increased practicality. The loading barrel can compress the spring and can adapt to semiconductor materials of different sizes within a certain range. The reverse force generated by the spring can make the loading barrel tightly contact with the semiconductor material, with high stability and easy transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the utility model;

[0019] Figure 2 It is a structural schematic diagram of the utility model from another perspective;

[0020] Figure 3 It is a structural schematic diagram of the utility model after the transmission box is removed from the bracket;

[0021] Figure 4 It is a structural schematic diagram of the platform of the utility model;

[0022] Figure 5 It is a schematic diagram of the cross-sectional structure of the vertical axis of the utility model.

[0023] In the figure: 1. base; 2. bracket; 3. carrier; 4. transmission box; 5. wire cutting machine; 6. swing arm; 7. unloading chute; 8. loading chute; 9. partition; 10. bearing seat; 11. transmission rod; 12. arc guide groove; 13. guide wheel; 14. first bevel gear; 15. second bevel gear; 16. double-axis motor; 17. fan-shaped end face gear; 18. first spur gear; 19. second spur gear; 20. third spur gear; 21. fourth spur gear; 22. vertical axis; 23. loading barrel; 24. arc groove; 25. sleeve; 26. spring. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0025] like Figure 1-5As shown, a compound semiconductor material swing slicing device comprises a base 1, a bracket 2 is arranged at one end of the top of the base 1, a swing slicing mechanism is arranged on the bracket 2, the swing slicing mechanism comprises a transmission box 4 arranged on one side of the upper end of the bracket 2, a partition 9 is arranged on the inner side of the transmission box 4, a double-axis motor 16 is fixedly installed at the bottom of the partition 9, a fan-shaped end face gear 17 is arranged on the output shaft at the top of the double-axis motor 16, a bearing seat 10 is arranged at the end of the top of the partition 9 away from the bracket 2, a transmission rod 11 is rotatably connected between the bearing seat 10 and the upper end of the bracket 2, and the transmission One end of the rod 11 away from the bearing seat 10 extends to the other side of the bracket 2 and is fixedly connected to the swing arm 6. The wire cutting machine 5 is arranged at the lower end of the swing arm 6. The second bevel gear 15 and the first bevel gear 14 are arranged on the outer side of the end of the transmission rod 11 close to the bearing seat 10. The second bevel gear 15 and the first bevel gear 14 have the same specifications and are arranged relatively to each other. The fan-shaped end face gear 17 corresponds to and adapts to the first bevel gear 14 and the second bevel gear 15, and is configured so that when the fan-shaped end face gear 17 rotates, the first bevel gear 14 and the second bevel gear 15 can alternately mesh with the fan-shaped end face gear 17.

[0026] Furthermore, in order to increase the stability of the swing arm 6, an arc guide groove 12 is provided on the upper end side of the bracket 2, the arc guide groove 12 is coaxial with the transmission rod 11, and a guide wheel 13 movably connected to the arc guide groove 12 is provided on one side of the swing arm 6.

[0027] Furthermore, in order to realize the loading, a loading mechanism is arranged at one end of the top of the base 1, and the loading mechanism includes a carrier 3 arranged at one end of the top of the base 1, one end of the carrier 3 corresponds to the motion trajectory of the wire cutting machine 5, and a loading groove 8 is arranged in the middle of the top of the carrier 3, and arc grooves 24 are symmetrically arranged on the front and rear sides of the loading groove 8 near one end of the wire cutting machine 5, and the inner sides of the two arc grooves 24 are rotatably connected with vertical shafts 22, and the upper ends of the two vertical shafts 22 extend to the inner side of the transmission box 4, and the first straight Gear 18 and second spur gear 19, a third spur gear 20 is arranged on the output shaft at the bottom of the dual-axis motor 16, one end of the lower end of the inner cavity of the transmission box 4 is rotatably connected to the fourth spur gear 21, the first spur gear 18, the second spur gear 19, and the fourth spur gear 21 have the same specifications, the third spur gear 20 is meshed with the second spur gear 19 and the fourth spur gear 21, the first spur gear 18 is meshed with the fourth spur gear 21, so that when the third spur gear 20 rotates, the first spur gear 18 and the second spur gear 19 rotate in opposite directions, and an elastic conveying member is arranged on the outer side of the lower end of the vertical shaft 22.

[0028] As an embodiment, the elastic conveying member includes a sleeve 25 fixedly connected to the outer side of the lower end of the vertical shaft 22, and a loading cylinder 23 with an inner diameter larger than the diameter of the sleeve 25 is provided on the outer side of the sleeve 25, and a plurality of springs 26 are provided between the inner side of the loading cylinder 23 and the outer side of the sleeve 25, and one end of the loading cylinder 23 protrudes from the inner wall of the loading trough 8.

[0029] Furthermore, in order to facilitate material unloading, a material unloading trough 7 with an inclined bottom is provided on the top side of the base 1 away from the carrier 3 , and one end of the material unloading trough 7 corresponds to the bottom of the wire cutting machine 5 .

[0030] It should be noted that the utility model is a compound semiconductor material swing slicing device. When in use, the semiconductor material is placed in the loading trough 8 on the top of the carrier 3, so that one end of the semiconductor material is located between the two loading barrels 23 and is firmly clamped by the loading barrel 23, and then the dual-axis motor 16 is started to drive the fan-shaped end face gear 17 and the third spur gear 20 to rotate. When the fan-shaped end face gear 17 is engaged with the first bevel gear 14, it will drive the swing arm 6 to swing to one side through the transmission rod 11. When the fan-shaped end face gear 17 is engaged with the second bevel gear 15, it will drive the swing arm 6 to swing to the other side through the transmission rod 11 to reset. The fan-shaped end face gear 17 rotates one circle to realize the wire cutting machine 5 to swing back and forth. During this period, the third spur gear 20 drives the second spur gear 19 and the fourth spur gear 21 rotate, the fourth spur gear 21 drives the first spur gear 18 to rotate, and then the first spur gear 18 and the second spur gear 19 drive the two vertical shafts 22 to rotate in opposite directions, and since the first spur gear 18, the second spur gear 19, and the fourth spur gear 21 have the same specifications, the two vertical shafts 22 have the same rotation speed, and then the semiconductor material is transported forward, and one driving source can realize swing cutting and automatic loading, with high precision and increased practicality, and the loading barrel 23 can compress the spring 26, which can adapt to semiconductor materials of different sizes within a certain range, and the reverse force generated by the spring 26 can make the loading barrel 23 tightly contact with the semiconductor material, with high stability and easy transportation.

[0031] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A compound semiconductor material swing slicing device, comprising a base (1), Features: A bracket (2) is provided at one end of the top of the base (1), and a swing slicing mechanism is provided on the bracket (2). The swing slicing mechanism comprises a transmission box (4) arranged on one side of the upper end of the bracket (2), a partition (9) is provided on the inner side of the transmission box (4), a dual-axis motor (16) is fixedly mounted on the bottom of the partition (9), a fan-shaped end face gear (17) is provided on the output shaft at the top of the dual-axis motor (16), a bearing seat (10) is provided at the end of the top of the partition (9) away from the bracket (2), a transmission rod (11) is rotatably connected between the bearing seat (10) and the upper end of the bracket (2), an end of the transmission rod (11) away from the bearing seat (10) extends to the other side of the bracket (2) and is fixedly connected to a swing arm (6), a wire cutting machine (5) is provided at the lower end of the swing arm (6), and a second bevel gear (15) and a first bevel gear (14) are provided on the outer side of the end of the transmission rod (11) close to the bearing seat (10).

2. A compound semiconductor material swing slicing device according to claim 1, Features: The second bevel gear (15) and the first bevel gear (14) have the same specifications and are arranged opposite to each other; the fan-shaped end face gear (17) corresponds to and is adapted to the first bevel gear (14) and the second bevel gear (15); and is configured such that when the fan-shaped end face gear (17) rotates, the first bevel gear (14) and the second bevel gear (15) can alternately mesh with the fan-shaped end face gear (17).

3. A compound semiconductor material swing slicing device according to claim 2, Features: An arc-shaped guide groove (12) is provided on the upper side of the bracket (2), the arc-shaped guide groove (12) is coaxial with the transmission rod (11), and a guide wheel (13) movably connected to the arc-shaped guide groove (12) is provided on one side of the swing arm (6).

4. A compound semiconductor material swing slicing device according to claim 3, Features: A loading mechanism is arranged at one end of the top of the base (1), and the loading mechanism comprises a carrier (3) arranged at one end of the top of the base (1), one end of the carrier (3) corresponds to the motion trajectory of the wire cutting machine (5), a loading trough (8) is arranged in the middle of the top of the carrier (3), and arc grooves (24) are symmetrically arranged on the front and rear sides of the loading trough (8) near one end of the wire cutting machine (5), the inner sides of the two arc grooves (24) are both rotatably connected with vertical shafts (22), the upper ends of the two vertical shafts (22) extend to the inner side of the transmission box (4), and the first spur gear (18) and the second spur gear (19) are respectively fixed to one end of the two vertical shafts (22) extending to the inner side of the transmission box (4), a third spur gear (20) is arranged on the output shaft at the bottom of the dual-axis motor (16), one end of the lower end of the inner cavity of the transmission box (4) is rotatably connected with a fourth spur gear (21), and an elastic conveying member is arranged on the outer side of the lower end of the vertical shaft (22).

5. A compound semiconductor material swing slicing device according to claim 4, Features: The first spur gear (18), the second spur gear (19), and the fourth spur gear (21) have the same specifications; the third spur gear (20) meshes with the second spur gear (19) and the fourth spur gear (21); the first spur gear (18) meshes with the fourth spur gear (21), so that when the third spur gear (20) rotates, the first spur gear (18) and the second spur gear (19) rotate in opposite directions.

6. A compound semiconductor material swing slicing device according to claim 5, Features: The elastic conveying member comprises a sleeve (25) fixedly connected to the outer side of the lower end of the vertical shaft (22); a loading cylinder (23) having an inner diameter greater than the diameter of the sleeve (25) is arranged on the outer side of the sleeve (25); a plurality of springs (26) are arranged between the inner side of the loading cylinder (23) and the outer side of the sleeve (25); and one end of the loading cylinder (23) protrudes from the inner wall of the loading trough (8).

7. A compound semiconductor material swing slicing device according to claim 6, Features: A material discharge trough (7) with an inclined bottom is provided on a side of the top of the base (1) away from the carrier (3), and one end of the material discharge trough (7) corresponds to the bottom of the wire cutting machine (5).

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