Wafer cutting device

Abstract

A supporting plate is arranged in a collecting box, a limiting block is fixedly connected to the outer wall of one side of the middle of the supporting plate, a sponge cushion is fixedly arranged on one side of the upper end of the supporting plate, a limiting sliding groove is formed in the side, corresponding to the limiting block, in the collecting box, and a corrugated telescopic pipe is fixedly connected to the middle of the bottom end of the supporting plate; the utility model has the following advantages: the inside of the corrugated telescopic pipe can be inflated or deflated by starting the air pump, so that the corrugated telescopic pipe extends upwards to push the supporting plate or the corrugated telescopic pipe shrinks downwards, the height of the supporting plate is reduced, and the effective volume of the collecting box can be reduced or increased; impact force is transmitted to a magnet ball through a sliding plate, the magnet ball pushes a supporting rod, a piston is pushed through the supporting rod to compress a spring, and therefore the impact force can be effectively relieved to protect the quartz wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cutting devices, in particular to a wafer cutting device. Background Art

[0002] Quartz wafer is an important electronic material. When subjected to mechanical stress, the quartz wafer will generate an electric field or charge proportional to the stress. This phenomenon is called the positive piezoelectric effect. Conversely, when the quartz wafer is subjected to an electric field, a strain proportional to the electric field will be generated. This phenomenon is called the inverse piezoelectric effect. The positive and inverse effects are collectively called the piezoelectric effect. The quartz wafer not only has the piezoelectric effect, but also has excellent mechanical properties, electrical properties and temperature properties. Chinese patent CN216400145U discloses a cutting device for quartz wafer production, which relates to the technical field of cutting devices. Most existing cutting machines may cause displacement of quartz wafers when cutting quartz wafers, resulting in a shift in the cutting position, which affects the work efficiency and the quality of the quartz wafer. The following scheme is proposed, which includes a box body, the side walls of the box body are through-opened, a frame body is fixedly arranged on the inner wall of the bottom end of the box body, the frame body is arranged in an inverted U shape, the frame body is provided with a transmission mechanism, two baffles with the same structure are fixedly arranged on the top of the frame body, and a fixing mechanism and a cutting mechanism are arranged above the top of the frame body. The utility model has a novel structure, avoids the displacement of the quartz wafer as much as possible, improves the working efficiency and the quality of the quartz wafer, and is suitable for promotion.

[0003] After searching for a cutting device for quartz wafer production, the inventor found that the following problems exist in the prior art: the cut quartz wafers fall directly into the collection box for collection. Since the collection box has a relatively high depth at the initial stage, the cut quartz wafers fall directly into the collection box and are easily bumped and damaged. Utility Model Content

[0004] The technical problem to be solved by the utility model is that the cut quartz wafers fall directly into a collection box for collection. Since the collection box has a relatively high depth at the initial stage, the cut quartz wafers fall directly into the collection box and are easily bumped and damaged. Therefore, a wafer cutting device is provided to solve the above problem.

[0005] The technical solution adopted by the utility model to solve the technical problem is: a chip cutting device, which includes: a collecting box, a support plate is arranged inside the collecting box, a limiting block is fixedly connected to the outer wall on one side of the middle part of the supporting plate, a sponge pad is fixedly arranged on one side of the upper end of the supporting plate, a limiting slide groove is opened on the side corresponding to the limiting block inside the collecting box, a corrugated telescopic tube is fixedly connected to the middle part of the bottom end of the supporting plate, the corrugated telescopic tube is a sealing structure, a slide plate is arranged on one side of the upper end of the collecting box, a rotating rod is fixedly connected to one side of the slide plate, a bearing is arranged on the end of the rotating rod away from the slide plate, gauze is fixedly arranged on the outer wall on one side of the upper end of the slide plate, and a buffer mechanism is arranged on the upper end of the collecting box close to the slide plate, and the buffer mechanism is used to support the slide plate.

[0006] As a preferred technical solution of the utility model, the rotating rod is rotatably connected to the inner wall of the collection box through a bearing, the number of the rotating rod and the number of the bearing are both two, and the slide plate is made of iron.

[0007] As a preferred technical solution of the utility model, a sleeve is fixedly connected to one side of the mounting plate, a support tube is sleeved on the inner wall of one end of the sleeve, a piston is slidingly connected to the inner wall of the support tube, a spring is provided on the inner wall of the support tube near one end of the piston, a support rod is fixedly connected to the side of the piston opposite to the spring, and a magnet ball is fixedly provided on the support rod extending to the outside of the support tube.

[0008] As a preferred technical solution of the utility model, the magnet ball is magnetically connected to the slide plate, the piston is cylindrical, and the mounting plate is fixedly connected to the collection box with screws.

[0009] As a preferred technical solution of the utility model, one side of the bottom end of the corrugated telescopic tube is fixedly connected to the bottom side of the collection box, a connecting pipe is fixedly arranged on one side of the lower end of the corrugated telescopic tube, an air pump is fixedly installed on the outer wall of one side of the lower end of the collection box, the output end of the air pump is fixedly connected to the connecting pipe, and the connecting pipe is connected to the interior of the corrugated telescopic tube.

[0010] As a preferred technical solution of the utility model, the number of the limiting blocks and the limiting sliding grooves are both four, and the limiting blocks are rectangular in shape.

[0011] The utility model has the following advantages: by starting the air pump, air can be inflated into the inside of the bellows expansion tube, so that the bellows expansion tube extends upward to push the support plate, so that when the cut quartz wafer falls into the collection box, the quartz wafer will first slide onto the gauze on the surface of the slide plate, and when the quartz wafer falls and contacts the gauze on the slide plate, an impact force will be generated, and a magnet ball magnetically adsorbed on one side of the lower end of the slide plate can transmit the corresponding impact force to the magnet ball, and then the magnet ball pushes the support rod, and the support rod pushes the piston compression spring, so that the impact force can be effectively reduced to protect the quartz wafer, and the quartz wafer that falls on the gauze finally slides onto the sponge pad in the collection box, and when a certain height of quartz wafers is collected on the sponge pad, air can be evacuated by the air pump to make the bellows expansion tube shrink downward, thereby reducing the height of the support plate, so that the effective volume of the collection box can be increased, and the quartz wafer can be effectively prevented from being bumped and damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural schematic diagram of a preferred embodiment of the utility model;

[0013] Figure 2 This is a schematic cross-sectional view of the collection box of a preferred embodiment of the utility model;

[0014] Figure 3 This is a schematic diagram of the slide structure of a preferred embodiment of the utility model;

[0015] Figure 4 It is a schematic diagram of a partially disassembled structure of the buffer mechanism of a preferred embodiment of the utility model.

[0016] Explanation of the accompanying drawings: 1. Collection box; 2. Support plate; 3. Limit block; 4. Sponge pad; 5. Limit slide groove; 6. Corrugated telescopic tube; 7. Slide plate; 8. Turn rod; 9. Bearing; 10. Gauze; 11. Buffer mechanism; 1101. Mounting plate; 1102. Sleeve; 1103. Support tube; 1104. Piston; 1105. Spring; 1106. Support rod; 1107. Magnet ball; 12. Connecting pipe; 13. Air pump. DETAILED DESCRIPTION

[0017] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0018] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0019] The utility model will be further described below in conjunction with the accompanying drawings.

[0020] Please refer to Figure 1-Figure 4 The utility model discloses a wafer cutting device, comprising: a collecting box 1, a supporting plate 2 is arranged inside the collecting box 1, a limiting block 3 is fixedly connected to the outer wall on one side of the middle part of the supporting plate 2, a sponge pad 4 is fixedly arranged on one side of the upper end of the supporting plate 2, a limiting slide groove 5 is arranged on one side of the collecting box 1 corresponding to the limiting block 3, a corrugated telescopic tube 6 is fixedly connected to the middle part of the bottom end of the supporting plate 2, the corrugated telescopic tube 6 is a sealing structure, a slide plate 7 is arranged on one side of the upper end of the collecting box 1, a rotating rod 8 is fixedly connected to one side of the sliding plate 7, a bearing 9 is arranged on the end of the rotating rod 8 away from the sliding plate 7, a gauze 10 is fixedly arranged on the outer wall on one side of the upper end of the sliding plate 7, a buffer mechanism 11 is arranged on the upper end of the collecting box 1 close to the sliding plate 7, and the buffer mechanism 11 is used to support the sliding plate 7.

[0021] like Figure 2As shown, the rotating rod 8 is rotatably connected to the inner wall of the collecting box 1 through the bearing 9, and the number of the rotating rod 8 and the bearing 9 are both two. The rotating rod 8 cooperates with the bearing 9 to facilitate the rotation of one end of the slide plate 7. The slide plate 7 is made of iron. One side of the bottom end of the corrugated telescopic tube 6 is fixedly connected to the bottom side of the inside of the collecting box 1. By controlling the contraction of the corrugated telescopic tube 6, the height of the support plate 2 can be adjusted. A connecting pipe 12 is fixedly arranged on one side of the lower end of the corrugated telescopic tube 6. The connecting pipe 12 is provided with a solenoid valve. The connecting pipe 12 facilitates the communication between the corrugated telescopic tube 6 and the air pump 13, and the switch of the connecting pipe 12 can be controlled by the solenoid valve. An air pump 13 is fixedly installed on the outer wall of one side of the lower end of the collecting box 1, and the output end of the air pump 13 is fixedly connected to the connecting pipe 12. The connecting pipe 12 is connected to the inside of the corrugated telescopic tube 6. There are four limit blocks 3 and four limit slide grooves 5. The limit block 3 is rectangular in shape. The support plate 2 can be limited by the limit block 3 and the limit slide groove 5.

[0022] like Figure 4 As shown, a sleeve 1102 is fixedly connected to one side of the mounting plate 1101, and a support tube 1103 is sleeved on the inner wall of one end of the sleeve 1102. The sleeve 1102 facilitates the support tube 1103 to be limited and fixed, and a piston 1104 is slidably connected to the inner wall of the support tube 1103. A spring 1105 is provided on the inner wall of one end of the support tube 1103 close to the piston 1104. The piston 1104 cooperates with the spring 1105 to reduce the impact force on the support rod 1106. The piston 1104 is fixedly connected to the support rod 1106 on the opposite side of the spring 1105. The support rod 1106 extends to the outside of the support tube 1103 and is fixedly provided with a magnet ball 1107. The magnet ball 1107 is magnetically connected to the slide plate 7. The piston 1104 is cylindrical, and the mounting plate 1101 is screwed and fixedly connected to the collection box 1.

[0023] Specifically, when the utility model is used, firstly, the air pump 13 is started, so that the air pump 13 inflates the inside of the bellows expansion tube 6 through the connecting tube 12, so that the bellows expansion tube 6 extends upward to push the support plate 2, and the support plate 2 is smoothly moved to the highest position through the limit block 3 and the limit slide groove 5, so that when the cut quartz wafer falls into the collection box 1, the quartz wafer will first slide onto the gauze 10 on the surface of the slide plate 7, and when the quartz wafer falls and contacts the gauze 10 on the slide plate 7, an impact force will be generated, and the corresponding impact force can be transmitted to the magnet ball 1107 magnetically adsorbed on one side of the lower end of the slide plate 7. 1107, and then the magnetic ball 1107 pushes the support rod 1106, and the support rod 1106 pushes the piston 1104 to compress the spring 1105, so as to effectively reduce the impact force to protect the quartz wafer. The quartz wafer falling on the gauze 10 finally slides onto the sponge pad 4 in the collecting box 1, and when a certain height of quartz wafers are collected on the sponge pad 4, the air pump 13 can be used to evacuate air so that the bellows 6 can be contracted downward, thereby reducing the height of the support plate 2, so as to increase the effective volume of the collecting box 1 (the quartz wafer cutting operation process is recorded by Chinese patent CN216400145U and will not be repeated here).

[0024] The above are only preferred implementations of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

[0025] Other parts of the present invention not described in detail belong to the prior art and will not be described here.

[0026] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A wafer cutting device, comprising: A collecting box (1), characterized in that a support plate (2) is arranged inside the collecting box (1), a limiting block (3) is fixedly connected to the outer wall of one side in the middle of the supporting plate (2), a sponge pad (4) is fixedly arranged on one side of the upper end of the supporting plate (2), a limiting slide groove (5) is provided on one side of the collecting box (1) corresponding to the limiting block (3), a corrugated telescopic tube (6) is fixedly connected to the middle of the bottom end of the supporting plate (2), the corrugated telescopic tube (6) is a sealing structure, a slide plate (7) is arranged on one side of the upper end of the collecting box (1), a rotating rod (8) is fixedly connected to one side of the slide plate (7), a bearing (9) is arranged on the end of the rotating rod (8) away from the slide plate (7), a gauze (10) is fixedly arranged on the outer wall of one side of the upper end of the slide plate (7), and a buffer mechanism (11) is arranged on the upper end of the collecting box (1) close to the slide plate (7), and the buffer mechanism (11) is used to support the slide plate (7).

2. A wafer cutting device as claimed in claim 1, characterized in that: The rotating rod (8) is rotatably connected to the inner wall of the collecting box (1) via a bearing (9), the rotating rod (8) and the bearing (9) are both in number two, and the slide plate (7) is made of iron.

3. A wafer cutting device as claimed in claim 1, characterized in that: The buffer mechanism (11) comprises a mounting plate (1101), a sleeve (1102), a support tube (1103), a piston (1104), a spring (1105), a support rod (1106), and a magnet ball (1107); one side of the mounting plate (1101) is fixedly connected with the sleeve (1102); the inner wall of one end of the sleeve (1102) is sleeved with the support tube (1103); the inner wall of the support tube (1103) is limitedly connected with the piston (1104); the inner wall of one end of the support tube (1103) is provided with a spring (1105); the side of the piston (1104) opposite to the spring (1105) is fixedly connected with the support rod (1106); the support rod (1106) extends to the outside of the support tube (1103) and is fixedly provided with a magnet ball (1107).

4. A wafer cutting device as claimed in claim 3, characterized in that: The magnet ball (1107) is magnetically connected to the slide plate (7), the piston (1104) is cylindrical, and the mounting plate (1101) is screw-fixedly connected to the collection box (1).

5. A wafer cutting device as claimed in claim 1, characterized in that: One side of the bottom end of the bellows telescopic tube (6) is fixedly connected to the bottom side of the interior of the collection box (1); one side of the lower end of the bellows telescopic tube (6) is fixedly provided with a connecting tube (12); an air pump (13) is fixedly installed on the outer wall of one side of the lower end of the collection box (1); the output end of the air pump (13) is fixedly connected to the connecting tube (12); and the connecting tube (12) communicates with the interior of the bellows telescopic tube (6).

6. A wafer cutting device as claimed in claim 1, characterized in that: The number of the limiting blocks (3) and the limiting sliding grooves (5) is four, and the limiting blocks (3) are rectangular in shape.

Images