Silicon wafer cutting device for diode production
By designing devices for mounting plates, push plates, lifting blocks and pneumatic cylinders, continuous cutting and automatic collection of silicon wafers are achieved, solving the problem of low cutting efficiency in the prior art and improving operating efficiency.
Patent Information
- Application Number
- CN202420201465.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-26
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-01-26
AI Technical Summary
The existing silicon wafer cutting device cannot achieve continuous cutting, resulting in inefficient operation.
A device including mounting plate, push plate, lifting block, inclined plate and pneumatic cylinder is designed. The lifting block and inclined plate are driven by pneumatic cylinder to make the pushing plate move smoothly, achieving continuous cutting of silicon wafers, and through the collection box and rotation. The combination of the board realizes automatic collection of silicon wafers.
The continuous cutting and automatic collection of silicon wafers are realized, improving cutting efficiency and operational convenience.
Smart Images
Figure CN222201167U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of cutting devices, in particular to a silicon wafer cutting device for diode production. Background Art
[0002] A diode is an electronic device made of semiconductor materials. A diode has two electrodes, one is called the positive electrode and the other is the negative electrode. When a forward voltage is applied between the two electrodes of the diode, the diode is turned on. When a reverse voltage is applied, the diode is cut off.
[0003] At present, when operators are producing diodes, they generally need to install silicon wafers at the same time. Silicon wafers are generally of relatively long size. At this time, a cutting device is needed to cut the silicon wafers into smaller sizes. Currently, when operators cut silicon wafers, they usually place the silicon wafers on a table and then cut them into the required size. However, continuous cutting cannot be achieved. Operators are required to push the silicon wafers under the blade for cutting, and the work efficiency is slow, so it needs to be improved. Utility Model Content
[0004] The purpose of the utility model is to solve the above problems. The utility model provides a silicon wafer cutting device for diode production, which has the advantage of continuous cutting.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a silicon wafer cutting device for diode production, comprising a table top, a mounting plate fixedly installed on the top of the table top, a push plate movably connected to the inner side of the mounting plate, a long plate fixedly installed on the left side of the top of the table top, a lifting block movably connected to the top of the inner side of the long plate, an inclined plate hinged on the right side of the lifting block, a fixed block hinged on the other end of the inclined plate, the right side of the fixed block is fixedly connected to the left side of the push plate, a first pneumatic cylinder fixedly installed on the left side of the bottom of the table top, the other end of the first pneumatic cylinder passes through the table top and is fixedly connected to the bottom of the lifting block, and a guide plate is fixedly installed on the right side of the table top.
[0006] As a preferred embodiment of the utility model, a limiting plate located on the right side of the mounting plate is fixedly installed on the top of the table top, and the left side of the limiting plate is fixedly connected to the right side of the mounting plate.
[0007] As a preferred embodiment of the utility model, a fixing frame is fixedly installed on the right end of the rear side of the top of the table top, a second pneumatic cylinder is fixedly installed on the top of the fixing frame, the other end of the second pneumatic cylinder passes through the fixing frame and extends to the top of the inner cavity of the fixing frame, and a blade is fixedly installed on the bottom of the second pneumatic cylinder.
[0008] As a preferred embodiment of the present invention, a mounting frame is fixedly installed on the bottom of the table top, and a connecting plate is fixedly installed on the inner side of the mounting frame.
[0009] As a preferred embodiment of the present invention, support plates are fixedly installed at both the front and rear ends of the right side of the connecting plate, and the support plates are internally movably connected to limit blocks.
[0010] As a preferred embodiment of the utility model, a collection box is fixedly installed on the inner side of the limit block, and a pull plate is fixedly installed on the right side of the collection box.
[0011] As a preferred embodiment of the utility model, a mounting block is fixedly mounted on the left side of the front face of the collection box, and a rotating plate is movably connected to the right side of the mounting block.
[0012] As a preferred embodiment of the present invention, a round block is movably sleeved on the right side of the rotating plate, and the other end of the round block is fixedly connected to the right side of the mounting frame.
[0013] Compared with the prior art, the beneficial effects of the utility model are as follows:
[0014] 1. The utility model sets a mounting plate, a push plate, a lifting block, an inclined plate and a fixed block. The operator first starts the first pneumatic cylinder. The operation of the first pneumatic cylinder will enable the lifting block to move downward smoothly under the limiting action of the long plate. At this time, the lifting block will cause the inclined plate to rotate and squeeze the fixed block, and the fixed block will move smoothly to the right with the pushing plate under the limiting action of the mounting plate. At this time, the pushing plate will push the silicon wafer to the bottom of the blade for cutting operation, and the effect of continuous cutting can be achieved.
[0015] 2. The utility model sets a collection box, a mounting block, a round block, a rotating plate and a pulling plate. Due to the design of the collection box, the collection box will collect the cut silicon wafers. At this time, the operator rotates the rotating plate, and the rotating plate will release the blocking effect on the mounting block. At this time, the pulling plate is pulled, and the pulling plate will move the collection box smoothly to the right under the cooperation of the support plate and the limit block. At this time, the operator can take out the silicon wafers more conveniently, and the silicon wafers can also be collected. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the structure of the utility model;
[0017] Figure 2 This is a schematic cross-sectional structural diagram of the lifting block of the utility model;
[0018] Figure 3 It is a cross-sectional structural schematic diagram of the front side of the utility model;
[0019] Figure 4 It is a schematic cross-sectional structure diagram of the connection plate of the utility model;
[0020] Figure 5It is a schematic cross-sectional structure diagram of the round block of the utility model.
[0021] In the figure: 1. table; 2. mounting plate; 3. pushing plate; 4. long board; 5. lifting block; 6. inclined board; 7. fixed block; 8. first pneumatic cylinder; 9. limit plate; 10. fixed frame; 11. second pneumatic cylinder; 12. blade; 13. mounting frame; 14. connecting plate; 15. supporting plate; 16. limit block; 17. collecting box; 18. mounting block; 19. round block; 20. rotating plate; 21. pulling plate; 22. guide plate. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] like Figures 1 to 5 As shown, the utility model provides a silicon wafer cutting device for diode production, including a table 1, a mounting plate 2 is fixedly installed on the top of the table 1, a pushing plate 3 is movably connected to the inner side of the mounting plate 2, a long plate 4 is fixedly installed on the left side of the top of the table 1, a lifting block 5 is movably connected to the top of the inner side of the long plate 4, an inclined plate 6 is hinged on the right side of the lifting block 5, a fixed block 7 is hinged on the other end of the inclined plate 6, the right side of the fixed block 7 is fixedly connected to the left side of the pushing plate 3, a first pneumatic cylinder 8 is fixedly installed on the left side of the bottom of the table 1, the other end of the first pneumatic cylinder 8 passes through the table 1 and is fixedly connected to the bottom of the lifting block 5, and a guide plate 22 is fixedly installed on the right side of the table 1.
[0024] The operator first starts the first pneumatic cylinder 8. The operation of the first pneumatic cylinder 8 will enable the lifting block 5 to move downward smoothly under the limiting action of the long plate 4. At this time, the lifting block 5 will cause the inclined plate 6 to rotate and squeeze the fixed block 7, and the fixed block 7 will bring the pushing plate 3 to push the silicon wafer smoothly to the right under the limiting action of the mounting plate 2. At this time, the effect of automatic feeding and cutting can be achieved.
[0025] refer to Figures 1 to 3 A limiting plate 9 located on the right side of the mounting plate 2 is fixedly installed on the top of the table top 1, and the left side of the limiting plate 9 is fixedly connected to the right side of the mounting plate 2.
[0026] As a technical optimization solution of the present invention, due to the design of the limiting plate 9, the limiting plate 9 can have a good limiting effect on the silicon wafer.
[0027] refer to Figures 1 to 3A fixing frame 10 is fixedly installed on the right end of the top rear side of the table top 1, and a second pneumatic cylinder 11 is fixedly installed on the top of the fixing frame 10. The other end of the second pneumatic cylinder 11 passes through the fixing frame 10 and extends to the top of the inner cavity of the fixing frame 10. A blade 12 is fixedly installed on the bottom of the second pneumatic cylinder 11.
[0028] As a technical optimization solution of the utility model, the operator starts the second pneumatic cylinder 11, and the operation of the second pneumatic cylinder 11 will cause the blade 12 to move downward and perform a cutting operation on the silicon wafer.
[0029] refer to Figures 2 to 5 A mounting frame 13 is fixedly installed at the bottom of the table top 1 , and a connecting plate 14 is fixedly installed on the inner side of the mounting frame 13 .
[0030] As a technical optimization solution of the present invention, due to the design of the mounting frame 13 , the mounting frame 13 will have a good fixing effect on the connecting plate 14 .
[0031] refer to Figure 1 , Figure 2 , Figure 4 and Figure 5 A support plate 15 is fixedly installed at both the front and rear ends of the right side of the connecting plate 14 , and the internal movably connected limit block 16 of the support plate 15 .
[0032] As a technical optimization solution of the present invention, due to the design of the support plate 15 , the support plate 15 will have a good limiting effect on the limiting block 16 .
[0033] refer to Figures 1 to 3 A collection box 17 is fixedly installed on the inner side of the limiting block 16 , and a pull plate 21 is fixedly installed on the right side of the collection box 17 .
[0034] As a technical optimization solution of the present invention, when the operator pulls the pull plate 21 , the pull plate 21 will move the collection box 17 smoothly under the limiting action of the limiting block 16 .
[0035] refer to Figure 5 A mounting block 18 is fixedly mounted on the left side of the front of the collecting box 17 , and a rotating plate 20 is movably connected to the right side of the mounting block 18 .
[0036] As a technical optimization solution of the present invention, due to the design of the rotating plate 20 , the rotating plate 20 will have a good locking effect on the mounting block 18 .
[0037] refer to Figure 1 , Figure 2 and Figure 5 A round block 19 is movably sleeved on the right side of the rotating plate 20 , and the other end of the round block 19 is fixedly connected to the right side of the mounting frame 13 .
[0038] As a technical optimization solution of the present invention, due to the design of the round block 19, the rotating plate 20 can rotate with the round block 19 as the axis.
[0039] The working principle and use process of this utility model:
[0040] The operator first places the silicon wafer between the limit plates 9 for limiting, and then starts the first pneumatic cylinder 8. The operation of the first pneumatic cylinder 8 will enable the lifting block 5 to move downward smoothly under the limiting action of the long plate 4. At this time, the lifting block 5 will cause the inclined plate 6 to rotate and squeeze the fixed block 7, and the fixed block 7 will simultaneously push the pushing plate 3 to move smoothly to the right under the limiting action of the mounting plate 2. At this time, the pushing plate 3 will simultaneously push the silicon wafer to the bottom of the blade 12. At this time, the operator starts the second pneumatic cylinder 11. The operation of the second pneumatic cylinder 11 will cause the blade 12 to move downward. At this time, the blade 12 will cut the silicon wafer, and the cut silicon wafer will automatically fall into the inside of the collection box 17 under the guidance of the guide plate 22.
[0041] After the collection is completed, the operator first rotates the rotating plate 20, and the rotating plate 20 will release the blocking effect on the mounting block 18. At this time, the operator pulls the pull plate 21, and the pull plate 21 will move the collection box 17 smoothly to the right under the cooperation of the support plate 15 and the limit block 16. At this time, the operator can achieve the purpose of collecting and uniformly taking out the silicon wafers.
[0042] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A silicon wafer cutting device for diode production, comprising a table (1), characterized in that: A mounting plate (2) is fixedly installed on the top of the table top (1), and a pushing plate (3) is movably connected to the inner side of the mounting plate (2). A long plate (4) is fixedly installed on the left side of the top of the table top (1), and a lifting block (5) is movably connected to the top of the inner side of the long plate (4). The right side of the lifting block (5) is hinged with an inclined plate (6), and the other end of the inclined plate (6) is hinged with a fixed block (7). The right side of the fixed block (7) is fixedly connected to the left side of the pushing plate (3). A first pneumatic cylinder (8) is fixedly installed on the left side of the bottom of the table top (1), and the other end of the first pneumatic cylinder (8) passes through the table top (1) and is fixedly connected to the bottom of the lifting block (5). A guide plate (22) is fixedly installed on the right side of the table top (1).
2. The silicon wafer cutting device for diode production according to claim 1, characterized in that: A limiting plate (9) located on the right side of the mounting plate (2) is fixedly mounted on the top of the table top (1), and the left side of the limiting plate (9) is fixedly connected to the right side of the mounting plate (2).
3. The silicon wafer cutting device for diode production according to claim 1, characterized in that: A fixing frame (10) is fixedly mounted on the right end of the top rear side of the table top (1), a second pneumatic cylinder (11) is fixedly mounted on the top of the fixing frame (10), the other end of the second pneumatic cylinder (11) passes through the fixing frame (10) and extends to the top of the inner cavity of the fixing frame (10), and a blade (12) is fixedly mounted on the bottom of the second pneumatic cylinder (11).
4. The silicon wafer cutting device for diode production according to claim 1, characterized in that: A mounting frame (13) is fixedly mounted on the bottom of the table top (1), and a connecting plate (14) is fixedly mounted on the inner side of the mounting frame (13).
5. The silicon wafer cutting device for diode production according to claim 4, characterized in that: Support plates (15) are fixedly mounted on both the front and rear ends of the right side of the connecting plate (14), and the support plate (15) is internally movably connected to a limiting block (16).
6. The silicon wafer cutting device for diode production according to claim 5, characterized in that: A collection box (17) is fixedly mounted on the inner side of the limiting block (16), and a pull plate (21) is fixedly mounted on the right side of the collection box (17).
7. The silicon wafer cutting device for diode production according to claim 6, characterized in that: A mounting block (18) is fixedly mounted on the left side of the front face of the collection box (17), and a rotating plate (20) is movably connected to the right side of the mounting block (18).
8. The silicon wafer cutting device for diode production according to claim 7, characterized in that: A round block (19) is movably sleeved on the right side of the rotating plate (20), and the other end of the round block (19) is fixedly connected to the right side of the mounting frame (13).