Cooling system electronic water pump injection overturning structure mold

The cooling system electronic water pump injection flip structure mold automates rubber bracket collection, enhancing production efficiency by using a lower mold mechanism to collect brackets into a collection box, reducing manual labor and shortening the molding cycle.

CN222201487UActive Publication Date: 2024-12-20NINGBO ZHAOQI PRECISION MASCH CO LTD
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Patent Information

Application Number
CN202421017538.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-11
Publication Date
2024-12-20
Estimated Expiration
2034-05-11

AI Technical Summary

Technical Problem

Existing cooling system electronic water pump injection flip structure molds require manual labor to collect demolded rubber brackets, reducing production efficiency.

Method used

A cooling system electronic water pump injection flip structure mold with a lower mold mechanism that allows rubber brackets to be collected automatically into a collection box after demolding, using a hydraulic cylinder to drive the upper mold body and a handle to rotate the lower mold body, enabling gravity-fed collection.

Benefits of technology

Automated collection of rubber brackets improves production efficiency by eliminating the need for manual handling and shortening the time interval between molding operations.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a cooling system electronic water pump injection turnover structure mold, which relates to the technical field of molds, and comprises a mounting and collecting mechanism used for mounting an upper mold mechanism and a lower mold mechanism and collecting rubber brackets falling from the lower mold mechanism; the upper die mechanism is used for being matched with the lower die mechanism to enable the injected raw materials to be formed; the lower die mechanism comprises a supporting block, a guide block, a rotating shaft, a limiting block, a lower die body, a first forming groove and a handle; the number of the supporting blocks and the number of the guiding blocks are both two, and the two supporting blocks are fixedly arranged at the two ends of the inner side of the L-shaped back plate correspondingly. According to the rubber support overturning and collecting device, formed rubber supports can be better overturned, output and collected, manpower does not need to be consumed for picking up the rubber supports, the time interval between two adjacent injection molding operations can be shortened while manpower is saved, and then the production efficiency of the rubber supports is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of molds, in particular to an injection flip structure mold for an electronic water pump of a cooling system. Background Art

[0002] Since new energy vehicles require precise temperature control of the three-electric system, multiple electronic water pumps need to be installed on the vehicle for water cooling. When installing the electronic water pump, a rubber bracket with shock-absorbing function needs to be used. In actual production, the rubber bracket is mainly formed by molds.

[0003] The utility model patent with patent authorization announcement number CN 220008710 U discloses a cooling system electronic water pump injection flip structure mold, including an upper template and a lower template, the upper template is located above the lower template, and the upper template and the lower template are driven by a first driving cylinder, a flippable middle template is arranged between the upper template and the lower template, the middle template is driven by a second driving cylinder, a flow channel plate for rubber feeding is arranged between the upper template and the middle template, guide columns are symmetrically arranged on both sides of the top of the lower template, and guide holes compatible with the guide columns are symmetrically opened on both sides of the middle template.

[0004] However, the above device still has some shortcomings in actual use. The most obvious one is that when the fixed plate is used to drive the forming plate to rotate so that the formed rubber bracket can be demolded, the fallen rubber bracket will fall on the lower template below the middle template. At this time, the user is required to pick up the multiple rubber brackets on the top of the lower template, which is too labor-intensive and reduces the production efficiency of the rubber bracket.

[0005] Therefore, it is necessary to invent a cooling system electronic water pump injection flip structure mold to solve the above problems. Utility Model Content

[0006] The utility model aims to provide a cooling system electronic water pump injection flip structure mold, which is provided with a lower mold mechanism so that after the rubber bracket is formed, the hydraulic cylinder drives the upper mold body to move up and reset. At this time, the rubber bracket remains on the inner side of the multiple first molding grooves on the top of the lower mold body, and then the handle is pulled outward, so that the handle drives the lower mold body and the rotating shaft to move forward synchronously until the limit block fits with the back of the L-shaped back plate. At this time, the lower mold body is no longer located above the support block and the guide block, and then the lower mold body is rotated by the handle, so that the lower mold body drives the multiple rubber brackets downward, and at this time, the multiple rubber brackets fall into the collection box under the action of gravity. The lower mold body is pushed backward after being flipped, and guided by the inclined surface at the top of the guide block, the lower mold body moves to the top of the support block again and fits against the inner wall of the L-shaped back plate. Then the hydraulic cylinder drives the raw material injection tube to descend, and the rubber bracket injection molding operation can be started again to solve the problem proposed in the above background technology that when the molding plate is rotated by the fixed plate to demold the molded rubber bracket, the rubber bracket will fall on the lower mold plate under the middle mold plate. At this time, the user is required to pick up the multiple rubber brackets on the top of the lower mold plate, which is too labor-intensive and reduces the production efficiency of the rubber bracket.

[0007] According to one aspect of the present disclosure, the following technical solution is provided: a cooling system electronic water pump injection flip structure mold, comprising:

[0008] An installation collection mechanism is used to install the upper mold mechanism and the lower mold mechanism, and collect the rubber bracket that falls from the lower mold mechanism;

[0009] An upper mold mechanism, the upper mold mechanism is used to cooperate with the lower mold mechanism to shape the injected raw material; and

[0010] A lower die mechanism, the lower die mechanism comprising a support block, a guide block, a rotating shaft, a limit block, a lower die body, a first molding groove and a handle;

[0011] There are two support blocks and two guide blocks, and the two support blocks are respectively fixed at the two ends of the inner side of the L-shaped back plate, and the two guide blocks are respectively fixed at the front sides of the two support blocks. An inclined guide surface is provided on the top of the guide block, and the rotating shaft slides through the L-shaped back plate. The limit block is fixed at the rear end of the rotating shaft, and the lower mold body is fixedly sleeved on the outer side of the rotating shaft. There are multiple first molding grooves, and the multiple first molding grooves are evenly opened at the top and bottom of the lower mold body, and the handle is fixedly set in the middle of the front side of the lower mold body.

[0012] According to the cooling system electronic water pump injection flip structure mold of at least one embodiment of the present disclosure, the installation and collection mechanism includes a bottom plate, a collection box and an L-shaped back plate.

[0013] According to the cooling system electronic water pump injection flip structure mold of at least one embodiment of the present disclosure, the collection box is placed on the top of the base plate, and the L-shaped back plate is fixedly arranged at the rear end of the base plate and fits with the rear end of the collection box.

[0014] According to at least one embodiment of the cooling system electronic water pump injection flip structure mold of the present disclosure, the upper mold mechanism includes a hydraulic cylinder, an upper mold body and a raw material injection tube.

[0015] According to at least one embodiment of the cooling system electronic water pump injection flip structure mold disclosed herein, there are two hydraulic cylinders, which are respectively fixed at the top front end and the top rear end of the L-shaped back plate, and the output shaft of the hydraulic cylinder slides through the L-shaped back plate and extends to the bottom of the L-shaped back plate and is fixedly connected to the upper mold body, the upper mold body is located directly above the lower mold body, and a plurality of second molding grooves are evenly opened at the bottom of the upper mold body, and a plurality of raw material injection tubes are provided, and the plurality of raw material injection tubes are evenly fixed and penetrated at the top of the upper mold body and are respectively connected to the plurality of second molding grooves.

[0016] Technical effects and advantages of the utility model:

[0017] The utility model is provided with a lower mold mechanism, so that after the rubber bracket is formed, the hydraulic cylinder drives the upper mold body to move up and reset. At this time, the rubber bracket remains on the inner side of the multiple first molding grooves on the top of the lower mold body. Then the handle is pulled outward, so that the handle drives the lower mold body and the rotating shaft to move forward synchronously until the limit block is in contact with the back of the L-shaped back plate. At this time, the lower mold body is no longer located above the support block and the guide block. Then the handle is used to rotate the lower mold body, so that the lower mold body drives the multiple rubber brackets downward. At this time, the multiple rubber brackets fall into the collection box under the action of gravity and are collected. During the process, the flipped lower mold body is pushed backward, and the lower mold body is moved to the top of the support block again under the guidance of the inclined surface at the top of the guide block and fits against the inner wall of the L-shaped back plate. Then the hydraulic cylinder drives the raw material injection tube to descend, and the rubber bracket injection molding operation can be started again. Compared with the same type of devices and methods in the prior art, the utility model can better flip, output and collect the molded rubber bracket, and there is no need to waste manpower to pick up the rubber bracket. While saving manpower, it can shorten the time interval between two adjacent injection molding operations, thereby improving the production efficiency of the rubber bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings illustrate exemplary embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0019] Figure 1 It is a schematic diagram of the overall structure of an injection flip structure mold of an electronic water pump of a cooling system according to an embodiment of the present disclosure.

[0020] Figure 2 It is a schematic diagram of the installation collection mechanism and upper mold mechanism structure of the cooling system electronic water pump injection flip structure mold according to an embodiment of the present disclosure.

[0021] Figure 3 It is a schematic diagram of the lower mold mechanism structure of the injection flip structure mold of the cooling system electronic water pump according to an embodiment of the present disclosure.

[0022] The specific reference numerals in the figure are:

[0023] 1. Install the collection mechanism; 11. Bottom plate; 12. Collection box; 13. L-shaped back plate;

[0024] 2. Upper die mechanism; 21. Hydraulic cylinder; 22. Upper die body; 23. Raw material injection tube;

[0025] 3. Lower mold mechanism; 31. Support block; 32. Guide block; 33. Rotating axis; 34. Limit block; 35. Lower mold body; 36. First molding groove; 37. Handle. DETAILED DESCRIPTION

[0026] For descriptive purposes, the present disclosure may use spatially relative terms such as "below," "beneath," "below," "above," "on," "higher," and "side (e.g., as in "sidewall")," to describe the relationship of one component to another (other) component as shown in the accompanying drawings. The spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, components described as "below" or "beneath" other components or features would then be positioned "above" the other components or features. Thus, the exemplary term "below" can encompass both the "above" and "below" orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0027] Figure 1 It is a schematic diagram of the overall structure of an injection flip structure mold of an electronic water pump of a cooling system according to an embodiment of the present disclosure.

[0028] like Figure 1-Figure 3 As shown, the cooling system electronic water pump injection flip structure mold disclosed in the present invention may include: an installation collection mechanism 1, an upper mold mechanism 2 and a lower mold mechanism 3 and other components.

[0029] Figure 2 It is a structural schematic diagram of an installation collection mechanism 1 and an upper mold mechanism 2 of an injection flip structure mold of an electronic water pump of a cooling system according to an embodiment of the present disclosure.

[0030] like Figure 2 As shown, in the present disclosure, the installation collection mechanism 1 includes a base plate 11, a collection box 12 and an L-shaped back plate 13, wherein the collection box 12 is placed on the top of the base plate 11, and the L-shaped back plate 13 is fixedly arranged at the rear end of the base plate 11 and fits with the rear end of the collection box 12.

[0031] Therefore, the rubber brackets dropped from the lower mold mechanism 3 can be collected by the collection box 12 to avoid random scattering and increase the difficulty of collection for operators, thus effectively saving manpower.

[0032] like Figure 2 As shown, in a preferred embodiment, the upper mold mechanism 2 includes a hydraulic cylinder 21, an upper mold body 22 and a raw material injection tube 23, wherein two hydraulic cylinders 21 are provided, and the two hydraulic cylinders 21 are respectively fixedly arranged at the top front end and the top rear end of the L-shaped back plate 13, and the output shaft of the hydraulic cylinder 21 slides through the L-shaped back plate 13 and extends to the bottom of the L-shaped back plate 13 and is fixedly connected to the upper mold body 22, and the upper mold body 22 is located directly above the lower mold body 35, and a plurality of second molding grooves are evenly opened at the bottom of the upper mold body 22, and a plurality of raw material injection tubes 23 are provided, and the plurality of raw material injection tubes 23 are evenly fixedly arranged through the top of the upper mold body 22 and are respectively connected to the plurality of second molding grooves.

[0033] Therefore, after the hydraulic cylinder 21 drives the upper mold body 22 to descend to the top of the lower mold body 35, the multiple second molding grooves at the bottom of the upper mold body 22 respectively cooperate with the multiple first molding grooves 36 at the top of the lower mold body 35 to form multiple molding chambers for molding rubber brackets. Subsequently, the molten rubber raw material is injected into the multiple molding chambers through multiple raw material injection tubes 23. After the rubber raw material is cooled, a rubber bracket for installing the electronic water pump in the cooling system is formed.

[0034] Figure 3 It is a structural schematic diagram of the lower mold mechanism 3 of the injection flip structure mold of the cooling system electronic water pump according to an embodiment of the present disclosure.

[0035] like Figure 3As shown, in the present disclosure, the lower mold mechanism 3 includes a support block 31, a guide block 32, a rotating shaft 33, a limit block 34, a lower mold body 35, a first molding groove 36 and a handle 37, wherein the support block 31 and the guide block 32 are each provided with two, the two support blocks 31 are respectively fixedly arranged at the two ends of the inner side of the L-shaped back plate 13, the two guide blocks 32 are respectively fixedly arranged on the front sides of the two support blocks 31, the top of the guide block 32 is provided with an inclined guide surface, the rotating shaft 33 slides through the L-shaped back plate 13, the limit block 34 is fixedly arranged at the rear end of the rotating shaft 33, the lower mold body 35 is fixedly sleeved on the outer side of the rotating shaft 33, a plurality of the first molding grooves 36 are provided, and a plurality of the first molding grooves 36 are evenly arranged at the top and bottom of the lower mold body 35, and the handle 37 is fixedly arranged in the middle of the front side of the lower mold body 35.

[0036] The upper mold body 22 is moved upward and reset after the rubber bracket is formed by the hydraulic cylinder 21. At this time, the rubber bracket remains on the inner side of the multiple first molding grooves 36 at the top of the lower mold body 35. The handle 37 is then pulled outward, so that the handle 37 drives the lower mold body 35 and the rotating shaft 33 to move forward synchronously until the limit block 34 is in contact with the back of the L-shaped back plate 13. At this time, the lower mold body 35 is no longer located above the support block 31 and the guide block 32. The lower mold body 35 is then rotated by the handle 37, so that the lower mold body 35 drives the multiple rubber brackets downward. At this time, the multiple rubber brackets fall into the collection box 12 under the action of gravity and are collected. In this process, the flipped lower mold body 35 is pushed backward, and the lower mold body 35 is moved to the top of the support block 31 again under the guidance of the inclined surface at the top of the guide block 32 and is in contact with the inner wall of the L-shaped back plate 13. The hydraulic cylinder 21 then drives the raw material injection tube 23 to descend, and the rubber bracket injection molding operation can be started again.

[0037] In the description of this specification, the description with reference to the terms "one embodiment / method", "some embodiments / methods", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment / method or example are included in at least one embodiment / method or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment / method or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments / methods or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments / methods or examples described in this specification and the features of different embodiments / methods or examples, unless they are contradictory.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] Those skilled in the art should understand that the above embodiments are only for the purpose of clearly illustrating the present disclosure, and are not intended to limit the scope of the present disclosure. For those skilled in the art, other changes or modifications may be made based on the above disclosure, and these changes or modifications are still within the scope of the present disclosure.

Claims

1. A cooling system electronic water pump injection flip structure mold, characterized in that: include: An installation collection mechanism is used to install the upper mold mechanism and the lower mold mechanism, and collect the rubber bracket that falls from the lower mold mechanism; An upper mold mechanism, the upper mold mechanism is used to cooperate with the lower mold mechanism to shape the injected raw material; and A lower die mechanism, the lower die mechanism comprising a support block, a guide block, a rotating shaft, a limit block, a lower die body, a first molding groove and a handle; There are two support blocks and two guide blocks, and the two support blocks are respectively fixed at the two ends of the inner side of the L-shaped back plate, and the two guide blocks are respectively fixed at the front sides of the two support blocks. An inclined guide surface is provided on the top of the guide block, and the rotating shaft slides through the L-shaped back plate. The limit block is fixed at the rear end of the rotating shaft, and the lower mold body is fixedly sleeved on the outer side of the rotating shaft. There are multiple first molding grooves, and the multiple first molding grooves are evenly opened at the top and bottom of the lower mold body, and the handle is fixedly set in the middle of the front side of the lower mold body.

2. The cooling system electronic water pump injection flip structure mold according to claim 1, characterized in that: The installation and collection mechanism comprises a bottom plate, a collection box and an L-shaped back plate.

3. The cooling system electronic water pump injection flip structure mold according to claim 2, characterized in that: The collection box is placed on the top of the bottom plate, and the L-shaped back plate is fixedly arranged at the rear end of the bottom plate and fits with the rear end of the collection box.

4. The cooling system electronic water pump injection flip structure mold according to claim 3, characterized in that: The upper die mechanism comprises a hydraulic cylinder, an upper die body and a raw material injection tube.

5. The cooling system electronic water pump injection flip structure mold according to claim 4, characterized in that: The hydraulic cylinders are provided with two, and the two hydraulic cylinders are respectively fixedly arranged at the top front end and the top rear end of the L-shaped back plate, the output shaft of the hydraulic cylinder slides through the L-shaped back plate and extends to the bottom of the L-shaped back plate and is fixedly connected to the upper mold body, the upper mold body is located directly above the lower mold body, and a plurality of second molding grooves are evenly opened at the bottom of the upper mold body, and a plurality of raw material injection tubes are provided, and the plurality of raw material injection tubes are evenly fixedly arranged through the top of the upper mold body and are respectively connected to the plurality of second molding grooves.