Easily stripped release film for circuit board

Abstract

The utility model discloses an easy-to-peel release film for a circuit board, which comprises a first non-woven fabric layer, a second non-woven fabric layer, an isolating layer, a first lamination layer, a second lamination layer, a first release agent layer and a second release agent layer, the first non-woven fabric layer is arranged above the isolating layer, the second non-woven fabric layer is arranged below the isolating layer, the first release agent layer is arranged above the second lamination layer, and the second release agent layer is arranged below the isolating layer. The first lamination layer is arranged on the top surface of the first non-woven fabric layer, the second lamination layer is arranged on the bottom surface of the second non-woven fabric layer, the first release agent layer is arranged on the top surface of the first lamination layer, and the second release agent layer is arranged on the bottom surface of the second lamination layer. First adsorption holes penetrating downwards to the first non-woven fabric layer are formed in the first release agent layer at intervals, and second adsorption holes penetrating upwards to the second non-woven fabric layer are formed in the second release agent layer at intervals. According to the release film for the easy-to-peel circuit board, the easy-to-peel effect is ensured, and the problem of residual glue retention on the circuit board is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of release films, in particular to a release film for an easily peelable circuit board. Background Art

[0002] In the lamination manufacturing process of flexible circuit boards, release films are required. Release films can effectively reduce the problem of adhesive overflow and contamination of equipment and products, improve the production qualification rate, and reduce the cleaning process caused by cross-contamination of adhesives.

[0003] In order to ensure the release film is peeled off from the circuit board, a layer of release agent needs to be applied. However, the release agent cannot absorb the residual glue. After the release film is peeled off, some residual glue remains on the circuit board, affecting the subsequent processing and use of the circuit board. Improvement is needed. Utility Model Content

[0004] The utility model aims to provide a release film for an easily peelable circuit board, which can protect the circuit board and process residual adhesive, thereby ensuring an easy peeling effect.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A release film for an easily strippable circuit board comprises: a first non-woven fabric layer, a second non-woven fabric layer, an isolation layer, a first coating layer, a second coating layer, a first release agent layer and a second release agent layer, wherein the first non-woven fabric layer is arranged above the isolation layer, and the second non-woven fabric layer is arranged below the isolation layer, the first coating layer is arranged on the top surface of the first non-woven fabric layer, and the second coating layer is arranged on the bottom surface of the second non-woven fabric layer, the first release agent layer is arranged on the top surface of the first coating layer, and the second release agent layer is arranged on the bottom surface of the second coating layer, and first adsorption holes penetrating downward to the first non-woven fabric layer are arranged on the first release agent layer at intervals, and second adsorption holes penetrating upward to the second non-woven fabric layer are arranged on the second release agent layer at intervals.

[0007] Wherein, the isolation layer is a layer of hot-melt film.

[0008] Wherein, the first release agent layer and the second release agent layer are respectively made of a layer of silicone oil.

[0009] Wherein, the first adsorption hole and the second adsorption hole are staggered.

[0010] Wherein, the first non-woven fabric layer and the second non-woven fabric layer are respectively made of spunlace non-woven fabrics.

[0011] Wherein, the first adsorption hole rectangular array is distributed on the first release agent layer, and the second adsorption hole rectangular array is distributed on the second release agent layer.

[0012] The beneficial effects of the utility model include: a release film for an easily peelable circuit board, which can be covered on the circuit board to protect it when under pressure, and is in contact with the circuit board through the first release agent layer, thereby ensuring an easy-to-peel effect. When the circuit board is under pressure, the air from the first adsorption hole is gradually discharged through the first non-woven fabric layer, and when decompressed, the residual glue on the circuit board can be instantly adsorbed through the first adsorption hole, thereby reducing the problem of residual glue retention on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of the utility model. DETAILED DESCRIPTION

[0014] Combine the following Figure 1 The technical solution of the utility model is further illustrated by specific embodiments.

[0015] like Figure 1 The release film for an easily peelable circuit board shown includes: a first non-woven fabric layer 2, a second non-woven fabric layer 3, an isolation layer 1, a first coating layer 9, a second coating layer 4, a first release agent layer 8 and a second release agent layer 5. The first non-woven fabric layer 2 is arranged above the isolation layer 1, and the second non-woven fabric layer 3 is arranged below the isolation layer 1. In this embodiment, the isolation layer 1 adopts a layer of hot-melt film, which can not only isolate the first non-woven fabric layer 2 from the second non-woven fabric layer 3, but also realize the composite fixation of the first non-woven fabric layer 2 and the second non-woven fabric layer 3 to ensure structural stability.

[0016] The first coating layer 9 is arranged on the top surface of the first non-woven fabric layer 2 to ensure the flatness of the top surface of the first non-woven fabric layer 2, which facilitates the subsequent construction of the first release agent layer. The first release agent layer 8 is arranged on the top surface of the first coating layer 9 to ensure the easy peeling effect of the release film top surface.

[0017] The second coating layer 4 is arranged on the bottom surface of the second non-woven fabric layer 3 to ensure the flatness and air tightness of the bottom surface of the second non-woven fabric layer 3. The second release agent layer 5 is arranged on the bottom surface of the second coating layer 4 to ensure the easy peeling effect of the bottom surface of the release film. In this embodiment, the first release agent layer 8 and the second release agent layer 5 respectively use a layer of silicone oil and can be used on both sides.

[0018] The first non-woven fabric layer 2 and the second non-woven fabric layer 3 are respectively made of spunlace non-woven fabrics with porous internal structures, which can be exhausted when compressed. The first release agent layer 8 is provided with first adsorption holes 7 penetrating downward to the first non-woven fabric layer 2, and the second release agent layer 5 is provided with second adsorption holes 6 penetrating upward to the second non-woven fabric layer 3. The circuit board can be contacted through the first release agent layer 8. When the circuit board is compressed, the air in the first adsorption holes 7 is gradually discharged through the elastic compression of the first non-woven fabric layer 2. In this way, when decompressed, the first non-woven fabric layer 2 can be reset by elasticity, and the first adsorption holes 7 can be used to instantly adsorb the residual glue on the circuit board, thereby reducing the problem of residual glue retention on the circuit board.

[0019] like Figure 1 As shown, the first adsorption holes 7 and the second adsorption holes 6 are staggered to ensure structural strength. In this embodiment, the first adsorption holes 7 are distributed in a rectangular array on the first release agent layer 8, and the second adsorption holes 6 are distributed in a rectangular array on the second release agent layer 5, forming a plurality of evenly distributed adsorption hole structures on both sides of the release film. The release film is rolled up after use on the front side, and can be unrolled and used on the other side later, thereby improving the utilization rate of the material.

[0020] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.

Claims

1. A release film for an easily peelable circuit board, characterized in that: include: A first non-woven fabric layer, a second non-woven fabric layer, an isolation layer, a first coating layer, a second coating layer, a first release agent layer and a second release agent layer, the first non-woven fabric layer is arranged above the isolation layer, the second non-woven fabric layer is arranged below the isolation layer, the first coating layer is arranged on the top surface of the first non-woven fabric layer, the second coating layer is arranged on the bottom surface of the second non-woven fabric layer, the first release agent layer is arranged on the top surface of the first coating layer, the second release agent layer is arranged on the bottom surface of the second coating layer, the first release agent layer is provided with first adsorption holes penetrating downward to the first non-woven fabric layer at intervals, and the second release agent layer is provided with second adsorption holes penetrating upward to the second non-woven fabric layer at intervals.

2. The release film for an easily peelable circuit board according to claim 1, characterized in that: The isolation layer is a hot-melt film.

3. The release film for an easily peelable circuit board according to claim 1, characterized in that: The first release agent layer and the second release agent layer each use a layer of silicone oil.

4. The release film for an easily peelable circuit board according to claim 1, characterized in that: The first adsorption hole is staggered with the second adsorption hole.

5. The release film for an easily peelable circuit board according to claim 1, characterized in that: The first non-woven fabric layer and the second non-woven fabric layer are respectively made of spunlace non-woven fabric.

6. The release film for an easily peelable circuit board according to claim 1, characterized in that: The first adsorption hole rectangular array is distributed on the first release agent layer, and the second adsorption hole rectangular array is distributed on the second release agent layer.

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