Box type electronic component braiding device
By introducing vibration rails and turret transfer mechanisms into the tape knitting device of electronic components, combined with the removal mechanism, the problems of vacancy and high waste rate in the load box are solved, and an efficient tape knitting process is achieved, which improves production efficiency and reduces the production efficiency The cost.
Patent Information
- Application Number
- CN202420397915.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-01
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-03-01
AI Technical Summary
When handling electronic components with high scrap rate in the prior art, the vacancy problem in the load box leads to low braiding efficiency, which requires a long time to fill the vacancy, affecting the overall production efficiency.
A cassette electronic component tape knitting device is designed, including electronic component box conveying mechanism, transfer mechanism, sequential arrangement conveying mechanism and removal mechanism. The components are arranged neatly and directly conveyed through vibration rails and turret transfer mechanisms. When we reach the tape knitting mechanism, we avoid feeding stations and use the removal mechanism to screen bad products to ensure smooth tape knitting.
It improves tape braiding efficiency, simplifies the process, reduces costs, and can effectively deal with vacant and defective products in the load box, ensures the consistency of component order and direction, and improves overall production efficiency.
Smart Images
Figure CN222203016U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic component processing, in particular to a box-type electronic component taping device. Background Art
[0002] There are now production lines that place chip electronic components in a tray for aging, testing, and taping. For chip components that use bottom electrode packaging, the components are usually first placed in the tray with the electrodes facing up, and then aged and tested. After the test, the defective components are removed from the tray, and the electronic components in the tray are turned over so that the electrodes of the electronic components in the tray face down (because the electrodes need to face down when taping). Finally, the electronic components are taken out of the tray and taped directly. There are also box testers that use turntables or linear production lines. Electronic components are tested in the tray with the electrodes facing down. This type of equipment does not require the electronic components to be turned over. Since the electronic components in the tray are distributed in two dimensions, and there are gaps in the electronic components in the tray after the defective products are removed, a row of components cannot be directly sucked up and put into the taping with a row of suction heads, otherwise there will be gaps in the components in the taping.
[0003] The prior art has a solution for first filling the gaps in components in a carrier box (for example, the patent with publication number CN217017518U). After the gaps are filled at the filling station, a row of components that are oriented in the same direction as the components on the carrier tape in the tape are directly sucked up from the carrier box by a row of suction heads and placed into the tape. The carrier box does not need to leave the turntable test mechanism or the linear movable test mechanism. However, for electronic components with a high scrap rate, there will be more gaps in the carrier box, and it will take a long time to fill the gaps, which will affect the tape efficiency. Utility Model Content
[0004] In view of the problem that a material replenishing station may affect the efficiency of taping, the utility model provides a cassette-type electronic component taping device, which can ensure efficient completion of taping without the need for a material replenishing station.
[0005] The technical solution is as follows: a box-type electronic component taping device, which includes an electronic component box conveying mechanism, an electronic component transfer mechanism 1, and a taping mechanism, wherein the electronic component box conveying mechanism is used to convey the electronic component box, and the electronic component transfer mechanism 1 is used to take out the electronic components from the electronic component box, and is characterized in that: it also includes an electronic component sequential arrangement conveying mechanism and an electronic component transfer mechanism 2, the electronic component sequential arrangement conveying mechanism is located between the electronic component box conveying mechanism and the taping mechanism, the electronic component transfer mechanism 1 is used to place the taken out electronic components into the electronic component sequential arrangement conveying mechanism, and the electronic component transfer mechanism 2 is used to place the electronic components in the electronic component sequential arrangement conveying mechanism into the taping mechanism.
[0006] Furthermore, the box-type electronic component taping device is located after the electronic component testing station.
[0007] Furthermore, the electronic components are sequentially arranged and conveyed by a vibration rail.
[0008] Furthermore, the second electronic component transfer mechanism is a turret transfer mechanism.
[0009] Furthermore, it also includes a rejection mechanism for rejecting defective electronic components, and the rejection mechanism is arranged between the electronic component sequential arrangement and conveying mechanism and the braiding mechanism.
[0010] Furthermore, the second electronic component transfer mechanism is provided with a rotating mechanism, and the rotating mechanism is used to control the rotation of the electronic component.
[0011] After adopting such a structure, the electronic components are taken out by the electronic component transfer mechanism 1 and placed in the electronic component sequential arrangement and conveying mechanism. The electronic components are arranged in order by the electronic component sequential arrangement and conveying mechanism and then transferred to the braiding mechanism for braiding by the electronic component transfer mechanism 2. In this way, there is no need to use an additional feeding station for feeding and then braiding, thereby improving the braiding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 It is a schematic diagram of the structure of the utility model. DETAILED DESCRIPTION
[0013] like Figure 1 The box-type electronic component taping device shown in the figure comprises an electronic component box conveying mechanism 1, an electronic component transfer mechanism 2, and a taping mechanism 3. The electronic component box conveying mechanism 1 is used to convey the electronic component box 4, which can be as follows Figure 1The straight conveying track shown can also be a turntable. The electronic component transfer mechanism 1 2 is used to take out the electronic components from the electronic component carrier box 4. It can be a suction head mechanism that can move in the horizontal and vertical directions (preferably a whole row of suction heads). The tape mechanism 3 includes a tape unloading machine that can unload the tape. It also includes an electronic component sequential arrangement conveying mechanism 5 and an electronic component transfer mechanism 2 6. The electronic component sequential arrangement conveying mechanism 5 is located between the electronic component carrier box conveying mechanism 1 and the tape mechanism 3. The electronic component transfer mechanism 1 2 is used to place the taken out electronic components into the electronic component sequential arrangement conveying mechanism 5. The electronic component transfer mechanism 2 6 is used to The electronic components in the electronic component sequential arrangement and conveying mechanism 5 are placed into the taping mechanism 3. The electronic component sequential arrangement and conveying mechanism 5 can be a vibration track, and its principle is similar to that of a vibration disk feeding device. The electronic components are arranged neatly and evenly in the track through vibration and reach one end close to the taping mechanism 3. The linear feeding track part of the vibration disk can also be directly used as the electronic component sequential arrangement and conveying mechanism 5. The electronic component transfer mechanism 2 places the electronic components on the linear feeding track part and relies on vibration to arrange the electronic components neatly and evenly. Compared with directly using a vibration disk, it can prevent the electronic components from flipping over in the vibration disk, resulting in failure to ensure that the electrodes are placed in the tape facing down.
[0014] The electronic component transfer mechanism 2 6 can be a turret transfer mechanism or can directly adopt a suction head mechanism similar to the electronic component transfer mechanism 1 2. The turret transfer mechanism can be directly purchased and used. Suction heads are distributed on the circumferential bottom. The suction heads are driven down by the vertical displacement mechanism to absorb the electronic components and then transfer them through the turret.
[0015] The above mechanism is suitable for the screening mechanism causing vacancies in the carrier box before the tape-forming device. Another way to ensure the efficient completion of tape-forming without the need for a feeding station is that the tape-forming device includes a rejection mechanism, which is arranged between the electronic component sequential arrangement conveying mechanism 5 and the tape-forming mechanism 3. The rejection mechanism may include Figure 1 In the waste box 7, when the suction head with defective electronic components moves to the top of the waste box, the defective products fall directly into the waste box. The rejected defective products include the defective products formed by the previous aging, or the leakage current comparison test before and after the reflow test, or the current surge test, four-parameter test and other electronic component test stations. In this way, the turret can be rejected (screened) during use, so that the effect of not needing to replenish materials can be achieved.
[0016] An appearance inspection device may also be provided at the turret transfer mechanism to perform an appearance inspection on the electronic components. A rotating mechanism may also be provided on the second electronic component transfer mechanism, and the rotating mechanism is used to control the rotation of the electronic components. If the length direction of the electronic components in the carrier box is inconsistent with the length direction of the slot body of the braid, it is necessary to add a device to rotate the electronic components on the turret so that the length direction of the electronic components is consistent with the length direction of the slot body of the braid before being placed in the carrier.
[0017] In addition, the electronic component transfer mechanism 1 2, the electronic component sequential arrangement conveying mechanism 5, the electronic component transfer mechanism 2 6, and the taping mechanism 3 can be set up in multiple groups and arranged around the electronic component box carrier conveying mechanism 1 to perform taping together to improve efficiency.
[0018] The above solution not only solves the problem of vacant positions in the carrier box when rejecting defective electronic components after testing (the linear vibration track used can realize continuous arrangement of multiple capacitors with vacant positions in the vibration track), but also can realize the rejection of electronic components after testing without being in the carrier box. The electronic components can maintain the same order in the vibration track and after being sucked up by the turret, and the turret can be used to reject defective products. In this way, defective products can be rejected, as well as defective products found in appearance inspection. It can even reject defective products caused by aging, comparative tests before and after reflow soldering tests, and various surge tests, and better realize the transfer of electronic components from the carrier box in the production line to the taping device. The whole solution has a simple structure, high efficiency and low cost.
[0019] The above are only preferred specific implementations of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by anyone familiar with the technology within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.
Claims
1. A box-type electronic component taping device, comprising an electronic component carrier box conveying mechanism, an electronic component transfer mechanism 1, and a taping mechanism, wherein the electronic component carrier box conveying mechanism is used to convey the electronic component carrier box, and the electronic component transfer mechanism 1 is used to take out the electronic components from the electronic component carrier box, characterized in that: It also includes an electronic component sequential arrangement and conveying mechanism and an electronic component transfer mechanism 2, the electronic component sequential arrangement and conveying mechanism is located between the electronic component box conveying mechanism and the taping mechanism, the electronic component transfer mechanism 1 is used to place the taken out electronic components into the electronic component sequential arrangement and conveying mechanism, and the electronic component transfer mechanism 2 is used to place the electronic components in the electronic component sequential arrangement and conveying mechanism into the taping mechanism.
2. A cassette-type electronic component taping device according to claim 1, characterized in that: The cassette electronic component taping device is located after the electronic component testing station.
3. A cassette-type electronic component taping device according to claim 1, characterized in that: The electronic components are sequentially arranged and conveyed by a vibration rail.
4. A cassette-type electronic component taping device according to claim 1, characterized in that: The second electronic component transfer mechanism is a turret transfer mechanism.
5. A cassette-type electronic component taping device according to claim 1 or 4, characterized in that: It also includes a rejection mechanism for rejecting defective electronic components, and the rejection mechanism is arranged between the electronic component sequential arrangement and conveying mechanism and the tape braiding mechanism.
6. A cassette-type electronic component taping device according to claim 1 or 4, characterized in that: The second electronic component transfer mechanism is provided with a rotating mechanism, and the rotating mechanism is used to control the rotation of the electronic component.