Mica plate heater

By combining graphene heating units with mica board heaters in mica board heaters, the problem of insufficient heating uniformity is solved, more efficient heating is achieved, and the production process is simplified, and costs are reduced.

CN222210496UActive Publication Date: 2024-12-20LIANGDI ELECTRONICS LIGHT SOURCE FACTORY CHANGZHOU CITY
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Patent Information

Application Number
CN202323264877.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-11-30
Publication Date
2024-12-20
Estimated Expiration
2033-11-30

AI Technical Summary

Technical Problem

The existing mica board heaters have shortcomings in heating uniformity, resulting in uneven coating or unsuitable thickness, which makes it impossible to meet the needs of uniform heating.

Method used

The graphene heating unit is combined with the front and rear mica plates, and the graphene conductive layer is bonded to the silicone to form a PP film graphene layer, which is directly sandwiched between the cover shell and the shell, simplifying the fixing process and improving the heating uniformity and efficiency.

Benefits of technology

The mica heating plate group is achieved more uniform and faster heating, which improves radiation efficiency, simplifies production processes and reduces production costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of heating warmers, in particular to a mica plate warmer which comprises a shell with a containing cavity, a mica heating plate set suitable for being embedded in the shell, and a cover shell connected with the shell and used for covering the mica heating plate set. The mica heating plate group comprises a graphene heating unit, a front mica plate and a rear mica plate, wherein the front mica plate and the rear mica plate are arranged on the two sides of the graphene heating unit respectively. The graphene heating unit comprises at least one graphene conducting layer; a junction box is further connected to the end face of the outer side, back on to the mica heating plate set, of the shell in a matched mode, and a circuit board electrically connected with the at least one graphene conducting layer is arranged in the junction box. According to the utility model, the heating uniformity can be improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of heating heaters, in particular to a mica board heater. Background Art

[0002] Autumn and winter are the seasons when electric heaters are most frequently used. These heaters generally include the following types: electric blankets, quartz tube heaters, fan heaters, air conditioners, and oil heaters. Their specific working principles are as follows: electric blankets use direct contact conduction; quartz tube heaters use heat radiation; fan heaters use warm air convection; air conditioners use warm air convection; and oil heaters use slow air convection. Electric blankets are known for their inconsistent quality, limited lifespan, fire hazard, and prolonged drying. Quartz tube heaters are known for their inconsistent quality, limited lifespan, slow heating, and prolonged drying. Fan heaters are known for their inconsistent quality, limited lifespan, rapid heating, and prolonged drying. Air conditioners are known for their relatively stable quality (but higher price), limited lifespan, rapid heating, and prolonged drying.

[0003] Based on the above situation, the use of mica board heaters has a faster heating speed than quartz tube electric heaters and can effectively shorten the heating time. In this regard, for example, the announcement number CN216143798U discloses a skirting-type mica board electric heater, which uses a plurality of mica heating plates in parallel as heating elements; specifically, the mica heating plate includes: a first mica sheet, a second mica sheet and a carbon heating coating, the first mica sheet and the second mica sheet are arranged opposite to each other, the edges of the two are fixed, and the carbon heating coating is arranged between the first mica sheet and the second mica sheet. Specifically, a carbon composite material is used as the exothermic coating on the mica board, which achieves large-area uniform heating compared to alloy wire or carbon fiber wire electric heating mica boards. However, actual research and development found that in this processing process, the coating uniformity and thickness accuracy of the exothermic coating are required to be high. When the coating is uneven or the thickness is too thick or too thin, it cannot meet the use requirements of uniform heating.

[0004] Therefore, for the mica board heater used in the prior art, the uniformity of its heating needs to be further optimized. Utility Model Content

[0005] The purpose of the utility model is to provide a mica plate heater to solve the technical problem of improving the uniformity of heating.

[0006] The mica plate heater of the present invention is realized as follows:

[0007] A mica plate heater comprises: a shell having a receiving cavity, a mica heating plate group suitable for being embedded in the shell, and a cover shell connected to the shell to cover the mica heating plate group;

[0008] The mica heating plate group includes: a graphene heating unit, and a front mica plate and a rear mica plate respectively arranged on both sides of the graphene heating unit;

[0009] The graphene heating unit includes at least one graphene conductive layer; and

[0010] The outer end surface of the shell facing away from the mica heating plate group is also equipped with a junction box, and a circuit board electrically connected to at least one graphene conductive layer is arranged in the junction box.

[0011] In an optional embodiment of the present invention, the housing includes a bottom plate and a folded side plate provided on a circumferential edge of the bottom plate;

[0012] The cover shell comprises a cover plate pressed on the side of the mica heating plate group facing away from the bottom plate and a folded plate arranged on the circumferential edge of the cover plate and used for fastening with the side plate.

[0013] In an optional embodiment of the present invention, the cover plate is a transparent glass plate or a metal mesh plate.

[0014] In an optional embodiment of the present invention, a pair of hanging beams are further connected to the outer end surface of the shell facing away from the mica heating plate group.

[0015] In an optional embodiment of the present invention, the graphene heating unit includes two graphene conductive layers bonded together.

[0016] In an optional embodiment of the present invention, the two graphene conductive layers are bonded together by organic silica gel.

[0017] In an optional embodiment of the present invention, one of the two graphene conductive layers is bonded to the inner side of the front mica board, and the other graphene conductive layer is bonded to the inner side of the rear mica board.

[0018] In an optional embodiment of the present invention, the graphene conductive layer is bonded to the front mica board and the rear mica board through organic silica gel.

[0019] In an optional embodiment of the present invention, each of the graphene conductive layers is a PP film graphene layer.

[0020] In an optional embodiment of the present invention, the PP film graphene layer is a powdered graphene layer after the PP film is peeled off.

[0021] By adopting the above technical solution, the present invention has the following beneficial effects: The mica heating plate assembly employed in the mica heating plate heater of the present invention generates heat more evenly, heats faster, and has higher radiation efficiency. Furthermore, the mica heating plate assembly is directly sandwiched between the cover and the housing, making assembly and disassembly very convenient. This eliminates the need for securing the mica heating plate to the housing or cover, and eliminates the need for pre-installed connecting structures on the mica heating plate to secure it to the housing or cover. This significantly simplifies the production process and reduces production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic structural diagram of the mica plate heater of the present invention from a first perspective;

[0023] Figure 2 yes Figure 1 A magnified schematic diagram of part A;

[0024] Figure 3 This is a second perspective structural diagram of the mica board heater of the present invention;

[0025] Figure 4 yes Figure 1 An enlarged schematic diagram of part B;

[0026] Figure 5 This is a schematic structural diagram of the mica heating plate group and the shell of the mica plate heater of the present invention;

[0027] Figure 6 The utility model is a structural diagram of the mica heating plate group of the mica plate heater.

[0028] In the figure: bottom plate 1, side plate 2, cover plate 3, folding plate 4, front mica plate 5, rear mica plate 6, graphene conductive layer 7, hanging beam 8, junction box 9, switch 10, mica heating plate group 11. DETAILED DESCRIPTION

[0029] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments in conjunction with the accompanying drawings.

[0030] See also Figures 1 to 6 As shown, this embodiment provides a mica plate heater, comprising: a housing having a receiving cavity, a mica heating plate assembly 11 adapted to be embedded within the housing, and a cover shell connected to the housing to cover the mica heating plate assembly 11. The mica heating plate assembly 11 is directly sandwiched between the cover shell and the housing, making assembly and disassembly very convenient, thereby eliminating the need to secure the mica heating plate assembly to the housing or the cover shell.

[0031] Specifically, the housing comprises a base plate 1 and a folded side plate 2 disposed along the circumferential edge of the base plate 1. The cover comprises a cover plate 3 that covers the side of the mica heating plate assembly 11 facing away from the base plate 1, and a folded flap 4 disposed along the circumferential edge of the cover plate 3 for fastening to the side plate 2. The folded flap 4 and the flap can optionally be fastened using screws. Based on this structure, it should be noted that the cover plate 3 can be a transparent glass plate or a metal mesh plate, and this embodiment does not impose an absolute limitation on this.

[0032] Next, we will describe the mica heating plate assembly 11, which includes a graphene heating unit and two front and rear mica plates 5 and 6, respectively, located on either side of the graphene heating unit. The graphene heating unit includes at least one graphene conductive layer 7. Furthermore, a junction box 9 is attached to the outer end of the housing, facing away from the mica heating plate assembly 11. This junction box 9 houses a circuit board electrically connected to the at least one graphene conductive layer 7. Of course, the junction box 9 also includes a switch 10, connected to the circuit board, for controlling the operating state of the graphene conductive layer 7.

[0033] In addition, in order to facilitate the fixing of the mica board heater of this embodiment on the wall for use, a pair of hanging beams 8 are further connected to the outer end surface of the shell facing away from the mica heating plate group 11.

[0034] Next, an optional implementation is given with reference to the accompanying drawings. The graphene heating unit includes two graphene conductive layers 7 bonded together. The two graphene conductive layers 7 are bonded together by organic silicone.

[0035] More specifically, one of the two graphene conductive layers 7 is bonded to the inner side of the front mica board 5, and the other graphene conductive layer 7 is bonded to the inner side of the rear mica board 6. For example, in one optional embodiment, the graphene conductive layers 7 are bonded to the front mica board 5 and the rear mica board 6 via organic silicone.

[0036] In this embodiment, the front mica plate 5 and the rear mica plate 6 are formed by gluing phlogopite or muscovite mica paper and then pressing it. Furthermore, as an example of an alternative embodiment, each graphene conductive layer 7 is a PP film graphene layer. The PP film graphene layer is a powdered graphene layer after the PP film is removed.

[0037] For the mica heating plate group 11 used in this embodiment, the glued mica paper is first cut, then stacked into thin plates and pressed into the front mica plate 5 and the rear mica plate 6. Then, graphene is infiltrated into the surface layer of the front mica plate 5 and the rear mica plate 6. The PP film on the surface of the graphene is removed and cleaned with ethanol. Then, it is dried in a drying machine at 65°C and then cooled. After cooling and drying, an organic silicone layer is applied to the surface of the graphene layer of the front mica plate 5 and the rear mica plate 6. Then, they are stacked and finally pressed. The mica heating plate group 11 formed in this way has excellent bending strength and processing performance, excellent bending strength and toughness, can be formed into various shapes without delamination, and has more uniform heat generation, faster heat generation, and higher radiation efficiency.

[0038] The above specific embodiments further illustrate the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

[0039] In the description of the present invention, it should be understood that the terms indicating orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0040] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0041] In the present invention, unless otherwise expressly specified or limited, a first feature being above or below a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being above, above, and above the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being below, below, and below the second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

Claims

1. A mica board heater, characterized in that: include: A shell having a receiving cavity, a mica heating plate group suitable for being embedded in the shell, and a cover shell connected to the shell to cover the mica heating plate group; in The mica heating plate group includes: a graphene heating unit, and a front mica plate and a rear mica plate respectively arranged on both sides of the graphene heating unit; The graphene heating unit comprises at least one graphene conductive layer; and The outer end surface of the shell facing away from the mica heating plate group is also equipped with a junction box, and a circuit board electrically connected to at least one graphene conductive layer is arranged in the junction box.

2. The mica board heater according to claim 1, characterized in that: The shell comprises a bottom plate and a folded side plate arranged at the circumferential edge of the bottom plate; The cover shell comprises a cover plate pressed on the side of the mica heating plate group facing away from the bottom plate and a folded plate arranged on the circumferential edge of the cover plate and used for fastening with the side plate.

3. The mica board heater according to claim 2, characterized in that: The cover plate is a transparent glass plate or a metal mesh plate.

4. The mica board heater according to any one of claims 1 to 3, characterized in that: The outer end surface of the shell facing away from the mica heating plate group is also equipped with a pair of hanging beams.

5. The mica board heater according to claim 1, characterized in that: The graphene heating unit comprises two graphene conductive layers which are bonded and connected.

6. The mica board heater according to claim 5, characterized in that: The two graphene conductive layers are bonded together by organic silica gel.

7. The mica board heater according to claim 5 or 6, characterized in that: One of the two graphene conductive layers is bonded to the inner side of the front mica board, and the other graphene conductive layer is bonded to the inner side of the rear mica board.

8. The mica board heater according to claim 7, characterized in that: The graphene conductive layer is bonded and connected to the front mica board and the rear mica board through organic silica gel.

9. The mica board heater according to claim 7, characterized in that: Each of the graphene conductive layers is a PP film graphene layer.

10. The mica board heater according to claim 9, characterized in that: The PP film graphene layer is a powdery graphene layer after the PP film is peeled off.