Electric control component and air conditioner

Abstract

The utility model discloses an electric control part and air conditioner, the electric control part includes: circuit board and heat sink, circuit board thickness both sides are first side and second side respectively, first side and second side are both equipped with heating device, the heating device of first side is mounted in patch, and the heating device of second side is mounted in patch. The height of at least one heating device on the second side is larger than that of any heating device on the first side, the heat dissipation plate is installed on the circuit board and located on the first side of the circuit board, and heat dissipation fins are arranged on the side, away from the circuit board, of the heat dissipation plate. Therefore, the assembling difficulty can be reduced, static electricity and mechanical stress damage in the assembling process can be avoided, the assembling precision, the assembling quality and the assembling efficiency are improved, structures such as a radiator support do not need to be arranged, and the structure of an electric control component is simplified.

Description

Technical Field

[0001] The utility model relates to the technical field of electric control, in particular to an electric control component and an air conditioner. Background Art

[0002] In the related art, the electronic control components are mainly in the form of plug-ins. The plug-in components need to be fixed to the radiator by screws. The radiator is cooled by setting an external fan, and air duct space needs to be reserved in the box of the electronic control components to dissipate heat by convection.

[0003] However, the process of fastening the plug-in components to the heat sink increases the number of assembly steps, reduces assembly efficiency, and requires manual plug-in. The process of fastening the plug-in components is easily affected by static electricity, and the assembly process of the heat sink is easily affected by mechanical stress, resulting in poor reliability and stability. In addition, the box body reserves air duct space, resulting in a larger open area of ​​the box body, which has limited protection against dust, foreign matter and pests, and will also reduce the reliability and stability of the electronic control components. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes an electric control component, which has higher assembly efficiency and lower probability of being affected by static electricity and mechanical stress during assembly.

[0005] The utility model also provides an air conditioner adopting the electric control component.

[0006] According to an embodiment of the utility model, the electric control component includes: a circuit board and a heat sink, the thickness of the circuit board is respectively on both sides of a first side and a second side, the first side and the second side are provided with heating devices, the heating device on the first side is patch-mounted, the height of at least one heating device on the second side is greater than the height of any heating device on the first side, the heat sink is installed on the circuit board and is located on the first side of the circuit board, and the side of the heat sink away from the circuit board has heat dissipation fins.

[0007] According to the electronic control component of the embodiment of the utility model, by arranging a surface-mount device on at least the first side of the circuit board and fixing the circuit board on the first side, on the one hand, at least part of the heat-generating device can be assembled in the form of a surface-mount device, and there is no need to set up an independent heat sink to dissipate the heat of the heat-generating device, which can reduce the difficulty of assembly, avoid static electricity and mechanical stress damage during the assembly process, and improve assembly accuracy, assembly quality and assembly efficiency; on the other hand, the heat sink dissipates the heat of the surface-mount device, and there is no need to form a cooling air duct between the two, and there is no need to set up structures such as a heat sink bracket. While simplifying the structure of the electronic control component, the open area and volume of the box body of the electronic control component can be reduced to improve the protection effect of the electronic control component.

[0008] According to some embodiments of the present invention, a flexible thermally conductive gasket is provided between the heat sink and the heating device on the first side, and the thermally conductive gasket is interference fit between the heat sink and the heating device.

[0009] In some embodiments, the heat sink includes a plate body and a support column, the heat sink fins are arranged on a side of the plate body away from the circuit board, the support column is arranged on a side of the plate body facing the circuit board, and the support column is supported on the circuit board to maintain a distance between the plate body and the heating device on the first side.

[0010] Furthermore, a distance between the plate body and the heating device on the first side is greater than or equal to 0.5 mm.

[0011] Furthermore, the support column is fastened to the circuit board via a fastener.

[0012] According to some embodiments of the utility model, the heat sink includes a plate body and a protrusion, the heat dissipation fins are arranged on a side of the plate body away from the circuit board, the protrusion is arranged on a side of the plate body facing the circuit board, and is arranged corresponding to at least part of the heating device on the first side.

[0013] Further, the heating device on the first side includes a first heating portion and a second heating portion that are spaced apart, the maximum height of the first heating portion is smaller than the maximum height of the second heating portion, the bump includes a first bump and a second bump that are spaced apart, the protruding height of the first bump is greater than the protruding height of the second bump, the first bump is arranged corresponding to the first heating portion, and the second bump is arranged corresponding to the second heating portion.

[0014] In some embodiments, the heat generating device on the first side constitutes a plurality of heat generating parts arranged at intervals, the heat dissipation fins constitute a plurality of heat dissipation groups arranged at intervals, and the plurality of heat generating parts and the plurality of heat dissipation groups are arranged in a one-to-one correspondence.

[0015] Furthermore, the heating device on the first side includes a first heating part and a second heating part which are spaced apart from each other, the plurality of heat dissipation groups include a first heat dissipation group and a second heat dissipation group which are spaced apart from each other, and the one with a larger heat dissipation fin height among the first heat dissipation group and the second heat dissipation group corresponds to the one with a larger heat generation among the first heat dissipation part and the second heat dissipation part.

[0016] Furthermore, a plurality of the heat dissipation groups are arranged at intervals along a first direction, and each of the heat dissipation groups includes a plurality of the heat dissipation fins arranged at intervals along the first direction, a distance between two adjacent heat dissipation fins in the same heat dissipation group is smaller than a distance between two adjacent heat dissipation groups, each of the heat dissipation fins is constructed as a long strip extending along a second direction perpendicular to the first direction, and two ends of the heat dissipation fins in the second direction extend to the edges of the opposite ends of the heat dissipation plate respectively.

[0017] According to some embodiments of the present invention, taking a plane perpendicular to the thickness direction of the circuit board as a projection plane, the orthographic projection of the circuit board on the projection plane completely falls within the range of the orthographic projection of the heat sink on the projection plane.

[0018] Furthermore, the electronic control component also includes: a cover shell, which is arranged on a side of the heat sink close to the circuit board, and the cover shell is connected to the heat sink to form an installation cavity for accommodating the circuit board between the cover shell and the heat sink.

[0019] Furthermore, the cover shell is an integrated structure, or a multi-plate splicing structure.

[0020] Furthermore, the cover shell has a heat dissipation structure.

[0021] Furthermore, a wire passing hole is provided on at least one side surface of the cover shell.

[0022] According to some embodiments of the present invention, the heat sink includes a plate body in the form of a flat plate, and the heat sink fins are arranged on a side of the plate body away from the circuit board.

[0023] The air conditioner according to the second embodiment of the utility model comprises the electronic control component described in the above embodiment.

[0024] Furthermore, the air conditioner includes an air conditioner outdoor unit, the electronic control component is arranged in the air conditioner outdoor unit, the air conditioner outdoor unit has a condenser and a main air duct for dissipating heat of the condenser, and the cooling fins are arranged in the main air duct or in a cooling air duct connected to the main air duct.

[0025] Furthermore, the heating device on the first side includes at least one of an inverter module, a semiconductor power device in a PFC circuit, and a rectifier bridge stack.

[0026] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1is a schematic diagram of an electric control component according to an embodiment of the utility model;

[0028] Figure 2 It is a disassembled schematic diagram of the electric control component according to an embodiment of the utility model;

[0029] Figure 3 is another schematic diagram of an electric control component according to an embodiment of the utility model;

[0030] Figure 4 is a schematic diagram of a circuit board according to an embodiment of the utility model at an angle;

[0031] Figure 5 is a schematic diagram of a circuit board according to an embodiment of the utility model from another angle;

[0032] Figure 6 is a schematic diagram of a heat dissipation plate according to an embodiment of the utility model;

[0033] Figure 7 is another schematic diagram of a heat dissipation plate according to an embodiment of the utility model.

[0034] Reference numerals:

[0035] Electronic control component 100,

[0036] Circuit board 10, first side 11, second side 12, heating element 13, first heating part 13a, second heating part 13b, inductor 13c, capacitor 13d,

[0037] The heat sink 20, the plate body 21, the support column 22, the bump 23, the first bump 23a, the second bump 23b, the heat sink fins 24, the first heat sink group 24a, the second heat sink group 24b,

[0038] The cover 30 , the heat dissipation structure 31 , the wire holes 32 , the thermal conductive pad 40 , and the mounting cavity 50 . DETAILED DESCRIPTION

[0039] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0040] The disclosure below provides many different embodiments or examples for realizing different structures of the utility model. In order to simplify the disclosure of the utility model, the components and settings of specific examples are described below. Of course, they are merely examples, and the purpose is not to limit the utility model. In addition, the utility model can repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the utility model provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the applicability of other processes and / or the use of other materials.

[0041] In the related art, the electric control component 100 is mainly in the form of a plug-in. The plug-in device needs to be fixed to the radiator by screws. The radiator is cooled by setting an external air cooling structure, and air duct space needs to be reserved in the box of the electric control component 100 to dissipate heat by convection.

[0042] However, the process of fastening the plug-in device to the heat sink increases the number of assembly steps, reduces assembly efficiency, and requires manual plug-in. The process of fastening the plug-in device is easily affected by static electricity, and the process of installing the heat sink to the heating device 13 is easily affected by mechanical stress. The reliability and stability are poor. In addition, the box body reserves air duct space, resulting in a larger open area of ​​the box body, which has limited protection against dust, foreign matter and pests, and will also reduce the reliability and stability of the electronic control component 100.

[0043] Based on this, the utility model proposes an electronic control component 100, which can reduce the difficulty of assembling the electronic control component 100 and simplify the assembly steps of the electronic control component 100 to improve the assembly efficiency, and can reduce manual plug-in operations and radiator assembly operations, reduce the probability of the electronic control component 100 being affected by static electricity and mechanical stress, and improve reliability and stability. At the same time, the open area in the box body of the electronic control component 100 can be set smaller, and there is no need to set up a separate air duct space, which has a better protection effect against dust, foreign matter and pests, and can also further improve the reliability and stability of the electronic control component 100.

[0044] Below, refer to Figure 1-Figure 6 The electric control component 100 and the air conditioner according to the embodiment of the utility model are described and illustrated in detail.

[0045] like Figure 1 and Figure 2 , Figure 3 As shown, the electric control component 100 according to the embodiment of the utility model includes: a circuit board 10 and a heat dissipation plate 20.

[0046] Among them, see Figure 4 and Figure 5As shown, the thickness of the circuit board 10 is respectively on the first side 11 and the second side 12, and the first side 11 and the second side 12 are both provided with heating devices 13, the heating devices 13 on the first side 11 are surface mounted, and the height of at least one heating device 13 on the second side 12 is greater than the height of any heating device 13 on the first side 11, and the heat sink 20 is installed on the circuit board 10 and is located on the first side 11 of the circuit board 10, and the side of the heat sink 20 away from the circuit board 10 has heat dissipation fins 24.

[0047] Specifically, the circuit board 10 has a first side 11 facing the heat sink 20 and a second side 12 facing away from the heat sink 20. The first side 11 and the second side 12 are both provided with heating devices 13. The heating devices 13 may include surface mount devices installed by surface mount and plug-in devices installed by plug-in welding. The heating devices 13 arranged on the first side 11 are all constructed as surface mount devices, while the heating devices 13 arranged on the second side 12 may be surface mount devices or plug-in devices, and the height of at least one heating device 13 on the second side 12 is higher than the height of all the heating devices 13 on the first side 11. The heat sink 20 is located on the first side 11 and is connected and fixed to the circuit board 10, and a heat sink fin 24 may be provided on the side of the heat sink 20 away from the circuit board 10, so as to perform direct contact or indirect heat exchange heat dissipation on the surface mount device arranged on the first side 11 of the circuit board 10 through the heat sink fin 24.

[0048] It should be pointed out that, based on the surface-mount devices arranged on the first side 11, at least part of the heating devices 13 in the electric control component 100 are selected as surface-mount devices, which can reduce the installation height of the first side 11, facilitate the connection between the circuit board 10 and the heat sink 20, and the heat sink 20 will not interfere with the heating devices 13 on the first side 11. The heating devices 13 with a higher height are arranged on the second side 12, and will not affect the connection between the heat sink 20 and the circuit board 10. The heat sink 20 can at least improve the heat dissipation efficiency of the heating devices 13 on the first side 11, and realize the rapid heat dissipation of the heating devices 13 on the first side 11. Therefore, the heating devices 13 with a larger heat generation can be arranged on the first side 11, and the heat sink 20 directly dissipates the heat for the heating devices 13 on the first side 11. There is no need to arrange an air cooling channel and a radiator between the first side 11 and the box body of the electric control component 100, which can reduce the space occupied by the electric control component 100, reduce the open area of ​​the box body, and improve the protection effect of the electric control component 100.

[0049] It can be understood that the heating device 13 in the electronic control component 100 generates heat when working, and based on the amount of heat generated, the heat dissipation device that generates more heat can be selected as a surface-mount device and set on the first side 11, and the device that generates less heat can be selected as a surface-mount device or a plug-in device and set on the second side 12. The heating device 13 constructed as a surface-mount device does not need to be manually plugged in, and can be surface-mounted and soldered by automated equipment to improve production efficiency, avoid static electricity generated by manual assembly, and reduce the risk of damage to the electronic control component 100 caused by static electricity. Automated assembly has higher assembly accuracy and can also reduce the probability of mechanical stress damage to the heating device 13 during the assembly process of the heating device 13, when the heat sink is set and assembled to the circuit board 10. At the same time, it can also solve the problems of bridging and poor welding when the pins of the plug-in device are soldered.

[0050] It can be understood that the heat sink 20 is provided with heat dissipation fins 24 on one side away from the circuit board 10, and the other side is suitable for contacting with the surface-mount devices on the circuit board 10 for heat dissipation. There is no need to provide structures such as a radiator bracket, which can also reduce the cost of the electronic control component 100 and simplify the structure of the electronic control component 100. The heat sink fins 24 provided on the heat sink 20 away from the first side 11 are specifically a multi-layer spaced and relatively arranged raised plate body 21 structure. The heat sink 20 can be made of metal structures with high heat dissipation efficiency such as aluminum and copper to effectively achieve heat dissipation.

[0051] According to the electric control component 100 of the embodiment of the utility model, by setting a surface-mount device on at least the first side 11 of the circuit board 10 and fixing the circuit board 10 on the first side 11, on the one hand, at least part of the heating device 13 is assembled in the form of a surface-mount device, and there is no need to set up an independent heat sink to dissipate the heat of the heating device 13, which can reduce the difficulty of assembly, avoid static electricity and mechanical stress damage during the assembly process, and improve assembly accuracy, assembly quality and assembly efficiency; on the other hand, the heat sink 20 dissipates the heat of the surface-mount device, and there is no need to form a cooling air duct between the two, and there is no need to set up structures such as a heat sink bracket. While simplifying the structure of the electric control component 100, the open area and volume of the box body of the electric control component 100 can be reduced to improve the protection effect of the electric control component 100.

[0052] It should be pointed out that the heating device 13 on the first side 11 may include at least one of the power devices involved in the control of the air conditioner, wherein the power device may be an intelligent power module for variable frequency control, an insulated gate bipolar transistor, a fast recovery diode, a rectifier bridge stack and other devices, and the surface structure is a mounting form, which can be soldered to the surface of the circuit board 10 (i.e., the first side 11) through a soldering process, and after the circuit board 10 and the heat sink 20 are fastened, the power device on the first side 11 can be cooled by the heat sink 20, and the circuit board 10 can be a PCB board for installing the above-mentioned power devices and other electrical components, and the heating device 13 arranged on the first side 11 is not limited to power devices.

[0053] According to some embodiments of the present invention, a flexible thermally conductive pad 50 is provided between the heat dissipation plate 20 and the heating device 13 on the first side 11, and the thermally conductive pad 50 is interference-fitted between the heat dissipation plate 20 and the heating device 13. It is worth noting that: Figure 2 The thermal pad 50 is hidden in the Figure 5 The thermally conductive pad 50 and the heat sink 20 are shown in an exploded view without being assembled.

[0054] Specifically, the thermal gasket 50 is a thermally conductive medium used for flexible assembly and matching. A structure such as a silicone pad can be selected to fill the gap between the SMD device and the heat sink 20 to improve the heat dissipation efficiency and heat dissipation effect between the two, avoid direct rigid contact or rigid matching between the SMD device and the base plate, and reduce the probability of mechanical damage to the SMD device.

[0055] Therefore, by providing the thermally conductive pad 50, not only can the heat dissipation effect and heat dissipation efficiency of the SMD device be improved, local heat concentration can be avoided, and the service life of the SMD device can be extended, but also mechanical damage to the SMD device can be avoided.

[0056] like Figure 3 , Figure 6 and Figure 7 As shown, in some embodiments, the heat sink 20 includes a plate body 21 and a support column 22, the heat dissipation fins 24 are arranged on a side of the plate body 21 away from the circuit board 10, the support column 22 is arranged on a side of the plate body 21 facing the circuit board 10, and the support column 22 is supported on the circuit board 10 to maintain a distance between the plate body 21 and the heating device 13 on the first side 11.

[0057] Specifically, the plate body 21 is arranged opposite to the circuit board 10, and the area of ​​the plate body 21 is less than or equal to the area of ​​the circuit board 10, or the area of ​​the circuit board 10 is less than or equal to the area of ​​the plate body 21. Support columns 22 can be set on the four corner areas and the middle area of ​​the plate body 21 to ensure that there is no wiring or device arrangement on the circuit board 10 where the support columns 22 are located, so as to avoid interference between the support columns 22 and the circuit board 10. The support columns 22 extend toward the first side 11 to separate the heat sink 20 from the circuit board 10 through the support columns 22 to define an installation space. The surface-mount device can be arranged in the installation space and ensure that the heating device 13 is spaced apart from the plate body 21 to avoid the plate body 21 scratching the heating device 13 and reduce the probability of mechanical damage to the heating device 13. The thickness of the thermal conductive gasket can be slightly greater than or equal to the spacing between the heating device 13 and the plate body 21, so as to fill the space between the plate body 21 and the heating device 13, so as to achieve contact heat dissipation of the heat sink 20 to the heating device 13, thereby improving the heat dissipation effect and heat dissipation efficiency.

[0058] It should be pointed out that the heat dissipation fins 24 are arranged on the side of the plate body 21 away from the support column 22. The heat dissipation fins 24 can be completely arranged on the side of the plate body 21 away from the first side 11, or the heat dissipation fins 24 can be arranged corresponding to the heating device 13. The arrangement of the heat dissipation fins 24 can increase the heat dissipation area of ​​the heat dissipation plate 20 to achieve rapid cooling of the heat dissipation plate 20, and further achieve rapid heat dissipation of the heating device 13.

[0059] Furthermore, the distance between the plate body 21 and the heating device 13 on the first side 11 is greater than or equal to 0.5 mm.

[0060] Exemplarily, the height of the support column 22 is H1, the height of the fixing position of the heating element 13 is H2, the height of the heating element 13 is H3, and the spacing is 0.5 mm, then it is necessary to ensure that H1-H2≥H3+0.5 mm.

[0061] Therefore, the distance between the circuit board 10 and the heat sink 20 is not less than 0.5 mm, and the thermal conductive gasket 50 is constructed of an elastic elastic material with a basic thickness of not less than 0.5 mm, so as to effectively fill the gap between the heating device 13 and the board body 21, achieve an interference fit effect, and improve the heat dissipation effect and efficiency.

[0062] like Figure 3 As shown, further, the support column 22 is fastened to the circuit board 10 by a fastener.

[0063] Specifically, support columns 22 can be set on at least two of the four corner areas of the plate body 21 and on the middle area of ​​the plate body 21, so that the installation space can be stably defined by multiple support columns 22, and a mounting structure can be formed by the support columns 22, such as an internal thread is set inside the support column 22, or a clip is set at the end of the support column 22, and the fastener can be a screw or a clip, and an assembly hole is opened on the corresponding circuit board 10. The screw or the clip passes through the assembly hole and is threaded or clipped with the support column 22 to realize the assembly between the heat sink 20 and the circuit board 10.

[0064] In this way, the heat sink 20 and the circuit board 10 can be integrated into one, which further improves the assembly efficiency and makes the heat sink 20 and the heating element 13 fit more closely, thus achieving a better heat dissipation effect.

[0065] See also Figure 6 and Figure 7 As shown, according to some embodiments of the utility model, the heat sink 20 includes a plate body 21 and a protrusion 23, the heat dissipation fin 24 is arranged on the side of the plate body 21 away from the circuit board 10, the protrusion 23 is arranged on the side of the plate body 21 facing the circuit board 10, and is arranged corresponding to at least part of the heating device 13 on the first side 11.

[0066] Specifically, the protrusion 23 is formed on the side of the plate body 21 away from the heat sink fin 24, and the heat sink fin 24 is arranged corresponding to the heating device 13, and the protrusion 23 can be one or more, and the protrusion 23 extends toward the first side 11 to make the distance between the heating device 13 located on the first side 11 and the heat sink 20 more reasonable.

[0067] It should be pointed out that the specifications and sizes of the multiple heating devices 13 arranged on the first side 11 may be the same or different, and the corresponding heights of the multiple heating devices 13 in the relative directions of the first side 11 and the second side 12 are different, and the protrusions 23 can be one or more, and the heights of the multiple protrusions 23 can also be the same or different. Exemplarily, the heating devices 13 located on the first side 11 include a first surface-mount device, a second surface-mount device and a third surface-mount device, and the heights increase successively. There can be two corresponding protrusions 23, one protrusion 23 corresponds to the first surface-mount device, one protrusion 23 corresponds to the second surface-mount device, and the third surface-mount device is directly opposite to the board body 21, so that the distance between the first surface-mount device and the protrusion 23, the distance between the second surface-mount device and another protrusion 23, and the distance between the third surface-mount device and the board body 21 are similar. A thermal pad 50 of the same specifications and sizes can be used for auxiliary heat dissipation to improve the heat dissipation efficiency and heat dissipation effect.

[0068] It can be understood that in order to make the distance between the first SMD device and the bump 23, the distance between the second SMD device and another bump 23, and the distance between the third SMD device and the board 21 close, the thermal conductive gasket 50 can be selected to be laid in one piece, that is, a whole thermal conductive gasket 50 is directly laid on the first side 11 to improve the assembly efficiency of the electronic control component 100. Alternatively, based on the number of heat-generating devices 13 on the first side 11 and the heat dissipation requirements, several small thermal conductive gaskets 50 that have been cut can be selected and reasonably arranged corresponding to the number of heat-generating devices 13 and the heat dissipation requirements to reduce the cost of the electronic control component 100.

[0069] like Figure 3 As shown, further, the heating device 13 on the first side 11 includes a first heating portion 13a and a second heating portion 13b arranged at intervals, the maximum height of the first heating portion 13a is less than the maximum height of the second heating portion 13b, the bump 23 includes a first bump 23a and a second bump 23b arranged at intervals, the protruding height of the first bump 23a is greater than the protruding height of the second bump 23b, the first bump 23a is arranged corresponding to the first heating portion 13a, and the second bump 23b is arranged corresponding to the second heating portion 13b.

[0070] It should be pointed out that the first heating part 13a and the second heating part 13b serve as references in the present invention. Here, it is intended to point out that the heating device 13 on the first side 11 includes multiple types. Based on the different heights of the heating devices 13, the first heating part 13a and the second heating part 13b are used to distinguish them, rather than defining the first side 11 as including two types of heating devices 13, respectively defining the first heating part 13a and the second heating part 13b. In other words, the first side 11 can be provided with two or more surface-mount devices, and based on the height of the heating device 13, it is defined as the first heating part 13a and the second heating part 13b, that is, multiple surface-mount devices. When comparing two of the heating devices 13 correspondingly provided with the bumps 23, the higher one can be defined as the second heating portion 13b, and the lower one can be defined as the first heating portion 13a, rather than being defined based on the type. The corresponding first bump 23a and the second bump 23b only serve as references in the present utility model. There can be multiple corresponding bumps 23, and when comparing any two of the bumps 23, the higher one is defined as the first bump 23a, which is provided corresponding to the lower first heating portion 13a, and the lower one is defined as the second bump 23b, which is provided corresponding to the higher first heating portion 13a.

[0071] Therefore, by setting the first protrusion 23a and the second protrusion 23b, the distances between the various heating devices 13 with different heights on the first side 11 and the heat sink 20 can be close, and a thermal conductive gasket 50 of uniform specifications or a whole thermal conductive gasket 50 can be selected to reduce the difficulty of assembly. At the same time, based on the setting of the protrusion 23, the heat dissipation efficiency of different heating devices 13 can also be improved, further improving the cooling effect of the electronic control component 100.

[0072] In some embodiments, the heating device 13 on the first side 11 is composed of a plurality of heating parts spaced apart along a first direction, a plurality of bumps 23 are also spaced apart along the first direction, and each bump 23 is constructed as a long strip of bumps extending along a second direction perpendicular to the first direction. For example, the first direction may be one of the length direction and the width direction of the heat sink 20, and the second direction may be the other of the length direction and the width direction of the heat sink 20, thereby simplifying the structure of the bump 23, ensuring the correspondence between the bump 23 and the heating part, reducing materials, and reducing costs.

[0073] Combination Figure 3 , Figure 4 and Figure 5 As shown, in some embodiments, the heating device 13 of the first side 11 constitutes a plurality of heating parts arranged at intervals, the heat dissipation fins 24 constitute a plurality of heat dissipation groups arranged at intervals, and the plurality of heating parts and the plurality of heat dissipation groups are arranged in one-to-one correspondence.

[0074] Specifically, there can be multiple SMD devices on the first side 11, and the multiple SMD devices can be arranged at intervals so that each SMD device is individually constructed as a heating part, or at least two of the multiple SMD devices can be arranged in a concentrated manner, so that a heating part is defined by the at least two concentrated SMD devices, that is, each heating part includes at least one heating device 13, and the corresponding heat dissipation fins 24 can also be dispersedly arranged on the plate body 21, and each heat dissipation fin 24 forms a fin group, and each fin group is defined as a heat dissipation group. The heat dissipation group is arranged corresponding to the heat dissipation part, and each heat dissipation group can cool and dissipate a corresponding heat dissipation part to achieve corresponding heat dissipation, and multiple heat dissipation groups can be arranged at intervals to avoid heat interference between multiple heat dissipation groups, so as to improve heat concentration on the heat dissipation plate 20 and improve heat dissipation efficiency and heat dissipation effect.

[0075] It should be pointed out that a plurality of heat sinks 24 may be provided in each heat sink group, and based on the difference in heat generation of different heat generating parts, the length and density of the heat sink fins 24 in each heat sink group may be different. For example, the heat sink fins 24 of the heat sink group corresponding to the heat generating part with relatively large heat generation may be longer in length and have a greater density, while the heat sink fins 24 of the heat sink group corresponding to the heat generating part with relatively small heat generation may be shorter in length and have a smaller density.

[0076] Exemplarily, the heating device 13 of the first side 11 includes a first heating portion 13a and a second heating portion 13b arranged at intervals, and the multiple heat dissipation groups include a first heat dissipation group 24a and a second heat dissipation group 24b arranged at intervals, and the one with the larger heat dissipation fin 24 in the first heat dissipation group 24a and the second heat dissipation group 24b is arranged corresponding to the one with the larger heat generation in the first heat dissipation group 13a and the second heat dissipation group 13b. Exemplarily, when the first heat dissipation portion 13a is arranged corresponding to the first heat dissipation group 24a, and the second heat dissipation portion 13b is arranged corresponding to the second heat dissipation group 24b, if the heat generation of the first heat dissipation portion 13a is greater than the heat generation of the second heat dissipation portion 13b, the height of the heat dissipation fin 24 in the first heat dissipation group 24a is greater than the height of the heat dissipation fin 24 in the second heat dissipation group 24b, and if the heat generation of the first heat dissipation portion 13a is less than the heat generation of the second heat dissipation portion 13b, the height of the heat dissipation fin 24 in the first heat dissipation group 24a is less than the height of the heat dissipation fin 24 in the second heat dissipation group 24b.

[0077] It should be pointed out that the first heating part 13a and the second heating part 13b serve as references in the present invention, which is intended to point out that the heating devices 13 on the first side 11 include multiple types, and based on the different calorific values ​​of the heating devices 13, they are distinguished by the first heating part 13a and the second heating part 13b, rather than defining the first side 11 as including two types of heating devices 13, respectively defining the first heating part 13a and the second heating part 13b. In other words, the first side 11 can be provided with two or more surface-mount devices, and based on the different calorific values ​​of the heating devices 13, they are defined as the first heating part 13a and the second heating part 13b.

[0078] Exemplarily, the first side 11 includes a first SMD device, a second SMD device and a third SMD device, the first SMD device has the largest heat generation, the third SMD device has the smallest heat generation, and when the first SMD device is compared with the second SMD device, the first SMD device with the large heat generation can be defined as the first heat generating portion 13a, and the second SMD device with the low heat generation can be defined as the second heat generating portion 13b, and when the second SMD device is compared with the third SMD device, the second SMD device with the large heat generation can be defined as the first heat generating portion 13a, and the third SMD device with the low heat generation can be defined as the second heat generating portion 13b.

[0079] Therefore, at least by adjusting the length of the heat sink fins 24 in different heat sink groups, different heat sink groups can specifically dissipate heat for a variety of heat generating devices 13 with different heat outputs, thereby improving the heat dissipation effect and heat dissipation efficiency, while avoiding local heat concentration on the heat sink 20. The heat sink fins 24 corresponding to the heat generating devices 13 with smaller heat outputs can be shorter in length, and the material cost of the electronic control component 100 can also be reduced.

[0080] like Figure 1 and Figure 6 As shown, further, a plurality of heat dissipation groups are arranged at intervals along a first direction, and each heat dissipation group includes a plurality of heat dissipation fins 24 arranged at intervals along the first direction, a spacing L between two adjacent heat dissipation fins 24 in the same heat dissipation group is smaller than a spacing W between two adjacent heat dissipation groups, and each heat dissipation fin 24 is constructed as a long strip extending along a second direction perpendicular to the first direction, and both ends of the heat dissipation fin 24 in the second direction extend to the edges of the opposite ends of the heat dissipation plate 20 respectively.

[0081] Specifically, the multiple heating groups on the first side 11 are arranged in sequence in a first direction, and the first direction can be one of the length direction and the width direction of the heat sink 20, and the multiple heat sink fins 24 in each corresponding heat sink group are also spaced apart along the first direction, so that the number of heat sink fins 24 corresponding to each heating device 13 is multiple, thereby improving the heat dissipation efficiency, and the second direction can be the other of the length direction and the width direction of the heat sink 20, and each heat sink fin 24 extends along the second direction to increase the heat dissipation area of ​​the heat sink 20 and improve the heat dissipation efficiency.

[0082] At the same time, the distance between any two adjacent heat dissipation fins 24 in the same heat dissipation group is smaller than the distance between any two adjacent heat dissipation groups (see Figure 5 As shown), the adjacent heat sink fins 24 in the same heat sink group can achieve heat exchange faster to improve the temperature uniformity effect in the same heat sink group. While achieving cooling, the temperature uniformity is improved to avoid local overheating, which causes the heating device 13 to reduce frequency or even burn out, and improve the working stability of the electronic control component 100. The interval between adjacent heat sink groups is greater than the interval between adjacent heat sink fins 24, which can also reduce heat exchange interference, reduce heat exchange between adjacent heat sink groups, and improve the heat dissipation effect of each heat sink group.

[0083] According to some embodiments of the present invention, taking a plane perpendicular to the thickness direction of the circuit board 10 as a projection plane, the orthographic projection of the circuit board 10 on the projection plane completely falls within the range of the orthographic projection of the heat sink 20 on the projection plane.

[0084] Specifically, the thickness direction of the circuit board 10 is defined as the height direction of the protrusion 23 and the heating device 13 located on the first side 11, and the plane defined by the length direction and the width direction of the circuit board 10 is parallel to the projection plane. A projection of the circuit board 10 with a length and a width can be formed on the projection plane. Corresponding to the projection plane, the heat sink 20 also defines a heat sink 20 projection with a length and a width. The outline dimension of the heat sink 20 projection is larger than the outline dimension of the circuit board 10 projection, that is, both the width dimension and the length dimension of the heat sink 20 are larger than or equal to the length dimension and the width dimension of the circuit board 10, so that the heat sink 20 can completely cover the circuit board 10, so as to improve the heat exchange effect and heat exchange efficiency of the heat sink 20 on the circuit board 10.

[0085] In addition, the heat sink 20 is disposed on the first side 11 of the circuit board 10 and can also simultaneously form a supporting structure of the circuit board 10. The box body of the electronic control component 100 does not need to further provide a structural plate located outside the heat sink 20, which can also simplify the structure of the electronic control component 100 and reduce costs. The integration of the heat sink 20 with the box body can also improve the structural strength of the box body and improve the overall structural stability and reliability of the electronic control component 100.

[0086] like Figure 1 As shown, further, the electronic control component 100 also includes: a cover shell 30, which is arranged on a side of the heat sink 20 close to the circuit board 10, and the cover shell 30 is connected to the heat sink 20 to form an installation cavity for accommodating the circuit board 10 between the cover shell 30 and the heat sink 20.

[0087] The housing 30 and the heat sink 20 define a box body of the electric control component 100 , and the heat sink 20 and the housing 30 can form an integrated assembly structure, which can further simplify the assembly steps and improve the assembly efficiency.

[0088] It should be pointed out that a plug interface can be provided on the circuit board 10, an avoidance hole for avoiding the plug interface can be provided on the cover 30, and at least two connecting wire holes are reserved. At the same time, at least two fixing structures are formed, and the fixing structure can be a snap-on structure or a screw-on structure, so that the cover 30 can be stably and reliably connected to the heat sink 20, thereby improving the structural stability and reliability of the electronic control component 100.

[0089] like Figure 1 and Figure 2 As shown, the cover 30 is an integrated structure, or a multi-plate splicing structure.

[0090] Exemplarily, the cover 30 may include a first plate opposite to the heat sink 20 and a plurality of second plates surrounding the first plate. The first plate and the second plate may be an integral part, such as an integral injection-molded metal part. The first plate and the second plate may also be spliced ​​by a connecting structure to form a sealed assembly structure between the cover 30 and the heat sink 20, thereby achieving an upgraded protection for the circuit board 10 and the devices thereon. The cover 30 may be made of an aluminum structure or a plastic structure, and a heat dissipation structure 31 may also be provided on the second plate to assist in the heat dissipation of the circuit board 10 and the heating devices 13 thereon through the cover 30, thereby further improving the heat dissipation effect.

[0091] like Figure 1 and Figure 2 As shown, the cover 30 has a heat dissipation structure 31 .

[0092] Exemplarily, the heat dissipation structure 31 can be constructed as a heat dissipation grille, which is opened on the first plate and / or the second plate. The heat dissipation structure 31 can also be constructed as a fin structure, and the fin length of the fin structure formed on the cover 30 is smaller than the length of the heat dissipation fin 24 on the heat dissipation plate 20, which mainly plays an auxiliary heat dissipation role.

[0093] Of course, the box body structure defined by the cover shell 30 and the heat sink 20 can also be formed into a fully sealed structure to improve the protection effect of the electronic control component 100, effectively prevent the invasion of pests, dust and foreign objects, and improve the working reliability and safety of the electronic control component 100.

[0094] In addition, if Figure 2 As shown, in some embodiments, a wire hole 32 can be set on at least one side of the cover shell 30, such as: the cover shell 30 includes a top plate and multiple side plates, and a wire hole 32 can be set on the top plate or at least one of the multiple side plates to meet the wiring requirements and reduce the difficulty of wiring.

[0095] like Figure 6 As shown, according to some embodiments of the present invention, the heat sink 20 includes a plate body 21 in the form of a flat plate, and the heat sink fins 24 are disposed on a side of the plate body 21 away from the circuit board 10 .

[0096] Specifically, a protrusion 23 can be formed on the surface of the flat plate body 21 facing the first side 11, and a heat sink fin 24 can be formed on the side away from the first side 11. The position of the heat sink fin 24 is more reasonable, the heat dissipation effect is better, and the structure of the heat sink 20 can be simplified, and the assembly difficulty of the electronic control component 100 can be reduced, thereby improving the assembly efficiency.

[0097] The air conditioner according to the embodiment of the second aspect of the utility model includes the electric control component 100 in the above embodiment, and the technical effects thereof are consistent with those of the above electric control component 100, which will not be described in detail herein.

[0098] Furthermore, the air conditioner includes an outdoor air conditioner, the electric control component 100 is arranged in the outdoor air conditioner, the outdoor air conditioner has a condenser and a main air duct for dissipating heat of the condenser, and the heat dissipation fins 24 are arranged in the main air duct or in a heat dissipation air duct connected to the main air duct.

[0099] Specifically, the electronic control component 100 is integrated in the outdoor unit of the air conditioner, such as the heat sink 20 or the cover 30 of the electronic control component 100 is fixed on the outer shell of the outdoor unit of the air conditioner, and at least a part of the heat sink 20 is arranged in the main air duct, so that the heat sink air duct formed between the heat dissipation fins 24 is connected to the main air duct, and the heat sink 20 is cooled by the airflow in the main air duct. While the cooling of the electronic control component 100 is achieved, there is no need to separately set up a cooling fan for cooling the electronic control component 100, which can further simplify the structure of the air conditioner outdoor unit to reduce the cost of the air conditioner.

[0100] In some embodiments, the heating device 13 on the first side 11 may include an inverter module, a semiconductor power device in a PFC circuit (abbreviation of Power Factor Correction), and at least one of a rectifier bridge stack, for example, it may include: an intelligent power module (IPM, Intelligent Power Module), a power switching device (IGBT, insulated gate bipolar transistor), a fast recovery diode, and at least one of a rectifier bridge stack.

[0101] In some embodiments, the heat generating device 13 of the second side 12 may include at least one tall device of an inductor 13c and a capacitor 13d.

[0102] Other structures and operations of the electric control unit and the air conditioner according to the embodiment of the utility model are well known to those skilled in the art and will not be described in detail here.

[0103] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0104] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0105] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0106] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0107] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0108] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An electronic control component, It is characterized in that include: A circuit board, wherein two sides of the thickness of the circuit board are respectively a first side and a second side, the first side and the second side are both provided with heating devices, the heating device on the first side is surface mounted, and the height of at least one heating device on the second side is greater than the height of any heating device on the first side; A heat sink is installed on the circuit board and is located on a first side of the circuit board. A side of the heat sink away from the circuit board is provided with heat dissipation fins.

2. The electronic control component according to claim 1, It is characterized in that A flexible thermally conductive gasket is provided between the heat dissipation plate and the heat generating device on the first side, and the thermally conductive gasket is interference fit between the heat dissipation plate and the heat generating device.

3. The electronic control component according to claim 1, It is characterized in that The heat sink includes a plate body and a support column, the heat sink fins are arranged on a side of the plate body away from the circuit board, the support column is arranged on a side of the plate body facing the circuit board, and the support column is supported on the circuit board to maintain a distance between the plate body and the heating device on the first side.

4. The electronic control component according to claim 3, It is characterized in that The distance between the plate body and the heating device on the first side is greater than or equal to 0.5 mm.

5. The electronic control component according to claim 3, It is characterized in that The support column is fastened to the circuit board via a fastener.

6. The electronic control component according to claim 1, It is characterized in that The heat sink includes a plate body and a bump, the heat sink fins are arranged on a side of the plate body away from the circuit board, the bumps are arranged on a side of the plate body facing the circuit board and corresponding to at least part of the heating device on the first side.

7. The electric control component according to claim 6, It is characterized in that The heating device on the first side includes a first heating portion and a second heating portion arranged at intervals, the maximum height of the first heating portion is smaller than the maximum height of the second heating portion, the bump includes a first bump and a second bump arranged at intervals, the protrusion height of the first bump is greater than the protrusion height of the second bump, the first bump is arranged corresponding to the first heating portion, and the second bump is arranged corresponding to the second heating portion.

8. The electronic control component according to claim 1, It is characterized in that The heating element on the first side constitutes a plurality of heating parts arranged at intervals, the heat dissipation fins constitute a plurality of heat dissipation groups arranged at intervals, and the plurality of heating parts and the plurality of heat dissipation groups are arranged in a one-to-one correspondence.

9. The electronic control component according to claim 8, It is characterized in that The heating device on the first side includes a first heating part and a second heating part which are spaced apart from each other, and the plurality of heat dissipation groups include a first heat dissipation group and a second heat dissipation group which are spaced apart from each other, and the one with a larger heat dissipation fin height among the first heat dissipation group and the second heat dissipation group corresponds to the one with a larger heat generation among the first heat dissipation group and the second heat dissipation group.

10. The electric control component according to claim 8, It is characterized in that A plurality of the heat dissipation groups are arranged at intervals along a first direction, and each of the heat dissipation groups includes a plurality of the heat dissipation fins arranged at intervals along the first direction, a spacing between two adjacent heat dissipation fins in the same heat dissipation group is smaller than a spacing between two adjacent heat dissipation groups, each of the heat dissipation fins is constructed as a long strip extending along a second direction perpendicular to the first direction, and two ends of the heat dissipation fin in the second direction respectively extend to the edges of the opposite ends of the heat dissipation plate.

11. The electronic control component according to any one of claims 1 to 10, It is characterized in that Taking a plane perpendicular to the thickness direction of the circuit board as a projection plane, the orthographic projection of the circuit board on the projection plane completely falls within the range of the orthographic projection of the heat sink on the projection plane.

12. The electric control component according to claim 11, It is characterized in that Also includes: The cover shell is arranged on a side of the heat dissipation plate close to the circuit board, and the cover shell is connected to the heat dissipation plate to form an installation cavity for accommodating the circuit board between the cover shell and the heat dissipation plate.

13. The electric control component according to claim 12, It is characterized in that The cover shell is an integrated structure or a multi-plate splicing structure.

14. The electric control component according to claim 12, It is characterized in that The cover shell is provided with a heat dissipation structure.

15. The electric control component according to claim 12, It is characterized in that A wire passing hole is provided on at least one side surface of the cover shell.

16. The electronic control component according to claim 1, It is characterized in that The heat sink comprises a plate body in the form of a flat plate, and the heat sink fins are arranged on a side of the plate body away from the circuit board.

17. An air conditioner, It is characterized in that Comprising the electronic control component according to any one of claims 1-16.

18. The air conditioner according to claim 17, It is characterized in that The air conditioner comprises an outdoor air conditioner, the electric control component is arranged in the outdoor air conditioner, the outdoor air conditioner has a condenser and a main air duct for heat dissipation of the condenser, and the heat dissipation fins are arranged in the main air duct or in a heat dissipation air duct connected to the main air duct.

19. The air conditioner according to claim 17, It is characterized in that The heating device on the first side includes at least one of an inverter module, a semiconductor power device in a PFC circuit, and a rectifier bridge stack.

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