Sampling device for production of semiconductor electronic special material
By designing the protective frame and sealing structure of the sampling device for the production of semiconductor electronic special materials, the problem of dust accumulation affecting the inspection results when the robot is not in use is solved, and the accuracy of the inspection results of semiconductor materials is ensured.
Patent Information
- Application Number
- CN202420669042.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-02
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-04-02
AI Technical Summary
The robot is prone to dust accumulation when not in use, affecting the inspection results of semiconductor materials.
A sampling device for the production of semiconductor electronic special materials is designed, including a workbench, a protective frame, a sealing plate, a control plate and an electric push rod. The sealing structure of the sealing plate and a protective frame is used to avoid the accumulation of external dust.
It effectively prevents the accumulation of dust on the sampling block and ensures the accuracy of the inspection results of semiconductor materials.
Smart Images

Figure CN222212312U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor electronic materials, in particular to a sampling device for producing semiconductor electronic special materials. Background Art
[0002] Semiconductors are materials with electrical conductivity between conductors and insulators at room temperature. All objects in life can be roughly divided into three categories according to their conductivity: conductors, semiconductors, and insulators.
[0003] When the above-mentioned semiconductor materials are produced, a sampling device is needed to sample some samples to facilitate the later inspection of the semiconductor materials. A sampling robot is needed for sampling. The manipulator on the sampling robot is convenient for sampling block semiconductor materials. When the manipulator is not in use, it is in contact with external dust for a long time, making the manipulator unclean. The dust on the manipulator during sampling will affect the inspection results of the semiconductor materials. Utility Model Content
[0004] In order to overcome the shortcomings of the prior art that the manipulator is prone to dust accumulation, which affects the inspection results of sampled semiconductors, one of the purposes of the utility model is to provide a sampling device for the production of semiconductor electronic special materials.
[0005] One of the purposes of the utility model is achieved by the following technical solution: A sampling device for semiconductor electronic special material production, comprising a workbench: the upper side of the workbench is rotatably connected with a rotating shaft, the upper end of the rotating shaft is fixedly connected with a rotating disk, the upper side of the rotating disk is fixedly connected with a connecting frame, the upper side of the connecting frame is fixedly connected with a cylinder, and the lower side of the connecting frame is provided with a protective unit;
[0006] The protection unit includes a fixed plate, which is fixedly connected to the lower side of the connecting frame, and a protection frame is fixedly connected to the lower side of the fixed plate, and sealing plates are provided on the outer sides of the left and right ends of the protection frame, and the front sides of the sealing plates on the left and right sides are fixedly connected to fixed blocks, and the outer sides of the fixed blocks on the left and right sides are fixedly connected to rotating block 1, and the outer side of the rotating block 1 is rotatably connected to a control plate, and the outer side of the upper end of the control plate is rotatably connected to rotating block 2, and the outer side of the rotating block 2 is fixedly connected to a moving block, an electric push rod is fixedly connected between the fixed plate and the moving block, and the output end of the cylinder is fixedly connected to a lifting plate, and a slide groove is provided on the lower side of the lifting plate, and slide plates are slidably connected to the inner sides of the front and rear ends of the slide groove, and sampling blocks are fixedly connected to the lower sides of the slide plates on the front and rear sides.
[0007] According to the sampling device for producing semiconductor electronic special materials, the sealing plate is slidably connected to the protection frame, which facilitates the control of the movement of the sealing plate.
[0008] According to the sampling device for producing semiconductor electronic special materials, a lifting groove is opened on the front side of the protective frame, and a lifting block is slidably connected to the inner side of the lifting groove, and the lifting block is fixedly connected to the moving block.
[0009] According to the sampling device for producing semiconductor electronic special materials, the control panels on the left and right sides are arranged in an oblique symmetrical structure.
[0010] According to the sampling device for semiconductor electronic special material production, a bidirectional screw is rotatably connected to the inner side of the slide groove, opposite threads are arranged at both ends of the bidirectional screw, and the two ends of the bidirectional screw are respectively threadedly connected to the left and right slides, so as to facilitate the control of the left and right slides to move toward each other.
[0011] According to the sampling device for producing semiconductor electronic special materials, the front side of the lifting plate is fixedly connected to the second motor.
[0012] According to the sampling device for producing semiconductor electronic special materials, a motor 1 is fixedly connected to the lower side of the workbench, and gears are fixedly connected to the outer side of the output end of the motor 1 and the outer side of the rotating shaft.
[0013] Beneficial effects:
[0014] By arranging a workbench, a fixed frame, a protective frame, a sealing plate, a control panel, a moving block and an electric push rod, after the sampling block finishes sampling the semiconductor, the sampling block can be sealed by the sealing plates and the protective frame on the left and right sides to prevent external dust from accumulating on the sampling block and affecting the inspection results of the semiconductor material.
[0015] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The present invention is further described below with reference to the accompanying drawings and embodiments;
[0017] Figure 1 This is the overall three-dimensional structural diagram of a sampling device for producing semiconductor electronic special materials of the utility model;
[0018] Figure 2 It is a partial three-dimensional structural diagram of a protection unit in a sampling device for producing semiconductor electronic special materials of the utility model;
[0019] Figure 3 for Figure 2 The enlarged view of point A in the middle;
[0020] Figure 4The utility model is a three-dimensional structural diagram of a sampling device for producing semiconductor electronic special materials without part of the protection unit.
[0021] Legend:
[0022] 1. Workbench; 2. Motor 1; 3. Rotating shaft; 4. Gear; 5. Turntable; 6. Connecting frame; 7. Protection unit; 701. Fixed plate; 702. Protection frame; 703. Closing plate; 704. Fixed block; 705. Rotating block 1; 706. Control board; 707. Lifting slot; 708. Lifting block; 709. Moving block; 710. Rotating block 2; 711. Electric push rod; 712. Lifting plate; 713. Slide slot; 714. Bidirectional screw; 715. Slide plate; 716. Sampling block; 717. Motor 2; 8. Cylinder. DETAILED DESCRIPTION
[0023] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.
[0024] Reference Figure 1-4 A sampling device for producing semiconductor electronic special materials comprises a workbench 1: a rotating shaft 3 is rotatably connected to the upper side of the workbench 1, a turntable 5 is fixedly connected to the upper end of the rotating shaft 3, a connecting frame 6 is fixedly connected to the upper side of the turntable 5, a cylinder 8 is fixedly connected to the upper side of the connecting frame 6, a protection unit 7 is arranged on the lower side of the connecting frame 6, a motor 2 is fixedly connected to the lower side of the workbench 1, a gear 4 is fixedly connected to the outer side of the output end of the motor 2 and the outer side of the rotating shaft 3, when in use, the motor 2 is started, and due to the meshing connection of the two gears 4, the motor 2 drives the rotating shaft 3 to rotate, the rotating shaft 3 drives the turntable 5 to rotate, the turntable 5 drives the connecting frame 6 to rotate, and the connecting frame 6 drives the sampling block 716 to rotate, so as to facilitate the transfer of the sampled semiconductor material.
[0025] The protection unit 7 includes a fixed plate 701, which is fixedly connected to the lower side of the connecting frame 6, and a protection frame 702 is fixedly connected to the lower side of the fixed plate 701. The outer sides of the left and right ends of the protection frame 702 are provided with sealing plates 703, and the front sides of the left and right sealing plates 703 are fixedly connected to fixed blocks 704, and the outer sides of the left and right fixed blocks 704 are fixedly connected to the rotating block 1 705, and the outer side of the rotating block 1 705 is rotatably connected to the control plate 706, and the outer side of the upper end of the control plate 706 is rotatably connected to the rotating block 2 710, and the outer side of the rotating block 2 710 is fixedly connected to the moving block 709, and the fixed plate 701 and the moving block 70 9 is fixedly connected with an electric push rod 711, the output end of the cylinder 8 is fixedly connected with a lifting plate 712, a slide groove 713 is provided on the lower side of the lifting plate 712, the inner sides of the front and rear ends of the slide groove 713 are slidably connected with slide plates 715, the lower sides of the front and rear slide plates 715 are fixedly connected with sampling blocks 716, the sealing plate 703 is slidably connected with the protection frame 702, the control plates 706 on the left and right sides are arranged in an oblique symmetrical structure, the inner side of the slide groove 713 is rotatably connected with a bidirectional screw 714, the two ends of the bidirectional screw 714 are provided with opposite threads, and the two ends of the bidirectional screw 714 are respectively threadedly connected with the left and right slide plates 715 Then, a lifting slot 707 is provided on the front side of the protection frame 702, and a lifting block 708 is slidably connected to the inner side of the lifting slot 707, and the lifting block 708 is fixedly connected to the moving block 709. A motor 2 717 is fixedly connected to the front side of the lifting plate 712. When it is necessary to sample the semiconductor material, the cylinder 8 is controlled, and the cylinder 8 drives the lifting plate 712 to descend, and the lifting plate 712 drives the sampling block 716 to descend, and then the motor 2 717 is driven, and the motor 2 717 drives the bidirectional screw 714 to rotate, and the bidirectional screw 714 drives the left and right side slide plates 715 to move toward each other, and the slide plates 715 drive the sampling blocks 716 to move closer to each other, so that the two sides can be sampled. The sampling block 716 on the side clamps the semiconductor material, and then the cylinder 8 drives the semiconductor material on the sampling block 716 to rise to complete the sampling. When the sampling block 716 is not in use, the electric push rod 711 is controlled to drive the moving block 709 to rise, and the moving block 709 drives the control board 706 to rotate, and the control board 706 drives the sealing plate 703 on the fixed block 704 to move. Due to the symmetrical structure of the left and right control boards 706, the left and right sealing plates 703 are close to each other, which is convenient for sealing the lower opening of the protective frame 702 to prevent external dust from entering the surface of the sampling block 716 and affecting the next sampling of the semiconductor material.
[0026] Working principle: When in use, the staff controls the cylinder 8 to drive the lifting plate 712 to descend, and the lifting plate 712 drives the sampling block 716 to descend, and starts the motor 2 717. Under the action of the bidirectional screw 714, it is convenient to control the sampling block 716 to sample the semiconductor material. After the sampling is completed, the lifting plate 712 is controlled to reset, and then the electric push rod 711 is controlled to drive the moving block 709 to move up and down. Under the action of the control board 706 and the fixed block 704, it is convenient to control the sealing plates 703 on the left and right sides to approach each other, so that the sealing plates 703 seal the lower side of the protective frame 702 to prevent external dust from accumulating on the surface of the sampling block 716 and affecting the next sampling.
[0027] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.
Claims
1. A sampling device for producing semiconductor electronic special materials, characterized in that: The workbench (1) comprises a workbench (1), wherein the upper side of the workbench (1) is rotatably connected to a rotating shaft (3), the upper end of the rotating shaft (3) is fixedly connected to a rotating disk (5), the upper side of the rotating disk (5) is fixedly connected to a connecting frame (6), the upper side of the connecting frame (6) is fixedly connected to a cylinder (8), and the lower side of the connecting frame (6) is provided with a protective unit (7); The protection unit (7) comprises a fixing plate (701), wherein the fixing plate (701) is fixedly connected to the lower side of the connecting frame (6), the lower side of the fixing plate (701) is fixedly connected to a protection frame (702), the outer sides of the left and right ends of the protection frame (702) are provided with sealing plates (703), the front sides of the sealing plates (703) on the left and right sides are fixedly connected to fixing blocks (704), the outer sides of the fixing blocks (704) on the left and right sides are fixedly connected to rotating blocks (705), the outer side of the rotating block (705) is rotatably connected to a control board (706), and the control board (706) The outer side of the upper end of the cylinder (706) is rotatably connected to a rotating block 2 (710), the outer side of the rotating block 2 (710) is fixedly connected to a moving block (709), an electric push rod (711) is fixedly connected between the fixed plate (701) and the moving block (709), the output end of the cylinder (8) is fixedly connected to a lifting plate (712), a sliding groove (713) is provided on the lower side of the lifting plate (712), the inner sides of the front and rear ends of the sliding groove (713) are slidably connected to slide plates (715), and the lower sides of the slide plates (715) on the front and rear sides are fixedly connected to sampling blocks (716).
2. A sampling device for producing semiconductor electronic special materials according to claim 1, characterized in that: The sealing plate (703) is slidably connected to the protection frame (702).
3. A sampling device for producing semiconductor electronic special materials according to claim 1, characterized in that: A lifting groove (707) is provided on the front side of the protection frame (702), a lifting block (708) is slidably connected to the inner side of the lifting groove (707), and the lifting block (708) is fixedly connected to the moving block (709).
4. A sampling device for producing semiconductor electronic special materials according to claim 1, characterized in that: The control panels (706) on the left and right sides are arranged in an obliquely symmetrical structure.
5. The sampling device for producing semiconductor electronic special materials according to claim 1, characterized in that: A bidirectional screw rod (714) is rotatably connected to the inner side of the slide groove (713), and opposite threads are arranged at both ends of the bidirectional screw rod (714). The two ends of the bidirectional screw rod (714) are respectively threadedly connected to the left and right side slide plates (715).
6. A sampling device for producing semiconductor electronic special materials according to claim 1, characterized in that: The front side of the lifting plate (712) is fixedly connected to a second motor (717).
7. A sampling device for producing semiconductor electronic special materials according to claim 1, characterized in that: The lower side of the workbench (1) is fixedly connected to a motor 1 (2), and the outer side of the output end of the motor 1 (2) and the outer side of the rotating shaft (3) are both fixedly connected to a gear (4).
