Temperature resistance detection equipment for radio frequency chip

Abstract

The utility model relates to the technical field of detection of radio frequency chips, in particular to temperature resistance detection equipment for radio frequency chips, which comprises a master control system box, and a heating head mechanism is movably mounted on one side of the top of the master control system box through an automatic lifting clamp. A detection seat is fixedly installed on the side face, close to the center of the bottom of the heating head mechanism, of the main control system box, and a limiting frame is fixedly installed on the side, away from the main control system box, of the top of the detection seat. The safety risk is effectively avoided, the sealing performance is ensured, and the error of the test result is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of radio frequency chip detection, in particular to a device for detecting the temperature resistance performance of a radio frequency chip. Background Art

[0002] RF chips are a vital component in modern communication systems. Due to the particularity of their high-frequency characteristics, there is a huge difference between RF chip testing and traditional digital chip testing. RF chip testing is an important link to ensure the stability of RF chip performance and normal operation. Through effective testing methods and appropriate testing equipment, problems with the chip can be detected and further improved and optimized.

[0003] The temperature resistance test of the RF chip is to simulate and observe whether the performance of the chip can maintain normal levels in harsh environments. Generally, the frequency stability of the chip in the transmission mode is tested in the range of -40℃ to 80℃. During operation, the test system will make the system obtain the result through specific calculations based on the set temperature and control the heater to achieve the purpose of adjusting the temperature. However, in the existing technical means for testing the temperature resistance of RF chips, manual labor is generally used to overlap the heat flow hood with the test cavity, and the heat flow hood has no fixed function, and the sealing cannot be guaranteed, which leads to certain safety risks. At the same time, the test also has certain errors due to the failure to guarantee the sealing.

[0004] Therefore, it is necessary to design a temperature resistance performance testing device for RF chips to solve the above-mentioned problems. Utility Model Content

[0005] The purpose of the utility model is to provide a temperature resistance performance testing device for a radio frequency chip. The automatic lifting fixture can realize the automatic closing of the heating head mechanism and the testing seat, and has a fixing function for the heat flow cover, which effectively avoids safety risks. At the same time, the sealing is guaranteed and the error of the test result is reduced, thereby solving the problems raised in the above-mentioned background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A device for testing the temperature resistance of a radio frequency chip comprises a main control system box, a heating head mechanism is movably mounted on one side of the top of the main control system box through an automatic lifting fixture, a detection seat is fixedly mounted on one side of the main control system box near the bottom center of the heating head mechanism, and a limit frame is fixedly mounted on the top of the detection seat away from the side of the main control system box.

[0008] The automatic lifting fixture comprises an electric telescopic cylinder body fixedly mounted on a side of the main control system box away from the detection seat and a fixture body, and the fixture body is movably mounted on the top of the electric telescopic cylinder body through a telescopic rod.

[0009] As a preferred solution of the utility model, the heating head mechanism and the main control system box are connected through a connecting pipeline, and the heating head mechanism is composed of a heating head body and a heat flow cover.

[0010] As a preferred solution of the utility model, the heat flow cover is fixedly installed at the bottom end of the heating head body, and a limiting slider is fixedly installed on the same side of the bottom end of the heating head body and the heat flow cover.

[0011] As a preferred solution of the utility model, a clamp seat is fixedly installed on the top end of the heating head body, and the clamp seat is installed through the end of the clamp body away from the electric telescopic cylinder.

[0012] As a preferred solution of the utility model, the bottom and top ends of the electric telescopic cylinder are respectively provided with a lower L-shaped mounting frame and an upper L-shaped mounting frame, and the lower L-shaped mounting frame, the upper L-shaped mounting frame and the main control system box are fixedly connected by fixing bolts.

[0013] As a preferred solution of the utility model, a test cavity aligned with the heating head mechanism is opened on the top surface of the detection seat, a high thermal conductivity substrate equipped with a heat flux sensor is fixedly installed on the inner bottom surface of the test cavity, and the RF chip to be tested is placed on the top surface of the high thermal conductivity substrate equipped with the heat flux sensor.

[0014] As a preferred solution of the utility model, a limiting groove matched with the limiting slider is opened on a side of the limiting frame close to the main control system box, and the bottom end of the limiting frame is fixedly connected to the top surface of the detection seat through a triangular mounting seat.

[0015] As a preferred solution of the utility model, a tilted control panel is fixedly installed on the front side of the main control system box near the top, and universal wheels with locks are movably installed at the four corners of the bottom end of the main control system box. An air compressor pump and a refrigerator are fixedly installed inside the main control system box.

[0016] As a preferred solution of the utility model, a display module and a control button module are provided on the control panel.

[0017] Beneficial effect: In the existing technical means for testing the temperature resistance of RF chips, manual labor is generally used to overlap the heat flow hood and the test cavity, and the heat flow hood has no fixing function, and the sealing cannot be guaranteed, which leads to certain safety risks. At the same time, the test also has certain errors due to the failure to ensure the sealing. The utility model can use the automatic lifting clamp to realize the automatic closing of the heating head mechanism and the detection seat, and has a fixing function for the heat flow hood, which effectively avoids the safety risks. At the same time, the sealing is guaranteed and the error of the test result is reduced, thereby solving the problems raised in the above background technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is the overall three-dimensional external structure diagram of the utility model;

[0019] Figure 2 This is a three-dimensional enlarged structural diagram of the automatic lifting fixture in the utility model;

[0020] Figure 3 This is a three-dimensional enlarged structural diagram of the heating head mechanism in the utility model;

[0021] Figure 4 This is a three-dimensional enlarged structural diagram of the detection seat in the utility model;

[0022] Figure 5 It is a three-dimensional enlarged structural diagram of the limiting frame in the utility model;

[0023] In the figure: 1. main control system box; 11. control panel; 111. display module; 112. control button module; 12. universal wheel with lock; 2. automatic lifting fixture; 21. electric telescopic cylinder; 211. lower L-shaped mounting frame; 212. upper L-shaped mounting frame; 22. fixture body; 23. telescopic rod; 3. heating head mechanism; 31. connecting pipeline; 32. heating head body; 321. clamp seat; 33. heat flow cover; 34. limit slider; 4. detection seat; 41. test cavity; 42. high thermal conductivity substrate equipped with heat flow sensor; 5. limit frame; 51. limit slide; 52. triangular mounting seat. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0025] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant literature, and several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0026] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this article includes any and all combinations of one or more related listed items.

[0028] See also Figure 1-5 , the utility model provides a technical solution:

[0029] A device for testing the temperature resistance of a radio frequency chip comprises a main control system box 1, a heating head mechanism 3 is movably installed on one side of the top of the main control system box 1 through an automatic lifting fixture 2, a detection seat 4 is fixedly installed on one side of the main control system box 1 near the bottom center of the heating head mechanism 3, and a limit frame 5 is fixedly installed on the top of the detection seat 4 away from the side of the main control system box 1.

[0030] Specifically, the automatic lifting fixture 2 includes an electric telescopic cylinder 21 and a fixture body 22 fixedly installed on the side of the main control system box 1 away from the detection seat 4. The fixture body 22 is movably installed on the top of the electric telescopic cylinder 21 through a telescopic rod 23. During testing, the electric telescopic cylinder 21 works, and the telescopic rod 23 drives the fixture body 22 to rise under its action. At the same time, the heating head mechanism 3 moves upward under the action of the fixture body 22. At this time, the RF chip to be tested can be introduced into the test cavity on the top surface of the detection seat 4, and then the telescopic rod 23 drives the fixture body 22 to reset until the heating head mechanism 3 and the detection seat 4 are overlapped and fixed. The automatic lifting fixture 2 can be used to realize the automatic closing of the heating head mechanism 3 and the detection seat 4, and has a fixing function for the heat flow cover, which effectively avoids safety risks. At the same time, the sealing is guaranteed, reducing the error of the test result;

[0031] Preferably, the heat flow cover 33 is fixedly installed at the bottom end of the heating head body 32, and the bottom end of the heating head body 32 and the same side of the heat flow cover 33 are fixedly installed with a limit slider 34; a limit slide groove 51 adapted to the limit slider 34 is opened on one side of the limit frame 5 close to the main control system box 1, and the bottom end of the limit frame 5 is fixedly connected to the top surface of the detection seat 4 through a triangular mounting seat 52, and the limit frame 5, the limit slide groove 51 and the limit slider 34 slidably connected to the limit slide groove 51 can make the lifting process of the heating head mechanism 3 stable and reliable, and at the same time, the heating head mechanism 3 and the detection seat 4 can be accurately closed to prevent shaking and misalignment;

[0032] Preferably, the bottom and top of the electric telescopic cylinder 21 are respectively provided with a lower L-shaped mounting frame 211 and an upper L-shaped mounting frame 212, and the lower L-shaped mounting frame 211, the upper L-shaped mounting frame 212 and the main control system box 1 are fixedly connected by fixing bolts, and the lower L-shaped mounting frame 211 and the upper L-shaped mounting frame 212 are provided to facilitate the installation of the electric telescopic cylinder 21, and the stability is strong, which is conducive to the stable operation of the automatic lifting fixture 2;

[0033] Preferably, the heating head mechanism 3 and the main control system box 1 are connected through a connecting pipe 31, and the heating head mechanism 3 is composed of a heating head body 32 and a heat flow cover 33; a clamp seat 321 is fixedly installed on the top of the heating head body 32, and the clamp seat 321 is installed through the end of the fixture body 22 away from the electric telescopic cylinder 21; a test cavity 41 aligned with the heating head mechanism 3 is opened on the top surface of the detection seat 4, and a high thermal conductivity substrate 42 equipped with a heat flow sensor is fixedly installed on the inner bottom surface of the test cavity 41, and a radio frequency chip to be tested is placed on the top surface of the high thermal conductivity substrate 42 equipped with the heat flow sensor; a control panel 11 arranged in an inclined manner is fixedly installed near the top of the front side of the main control system box 1, and the four corners at the bottom of the main control system box 1 are movable The main control system box 1 is dynamically installed with a universal wheel 12 with a lock, and an air compressor pump and a refrigerator are fixedly installed inside; the control panel 11 is provided with a display module 111 and a control button module 112. During the test, the operator sets the temperature range to be tested through the control panel 11, and starts the main control system box 1 to work, and uses the air compressor to pass dry and clean air into the refrigerator for low-temperature treatment, and then the air reaches the heating head body 32 through the connecting pipe 31 for heating, and the airflow enters the test cavity 41 through the heat flow cover 33. The temperature sensor in the heat flow cover 33 can monitor the current temperature in the cavity in real time, and use the heat flow sensor to monitor the amount of heat migration of the RF chip during the heat transfer process, thereby realizing the detection of temperature resistance performance;

[0034] In summary, the utility model can utilize the automatic lifting fixture 2 to realize the automatic closing of the heating head mechanism 3 and the detection seat 4, and has a fixing function for the heat flow cover, which effectively avoids safety risks, and at the same time ensures the sealing performance, thereby reducing the error of the test result.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for testing the heat resistance of a radio frequency chip, comprising a main control system box (1), characterized in that: A heating head mechanism (3) is movably mounted on one side of the top of the main control system box (1) via an automatic lifting fixture (2); a detection seat (4) is fixedly mounted on one side of the main control system box (1) near the bottom center of the heating head mechanism (3); a limiting frame (5) is fixedly mounted on the top of the detection seat (4) away from the main control system box (1); The automatic lifting fixture (2) comprises an electric telescopic cylinder (21) fixedly mounted on a side of the main control system box (1) away from the detection seat (4) and a fixture body (22); the fixture body (22) is movably mounted on the top of the electric telescopic cylinder (21) via a telescopic rod (23).

2. The device for detecting the temperature resistance of a radio frequency chip according to claim 1, characterized in that: The heating head mechanism (3) and the main control system box (1) are connected through a connecting pipeline (31), and the heating head mechanism (3) is composed of a heating head body (32) and a heat flow cover (33).

3. The temperature resistance performance testing device of a radio frequency chip according to claim 2, characterized in that: The heat flow cover (33) is fixedly mounted on the bottom end of the heating head body (32), and a limiting slider (34) is fixedly mounted on the same side of the bottom end of the heating head body (32) and the heat flow cover (33).

4. The device for detecting the temperature resistance of a radio frequency chip according to claim 3, characterized in that: A clamping seat (321) is fixedly mounted on the top end of the heating head body (32), and the clamping seat (321) is installed through the end of the clamp body (22) away from the electric telescopic cylinder body (21).

5. The device for detecting the temperature resistance of a radio frequency chip according to claim 1, characterized in that: A lower L-shaped mounting frame (211) and an upper L-shaped mounting frame (212) are respectively mounted on the bottom and top ends of the electric telescopic cylinder body (21), and the lower L-shaped mounting frame (211), the upper L-shaped mounting frame (212) and the main control system box (1) are fixedly connected by fixing bolts.

6. The device for detecting the temperature resistance of a radio frequency chip according to claim 1, characterized in that: The top surface of the detection seat (4) is provided with a test cavity (41) aligned with the heating head mechanism (3); a high thermal conductivity substrate (42) equipped with a heat flux sensor is fixedly mounted on the inner bottom surface of the test cavity (41); and a radio frequency chip to be tested is placed on the top surface of the high thermal conductivity substrate (42) equipped with the heat flux sensor.

7. The device for detecting the temperature resistance of a radio frequency chip according to claim 1, characterized in that: A limiting groove (51) adapted to the limiting slider (34) is provided on a side of the limiting frame (5) close to the main control system box (1), and the bottom end of the limiting frame (5) is fixedly connected to the top surface of the detection seat (4) via a triangular mounting seat (52).

8. The device for detecting the temperature resistance of a radio frequency chip according to claim 1, characterized in that: A control panel (11) arranged in an inclined manner is fixedly installed near the top of the front side of the main control system box (1), and universal wheels (12) with locks are movably installed at the four corners of the bottom end of the main control system box (1). An air compressor pump and a refrigerator are fixedly installed inside the main control system box (1).

9. The device for detecting the temperature resistance of a radio frequency chip according to claim 8, characterized in that: The control panel (11) is provided with a display module (111) and a control button module (112).

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