Air cooling and liquid cooling combined heat dissipation VPX case structure

Abstract

The utility model discloses an air cooling and liquid cooling combined heat dissipation VPX case structure, and belongs to the technical field of VPX cases. Comprising a case body and a board card module clamped in the case body, and further comprises air cooling assemblies arranged on the two sides of the case body, heat dissipation teeth fixedly arranged on the top of the board card module and liquid cooling assemblies clamped in the case body and located on the two sides of the board card module, an air inlet and an air outlet which are matched with the air cooling assembly are respectively formed in two side parts of the case body, and a ventilation window is formed in the liquid cooling assembly; according to the utility model, the air cooling assembly and the liquid cooling assembly are arranged to realize the effects of air cooling and liquid cooling of the case respectively, and the ventilation window is arranged on the liquid cooling assembly, so that the circulation of air in the case can be effectively improved under the air cooling assembly, the temperature rise of the board card module is reduced, and the service life of the board card module is prolonged. And internal devices of the board card module are always in a working temperature range, so that the use and service life of equipment are prevented from being influenced.

Description

Technical Field

[0001] The utility model relates to the technical field of VPX chassis, in particular to a VPX chassis structure with combined air cooling and liquid cooling for heat dissipation. Background Art

[0002] In the current VPX chassis design, it is mainly divided into air-cooled chassis and liquid-cooled chassis. However, with the increase in functional requirements, the number of board modules inside the chassis is increasing, and the heat consumption of the modules is also increasing. In addition, the demand for miniaturization design and the overall space occupied by the chassis are limited. Pure air cooling or pure liquid cooling can no longer dissipate the heat generated by the high heat consumption components inside the board in time. At this time, heat accumulates inside the board, the temperature rises, and exceeds the operating temperature of the internal components, causing the equipment to shut down or shortening the service life of the equipment.

[0003] In the prior art, although there is a technology for dissipating heat inside a chassis by combining air cooling and liquid cooling, the air cooling and liquid cooling methods in the prior art are independent heat dissipation modes and lack the effect of mutual support. Although the heat dissipation effect can be improved to a certain extent, the heat dissipation effect is not ideal. Therefore, the present application proposes a VPX chassis structure with a combination of air cooling and liquid cooling. Utility Model Content

[0004] The utility model aims to solve the problem of poor heat dissipation effect of the VPX chassis in the prior art, and proposes a VPX chassis structure with combined heat dissipation of air cooling and liquid cooling.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A VPX chassis structure with combined air cooling and liquid cooling includes a chassis body and a board module snapped into the chassis body, and also includes an air cooling component arranged on both sides of the chassis body for sending external air into the chassis to dissipate heat for the board module and exhausting hot air inside the chassis to dissipate heat for the board module, a heat dissipation tooth fixedly arranged on the top of the board module, and a liquid cooling component snapped into the chassis body and located on both sides of the board module, wherein the two sides of the chassis body are respectively provided with an air inlet and an air outlet that match the air cooling component, and the liquid cooling component is provided with a ventilation window for gas to enter through the air inlet and be discharged from the chassis body through the air outlet to improve the heat dissipation effect.

[0007] As a preferred technical solution of the present application, the heat dissipation teeth are arranged in an array on the top of the board module parallel to the gas flow direction.

[0008] As a preferred technical solution of the present application, the air cooling component is a heat dissipation fan installed inside the chassis body and corresponding to the air inlet and the air outlet respectively.

[0009] As a preferred technical solution of the present application, the liquid cooling assembly includes a liquid cooling slot inserted into the chassis body, a liquid cooling channel opened inside the liquid cooling slot, and a brazed cover plate welded to the outside of the liquid cooling channel to form a sealed channel cavity, wherein the ventilation windows are arranged in several groups along the liquid cooling slot array and parallel to the gas flow direction.

[0010] As a preferred technical solution of the present application, two liquid cooling joints connected to the liquid cooling channel and used for liquid inlet and outlet respectively are arranged on the top of the liquid cooling slot, and the two liquid cooling joints pass through the chassis body and extend upward.

[0011] As a preferred technical solution of the present application, a slot matching with the liquid cooling connector is provided on the chassis body.

[0012] As a preferred technical solution of the present application, the liquid cooling channel is arranged in an S-shaped rotation, and a smooth transition is arranged at the corners.

[0013] Compared with the prior art, the utility model provides a VPX chassis structure with combined air cooling and liquid cooling, which has the following beneficial effects:

[0014] 1. The VPX chassis structure with combined air cooling and liquid cooling can achieve the effects of air cooling and liquid cooling of the chassis respectively through the air cooling components and liquid cooling components. Secondly, the ventilation window is provided on the liquid cooling component, and the air cooling component can effectively improve the air circulation inside the chassis, effectively bring the heat of the board module out of the chassis, effectively improve the heat dissipation effect, and reduce the temperature rise of the board module;

[0015] 2. The VPX chassis structure with combined air cooling and liquid cooling can further dissipate the heat generated by the board modules through the heat dissipation teeth. Secondly, the air cooling components, liquid cooling components and ventilation windows can make the air entering the chassis flow over the surface of the heat dissipation teeth, further taking away the heat from the board modules and improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The structure of the utility model is shown in FIG. Figure 1 ;

[0017] Figure 2 The structure of the utility model is shown in FIG. Figure 2 ;

[0018] Figure 3 It is a schematic diagram of the internal structure of the utility model;

[0019] Figure 4 This is a schematic diagram of the split structure of the utility model;

[0020] Figure 5 This is a schematic diagram of the structure of the liquid cooling component of the utility model;

[0021] Figure 6 This is a schematic diagram of the split structure of the liquid cooling component of the utility model;

[0022] Figure 7 It is a structural schematic diagram of the board module and the heat dissipation teeth of the utility model.

[0023] In the figure:

[0024] 100, chassis body; 101, air inlet; 102, air outlet; 103, card slot; 200, board module; 201, heat dissipation gear; 300, air cooling assembly; 301, heat dissipation fan; 400, liquid cooling assembly; 401, ventilation window; 402, liquid cooling slot; 403, liquid cooling channel; 404, brazing cover plate; 405, liquid cooling joint. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model; it is obvious that the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the utility model without making creative work are within the scope of protection of the utility model.

[0026] Example:

[0027] Reference Figure 1-7A VPX chassis structure with combined air cooling and liquid cooling comprises a chassis body 100 and a VPX board module 200 connected to the chassis body 100. The main structure of the board module 200 adopts a temperature averaging plate design. When the board is working, the temperature averaging plate structure can prevent heat accumulation at the heat source module and quickly diffuse it to the guide rails on both sides. Then, the heat is taken away by the fluid inside the liquid cooling slots 402 on both sides. The chassis body 100 also includes a heat exchanger 402 disposed on both sides for sending external air into the chassis to cool the board module. The air cooling assembly 300 is used to dissipate heat from the board module 200 and discharge the hot air inside the chassis to achieve heat dissipation for the board module 200, the heat dissipation teeth 201 fixedly arranged on the top of the VPX board module 200, and the liquid cooling assembly 400 is connected to the inside of the chassis body 100 and is located on both sides of the VPX board module 200, wherein the two sides of the chassis body 100 are respectively provided with an air inlet 101 and an air outlet 102 that match the air cooling assembly 300, and the liquid cooling assembly 400 is provided with a gas supply that enters through the air inlet 101 and passes through the outlet The air outlet 102 is used to discharge the air from the inside of the chassis body 100 to improve the heat dissipation effect through the ventilation window 401. Specifically, when in use, the air cooling components 300 arranged on both sides of the chassis body 100 can timely introduce external air into the chassis, and through the ventilation windows 401 arranged on the liquid cooling components 400, the air circulation inside the chassis can be effectively improved to timely discharge the heat inside the chassis from the inside of the chassis body 100, thereby achieving a good air cooling effect. The heat dissipation teeth 201 arranged in cooperation with the arrangement can further guide the heat generated by the board module 200 for heat dissipation, and take away part of the heat through the arranged liquid cooling components 400. At the same time, the ventilation windows 401 and the air cooling components 300 can make the air entering the chassis body 100 flow through the heat dissipation teeth 201, effectively taking away the heat on the heat dissipation teeth 201, achieving a good heat dissipation effect inside the chassis, effectively reducing the temperature rise of the board module 200, so that the internal components of the board module 200 are always within the working temperature range, avoiding affecting the use and life of the equipment.

[0028] Reference Figure 3 and Figure 4 The heat dissipation teeth 201 are arranged in an array parallel to the gas flow direction on the top of the VPX board module 200. The heat dissipation teeth 201 are arranged parallel to the gas flow direction. Therefore, under the action of the heat dissipation fan 301, the ventilation window 401 is set, so that the air entering the box body can flow over the surface of the heat dissipation teeth 201, further taking away the heat of the board module 200 and reducing the temperature rise of the board module 200.

[0029] Reference Figure 1-4The air cooling component 300 is a heat dissipation fan 301 installed inside the chassis body 100 and corresponding to the air inlet 101 and the air outlet 102 respectively. The heat dissipation fan 301 installed at the air inlet 101 can introduce air outside the chassis into the chassis for air cooling and heat dissipation. The heat dissipation fan 301 located at the air outlet 102 can discharge the heat generated by the board module 200 inside the chassis, effectively improving the circulation of the air inside the chassis, and further improving the heat dissipation effect on the board module 200.

[0030] Reference Figure 5 and Figure 6 The liquid cooling component 400 includes a liquid cooling slot 402 inserted into the chassis body 100, a liquid cooling channel 403 opened in the liquid cooling slot 402, and a brazing cover plate 404 welded on the outside of the liquid cooling channel 403 to form a sealed channel cavity, wherein the ventilation windows 401 are arranged in several groups along the liquid cooling slot 402 array and parallel to the gas flow direction. When in use, liquid cooling liquid is injected into the channel cavity. While the liquid cooling liquid takes away the heat generated by the board module 200, the ventilation windows 401 are arranged. Under the action of the wind force of the heat dissipation fan 301, the cold air outside the chassis body 100 can be introduced into the interior thereof to cool the board module 200, and at the same time, the air entering the interior of the chassis can flow through the surface of the heat dissipation teeth 201, further taking away the heat of the board module 200, reducing the temperature rise of the board module 200, so that the internal components of the board module 200 are always within the working temperature range, which will not affect the use and life of the equipment.

[0031] Reference Figure 1-3 Two liquid cooling joints 405 connected to the liquid cooling channel 403 and used for liquid inlet and liquid outlet are respectively arranged at the top of the liquid cooling slot 402. The two liquid cooling joints 405 pass through the chassis body 100 and extend upward.

[0032] The chassis body 100 is provided with a card slot 103 that matches the liquid cooling connector 405. When in use, liquid cooling liquid is injected through the liquid cooling connector 405 at the inlet and flows out through the liquid cooling connector 405 at the outlet, forming a circulating flow. When it circulates, it can take away the heat generated by the board module 200 to achieve the effect of heat dissipation.

[0033] Reference Figure 5 and Figure 6 The liquid cooling channel 403 is arranged in an S-shaped rotation and has a smooth transition at the corner. The liquid cooling channel 403 is arranged in an S-shaped rotation so that the liquid cooling liquid circulates through the liquid cooling joint 405 to achieve a good heat dissipation effect. Furthermore, the liquid cooling channel 403 has a smooth transition at the corner, which can reduce the internal fluid resistance.

[0034] Specifically, when the VPX chassis structure with combined air cooling and liquid cooling is in use: when the board is working, the temperature plate structure can prevent heat accumulation at the heat source module, and quickly diffuse the heat to the guide rails on both sides, and then the heat is taken away by the fluid inside the liquid cooling slots 402 on both sides. The heat dissipation teeth 201 provided in combination can further guide the heat generated by the board module 200 for heat dissipation. At the same time, the air outside the chassis body 100 is introduced into the chassis body for air cooling through the provided cooling fan 301. The air entering the chassis body 100 through the provided ventilation window 401 can improve The air flows between the liquid cooling slots 402 set on both sides of the board module 200, and is quickly discharged from the chassis body 100 through the heat dissipation fan 301, effectively improving the air circulation inside the chassis and timely discharging the internal heat of the chassis from the inside of the chassis body 100, thereby achieving a good air cooling effect. Furthermore, through the set ventilation windows 401, the air entering the interior of the chassis can flow over the surface of the heat dissipation teeth 201, further taking away the heat of the board module 200, reducing the temperature rise of the board module 200, and making the internal components of the board module 200 always within the operating temperature range, avoiding affecting the use and life of the equipment.

[0035] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A VPX chassis structure with combined air cooling and liquid cooling, comprising a chassis body (100) and a board module (200) connected to the chassis body (100), characterized in that: It also includes an air cooling assembly (300) arranged on both sides of the chassis body (100) for sending external air into the chassis to dissipate heat from the board module and exhausting hot air from the chassis to dissipate heat from the board module (200), a heat dissipation tooth (201) fixedly arranged on the top of the board module (200), and a liquid cooling assembly (400) clamped inside the chassis body (100) and located on both sides of the board module (200), wherein the chassis body (100) is respectively provided with an air inlet (101) and an air outlet (102) that match the air cooling assembly (300), and the liquid cooling assembly (400) is provided with a ventilation window (401) for air to enter through the air inlet (101) and be discharged from the chassis body (100) through the air outlet (102) to improve the heat dissipation effect.

2. The VPX chassis structure with combined air cooling and liquid cooling according to claim 1, characterized in that: The heat dissipation teeth (201) are arranged in an array parallel to the gas flow direction on the top of the board module (200).

3. The VPX chassis structure with combined air cooling and liquid cooling according to claim 1, characterized in that: The air cooling component (300) is a heat dissipation fan (301) installed inside the chassis body (100) and corresponding to the air inlet (101) and the air outlet (102) respectively.

4. The VPX chassis structure with combined air cooling and liquid cooling according to claim 1, characterized in that: The liquid cooling assembly (400) comprises a liquid cooling slot (402) inserted into the chassis body (100), a liquid cooling channel (403) opened in the liquid cooling slot (402), and a brazing cover plate (404) welded to the outside of the liquid cooling channel (403) to form a sealed channel cavity, wherein the ventilation windows (401) are arranged in a plurality of groups along the array of the liquid cooling slots (402) and parallel to the gas flow direction.

5. The VPX chassis structure with combined air cooling and liquid cooling according to claim 4, characterized in that: Two liquid cooling joints (405) connected to the liquid cooling channel (403) and used for liquid inlet and liquid outlet are provided at the top of the liquid cooling slot (402); the two liquid cooling joints (405) pass through the chassis body (100) and extend upwards.

6. The VPX chassis structure with combined air cooling and liquid cooling according to claim 5, characterized in that: The chassis body (100) is provided with a slot (103) that matches the liquid cooling connector (405).

7. The VPX chassis structure with combined air cooling and liquid cooling according to claim 4, characterized in that: The liquid cooling channel (403) is arranged in an S-shaped rotation, and the corners are arranged with a smooth transition.

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