Compression-resistant and impact-resistant ceramic chip capacitor

Abstract

The utility model provides a compression-resistant and impact-resistant ceramic chip capacitor, which relates to the technical field of chip capacitors and comprises a dielectric ceramic disc, metal pins are fixed on the surface of the dielectric ceramic disc, a pressure-bearing thin shell is arranged on the surface of the dielectric ceramic disc, fixing glue is arranged on the inner wall of the pressure-bearing thin shell, and a catenary arch is arranged on the inner wall of the pressure-bearing thin shell. A mode of installing a pressure-bearing thin shell is adopted to solve the problems that a ceramic chip capacitor is not specially optimized for pressure resistance and impact resistance in design and material composition, is fragile in structure, and does not have sufficient physical strength to resist impact and pressure possibly encountered in the transportation or installation process, which means that the ceramic chip capacitor cannot be damaged when being subjected to excessive external force, and the service life of the ceramic chip capacitor is prolonged. A ceramic chip capacitor is very easy to crack, break and even damage the internal structure, and the physical damage directly affects the performance of the capacitor and even causes complete failure of the capacitor, so that when the capacitor is processed and transported, once an automobile bumps, the yield is reduced, and the production cost and the transportation cost are increased.

Description

Technical Field

[0001] The utility model relates to the technical field of chip capacitors, and in particular to a pressure-resistant and impact-resistant ceramic chip capacitor. Background Art

[0002] Ceramic chip capacitors, also known as multilayer ceramic capacitors (MLCC), are a common electronic component widely used in various electronic devices. Ceramic chip capacitors are composed of multiple layers of alternating ceramic dielectrics and electrode materials. These layers are stacked together and sintered at high temperatures to form an integral structure. This structure enables ceramic chip capacitors to provide larger capacitance and better electrical performance in the case of the same volume. Due to its multi-layer structure design, ceramic chip capacitors can be made very small without sacrificing capacitance, which is suitable for surface mount technology.

[0003] In the prior art, ceramic chip capacitors are not specifically optimized for compression and impact resistance in terms of design and material composition. Therefore, their structure is relatively fragile and does not have sufficient physical strength to withstand the impact and pressure that may be encountered during transportation or installation. This means that when subjected to excessive external force, ceramic chip capacitors are very likely to crack, break, or even have internal structural damage. These physical damages will directly affect the performance of the capacitor and may even cause it to fail completely. Therefore, when handling and transporting such capacitors, once the car is bumpy, the yield will be reduced, resulting in increased production and transportation costs. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a pressure-resistant and impact-resistant ceramic chip capacitor.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a pressure-resistant and impact-resistant ceramic chip capacitor, comprising a dielectric ceramic disc, a metal pin is fixed on the surface of the dielectric ceramic disc, a pressure-bearing thin shell is provided on the surface of the dielectric ceramic disc, a fixing glue is provided on the inner wall of the pressure-bearing thin shell, a catenary arch is provided on the inner wall of the pressure-bearing thin shell, and the surface of the catenary arch is fixed to the inner wall of the pressure-bearing thin shell by gluing the fixing glue. In the prior art, the design and material composition of the ceramic chip capacitor are not specifically optimized for pressure resistance and impact resistance, so its structure is relatively fragile and does not have sufficient physical strength to resist the impact and pressure that may be encountered during transportation or installation. This means that when subjected to excessive external force, the ceramic chip capacitor is very likely to crack, break or even have internal structure damage. These physical damages will directly affect the performance of the capacitor and even lead to It completely fails. Therefore, when handling and transporting such capacitors, once the car is bumpy, the yield rate will be reduced, resulting in increased production and transportation costs. In view of such problems, the utility model solves them by installing a pressure-bearing thin shell, so that when the ceramic chip capacitor is under pressure, the pressure on the pressure-bearing thin shell will be evenly dispersed on the surface of the pressure-bearing thin shell due to the thin shell structure. This means that every part of the pressure-bearing thin shell is bearing force, so that the pressure-bearing thin shell can achieve high strength while maintaining light weight and bear the compression effect. When the product is impacted, the pressure-bearing thin shell will evenly disperse the impact force on the surface, and at the same time, the fixing glue will provide elastic deformation for buffering under pressure. The catenary arch can also play the role of a thin shell structure and act as a reinforcing rib for the pressure-bearing thin shell, so that the product can achieve the purpose of impact resistance and the effect of increasing the service life of the equipment.

[0006] Preferably, an insulating layer is fixed to the inner wall of the catenary arch, and the inner wall of the insulating layer is fixed to the surface of the dielectric ceramic disc. In the prior art, it is crucial to ensure the accurate correspondence between the electrical positive and negative poles of the dielectric ceramic disc. If the insulation of the dielectric ceramic disc is insufficient, then they cannot effectively isolate the positive and negative charges, resulting in charge leakage, thereby affecting the performance of the capacitor. In this case, the ceramic patch capacitors will not work properly because they cannot maintain the necessary charge separation, which is the basis for capacitors to store energy, resulting in the product being unable to be used normally. In response to such problems, the utility model solves this problem by installing an insulating layer, so that when the product is in use, the insulating layer ensures that the dielectric ceramic disc does not contact the catenary arch or other components, thereby preventing the electrode effect from being affected, thereby achieving the effect of improving the stability of the product.

[0007] Preferably, the surface of the pressure-bearing thin shell, the surface of the catenary arch and the surface of the insulating layer are all provided with through circular holes, and an insulating tube is fixed to the inner wall of the through circular hole, and the inner wall of the insulating tube is fixed to the circumference of the metal pin. In the prior art, the metal pin is a vital component for accessing the circuit of the ceramic chip capacitor. If the metal pin contacts other components of the product during use, it will cause a short circuit in the product, causing the product to be punctured or damaged, resulting in reduced stability in product use. To address such problems, the utility model solves them by installing an insulating tube, so that when the product is in use, the insulating tube insulates the contact position between the metal pin and other components, thereby preventing short circuits and damage to the components, thereby achieving the effect of improving product stability.

[0008] Preferably, a positioning clamping groove is provided on the surface of the pressure-bearing thin shell to facilitate clamping and equipment positioning during installation, thereby improving production efficiency.

[0009] Preferably, a pressure-bearing platform is provided on the surface of the pressure-bearing thin shell, and the pressure-bearing platform increases the pressure-bearing area when under pressure, reduces the pressure, and prevents damage to the equipment.

[0010] Preferably, the fixing glue is made of silicone material. Silicone can withstand extreme temperatures and maintain stability regardless of high or low temperatures. It can also maintain a certain degree of flexibility and elasticity after curing and is used to absorb impact and stress while maintaining good adhesion.

[0011] Preferably, the surface of the pressure-bearing thin shell is set to be a rough surface. When the staff adheres the pressure-bearing thin shell to the circuit board, the rough surface increases the adhesive contact area and improves the equipment fixing effect.

[0012] Beneficial Effects

[0013] 1. In the prior art, the design and material composition of ceramic chip capacitors are not optimized specifically for compression and impact resistance. Therefore, their structure is relatively fragile and does not have sufficient physical strength to resist the impact and pressure that may be encountered during transportation or installation. This means that when subjected to excessive external force, ceramic chip capacitors are very likely to crack, break or even have internal structural damage. These physical damages will directly affect the performance of the capacitor and even cause it to fail completely. Therefore, when handling and transporting such capacitors, once the car is bumpy, the yield rate will be reduced, resulting in increased production and transportation costs. In response to such problems, the utility model adopts an The problem is solved by installing a pressure-bearing thin shell. When the ceramic chip capacitor is under pressure, the pressure on the pressure-bearing thin shell will be evenly dispersed on the surface of the pressure-bearing thin shell due to the thin shell structure. This means that every part of the pressure-bearing thin shell is bearing force, so that the pressure-bearing thin shell can achieve high strength while maintaining light weight and achieve the compression resistance effect. When the product is impacted, the pressure-bearing thin shell will evenly disperse the impact force on the surface. At the same time, the fixing glue provides elastic deformation for buffering under pressure. The catenary arch can also play the role of a thin shell structure and act as a reinforcement for the pressure-bearing thin shell, so that the product can achieve the purpose of impact resistance and the effect of increasing the service life of the equipment.

[0014] 2. In the prior art, it is crucial to ensure the accurate correspondence between the electrical positive and negative poles of the dielectric ceramic disc. If the insulation of the dielectric ceramic disc is insufficient, then they cannot effectively isolate the positive and negative charges, resulting in charge leakage, thereby affecting the performance of the capacitor. In this case, the ceramic chip capacitors will not work properly because they cannot maintain the necessary charge separation, which is the basis for the capacitor to store energy, resulting in the product being unable to be used normally. To address such problems, the utility model solves this problem by installing an insulating layer, so that when the product is in use, the insulating layer ensures that the dielectric ceramic disc does not contact the catenary arch or other components, preventing the electrode effect from being affected, thereby achieving the effect of improving the stability of the product.

[0015] 3. In the prior art, metal pins are crucial components for ceramic chip capacitors to access circuits. If the metal pins come into contact with other components of the product during use, it will cause a short circuit in the product, resulting in breakdown or damage to the product, and reduced product stability. To address this problem, the utility model solves this problem by installing an insulating tube. When the product is in use, the insulating tube insulates the contact position between the metal pins and other components, thereby preventing short circuits and damage to the components, thereby improving product stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0017] Figure 2It is a cross-sectional view of the catenary arch of the utility model;

[0018] Figure 3 It is a three-dimensional structural schematic diagram of the fixing adhesive of the utility model;

[0019] Figure 4 It is a schematic diagram of the three-dimensional structure of the insulating layer of the utility model.

[0020] Legend:

[0021] 1. Dielectric ceramic disc; 101. Metal pin; 2. Pressure-bearing thin shell; 201. Catenary arch; 202. Fixing glue; 203. Pressure-bearing platform; 204. Positioning clamp groove; 3. Insulating layer; 4. Through circular hole; 401. Insulating cylinder. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention is further described below in conjunction with specific embodiments and drawings, but the following embodiments are only preferred embodiments of the present invention, not all. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work are all within the protection scope of the present invention.

[0023] The specific embodiments of the present utility model are described below in conjunction with the accompanying drawings. Specific embodiment:

[0025] Reference Figure 1-4A pressure-resistant and impact-resistant ceramic chip capacitor comprises a dielectric ceramic disc 1, a metal pin 101 is fixed on the surface of the dielectric ceramic disc 1, a pressure-bearing thin shell 2 is arranged on the surface of the dielectric ceramic disc 1, a fixing glue 202 is arranged on the inner wall of the pressure-bearing thin shell 2, a catenary arch 201 is arranged on the inner wall of the pressure-bearing thin shell 2, and the surface of the catenary arch 201 is fixed to the inner wall of the pressure-bearing thin shell 2 by gluing the fixing glue 202. The design and material composition of the ceramic chip capacitor are not specifically optimized for pressure resistance and impact resistance, so its structure is relatively fragile and does not have sufficient physical strength to resist the impact and pressure that may be encountered during transportation or installation. This means that when subjected to excessive external force, the ceramic chip capacitor is very likely to crack, break or even have internal structural damage. These physical damages will directly affect the performance of the capacitor and even cause it to fail completely. Therefore, When handling and transporting such capacitors, once the car is bumpy, the yield rate will be reduced, resulting in increased production and transportation costs. The method of installing a pressure-bearing thin shell 2 is used to solve this problem. When the ceramic chip capacitor is under pressure, the pressure on the pressure-bearing thin shell 2 is evenly dispersed on the surface of the pressure-bearing thin shell 2 due to the thin shell structure. This means that each part of the pressure-bearing thin shell 2 is bearing force, so that the pressure-bearing thin shell 2 can achieve high strength while maintaining light weight and bear the realization of the compression resistance effect. When the product is impacted, the pressure-bearing thin shell 2 will evenly disperse the impact force on the surface, and at the same time, the fixing glue 202 is compressed to provide elastic deformation for buffering. The catenary arch 201 can also play the role of a thin shell structure and play the role of a reinforcing rib for the pressure-bearing thin shell 2, so that the product can achieve the purpose of impact resistance and the effect of increasing the service life of the equipment. The fixing glue 202 is made of silicone material. Silicone can withstand extreme temperatures. Whether it is high or low temperature, it can maintain stability, and after curing, it can maintain a certain flexibility and elasticity. It is used to absorb impact and stress while maintaining good adhesion. The surface of the pressure-bearing thin shell 2 is set to be a rough surface. When the staff adheres the pressure-bearing thin shell 2 to the circuit board, the rough surface increases the adhesive contact area and improves the equipment fixing effect.

[0026] An insulating layer 3 is fixed to the inner wall of the catenary arch 201, and the inner wall of the insulating layer 3 is fixed to the surface of the dielectric ceramic disc 1. It is crucial to ensure the accurate correspondence between the electrical positive and negative poles of the dielectric ceramic disc 1. If the insulation of the dielectric ceramic disc 1 is insufficient, then they cannot effectively isolate the positive and negative charges, resulting in charge leakage, thereby affecting the performance of the capacitor. In this case, the ceramic chip capacitors will not work properly because they cannot maintain the necessary charge separation, which is the basis for the capacitor to store energy, resulting in the product being unable to be used normally. The problem is solved by installing an insulating layer 3, so that when the product is in use, the insulating layer 3 ensures that the dielectric ceramic disc 1 does not contact the catenary arch 201 or other components, preventing the electrode effect from being affected, thereby achieving the effect of improving product stability. The surface of the pressure-bearing thin shell 2, the surface of the catenary arch 201 and the surface of the insulating layer 3 are all provided with through circular holes 4, and the inner wall of the through circular hole 4 is fixed with an insulating cylinder 401, and the inner wall of the insulating cylinder 401 is fixed to the circumference of the metal pin 101. The metal pin 101 is a crucial component for the ceramic patch capacitor to access the circuit. If the metal pin 101 contacts other parts of the product during use, it will cause the product to short-circuit, causing the product to be broken down or damaged, resulting in reduced product stability. The method of installing the insulating cylinder 401 is used to solve this problem, so that when the product is used, the insulating cylinder 401 insulates the contact position between the metal pin 101 and other parts, thereby preventing the component from short-circuiting and damaging, and achieving the effect of improving product stability. The surface of the pressure-bearing thin shell 2 is provided with a positioning clamping groove 204, which is convenient for clamping and equipment positioning during installation, and improves production efficiency. The surface of the pressure-bearing thin shell 2 is provided with a pressure-bearing platform 203, which increases the pressure-bearing area when under pressure, reduces the pressure, and prevents equipment damage.

[0027] The working principle of the utility model is as follows: when the ceramic chip capacitor is under pressure, the pressure on the pressure-bearing thin shell 2 will be evenly dispersed on the surface of the pressure-bearing thin shell 2 due to its thin shell structure. This means that every part of the pressure-bearing thin shell 2 is bearing the force, so that the pressure-bearing thin shell 2 can achieve high strength while maintaining its light weight, and achieve the compression resistance effect. When the product is impacted, the pressure-bearing thin shell 2 will evenly disperse the impact force on the surface, and at the same time, the fixing glue 202 will provide elastic deformation for buffering under pressure. The catenary arch 201 can also play the role of a thin shell structure and serve as a reinforcing rib for the pressure-bearing thin shell 2.

[0028] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0029] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A compression-resistant and impact-resistant ceramic chip capacitor, comprising a dielectric ceramic disc (1), a metal pin (101) being fixed on the surface of the dielectric ceramic disc (1), characterized in that: A pressure-bearing thin shell (2) is provided on the surface of the dielectric ceramic disc (1), a fixing glue (202) is provided on the inner wall of the pressure-bearing thin shell (2), a catenary arch (201) is provided on the inner wall of the pressure-bearing thin shell (2), and the surface of the catenary arch (201) is glued and fixed to the inner wall of the pressure-bearing thin shell (2) by the fixing glue (202).

2. The compression-resistant and impact-resistant ceramic chip capacitor according to claim 1, characterized in that: An insulating layer (3) is fixed to the inner wall of the catenary arch (201), and the inner wall of the insulating layer (3) is fixed to the surface of the dielectric ceramic disc (1).

3. The compression-resistant and impact-resistant ceramic chip capacitor according to claim 1, characterized in that: The surface of the pressure-bearing thin shell (2), the surface of the catenary arch (201) and the surface of the insulating layer (3) are all provided with through circular holes (4), the inner wall of the through circular hole (4) is fixed with an insulating cylinder (401), and the inner wall of the insulating cylinder (401) is fixed to the circumferential surface of the metal pin (101).

4. The compression-resistant and impact-resistant ceramic chip capacitor according to claim 1, characterized in that: A positioning clamping groove (204) is provided on the surface of the pressure-bearing thin shell (2).

5. The compression-resistant and impact-resistant ceramic chip capacitor according to claim 1, characterized in that: A pressure-bearing platform (203) is provided on the surface of the pressure-bearing thin shell (2).

6. The compression-resistant and impact-resistant ceramic chip capacitor according to claim 1, characterized in that: The fixing glue (202) is made of silica gel material.

7. The compression-resistant and impact-resistant ceramic chip capacitor according to claim 1, characterized in that: The surface of the pressure-bearing thin shell (2) is set to be a rough surface.

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