Semiconductor chip tape automatic heat dissipation pasting machine

Abstract

The utility model relates to an automatic heat dissipation pasting machine for a semiconductor chip belt. The automatic heat dissipation pasting machine comprises an attaching rack, an unwinding device and a winding device, wherein the unwinding device and the winding device are arranged on the two sides of the attaching rack; the attaching rack is provided with a track device, a rolling device, a missing attaching detection device, a plurality of groups of feeding and attaching devices and a plurality of groups of jacking devices; the rail device comprises a conveying rail and two driving mechanisms, the two driving mechanisms are arranged at the two ends of the conveying rail respectively, each driving mechanism comprises a driver, a clutch, a conveying wheel and a pressing wheel, and the pressing wheels and the conveying wheels are distributed up and down and rotationally connected to the conveying rail. And an output shaft of the driver is connected with the conveying wheel through the clutch. The heat dissipation paste attaching machine solves the problems that an existing heat dissipation paste attaching machine is not provided with a corresponding paste missing processing structure, when a rear detection camera detects the paste missing situation, the machine can only be stopped, manual processing is carried out, and the production efficiency is affected.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to an automatic heat dissipation pasting machine for semiconductor chips. Background Art

[0002] Semiconductor chips are used in electronic devices such as display screens. Semiconductor chips have high power and generate a lot of heat during operation, so a heat dissipation film needs to be attached to the surface. Generally, the heat dissipation film material is made of metals with good thermal conductivity such as aluminum.

[0003] COF roll-to-roll automatic mounting machine is mainly used to attach heat dissipation film to the PI surface of TAPE in the flip chip packaging process of display semiconductor chips. It is an application process for attaching heat sinks with high precision. Since the back of the display semiconductor chip is flat, the existing process is to attach the heat dissipation film to the back of the semiconductor chip.

[0004] Since the front side of the semiconductor chip generates more heat than the back side when it is working, a heat dissipation film can be attached to the front side of the semiconductor chip based on the heat dissipation film already attached to the back side. However, the front side of the semiconductor chip is non-planar. If the heat dissipation film is attached to the front side of the semiconductor chip, wrinkles will appear on the heat dissipation film, which will not be able to completely fit on the front side of the semiconductor chip, affecting the heat dissipation effect. Irregular raised wrinkles will appear on the surface of the product, affecting the product appearance qualification rate.

[0005] To solve this problem, the invention patent with publication number CN117373955A discloses a heat dissipation patch attaching machine. The heat dissipation patch attaching machine adopts a fully automated design and can attach heat dissipation film to the non-flat surface of the semiconductor chip. The attached heat dissipation film can fit tightly with the semiconductor chip, and the heat dissipation effect achieved is better. In addition, the heat dissipation patch attaching machine is provided with a rear detection camera to detect whether there is a missing paste. However, the heat dissipation patch attaching machine is not provided with a corresponding missing paste processing structure. When the rear detection camera detects that a missing paste occurs, the machine can only be shut down and manually processed, which greatly affects the efficiency.

[0006] Therefore, it is necessary to provide a technical solution to solve the above problems. Utility Model Content

[0007] The utility model aims to solve the problem that the existing heat dissipation patch attaching machine is not provided with a corresponding missing patch processing structure, and when a rear detection camera detects a missing patch, the machine can only be stopped and manually processed, which affects the production efficiency.

[0008] To achieve the above-mentioned purpose, the utility model provides a semiconductor chip strip automatic heat dissipation pasting machine, comprising a pasting frame and a reeling device and a winding device arranged on both sides of the pasting frame; the pasting frame is provided with a track device, a rolling device, a missing pasting detection device, a feeding pasting device and a plurality of lifting devices; wherein:

[0009] The track device includes a conveying rail and two sets of driving mechanisms, the two sets of driving mechanisms are respectively arranged at both ends of the conveying rail, the driving mechanism includes a driver, a clutch, a conveying wheel and a pressure wheel, the pressure wheel and the conveying wheel are distributed up and down, and are both rotatably connected to the conveying rail, and the output shaft of the driver is connected to the conveying wheel through the clutch;

[0010] The feeding and attaching device is arranged on the outer side of the track device, and is used to attach the heat dissipation film to the semiconductor chip belt conveyed by the track device;

[0011] The rolling device and the missing laminating detection device are both located above the track device and are arranged in sequence at the rear end of the feeding and laminating device;

[0012] A plurality of groups of the lifting devices are all arranged below the track device, and correspond one to one with the positions of the feeding and laminating device and the rolling device.

[0013] More specifically, the conveyor rail is composed of two parallel guide rails, and supporting ridges are arranged on the opposite surfaces of the two guide rails, and a plurality of ribs are arranged on the top of the supporting ridges; a stopper is arranged on the top of the guide rail at a position corresponding to the supporting ridges.

[0014] More specifically, the conveying wheel and the pressure wheel are provided at both ends of the guide rail; a pressure seat is provided at both ends of the guide rail, one end of the pressure seat is hinged to the guide rail, the pressure wheel is rotatably connected to the pressure seat, and the end of the pressure seat away from the guide rail is detachably connected to a counterweight block.

[0015] More specifically, a rotating block is rotatably connected to the middle part of the pressure seat, and a slider is slidably connected to one side of the pressure seat. A slot is provided on the side of the rotating block close to the slider, and an insertion rod is rotatably connected to the slider. The end of the insertion rod is placed in the slot, and the pressure seat is provided with an adjusting part for adjusting the position of the slider; the pressure wheel is rotatably connected to the side of the rotating block away from the slider.

[0016] More specifically, an ion wind emitter is arranged on the conveying track.

[0017] More specifically, a displacement detection mechanism is provided on the conveying rail, and the displacement detection mechanism includes an encoder and a detection gear. The encoder is installed on the conveying rail, and the detection gear is installed on the output end of the encoder.

[0018] More specifically, the feeding and pasting device includes a base frame and a heat sink output mechanism, a pasting removal mechanism, a front visual detector and a rear visual detector installed on the base frame; the base frame is installed on the attachment frame; the heat sink output mechanism is used to output a heat sink that matches the shape of the semiconductor chip; the pasting removal mechanism is used to attach the heat sink output by the heat sink output mechanism to the semiconductor chip belt; the front visual detector is used to detect the pasting quality of the pasting removal mechanism; the rear visual detector is used to detect whether the heat sink output by the heat sink output mechanism has moved into place.

[0019] More specifically, a slide rail is provided on the base frame, a telescopic driver is provided on the outer side of the slide rail, the telescopic driver is fixedly connected to the base frame, and a locking block is installed at the output end thereof, and a locking groove is provided on the top of the locking block; the heat sink output mechanism is slidably connected to the slide rail, and a locking piece is provided at the bottom of the heat sink output mechanism, and the locking piece is placed in the locking groove.

[0020] More specifically, the unwinding device includes an unwinding frame, an unwinding wheel and a winding wheel, the unwinding wheel and the winding wheel are distributed up and down and are both rotatably connected to the unwinding frame, and the unwinding frame is provided with a driving component for driving the unwinding wheel and the winding wheel to rotate; two groups of sensor components are arranged between the unwinding wheel and the winding wheel, the two groups of sensor components are distributed up and down and are installed on the unwinding frame.

[0021] More specifically, a receiving groove is provided on the unwinding frame, the receiving groove is located between the unwinding wheel and the winding wheel, and a supporting member is provided in the receiving groove.

[0022] The beneficial effects of the utility model are:

[0023] The present application utilizes the cooperation of two sets of driving mechanisms to realize the forward and reverse switching movement of the semiconductor chip belt. When the missing-sticking detection device detects the presence of a chip with a missing heat sink sticker, the driving mechanism can be used to control the semiconductor chip belt to move in the reverse direction, that is, the chip with a missing heat sink sticker is reset to the feeding and bonding device for automatic bonding. In this way, there is no need to stop the machine for manual bonding of the heat sink sticker, which not only improves production efficiency but also ensures product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic structural diagram of a semiconductor chip strip automatic heat dissipation pasting machine involved in the utility model;

[0025] Figure 2 It is a structural schematic diagram of a bonding frame in an automatic heat dissipation bonding machine for semiconductor chips involved in the utility model;

[0026] Figure 3 It is a structural schematic diagram of a track device in a semiconductor chip strip automatic heat dissipation mounting machine involved in the utility model;

[0027] Figure 4 for Figure 3 The enlarged schematic diagram of point A in the middle;

[0028] Figure 5 for Figure 3 The enlarged schematic diagram of point B in the middle;

[0029] Figure 6 It is a partial schematic diagram of a track device in a semiconductor chip strip automatic heat dissipation mounting machine involved in the utility model;

[0030] Figure 7 It is a structural schematic diagram of a press seat in a semiconductor chip strip automatic heat dissipation mounting machine involved in the utility model;

[0031] Figure 8 It is a structural schematic diagram of another angle of view of a pressure seat in a semiconductor chip strip automatic heat dissipation mounting machine involved in the utility model;

[0032] Fig. 9 It is a structural schematic diagram of a feeding and bonding device in an automatic heat dissipation bonding machine for semiconductor chips involved in the utility model;

[0033] Fig.10 It is a structural schematic diagram of another perspective of a feeding and bonding device in a semiconductor chip strip automatic heat dissipation bonding machine involved in the utility model;

[0034] Fig.11 for Fig.10 Enlarged schematic diagram of point C in the middle.

[0035] Markings in the figure:

[0036] 1. Attachment rack; 2. Unwinding device; 3. Rewinding device; 4. Track device; 5. Rolling device; 6. Missing sticker detection device; 7. Feeding and attaching device; 8. Lifting device;

[0037] 21. Unwinding frame; 22. Unwinding wheel; 23. Rewinding wheel; 24. Sensing component; 25. Supporting member;

[0038] 41. conveying rail; 411. guide rail; 412. supporting convex strip; 413. convex rib; 414. stopper; 42. driving mechanism; 421. driver; 422. clutch; 423. conveying wheel; 424. pressing wheel; 425. pressing seat; 4251. rotating block; 4252. slider; 4253. plug rod; 426. counterweight; 43. ion wind emitter; 44. encoder; 45. detection gear;

[0039] 71. Base frame; 72. Heat dissipation sticker output mechanism; 73. Sticker removal mechanism; 74. Front visual detector; 75. Rear visual detector; 76. Telescopic drive; 77. Lock block; 78. Locking piece. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0041] It should be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be a central element at the same time; when an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time.

[0042] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0043] In the description of the embodiments of the present invention, it should be understood that the directions or positional relationships indicated by “up”, “down”, “front”, “back”, “left”, “right”, “top”, “bottom”, “inside” and “outside”, etc., are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0044] In order to more clearly illustrate the technical solution of the utility model, a preferred embodiment is provided below. Figures 1 to 11, a semiconductor chip strip automatic heat dissipation pasting machine, comprising a pasting frame 1 and a reeling device 2 and a reeling device 3 arranged on both sides of the pasting frame 1; the pasting frame 1 is provided with a track device 4, a rolling device 5, a missing pasting detection device 6, a plurality of feeding pasting devices 7 and a plurality of lifting devices 8; wherein:

[0045] The track device 4 includes a conveying rail 41 and two sets of driving mechanisms 42. The two sets of driving mechanisms 42 are respectively arranged at both ends of the conveying rail 41. The driving mechanism 42 includes a driver 421, a clutch 422, a conveying wheel 423 and a pressure wheel 424. The pressure wheel 424 and the conveying wheel 423 are distributed up and down and are both rotatably connected to the conveying rail 41. The output shaft of the driver 421 is connected to the conveying wheel 423 through the clutch 422.

[0046] A plurality of feeding and laminating devices 7 are arranged outside the track device 4, and are used to attach the heat dissipation film to the semiconductor chip belt conveyed by the track device 4;

[0047] The rolling device 5 and the missing sticking detection device 6 are both located above the track device 4 and are arranged in sequence at the rear end of the feeding and sticking device 7;

[0048] A plurality of lifting devices 8 are arranged below the track device 4 and correspond one to one with the positions of the feeding and laminating devices 7 and the rolling devices 5 .

[0049] Compared with the prior art, the automatic heat dissipation attaching machine for semiconductor chip strips involved in the utility model is different in that the utility model utilizes the cooperation of two sets of driving mechanisms 42 to realize the forward and reverse switching movement of the semiconductor chip strips. In actual application, the unwinding device 2 outputs the semiconductor chip tape, the semiconductor chip tape passes through the track device 4, and is reeled onto the reeling device 3, and the semiconductor chip tape on the track device 4 is driven by the driving mechanism 42 arranged at the rear end to move forward, so that the chip passes through the feeding and pasting device 7, the rolling device 5 and the missing pasting detection device 6 in sequence, thereby performing gluing, rolling, leak detection and other operations; and when the missing pasting detection device 6 detects that the chip of the semiconductor chip tape is missing the heat dissipation sticker, the clutch 422 in the driving mechanism 42 arranged at the rear end will control the driver 421 to disconnect from the conveying wheel 423, and the clutch 422 in the driving mechanism 42 arranged at the front end will control the driver 421 to connect with the conveying wheel 423, at this time, the driving mechanism 42 arranged at the front end can drive the semiconductor chip tape to move in the reverse direction, so that the chip that is missing the heat dissipation sticker is reset to the feeding and pasting device 7, thereby supplementing the heat dissipation sticker, so that there is no need to stop the machine for manual supplementation of the heat dissipation sticker, which not only improves the production efficiency but also ensures the quality of the product.

[0050] It should be noted that the specific structures of the rolling device 5, the missing detection device 6, the lifting device 8 and other components are the same as those in the prior art, so they will not be described in detail here.

[0051] In this embodiment, the conveying rail 41 is composed of two parallel guide rails 411, and the opposite surfaces of the two guide rails 411 are provided with supporting convex strips 412, and the top of the supporting convex strips 412 is provided with a plurality of convex ribs 413; the top of the guide rail 411 is provided with a stopper 414 at the position corresponding to the supporting convex strips 412. In actual application, the semiconductor chip belt is arranged between the two guide rails 411, and the two sides thereof are respectively placed on the convex ribs 413 of the corresponding supporting convex strips 412. The contact surface between the semiconductor chip belt and the guide rail 411 can be reduced by the convex ribs 413, which not only reduces the risk of damage to the semiconductor chip belt, but also improves the smoothness of the movement of the semiconductor chip belt, and the stopper 414 is located above the semiconductor chip belt, which plays a role in limiting the semiconductor chip belt.

[0052] Preferably, the distance between the two guide rails 411 is adjustable to meet the conveying requirements of different semiconductor chip strips.

[0053] In this embodiment, a conveying wheel 423 and a pressing wheel 424 are provided at both ends of the guide rail 411; a pressing seat 425 is provided at both ends of the guide rail 411, one end of the pressing seat 425 is hinged to the guide rail 411, the pressing wheel 424 is rotatably connected to the pressing seat 425, and a counterweight 426 is detachably connected to the end of the pressing seat 425 away from the guide rail 411. In actual application, the semiconductor chip belt is located above the conveying wheel 423, and the pressing seat 425 is located above the semiconductor chip belt. Under the gravity of the pressing seat 425, the pressing wheel 424 will press on the top surface of the semiconductor chip belt, so that the semiconductor chip belt and the conveying wheel 423 are kept in close contact, ensuring that the conveying wheel 423 can continuously convey the semiconductor chip belt, and improving the moving stability of the semiconductor chip belt; in addition, according to the different semiconductor chip belts, different counterweights 426 can be replaced to change the pressure applied by the pressing wheel 424 to the semiconductor chip belt to meet the use requirements of different semiconductor chip belts.

[0054] In this embodiment, a rotating block 4251 is rotatably connected to the middle part of the pressure seat 425, and a slider 4252 is slidably connected to one side of the pressure seat 425. A slot is provided on the side of the rotating block 4251 close to the slider 4252, and an insertion rod 4253 is rotatably connected to the slider 4252. The end of the insertion rod 4253 is placed in the slot, and a position adjustment member for adjusting the position of the slider 4252 is provided on the pressure seat 425; the pressure wheel 424 is rotatably connected to the side of the rotating block 4251 away from the slider 4252. In actual application, the position adjustment member can control the rotation of the rotating block 4251 by adjusting the position of the slider 4252, so as to change the inclination angle of the pressure wheel 424. When the semiconductor chip belt moves in the forward direction, the position adjustment member will adjust the position of the slider 4252 to make the corresponding pressure wheels 424 on the two guide rails 411 be distributed in an outward-facing "X" shape. At this time, the semiconductor chip belt will be subjected to the outward pushing tension applied by the pressure wheels 424 during the movement, so that the semiconductor chip belt on the track device 4 remains in a tensioned state, thereby improving the quality of subsequent attachment of the heat sink. When the semiconductor chip belt needs to move in the reverse direction, the position adjustment member will adjust the position of the slider 4252 again, so that the corresponding pressure wheels 424 on the two guide rails 411 are distributed in an inward-facing "X" shape, so that when the semiconductor chip belt moves in the reverse direction, it will still be subjected to the outward pushing tension, ensuring that the semiconductor chip belt on the track device 4 always remains in a tensioned state.

[0055] In this embodiment, an ion wind emitter 43 is provided on the conveying rail 41. In actual application, the ion wind emitter 43 blows ion wind to the semiconductor chip belt, and the ion wind can blow away the dust on the semiconductor chip belt and remove the static electricity attached to the semiconductor chip belt, so as to keep the semiconductor chip clean, so that the heat dissipation sticker attached to the semiconductor chip can be made flatter and tighter.

[0056] In this embodiment, a displacement detection mechanism is provided on the conveying rail 41, and the displacement detection mechanism includes an encoder 44 and a detection gear 45. The encoder 44 is installed on the conveying rail 41, and the detection gear 45 is installed on the output end of the encoder 44. It should be noted that the side of the semiconductor chip belt is provided with an array of holes, and the teeth of the detection gear 45 are placed in the hole. In actual application, the movement of the semiconductor chip belt will drive the detection gear 45 to rotate, and the encoder 44 can detect the displacement of the semiconductor chip belt by analyzing the rotation angle of the detection gear 45, and then determine whether the next chip is accurately moved to the position; for example, assuming that the semiconductor chip belt moves normally once, the rotation angle of the detection gear 45 is a°, if the encoder 44 detects that the rotation angle of the detection gear 45 is greater than or less than a°, it means that the movement of the semiconductor chip belt does not meet the standard, and the chip is not moved to the position. At this time, it is necessary to readjust the position of the semiconductor chip belt to realign the chip with the pick-up and paste mechanism 73. The above design can ensure that the chip is accurately aligned with the pick-up and paste mechanism 73, thereby improving the processing quality.

[0057] In this embodiment, the feeding and bonding device 7 includes a base frame 71 and a heat sink output mechanism 72, a pick-up mechanism 73, a front visual detector 74 and a rear visual detector 75 installed on the base frame 71; the base frame 71 is installed on the attachment frame 1; the heat sink output mechanism 72 is used to output a heat sink that matches the shape of the semiconductor chip; the pick-up mechanism 73 is used to attach the heat sink output by the heat sink output mechanism 72 to the semiconductor chip belt; the front visual detector 74 is used to detect the bonding quality of the pick-up mechanism 73; the rear visual detector 75 is used to detect whether the heat sink output by the heat sink output mechanism 72 has moved into place. In actual application, the lifting device 8 lifts up the semiconductor chip and fixes it by adsorption, and the heat sink output mechanism 72 outputs the heat sink to a specific position. The rear visual detector 75 detects the output heat sink. If there is a deviation between the actual position of the heat sink and the preset position, the rear visual detector 75 will feed back the information to the attachment mechanism 73, so that the attachment mechanism 73 can accurately absorb the heat sink. Finally, the attachment mechanism 73 will attach the heat sink to the semiconductor chip, and the front visual detector 74 will perform quality inspection.

[0058] In this embodiment, a slide rail is provided on the bottom frame 71, and a telescopic driver 76 is provided on the outside of the slide rail. The telescopic driver 76 is fixedly connected to the bottom frame 71, and a locking block 77 is installed at its output end, and a locking groove is provided on the top of the locking block 77; the heat dissipation patch output mechanism 72 is slidably connected to the slide rail, and a locking piece 78 is provided at the bottom of the heat dissipation patch output mechanism 72, and the locking piece 78 is placed in the locking groove. The above design makes it easy to disassemble and assemble the heat dissipation patch output mechanism 72 and the bottom frame 71, and is convenient for the repair and maintenance of the heat dissipation patch output mechanism 72.

[0059] In this embodiment, the unwinding device 2 includes an unwinding frame 21, an unwinding wheel 22 and a winding wheel 23. The unwinding wheel 22 and the winding wheel 23 are distributed up and down and are both rotatably connected to the unwinding frame 21. The unwinding frame 21 is provided with a driving component for driving the unwinding wheel 22 and the winding wheel 23 to rotate; two groups of sensor components 24 are arranged between the unwinding wheel 22 and the winding wheel 23, and the two groups of sensor components 24 are distributed up and down and are installed on the unwinding frame 21. In actual application, the unwinding wheel 22 unwinds the material roll, and the semiconductor chip tape in the material roll is transported to the track device 4, while the release film roll in the material roll is wound onto the reel-in 23; it should be understood that a naturally hanging semiconductor chip tape buffer section is provided between the unwinding wheel 22 and the track device 4, and the semiconductor chip tape buffer section is mainly provided to realize soft transmission, so that during the movement of the semiconductor chip tape, the semiconductor chip tape on the unwinding wheel 22 and the track device 4 will not be subjected to rigid tension, thereby improving the smoothness and stability of the movement of the semiconductor chip tape on the track device 4, and avoiding the breakage of the semiconductor chip tape. The semiconductor chip tape buffer section should not be too long or too short, and the position detected by the two sets of sensor components 24 is the threshold value that the lowest point of the semiconductor chip tape buffer section can reach. When the sensor component 24 detects an abnormality, it means that the semiconductor chip tape buffer section is too long or too short. At this time, the sensor component 24 will feedback information to make the device alarm.

[0060] In this embodiment, a receiving groove is provided on the unwinding frame 21, and the receiving groove is located between the unwinding wheel 22 and the winding wheel 23, and a supporting member 25 is provided in the receiving groove. It should be understood that when the coil on the unwinding device 2 is exhausted, a new coil needs to be loaded and connected with the old coil. At this time, the supporting member 25 can be pulled outward to place the new coil and the old coil, so as to facilitate the staff to perform the coil connection operation.

[0061] In this embodiment, an ion wind emitter is also provided on the unwinding frame 21 to remove dust and static electricity from the semiconductor chip tape.

[0062] It should be noted that the structure of the winding device 3 is the same as that of the unwinding device 2, so no further details will be given here.

[0063] The above description is only a preferred embodiment of the present invention, and its structure is not limited to the shapes listed above. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor chip strip automatic heat dissipation pasting machine, comprising a pasting frame and a reeling device and a winding device arranged on both sides of the pasting frame; the pasting frame is provided with a track device, a rolling device, a missing pasting detection device, a feeding pasting device and a plurality of lifting devices; the characteristics are: The track device includes a conveying rail and two sets of driving mechanisms, the two sets of driving mechanisms are respectively arranged at both ends of the conveying rail, the driving mechanism includes a driver, a clutch, a conveying wheel and a pressure wheel, the pressure wheel and the conveying wheel are distributed up and down, and are both rotatably connected to the conveying rail, and the output shaft of the driver is connected to the conveying wheel through the clutch; The feeding and attaching device is arranged on the outer side of the track device, and is used to attach the heat dissipation film to the semiconductor chip belt conveyed by the track device; The rolling device and the missing laminating detection device are both located above the track device and are arranged in sequence at the rear end of the feeding and laminating device; A plurality of groups of the lifting devices are all arranged below the track device, and correspond one to one with the positions of the feeding and laminating device and the rolling device.

2. According to claim 1, a semiconductor chip strip automatic heat dissipation mounting machine is characterized in that: The conveying rail is composed of two parallel guide rails, and supporting convex strips are arranged on the opposite surfaces of the two guide rails. The top of the supporting convex strips is provided with a plurality of convex ribs; and a stopper is arranged on the top of the guide rail at a position corresponding to the supporting convex strips.

3. According to claim 2, a semiconductor chip strip automatic heat dissipation mounting machine is characterized in that: The conveying wheel and the pressure wheel are provided at both ends of the guide rail; a pressure seat is provided at both ends of the guide rail, one end of the pressure seat is hinged to the guide rail, the pressure wheel is rotatably connected to the pressure seat, and a counterweight block is detachably connected to the end of the pressure seat away from the guide rail.

4. The automatic heat dissipation attaching machine for semiconductor chips according to claim 3, characterized in that: The middle part of the pressure seat is rotatably connected to a rotating block, and one side of the pressure seat is slidably connected to a slider. A slot is provided on the side of the rotating block close to the slider, and an insertion rod is rotatably connected to the slider. The end of the insertion rod is placed in the slot, and the pressure seat is provided with an adjusting member for adjusting the position of the slider; the pressure wheel is rotatably connected to the side of the rotating block away from the slider.

5. The semiconductor chip strip automatic heat dissipation attaching machine according to claim 1, characterized in that: An ion wind emitter is arranged on the conveying rail.

6. The semiconductor chip strip automatic heat dissipation attaching machine according to claim 1, characterized in that: The conveying rail is provided with a displacement detection mechanism, which includes an encoder and a detection gear. The encoder is installed on the conveying rail, and the detection gear is installed on the output end of the encoder.

7. The semiconductor chip strip automatic heat dissipation attaching machine according to claim 1, characterized in that: The feeding and pasting device includes a base frame and a heat sink output mechanism, a pick-up mechanism, a front visual detector and a rear visual detector installed on the base frame; the base frame is installed on the attachment frame; the heat sink output mechanism is used to output a heat sink that matches the shape of the semiconductor chip; the pick-up mechanism is used to attach the heat sink output by the heat sink output mechanism to the semiconductor chip belt; the front visual detector is used to detect the pasting quality of the pick-up mechanism; the rear visual detector is used to detect whether the heat sink output by the heat sink output mechanism has moved into place.

8. The semiconductor chip strip automatic heat dissipation attaching machine according to claim 7, characterized in that: The base frame is provided with a slide rail, and a telescopic driver is provided on the outer side of the slide rail. The telescopic driver is fixedly connected to the base frame, and a locking block is installed at the output end thereof, and a locking groove is provided on the top of the locking block; the heat sink output mechanism is slidably connected to the slide rail, and a locking piece is provided at the bottom of the heat sink output mechanism, and the locking piece is placed in the locking groove.

9. The semiconductor chip strip automatic heat dissipation attaching machine according to claim 1, characterized in that: The unwinding device includes an unwinding frame, an unwinding wheel and a rewinding wheel, wherein the unwinding wheel and the rewinding wheel are distributed up and down and are both rotatably connected to the unwinding frame, and the unwinding frame is provided with a driving component for driving the unwinding wheel and the rewinding wheel to rotate; two groups of sensor components are arranged between the unwinding wheel and the rewinding wheel, and the two groups of sensor components are distributed up and down and are installed on the unwinding frame.

10. The semiconductor chip strip automatic heat dissipation attaching machine according to claim 9, characterized in that: The unwinding frame is provided with a receiving groove, the receiving groove is located between the unwinding wheel and the winding wheel, and a supporting member is provided in the receiving groove.

Images