LED chip feeding and assembling device

Abstract

An LED chip feeding and assembling device is characterized by comprising a lamp strip, an LED chip, a patch carrier and a patch feeding mechanism. The lamp strip comprises a plurality of varnished wires which are arranged in parallel; the surface mounting carrier is provided with first wire slots corresponding to a plurality of parallel enamelled wires at intervals and in outline arrangement, the cross section of each first wire slot is in a V shape with an opening facing the vertical upper part, the enamelled wires pass through the surface mounting carrier through the first wire slots in the horizontal direction, a plurality of chip slots are arranged vertically below the first wire slots, and the chip slots are arranged below the chip slots. The head end and the tail end of each chip groove are close to at least two adjacent enameled wires. The patch feeding mechanism comprises a conveying track, a plurality of feeding manipulators, a sliding rack, a horizontal sliding track, a rack driving mechanism, a lifting cylinder, a plurality of suction cup mechanisms and a suction cup lifting table; and the patch loading mechanism drives the patch carrier to carry the LED chip to be soldered with the enameled wire.

Description

Technical Field

[0001] The utility model relates to the technical field of LED processing equipment, in particular to an LED chip loading and assembling device. Background Art

[0002] LED light strips are LEDs assembled on a strip-shaped FPC (flexible circuit board) or PCB hard board, and are named because their product shape resembles a strip. LED light strips can be divided into LED hard light strips and flexible LED light strips. Light strips have been widely used for decoration and lighting in buildings, bridges, roads, gardens, courtyards, floors, ceilings, furniture, cars, ponds, underwater, advertisements, signs, logos, etc.

[0003] The widespread application of LED light strips has led to higher and higher requirements for the quality of light strips. Traditional product welding is mainly done by manual electric welding. Due to the inaccurate positioning of manual electric welding, the thickness and uniformity of welding are prone to leakage and biased welding, resulting in loose welding and even direct product falling off, making the quality of LED light strips generally poor;

[0004] Moreover, the existing production process of LED light strips is to peel off the paint coating of the two enameled wires serving as the positive and negative electrodes to expose the conductor core wire, then solder the positive and negative electrodes of the LED chip to the conductor core wire, and then apply UV glue to the soldering position. After curing, the LED chip and the conductor core wire are covered and protected to complete the entire package.

[0005] However, this traditional LED light string with two positive and negative enameled wires has a simple structure and can display fewer light source variations. If you want a richer light source performance, you can only use multiple rows of wires. This is because the existing process cannot complete the integration of multiple rows of wires in one package.

[0006] The difficulty lies in how to accurately and orderly install multiple LED chips on each line group in automated production. At the same time, because the gaps between multiple LED chips are small, they cannot be soldered at the same time. Therefore, how to maintain a stable relationship between multiple LED chips and conductor cores when soldering one by one is also a problem that needs to be overcome.

[0007] Therefore, if we can design an LED light string with multiple wire groups and realize automatic packaging of such light strings, it will greatly expand the application scenarios and market of the light strings. Utility Model Content

[0008] In order to solve the deficiencies of the above-mentioned technologies, the utility model provides an LED chip loading and assembly device. The technical solution of the utility model: an LED chip loading and assembly device, comprising a light strip, an LED chip, a patch carrier, and a patch loading mechanism; the light strip comprises a plurality of parallel enameled wires;

[0009] The patch carrier corresponds to a plurality of first wire grooves with a spacing and contour of parallel enameled wires, the cross section of the first wire groove is in a "V" shape with an opening facing vertically upward, the enameled wire passes through the patch carrier through the first wire groove in a horizontal direction, and a plurality of chip grooves are arranged vertically below the first wire groove, and the first and last ends of each chip groove are close to at least two adjacent enameled wires;

[0010] The patch loading mechanism includes a feeding track, a plurality of loading manipulators, a sliding frame, a horizontal sliding track, a frame driving mechanism, a lifting cylinder, a plurality of suction cup mechanisms and a suction cup lifting platform;

[0011] The feed track is provided with a plurality of feed troughs aligned with the chip slots of the patch carrier of the loading station, and one end of the feed trough close to the loading station is the waiting station, and the plurality of loading manipulators clamp the LED chips into each feed trough and push the LED chips toward one side of the waiting station;

[0012] The horizontal sliding track is connected and arranged between the waiting station and the loading station, the sliding frame is slidably matched with the horizontal sliding track, the frame driving mechanism includes a driving motor and a driving gear fixedly arranged on the sliding frame, and a rack meshing with the driving gear is provided on the horizontal sliding track. The driving motor drives the driving gear to rotate forward and reversely, and drives the sliding frame to reciprocate between the waiting station and the loading station;

[0013] A lifting slot corresponding to each chip slot position is provided vertically below the sliding rack, and the plurality of suction cup mechanisms are respectively arranged in the lifting slot for sliding cooperation, and the plurality of suction cup mechanisms each include a slider, a vacuum suction cup and a vacuum pump, the vacuum suction cup is fixed to the slider and faces one side of the chip slot, and an air hole connected to the vacuum suction cup is provided in the slider, and each air hole is connected to a vacuum pump hose, and the vacuum pump controls each vacuum suction cup to absorb the LED chip in the feeding track, or put the LED chip into the chip slot;

[0014] The suction cup lifting platform is fixedly connected to each slider member and is connected to a lifting cylinder piston rod. The lifting cylinder drives each vacuum suction cup to synchronously move toward or away from the feeding trough and the chip trough.

[0015] With the above technical solution, due to the small size of LED chips, the efficiency of clamping them one by one is low. Therefore, multiple sets of mechanical arms are dragged to clamp the chips to the feeding track, and then multiple suction cup mechanisms are used to absorb and place them in the chip slots at the same time, which improves the chip placement accuracy and efficiency.

[0016] Then you just need to align the enameled wire with the first wire groove, insert it into the SMD carrier and align it with each LED chip to easily complete the soldering work between the two, ensuring that the position of the enameled wire and LED chip is stable during the soldering process without shaking.

[0017] The utility model is further configured as follows: the two ends of the light strip are respectively connected to the light strip pay-off and take-up mechanisms to make horizontal stepping movements, and a first carrier lifting mechanism is arranged along the transmission direction of the light strip, and a rotating workbench is arranged vertically below the light strip and located at the first carrier lifting mechanism;

[0018] The rotating workbench is evenly loaded with a plurality of patch carriers, and the rotating workbench includes a loading station close to the patch loading mechanism and an unloading station close to the first carrier lifting mechanism;

[0019] The chip loading mechanism clamps a number of LED chips into each chip slot, and the rotating worktable reciprocates to transport the chip carrier carrying the LED chips to the unloading station;

[0020] The first carrier lifting mechanism includes a lifting track, a lifting drive mechanism, a lifting platform and a pneumatic clamp. The lifting platform is arranged on the lifting track to perform vertical sliding cooperation, including a clamping station close to the unloading station and a soldering station close to the soldering machine. The lifting drive mechanism drives the lifting platform and the pneumatic clamp to slide back and forth vertically between the two stations. The pneumatic clamp is provided with a pair of claws adapted to the contour of the patch carrier, and grabs the patch carrier of the unloading station to the soldering station, and solders the LED chip and the conductor core;

[0021] The pneumatic gripper puts the empty carrier back to the unloading station, and the light strip pay-off and take-up mechanism drives the enameled wire to carry the soldered LED chip and move stepwise in the horizontal direction.

[0022] By adopting the above technical solution, the enameled wire is suspended and transmitted horizontally. After the LED chip is placed into the chip slot using the patch loading device, the patch carrier is driven by the rotating workbench and the first carrier lifting device to move and rise to the soldering station. At this time, the patch carrier meets the enameled wire from bottom to top, and the first wire groove is used to guide the enameled wire to be embedded to ensure that the conductor core is stabilized during soldering so that the automated production process does not shake.

[0023] The utility model is further configured as follows: the end of the feed track close to the patch carrier is a stop end, the stop end has a uniform spacing with the chip slots that are aligned with each other, and the lifting slots corresponding to the positions of the chip slots are aligned with the chip positions at the stop ends when they are moved to the waiting station.

[0024] By adopting the above technical solution, each suction cup mechanism on the sliding frame can accurately align with the stop end or the chip slot when stopping during the reciprocating movement of a fixed distance.

[0025] The beneficial effects of the utility model are as follows: through the arrangement and mutual cooperation of the patch carrier, the feeding mechanism, the rotating worktable, and the first carrier lifting mechanism, the functions of automatic feeding of LED chips and automatic alignment with the enameled wire are realized, which greatly facilitates the accuracy and efficiency of the soldering process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 The structure of the embodiment of the utility model Figure 1 ;

[0027] Figure 2 The structure of the embodiment of the utility model Figure 2 ;

[0028] Figure 3 The structure of the embodiment of the utility model Figure 3 ;

[0029] Figure 4 The structure of the embodiment of the utility model Figure 4 ;

[0030] Figure 5 The structure of the embodiment of the utility model Figure 5 ;

[0031] Figure 6 for Figure 4 A large picture is posted at A;

[0032] Among them, 1-the first carrier lifting mechanism, 11-the lifting track, 12-the lifting drive mechanism, 13-the lifting platform, 14-the pneumatic clamp, 2-the tin soldering machine, 3-the rotating workbench, 4-the patch carrier, 41-the first wire slot, 42-the chip slot, 5-the patch loading mechanism, 51-the feeding track, 52-the sliding rack, 521-the driving gear, 531-the rack, 522-the lifting slot, 53-the horizontal sliding track, 54-the lifting mechanism, 55-the suction cup lifting platform, 56-the slider, 57-the vacuum suction cup, 58-the hose, 6-the light strip, 61-the enameled wire, 62-the LED chip.

[0033] In order to better illustrate this embodiment, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product. In addition, the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. DETAILED DESCRIPTION

[0034] In order to make the technical solution and advantages of the present application clearer, the technical solution of the present application will be further described in detail in detail and in detail in conjunction with the accompanying drawings. It can be understood that the specific embodiments described here are only partial embodiments of the present application, which are only used to explain the present application, not to limit the present application. It should be noted that, for the convenience of description, only the parts related to the present application are shown in the accompanying drawings, and other related parts can refer to the general design. In the absence of conflict, the embodiments in the present application and the technical features in the embodiments can be combined with each other to obtain new embodiments.

[0035] like Figure 1-6 As shown, a device for loading and assembling an LED chip 62 includes a light strip 6, an LED chip 62, a patch carrier 4, and a patch loading mechanism 5; the light strip 6 includes a plurality of patch carriers 61 arranged in parallel;

[0036] The patch carrier 4 corresponds to a plurality of first wire grooves 41 arranged with a spacing and contour parallel to the patch carrier 61. The cross section of the first wire groove 41 is in a "V" shape with an opening facing vertically upward. The patch carrier 61 passes through the patch carrier 4 through the first wire groove 41 in a horizontal direction. A plurality of chip grooves 42 are arranged vertically below the first wire groove 41. The first and last ends of each chip groove 42 are close to at least two adjacent patch carriers 61.

[0037] The patch loading mechanism 5 includes a feeding track 51, a plurality of loading manipulators, a sliding frame 52, a horizontal sliding track 53, a frame driving mechanism, a lifting cylinder 54, a plurality of suction cup mechanisms and a suction cup lifting platform 1355;

[0038] The feed track 51 is provided with a plurality of feed slots aligned with the chip slots 42 of the patch carrier 4 of the loading station. One end of the feed slot close to the loading station is the waiting station. The plurality of loading manipulators clamp the LED chips 62 into each feed slot and push the LED chips 62 toward one side of the waiting station.

[0039] The horizontal sliding rail 53 is connected and arranged between the waiting station and the loading station, the sliding frame 52 is slidably matched with the horizontal sliding rail 53, and the frame driving mechanism includes a driving motor and a driving gear 521 fixedly arranged on the sliding frame 52. The horizontal sliding rail 53 is provided with a rack 531 meshing with the driving gear 521. The driving motor drives the driving gear 521 to rotate forward and reverse, driving the sliding frame 52 to reciprocate between the waiting station and the loading station;

[0040] A lifting groove 522 corresponding to the position of each chip slot 42 is provided vertically below the sliding rack 52. The plurality of suction cup mechanisms are respectively arranged in the lifting groove 522 for sliding cooperation. The plurality of suction cup mechanisms each include a slider 56, a vacuum suction cup 57 and a vacuum pump. The vacuum suction cup 57 is fixed to the slider 56 and faces one side of the chip slot 42. The slider 56 is provided with air holes connected to the vacuum suction cup 57. Each air hole is connected to a vacuum pump hose 58. The vacuum pump controls each vacuum suction cup 57 to absorb the LED chip 62 in the feeding track 51 or put the LED chip 62 into the chip slot 42.

[0041] The suction cup lifting platform 13 is fixedly connected to each slider 56 and is connected to the piston rod of the lifting cylinder 54. The lifting cylinder 54 drives each vacuum suction cup 57 to move synchronously toward or away from the feeding slot and the chip slot 42.

[0042] Since the LED chips 62 are small in size, the efficiency of clamping them one by one is low. Therefore, multiple groups of mechanical arms are dragged to clamp the chips to the feeding track 51, and then multiple suction cup mechanisms are used to absorb and place them in the chip slots 42, thereby improving the chip placement accuracy and efficiency.

[0043] Then, you only need to align the SMD carrier 61 with the first wire groove 41, insert it into the SMD carrier 4 and align it with each LED chip 62, so as to easily complete the soldering work between the two, ensuring that the position of the SMD carrier 61 and the LED chip 62 is stable during the soldering process without shaking.

[0044] The two ends of the light strip 6 are respectively connected to the light strip 6 pay-off and take-up mechanisms to make horizontal stepping movements, and a first carrier lifting mechanism 1 is arranged along the transmission direction of the light strip 6, and a rotating workbench 3 is arranged vertically below the light strip 6 and located at the first carrier lifting mechanism 1;

[0045] The rotating workbench 3 is evenly loaded with a plurality of patch carriers 4, and the rotating workbench 3 includes a loading station close to the patch loading mechanism 5 and an unloading station close to the first carrier lifting mechanism 1;

[0046] The chip loading mechanism 5 clamps a plurality of LED chips 62 into each chip slot 42, and the rotating worktable 3 reciprocates and transports the chip carrier 4 carrying the LED chips 62 to the unloading station;

[0047] The first carrier lifting mechanism 1 includes a lifting track 11, a lifting drive mechanism 12, a lifting platform 13 and a pneumatic clamp 14. The lifting platform 13 is arranged on the lifting track 11 to make vertical sliding cooperation, including a clamping station close to the unloading station and a soldering station close to the soldering machine. The lifting drive mechanism 12 drives the lifting platform 13 and the pneumatic clamp 14 to slide back and forth vertically between the two stations. The pneumatic clamp 14 is provided with a pair of claws adapted to the contour of the patch carrier 4, and grabs the patch carrier 4 of the unloading station to the soldering station, and solders the LED chip 62 and the conductor core;

[0048] The pneumatic gripper 14 puts the empty carrier back to the unloading station, and the light strip 6 pay-off and take-up mechanism drives the patch carrier 61 to carry the soldered LED chip 62 to move in a horizontal stepping direction.

[0049] The patch carrier 61 is suspended and transferred horizontally. After the LED chip 62 is placed into the chip slot 42 by the patch loading device, the patch carrier 4 is driven by the rotating workbench 3 and the first carrier lifting device to move and rise to the soldering station. At this time, the patch carrier 4 meets the patch carrier 61 from bottom to top, and the first wire groove 41 is used to guide the patch carrier 61 to be embedded to ensure that the conductor core is stabilized during soldering so that the automated production process does not shake.

[0050] The end of the feeding track 51 close to the patch carrier 4 is a stop end, and the stop end has a uniform spacing with the chip slots 42 that are aligned with each other. The lifting slots 522 corresponding to the positions of each chip slot 42 are aligned with the chip positions at each stop end when they are moved to the waiting station.

[0051] Each suction cup mechanism on the sliding frame 52 is precisely aligned with the stop end or the chip slot 42 when stopping during the reciprocating movement of a fixed distance.

[0052] Through the arrangement and mutual cooperation of the chip carrier 4, the loading mechanism, the rotating worktable 3, and the first carrier lifting mechanism 1, the functions of automatic loading of the LED chip 62 and automatic alignment with the chip carrier 61 are realized, which greatly facilitates the accuracy and efficiency of the soldering process.

[0053] So far, the technical solution of the present application has been described in conjunction with the preferred embodiments shown in the accompanying drawings. Those skilled in the art should understand that the scope of protection of the present application is obviously not limited to these specific embodiments. Without departing from the principles of the present application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the scope of protection of the present application.

Claims

1. An LED chip loading and assembly device, characterized in that: It includes a light strip, an LED chip, a patch carrier, and a patch feeding mechanism; the light strip includes a plurality of enameled wires arranged in parallel; The patch carrier corresponds to a plurality of first wire grooves with a spacing and contour setting of parallel enameled wires, the cross section of the first wire groove is a "V" shape with an opening facing vertically upward, the enameled wire passes through the patch carrier through the first wire groove in a horizontal direction, and a plurality of chip grooves are arranged vertically below the first wire groove, and the first and last ends of each chip groove are close to at least two adjacent enameled wires; The patch loading mechanism includes a feeding track, a plurality of loading manipulators, a sliding frame, a horizontal sliding track, a frame driving mechanism, a lifting cylinder, a plurality of suction cup mechanisms and a suction cup lifting platform; The feed track is provided with a plurality of feed troughs aligned with the chip slots of the patch carrier of the loading station, and one end of the feed trough close to the loading station is the waiting station, and the plurality of loading manipulators clamp the LED chips into each feed trough and push the LED chips toward one side of the waiting station; The horizontal sliding track is connected and arranged between the waiting station and the loading station, the sliding frame is slidably matched with the horizontal sliding track, the frame driving mechanism includes a driving motor and a driving gear fixedly arranged on the sliding frame, and a rack meshing with the driving gear is provided on the horizontal sliding track. The driving motor drives the driving gear to rotate forward and reversely, and drives the sliding frame to reciprocate between the waiting station and the loading station; A lifting slot corresponding to each chip slot position is provided vertically below the sliding rack, and the plurality of suction cup mechanisms are respectively arranged in the lifting slot for sliding cooperation, and the plurality of suction cup mechanisms each include a slider, a vacuum suction cup and a vacuum pump, the vacuum suction cup is fixed to the slider and faces one side of the chip slot, and an air hole connected to the vacuum suction cup is provided in the slider, and each air hole is connected to a vacuum pump hose, and the vacuum pump controls each vacuum suction cup to absorb the LED chip in the feeding track, or put the LED chip into the chip slot; The suction cup lifting platform is fixedly connected to each slider member and is connected to a lifting cylinder piston rod. The lifting cylinder drives each vacuum suction cup to synchronously move toward or away from the feeding trough and the chip trough.

2. The LED chip loading and assembly device according to claim 1, characterized in that: The two ends of the light strip are respectively connected to the light strip pay-off and take-up mechanisms to move in a horizontal direction, and a first carrier lifting mechanism is arranged along the transmission direction of the light strip, and a rotating workbench is arranged vertically below the light strip and located at the first carrier lifting mechanism; The rotating workbench is evenly loaded with a plurality of patch carriers, and the rotating workbench includes a loading station close to the patch loading mechanism and an unloading station close to the first carrier lifting mechanism; The chip loading mechanism clamps a number of LED chips into each chip slot, and the rotating worktable reciprocates to transport the chip carrier carrying the LED chips to the unloading station; The first carrier lifting mechanism includes a lifting track, a lifting drive mechanism, a lifting platform and a pneumatic clamp. The lifting platform is arranged on the lifting track to perform vertical sliding cooperation, including a clamping station close to the unloading station and a soldering station close to the soldering machine. The lifting drive mechanism drives the lifting platform and the pneumatic clamp to slide back and forth vertically between the two stations. The pneumatic clamp is provided with a pair of claws adapted to the contour of the patch carrier, and grabs the patch carrier of the unloading station to the soldering station, and solders the LED chip and the conductor core; The pneumatic gripper puts the empty carrier back to the unloading station, and the light strip pay-off and take-up mechanism drives the enameled wire to carry the soldered LED chip and move stepwise in the horizontal direction.

3. The LED chip loading and assembly device according to claim 2, characterized in that: The end of the conveying track close to the patch carrier is the stop end, and the stop end has the same spacing as the chip slots that are aligned with each other. When the lifting slots corresponding to the positions of each chip slot are moved to the waiting station, they are aligned with the chip positions at each stop end.

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