Flip LED chip packaging structure with double light-emitting areas

Abstract

The utility model belongs to an LED light source packaging structure, and particularly relates to a packaging structure of a flip LED chip with double light-emitting areas, a second light-emitting area of the LED chip surrounds a first light-emitting area in the center, the first light-emitting area and the second light-emitting area are connected with different electrodes, and the LED chip is packaged in a reflection structure; when the required light-emitting brightness is low, only the second light-emitting area can be lightened, and the second light-emitting area located in the center has better light concentration degree and higher reflection light efficiency in the reflection structure; when the required luminance is high, the first light-emitting area and the second light-emitting area are lightened at the same time, and higher luminance can be provided.

Description

Technical Field

[0001] The utility model belongs to an LED light source packaging structure, in particular to a packaging structure of a flip-chip LED chip with double light-emitting areas. Background Art

[0002] With the continuous advancement of technology, the brightness and light efficiency of LED light-emitting devices have been continuously improved, and have been able to reach or even exceed the level of traditional lighting sources. LED light-emitting devices have the advantages of high brightness, high efficiency, energy saving and environmental protection, miniaturization, high reliability and low cost, so they have broad application prospects in the fields of lighting and display.

[0003] In the prior art, LED light-emitting devices generally encapsulate LED chips in a reflective structure to improve the light-emitting efficiency. An LED chip generally has a light-emitting area. This LED chip can directly adjust the light brightness by adjusting the voltage. However, when a lower light brightness is required, the overall light brightness of the LED chip is low, and the edge of the light-emitting area is difficult to obtain effective reflection from the emission structure, thereby limiting the light efficiency improvement of the LED light-emitting device. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the problem in the prior art that when the LED chip emits light as a whole, the edge light reflection efficiency of the light-emitting area is low, which limits the improvement of the light efficiency of the LED light-emitting device, thereby providing a flip-chip LED chip packaging structure with dual light-emitting areas.

[0005] A flip-chip LED chip packaging structure with dual light-emitting areas, comprising an LED chip, a substrate, a reflective white glue and a fluorescent glue;

[0006] The top of the LED chip forms a first light-emitting area and a second light-emitting area, the first light-emitting area is located at the center of the LED chip, and the second light-emitting area surrounds the first light-emitting area; the bottom of the LED chip forms electrodes, the electrodes include a first positive electrode and a first negative electrode conductively connected to the first light-emitting area, and also include a second positive electrode and a second negative electrode conductively connected to the second light-emitting area;

[0007] The LED chip is fixed on the upper side of the substrate, and the electrode is fixed to the pad formed on the upper side of the substrate and conductively welded;

[0008] The reflective white glue is fixed on the upper side of the substrate, surrounding the LED chip, and the inner side is inclined to form an inclined surface structure facing upward;

[0009] The fluorescent glue is fixed to the upper side of the LED chip, and the edge is connected to the top of the reflective white glue.

[0010] Furthermore, the LED chip is a rectangular structure, and the first light-emitting area is a rectangular structure.

[0011] Furthermore, the LED chip is a rectangular structure, and the first light-emitting area is a circular structure.

[0012] Furthermore, it also includes transparent silicone, which fills the side of the LED chip, the reflective white glue and the fluorescent glue to form a space surrounded by it.

[0013] Furthermore, it also includes a lens, which is fixed on the upper side of the substrate and surrounds the LED chip, the reflective white glue and the fluorescent glue.

[0014] Furthermore, the lens is a hemispherical focusing lens.

[0015] Furthermore, the lens is a lens with a smooth surface.

[0016] Furthermore, the fluorescent glue includes a first light conversion region and a second light conversion region, the first light conversion region has the same shape and size as the first light-emitting region, and is located directly above the first light-emitting region, and the portion of the fluorescent glue outside the first light conversion region forms a second light conversion region.

[0017] Furthermore, the substrate is a ceramic substrate.

[0018] Furthermore, an isolation layer is formed between the first light-emitting region and the second light-emitting region.

[0019] Beneficial effects: The utility model provides a packaging structure, in which the second light-emitting area of ​​the LED chip surrounds the first light-emitting area in the center, and the first light-emitting area and the second light-emitting area are connected to different electrodes, and the LED chip is packaged in a reflective structure; when the required light-emitting brightness is lower, only the second light-emitting area can be lit, and the second light-emitting area located in the center has better light concentration and higher reflective light effect in the reflective structure; when the required light-emitting brightness is higher, the first light-emitting area and the second light-emitting area are lit at the same time, which can provide higher brightness. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 Another schematic diagram of the overall structure of the utility model;

[0023] Figure 3 This is a schematic diagram of the top view structure of the LED chip of the utility model;

[0024] Figure 4 This is a schematic diagram of another LED chip structure viewed from above in the present invention.

[0025] Explanation of the accompanying drawings: 1. LED chip; 11. First light-emitting area; 12. Second light-emitting area; 2. Substrate; 3. Reflective white glue; 4. Fluorescent glue; 41. First light conversion area; 42. Second light conversion area; 5. Transparent silicone; 6. Lens. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0027] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0029] A flip-chip LED chip packaging structure with dual light-emitting areas, comprising an LED chip 1, a substrate 2, a reflective white glue 3 and a fluorescent glue 4; a first light-emitting area 11 and a second light-emitting area 12 are formed on the top of the LED chip 1, the first light-emitting area 11 is located at the center of the LED chip 1, and the second light-emitting area 12 surrounds the first light-emitting area 11; an electrode is formed on the bottom of the LED chip 1, the electrode comprises a first positive electrode and a first negative electrode respectively conductively connected to the first light-emitting area 11, and also comprises a second positive electrode and a second negative electrode conductively connected to the second light-emitting area 12; the LED chip 1 is fixed on the upper side of the substrate 2, and the electrodes are fixed to and conductively welded to the pads formed on the upper side of the substrate 2; the reflective white glue 3 is fixed on the upper side of the substrate 2, surrounds the LED chip 1, and is tilted on the inner side to form an inclined surface structure obliquely upward; the fluorescent glue 4 is fixed on the upper side of the LED chip 1, and the edge is connected to the top of the reflective white glue 3.

[0030] The present embodiment provides a packaging structure, in which the second light-emitting area 12 of the LED chip 1 surrounds the first light-emitting area 11 in the center, and the first light-emitting area 11 and the second light-emitting area 12 are connected to different electrodes, and the LED chip 1 is packaged in a reflective structure; when the required light-emitting brightness is lower, only the second light-emitting area 12 can be lit, and the second light-emitting area 12 located in the center has better light concentration and higher reflective light effect in the reflective structure; when the required light-emitting brightness is higher, the first light-emitting area 11 and the second light-emitting area 12 are lit at the same time, which can provide higher brightness.

[0031] Specifically, it also includes transparent silica gel 5, and the transparent silica gel 5 fills the side of the LED chip 1, and the space formed by the reflective white glue 3 and the fluorescent glue 4 is surrounded. As a preferred embodiment of this embodiment, the substrate 2 is a ceramic substrate.

[0032] In some embodiments of the present invention, the LED chip 1 is a rectangular structure, and the first light-emitting area 11 is a rectangular structure. In other embodiments of the present invention, the LED chip 1 is a rectangular structure, and the first light-emitting area 11 is a circular structure. The chip with a circular light-emitting surface cooperates with a circular lens 6 and a circular reflector cup structure, and has a higher light efficiency, a better light spot, and a more uniform light-emitting angle under the same light-emitting area.

[0033] As a further improvement of this embodiment, an isolation layer is formed between the first light-emitting region 11 and the second light-emitting region 12, so that the first light-emitting region 11 and the second light-emitting region 12 are effectively isolated optically and electrically to avoid mutual influence between the two light-emitting regions. As a preferred embodiment of this embodiment, the isolation layer is made of silicon dioxide.

[0034] As a further improvement of this embodiment, a lens 6 is further included, and the lens 6 is fixed on the upper side of the substrate 2 and surrounds the LED chip 1, the reflective white glue 3 and the fluorescent glue 4. Specifically, the lens 6 is a hemispherical focusing lens, and the lens 6 is a lens with a smooth surface, which can provide effective light gathering effect for the LED chip 1.

[0035] In some other embodiments of the utility model, the fluorescent glue 4 includes a first light conversion area 41 and a second light conversion area 42, the first light conversion area 41 is the same shape and size as the first light emitting area 11, and is located directly above the first light emitting area 11, and the portion of the fluorescent glue 4 outside the first light conversion area 41 forms the second light conversion area 42. The light conversion characteristics of the first light conversion area 41 and the second light conversion area 42 are different, so that different color temperatures can be adjusted by adjusting the brightness of the first light emitting area 11 and the second light emitting area 12 respectively; and because the second light emitting area 12 surrounds the first light emitting area 11, a better light mixing effect can be achieved when the two light emitting areas emit light.

[0036] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0037] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A flip-chip LED chip packaging structure with dual light-emitting areas, characterized in that: It comprises an LED chip (1), a substrate (2), a reflective white glue (3) and a fluorescent glue (4); A first light-emitting area (11) and a second light-emitting area (12) are formed on the top of the LED chip (1), wherein the first light-emitting area (11) is located at the center of the LED chip (1), and the second light-emitting area (12) surrounds the first light-emitting area (11); electrodes are formed on the bottom of the LED chip (1), wherein the electrodes include a first positive electrode and a first negative electrode respectively conductively connected to the first light-emitting area (11), and also include a second positive electrode and a second negative electrode conductively connected to the second light-emitting area (12); The LED chip (1) is fixed on the upper side of the substrate (2), and the electrode is fixed to a soldering pad formed on the upper side of the substrate (2) and conductively welded; The reflective white glue (3) is fixed on the upper side of the substrate (2), surrounds the LED chip (1) and is inclined on the inside to form an inclined surface structure facing upward; The fluorescent glue (4) is fixed to the upper side of the LED chip (1), and the edge is connected to the top of the reflective white glue (3).

2. The flip-chip LED chip packaging structure with dual light-emitting areas according to claim 1, characterized in that: The LED chip (1) is a rectangular structure, and the first light-emitting area (11) is a rectangular structure.

3. The flip-chip LED chip packaging structure with dual light-emitting areas according to claim 1, characterized in that: The LED chip (1) is a rectangular structure, and the first light-emitting area (11) is a circular structure.

4. The flip-chip LED chip packaging structure with dual light-emitting areas according to claim 1, characterized in that: It also includes transparent silica gel (5), and the transparent silica gel (5) fills the side of the LED chip (1), the reflective white glue (3) and the fluorescent glue (4) to form a space surrounded by it.

5. The flip-chip LED chip packaging structure with dual light-emitting areas according to claim 1, characterized in that: It also comprises a lens (6), wherein the lens (6) is fixed on the upper side of the substrate (2) and surrounds the LED chip (1), the reflective white glue (3) and the fluorescent glue (4).

6. The flip-chip LED chip packaging structure with dual light-emitting areas according to claim 5, characterized in that: The lens (6) is a hemispherical focusing lens.

7. The flip-chip LED chip packaging structure with dual light-emitting areas according to claim 5, characterized in that: The lens (6) is a lens with a smooth surface.

8. The flip-chip LED chip packaging structure with dual light-emitting areas according to claim 1, characterized in that: The fluorescent glue (4) comprises a first light conversion region (41) and a second light conversion region (42); the first light conversion region (41) is the same shape and size as the first light emitting region (11) and is located directly above the first light emitting region (11); and the portion of the fluorescent glue (4) outside the first light conversion region (41) forms the second light conversion region (42).

9. The flip-chip LED chip packaging structure with dual light-emitting areas according to claim 1, characterized in that: The substrate (2) is a ceramic substrate.

10. The flip-chip LED chip packaging structure with dual light-emitting areas according to claim 1, characterized in that: An isolation layer is formed between the first light-emitting region (11) and the second light-emitting region (12).

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