High heat dissipation gateway

Abstract

The utility model relates to a gateway with high heat dissipation. The gateway comprises a housing; the mainboard is arranged in the shell; the mobile communication module is electrically connected to the mainboard, and the data acquisition module comprises a data receiving module and a data transmission module; the sensor module is electrically connected to the main board and comprises a humidity sensor and a temperature sensor; the heat dissipation module comprises a heat dissipation fan, heat dissipation fins and a heat dissipation shell, the heat dissipation shell is connected with the outer side of the shell, the heat dissipation fins and the heat dissipation fan are arranged in the heat dissipation shell, heat dissipation channels are formed in the heat dissipation fins, the heat dissipation fan is arranged right opposite to the heat dissipation channels, and the heat dissipation fan is electrically connected with the mainboard; and the power supply module is arranged in the shell and is used for supplying power to the mainboard, the mobile communication module, the sensor module and the heat dissipation module. By adopting the structure, the problem that the temperature is too high when the gateway works is solved, and the service life of the gateway is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of gateways, and in particular to a high heat dissipation gateway. Background Art

[0002] A gateway is also called an internetwork connector or protocol converter. A gateway realizes network interconnection above the network layer. It is a complex network interconnection device that is only used for interconnection between two networks with different high-level protocols. A gateway can be used for both wide area network interconnection and local area network interconnection. A gateway is a computer system or device that performs the important task of conversion. In the use of existing gateways, most of them are naturally cooled, but the efficiency of natural cooling is low. Most gateways are set up in multiples and placed together for operation, which makes it easy for the gateway to heat up, resulting in a decrease in the working efficiency and life of the gateway.

[0003] Therefore, there is an urgent need to provide a high heat dissipation gateway to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings and defects of the prior art, provide a high heat dissipation gateway, solve the problem that the temperature of the gateway is too high when working, and increase the working life of the gateway.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A high heat dissipation gateway, characterized by comprising:

[0007] case;

[0008] A mainboard, disposed in the housing;

[0009] A mobile communication module, electrically connected to the mainboard, the mobile communication module comprising a data receiving module and a data transmission module;

[0010] A sensor module, electrically connected to the mainboard, the sensor module comprising a humidity sensor and a temperature sensor, the temperature sensor being used to detect the temperature inside the housing, and the humidity sensor being used to detect the humidity;

[0011] A heat dissipation module, the heat dissipation module comprising a heat dissipation fan, heat dissipation fins and a heat dissipation shell, the heat dissipation shell is connected to the outer side of the housing, the heat dissipation fins and the heat dissipation fan are arranged in the heat dissipation shell, a heat dissipation channel is arranged in the heat dissipation fins, the heat dissipation fan is arranged opposite to the heat dissipation channel, and the heat dissipation fan is electrically connected to the mainboard;

[0012] A power module is disposed in the housing and is used to supply power to the mainboard, the mobile communication module, the sensor module and the heat dissipation module.

[0013] Optionally, the high heat dissipation gateway further includes a storage module, and the storage module is electrically connected to the mainboard.

[0014] Optionally, the storage module is a SIM card, the housing is provided with a SIM card slot for accommodating the SIM card, and the SIM card is connected to the mainboard.

[0015] Optionally, the data transmission module includes a wired output module and a wireless output module, and the wireless output module is a cellular network module.

[0016] Optionally, the high heat dissipation gateway further includes a display device, which is disposed outside the shell, and the mainboard, the mobile communication module, the sensor module and the power module are all electrically connected to the display device.

[0017] Optionally, mounting seats are provided at both ends of the shell.

[0018] Optionally, both the shell and the heat dissipation casing are provided with ventilation holes, and the ventilation holes are provided in multiple groups.

[0019] Optionally, an alarm module is further provided in the shell, and the alarm module includes an alarm light and an alarm, and the alarm light and the alarm are both electrically connected to the power module.

[0020] Optionally, a filter is further provided in the housing and the heat dissipation shell, and the filter covers the vent hole.

[0021] Compared with the prior art, the utility model has the following beneficial effects:

[0022] In the mainboard of the utility model, the mainboard is arranged in the housing, the mobile communication module is electrically connected to the mainboard, the mobile communication module includes a data receiving module and a data transmission module, and the data reception and data transmission between the mainboard and the cloud platform are realized by setting the data receiving module and the data transmission module; the sensor module is electrically connected to the mainboard, and the sensor module includes a humidity sensor and a temperature sensor, which can avoid the influence of humidity or excessive humidity on the life of the gateway; the cooling fan is arranged directly opposite the cooling channel, and the flow and exchange of air are accelerated by the setting of the cooling fan, and the cooling efficiency of the cooling module is further improved, which solves the problem of unstable power of the gateway at high temperature, and can make the gateway work smoothly within a certain temperature range. The power module is responsible for supplying power to the mainboard, the mobile communication module, the sensor module and the cooling module. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the utility model.

[0024] Figure 2 It is a structural schematic diagram of the heat dissipation module.

[0025] Figure 3 It is the overall structural diagram of the utility model.

[0026] The above drawings include the following reference numerals:

[0027] 1. Shell, 2. SIM card slot, 31. Cooling fan, 32. Cooling fins, 33. Cooling shell, 4 vents, 51. Wired interface, 52. Wireless interface, 6. Mounting base. DETAILED DESCRIPTION

[0028] The present invention is further described in detail below in conjunction with embodiments and drawings, but the implementation manner of the present invention is not limited thereto.

[0029] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0031] The technical solution of the utility model proposes a high heat dissipation gateway.

[0032] Reference Figures 1 to 3 , in this embodiment, includes:

[0033] Shell 1;

[0034] A main board is arranged in the housing 1;

[0035] A mobile communication module is electrically connected to the mainboard, and the mobile communication module includes a data receiving module and a data transmission module;

[0036] A sensor module is electrically connected to the mainboard. The sensor module includes a humidity sensor and a temperature sensor. The temperature sensor is used to detect the temperature in the housing 1, and the humidity sensor is used to detect the humidity.

[0037] The heat dissipation module includes a heat dissipation fan 31, heat dissipation fins 32 and a heat dissipation shell 33. The heat dissipation shell 33 is connected to the outer side of the housing 1. The heat dissipation fins 32 and the heat dissipation fan 31 are arranged in the heat dissipation shell 33. The heat dissipation fins 32 are provided with a heat dissipation channel. The heat dissipation fan 31 is arranged opposite to the heat dissipation channel. The heat dissipation fan 31 is electrically connected to the mainboard.

[0038] The power module is arranged in the housing 1 and is used to supply power to the mainboard, the mobile communication module, the sensor module and the heat dissipation module.

[0039] Optionally, in this embodiment, the mainboard is arranged in the housing 1, the mobile communication module is electrically connected to the mainboard, the mobile communication module includes a data receiving module and a data transmission module, the data receiving module can receive data transmitted from other devices, and parse it into a readable format so that the device can understand and process the data, and the data transmission module transmits the received data to the cloud platform. Through the setting of the data receiving module and the data transmission module, data reception and data transmission between the mainboard and the cloud platform are realized; the sensor module is electrically connected to the mainboard, and the sensor module includes a humidity sensor and a temperature sensor, wherein the humidity sensor can detect and monitor the humidity of the environment surrounding the gateway in real time, and can avoid the life of the gateway caused by excessive humidity. The heat dissipation module includes a heat dissipation fan 31, heat dissipation fins 32 and a heat dissipation shell 33, wherein the heat dissipation shell 33 is connected to the outer side of the shell 1, the heat dissipation fins 32 and the heat dissipation fan 31 are both arranged in the heat dissipation shell 33, and the heat dissipation fins 32 are provided with a heat dissipation channel. The heat generated during operation is dissipated through the heat dissipation fins 32 to prevent the mainboard temperature from being too high, causing damage to the device or affecting the working rate; the heat dissipation fan 31 is arranged opposite to the heat dissipation channel, that is, the heat dissipation efficiency of the single heat dissipation fin 32 is not high. Through the arrangement of the heat dissipation fan 31, the flow and exchange of air are accelerated, and the heat dissipation efficiency of the heat dissipation module is further improved, which solves the problem of unstable power of the gateway at high temperature, and can make the gateway work stably within a certain temperature range. The power module is responsible for supplying power to the mainboard, mobile communication module, sensor module and heat dissipation module. In the event of a power outage, the power module can be used to supply power and continue data transmission. The heat dissipation module is electrically connected to the mainboard, that is, the temperature sensor is also electrically connected to the heat dissipation fan 31. The temperature sensor can monitor the surface temperature of the gateway in real time, and when the temperature reaches the highest preset value, the power of the heat dissipation fan 31 is automatically turned on through the mainboard, and when the temperature reaches the lowest preset value, the power of the heat dissipation fan 31 is automatically turned off, that is, the working efficiency of the heat dissipation fan 31 is automatically adjusted according to the temperature of the gateway, which not only plays a role in heat dissipation, but also reduces energy consumption, and solves the problem that the gateway will generate heat during operation, which not only reduces its service life, but also increases the risk of fire.

[0040] In this embodiment, the high heat dissipation gateway also includes a storage module, which is electrically connected to the mainboard, and the storage module is electrically connected to the mobile communication module, so that in the case of network interruption, the transmitted data is saved in the storage module to ensure that the data is not lost, and the transmission is continued after the network is restored. Furthermore, the storage module is a SIM card, and a SIM card slot 2 is provided on the housing 1 to accommodate the SIM card. The SIM card is connected to the mainboard, and the data obtained by the data receiving module is stored in the SIM card. When the network is disconnected, the SIM card can save the data to prevent data loss, and the transmission is continued when the network is connected.

[0041] In this embodiment, the data transmission module includes a wired output module and a wireless output module. A wired interface 51 and a wireless interface 52 are provided on the shell 1, and the wired interface 51 and the wireless interface 52 are both connected to the mainboard. Through the setting of the wired output module and the wireless output module, wired transmission and wireless transmission of data between the mainboard and the cloud platform are realized; the wireless output module is a cellular network module, such as a 4G communication module or a 5G communication module. The cellular network module is stable and convenient. A 4G / 5G interface is provided on the wireless output module, which facilitates data transmission and conversion, and facilitates the use of the gateway outdoors without broadband.

[0042] In this embodiment, the high heat dissipation gateway also includes a display device, which is arranged on the outside of the shell 1, wherein the mainboard, mobile communication module, sensor module and power module are all electrically connected to the display device, and the display device is used to display the temperature, humidity, power supply and working status of the mainboard, so that people can monitor the working status of the gateway through the display device, which is convenient for maintenance and replacement.

[0043] In this embodiment, mounting seats 6 are provided at both ends of the shell 1. The setting of the mounting seats 6 facilitates the installation and fixation of the gateway. Furthermore, vent holes 4 are provided on the shell 1 and the heat dissipation shell 33, and the vent holes 4 are provided in multiple groups. Through the setting of the vent holes 4, the air in the shell 1 can be exchanged with the outside world, thereby improving the heat dissipation efficiency.

[0044] In this embodiment, an alarm module is also provided in the shell 1, which includes an alarm light and an alarm, and the alarm and the alarm light are electrically connected to the power module. When in use, when the temperature in the network management is too high or abnormal, the alarm and the alarm light will give an alarm prompt to remind people to take action to prevent damage to the gateway or fire caused by excessive temperature.

[0045] In this embodiment, a filter is further provided in the shell 1 and the heat dissipation housing 33, and the filter covers the vent 4. The setting of the filter prevents external dust from entering the shell 1 and the heat dissipation module, resulting in a decrease in heat dissipation efficiency and affecting the normal operation of the gateway. People can replace the filter regularly to prevent dust from clogging the filter.

[0046] The above-mentioned embodiments only express the implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A high heat dissipation gateway, characterized in that: include: case; A mainboard, disposed in the housing; A mobile communication module, electrically connected to the mainboard, the mobile communication module comprising a data receiving module and a data transmission module; A sensor module, electrically connected to the mainboard, the sensor module comprising a humidity sensor and a temperature sensor, the temperature sensor being used to detect the temperature inside the housing, and the humidity sensor being used to detect the humidity; A heat dissipation module, the heat dissipation module comprising a heat dissipation fan, heat dissipation fins and a heat dissipation shell, the heat dissipation shell is connected to the outer side of the housing, the heat dissipation fins and the heat dissipation fan are arranged in the heat dissipation shell, a heat dissipation channel is arranged in the heat dissipation fins, the heat dissipation fan is arranged opposite to the heat dissipation channel, and the heat dissipation fan is electrically connected to the mainboard; A power module is disposed in the housing and is used to supply power to the mainboard, the mobile communication module, the sensor module and the heat dissipation module.

2. A high heat dissipation gateway according to claim 1, characterized in that: The high heat dissipation gateway further includes a storage module, and the storage module is electrically connected to the mainboard.

3. A high heat dissipation gateway according to claim 2, characterized in that: The storage module is a SIM card. The housing is provided with a SIM card slot for accommodating the SIM card. The SIM card is connected to the mainboard.

4. The high heat dissipation gateway according to claim 1, characterized in that: The data transmission module includes a wired output module and a wireless output module, and the wireless output module is a cellular network module.

5. The high heat dissipation gateway according to claim 1, characterized in that: The high heat dissipation gateway further includes a display device, which is disposed outside the housing, and the mainboard, the mobile communication module, the sensor module and the power module are all electrically connected to the display device.

6. The high heat dissipation gateway according to claim 1, characterized in that: Mounting seats are arranged at both ends of the shell.

7. The high heat dissipation gateway according to claim 1, characterized in that: The shell and the heat dissipation housing are both provided with ventilation holes, and the ventilation holes are provided in multiple groups.

8. The high heat dissipation gateway according to claim 1, characterized in that: An alarm module is also arranged in the shell, and the alarm module includes an alarm light and an alarm, and both the alarm light and the alarm are electrically connected to the power module.

9. The high heat dissipation gateway according to claim 7, characterized in that: A filter screen is also arranged inside the shell and the heat dissipation casing, and the filter screen covers the vent hole.

Images