High-thermal-conductivity PCB (printed circuit board)

Abstract

The utility model relates to the technical field of electronic products, in particular to a high-thermal-conductivity PCB (printed circuit board), which comprises a substrate and a base, the lower end of the substrate is fixedly connected with an insulating heat-conducting layer, a heat-conducting fin is fixedly connected inside the lower end of the substrate, the lower end of the heat-conducting fin penetrates through the insulating heat-conducting layer, and the insulating heat-conducting layer is fixedly connected with the base. According to the utility model, through the arrangement of the insulation heat conduction layer, heat conduction processing can be carried out on the bottom surface of the PCB, and insulation protection processing can be carried out on the bottom surface of the PCB, so that the heat conduction effect of the PCB is improved, and the service life of the PCB is prolonged. And heat in the PCB can be quickly conducted out under the action of the arranged heat conducting fins, and the heat conducted out by the heat conducting fins can be quickly dissipated under the rotation action of the heat dissipation fan, so that the heat cannot be remained in the PCB to cause heat loss of the PCB, and the heat conducting performance of the PCB is improved.

Description

Technical Field

[0001] The utility model relates to a high thermal conductivity PCB circuit board, belonging to the technical field of electronic products. Background Art

[0002] PCB circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing, it is called a printed circuit board. The printed circuit board consists of an insulating base plate, connecting wires and pads for assembling and welding electronic components. It has the dual functions of a conductive line and an insulating base plate. It can replace complex wiring and realize electrical connection between components in the circuit. It not only simplifies the assembly and welding of electronic products, reduces the wiring workload under traditional methods, and greatly reduces the labor intensity of workers, but also reduces the size of the whole machine, reduces product costs, and improves the quality and reliability of electronic equipment.

[0003] During use, the existing PCB circuit board has an overall packaging setting for the PCB circuit board, and then only relies on the surface of the PCB circuit board itself for heat dissipation effect, poor thermal conductivity, and easy damage to electronic components, reducing the service life of the PCB circuit board; and when the PCB circuit board is in the chassis, the heat dissipation effect is poor, and the temperature continues to rise during operation, making it difficult to quickly conduct heat and dissipate heat on the PCB circuit board itself, affecting the safe operation of electronic equipment. Utility Model Content

[0004] The purpose of the utility model is to provide a high thermal conductivity PCB circuit board to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A high thermal conductivity PCB circuit board comprises a substrate and a base, wherein the lower end of the substrate is fixedly connected to an insulating heat-conducting layer, the lower end of the substrate is fixedly connected to a heat-conducting fin, the lower end of the heat-conducting fin penetrates the insulating heat-conducting layer, the interior of the insulating heat-conducting layer is sealed and connected to a curved cooling pipe, the front and rear ends of the insulating heat-conducting layer are fixedly connected to connecting end plates, the middle positions of the outer ends of the connecting end plates are sealed and connected to liquid guide terminals, the liquid guide terminals are sealed and connected to the curved cooling pipe, and the outer end surface of the connecting end plate is slidably connected to the base.

[0007] Furthermore, the middle position of the base is open-type, a heat pipe is fixedly connected to the middle side wall of the base, and a heat dissipation fan is fixedly connected to the inner side of the heat pipe.

[0008] Furthermore, a liquid injection groove is provided inside the base, a liquid pump is sealedly connected to the right side of the front end of the base, a liquid pump is sealedly connected to the rear end of the liquid pump, and the liquid pump is sealedly connected to the base.

[0009] Furthermore, the inner rear end of the base is sealed and connected with a return pipe.

[0010] Furthermore, the front end of the liquid suction pump and the rear end of the reflux pipe are both sealedly connected with a liquid guiding hose, the outer end of the liquid guiding hose is sealedly connected with a connecting pipe sleeve, and the connecting pipe sleeve is set to a rubber material.

[0011] Furthermore, the upper sides of the front and rear ends of the base are both spirally connected with limit bolts, and the limit bolts are spirally connected to the connecting end plates.

[0012] Furthermore, the insulating heat-conducting layer is made of heat-conducting silicone rubber.

[0013] Furthermore, a polyimide film is attached to the surface of the heat conducting fin.

[0014] The beneficial effects of the utility model are:

[0015] The utility model can not only conduct heat to the bottom surface of the PCB circuit board by setting the insulating heat-conducting layer, but also conduct insulation protection treatment to the bottom surface of the PCB circuit board, and can quickly conduct the heat inside the PCB circuit board through the function of the provided heat-conducting fins, and can quickly dissipate the heat conducted by the heat-conducting fins under the rotation of the heat dissipation fan, so that the heat will not be retained inside the PCB circuit board and cause heat loss of the circuit board, thereby improving the thermal conductivity of the PCB circuit board. The utility model can cover the outer side of the liquid guide end at the front and rear ends by using the function of the connecting pipe sleeve, and can inject the coolant in the liquid injection tank into the curved cooling pipe through the liquid guide hose through the liquid suction pipe through the liquid suction pump, so that the heat in the insulating heat-conducting layer can be quickly conducted to ensure the rapid dissipation of the conducted heat, and the coolant can enter the liquid injection tank again through the function of the reflux pipe, and the coolant that absorbs the heat can be heat exchanged through the function of the provided heat-conducting pipe, and has the effect of cooling the coolant under the rotation of the heat dissipation fan, thereby improving the overall heat conduction and heat dissipation effect of the device on the PCB circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the specific embodiments of the present invention and do not constitute a limitation to the present invention.

[0017] Figure 1 This is a front view of a high thermal conductivity PCB circuit board of the utility model;

[0018] Figure 2 The utility model is a high thermal conductivity PCB circuit board Figure 1 The enlarged view of point A in the middle;

[0019] Figure 3 This is a side view of a high thermal conductivity PCB circuit board of the utility model;

[0020] Figure 4 This is a schematic diagram of the overall structure of a high thermal conductivity PCB circuit board of the utility model;

[0021] Numbers in the figure: 1. Base plate; 2. Insulating heat-conducting layer; 3. Heat-conducting fins; 4. Bended cooling pipe; 5. Connecting end plate; 6. Liquid-conducting terminal; 7. Base; 8. Heat-conducting pipe; 9. Cooling fan; 10. Liquid injection tank; 11. Liquid extraction pump; 12. Liquid extraction pipe; 13. Reflux pipe; 14. Liquid-conducting hose; 15. Connecting pipe sleeve; 16. Limiting bolt. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Example 1 Please refer to Figure 1-Figure 4 , the utility model provides a technical solution:

[0024] A high thermal conductivity PCB circuit board comprises a substrate 1 and a base 7, wherein an insulating heat-conducting layer 2 is fixedly connected to the lower end of the substrate 1, a heat-conducting fin 3 is fixedly connected to the lower end of the substrate 1, the lower end of the heat-conducting fin 3 penetrates the insulating heat-conducting layer 2, the middle position of the base 7 is open, a heat-conducting pipe 8 is fixedly connected to the middle side wall of the base 7, a heat-dissipating fan 9 is fixedly connected to the inner side of the heat-conducting pipe 8, the insulating heat-conducting layer 2 is made of heat-conducting silicone rubber, and a polyimide film is attached to the surface of the heat-conducting fin 3. Through the function of the insulating heat-conducting layer 2, not only the bottom surface of the PCB circuit board can be heat-conducted, but also the bottom surface of the PCB circuit board can be insulated and protected, and the internal heat of the PCB circuit board can be quickly exported through the function of the arranged heat-conducting fin 3, and the heat exported by the heat-conducting fin 3 can be quickly dissipated under the rotation of the heat-dissipating fan 9, so that the heat will not be retained in the PCB circuit board to cause heat loss of the circuit board, thereby improving the thermal conductivity of the PCB circuit board.

[0025] Specifically, Figure 1 and Figure 2As shown, the upper sides of the front and rear ends of the base 7 are both spirally connected with limit bolts 16, and the limit bolts 16 are spirally connected to the connecting end plate 5. Through the action of the limit bolts 16, the substrate 1 can be fixedly installed on the upper end of the base 7, so that the device can be connected and used as a whole.

[0026] Example 2 Please refer to Figure 1-Figure 4 The difference between this embodiment and embodiment 1 is that: the interior of the insulating heat-conducting layer 2 is sealed and connected with a curved cooling pipe 4, the front and rear ends of the insulating heat-conducting layer 2 are fixedly connected with a connecting end plate 5, the middle position of the outer end of the connecting end plate 5 is sealed and connected with a liquid guide end 6, the liquid guide end 6 is sealed and connected to the curved cooling pipe 4, the outer end surface of the connecting end plate 5 is slidably connected with a base 7, a liquid injection groove 10 is provided inside the base 7, a liquid pump 11 is sealed and connected to the right side of the front end of the base 7, a liquid pump 11 is sealed and connected to a liquid suction pipe 12 at the rear end of the liquid pump 11, the liquid suction pipe 12 is sealed and connected to the base 7, the inner rear end of the base 7 is sealed and connected with a return pipe 13, the front end of the liquid pump 11 and the rear end of the return pipe 13 are sealed and connected with a liquid guide hose 14, the liquid guide hose 14 The outer end is sealed and connected with a connecting sleeve 15, which is made of rubber material. The connecting sleeve 15 can be covered on the outside of the liquid guide end 6 at the front and rear ends, and the coolant in the liquid injection tank 10 can be injected into the curved cooling tube 4 through the liquid guide hose 14 through the liquid pump 11 through the liquid pumping tube 12, so that the heat in the insulating heat-conducting layer 2 can be quickly extracted to ensure the rapid dissipation of the extracted heat, and the coolant can enter the liquid injection tank 10 again through the reflux pipe 13, and the coolant that absorbs heat can be heat exchanged through the provided heat-conducting pipe 8, and the coolant has the effect of cooling down under the rotation of the heat dissipation fan 9, thereby improving the overall heat conduction and heat dissipation effect of the device on the PCB circuit board.

[0027] Working principle of the utility model: when the device is in use, it is powered by the internal power supply of the electronic device. When the PCB circuit board is in use, the insulating heat-conducting layer 2 can not only conduct heat to the bottom surface of the PCB circuit board, but also insulate and protect the bottom surface of the PCB circuit board. The heat inside the PCB circuit board can be quickly guided out through the provided heat-conducting fins 3. Under the rotation of the heat-dissipating fan 9, the heat guided out by the heat-conducting fins 3 can be quickly dissipated, so that the heat will not be retained inside the PCB circuit board to cause heat loss of the circuit board, thereby improving the thermal conductivity of the PCB circuit board. The connecting pipe sleeve 15 is used to The function of the device is to cover the outer side of the liquid guide end 6 at the front and rear ends, and through the function of the liquid pump 11, the coolant in the liquid injection tank 10 can be injected into the curved cooling tube 4 through the liquid guide hose 14 through the liquid suction pipe 12, so that the heat in the insulating heat-conducting layer 2 can be quickly extracted to ensure the rapid dissipation of the extracted heat, and through the function of the reflux pipe 13, the coolant can enter the liquid injection tank 10 again, and through the function of the set heat-conducting pipe 8, the coolant that absorbs heat can be heat exchanged, and under the rotation of the heat dissipation fan 9, the coolant has the effect of cooling down, thereby improving the overall heat conduction and heat dissipation effect of the device on the PCB circuit board.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high thermal conductivity PCB circuit board, comprising a substrate (1) and a base (7), Features: The lower end of the substrate (1) is fixedly connected to an insulating heat-conducting layer (2), the lower end of the substrate (1) is fixedly connected to a heat-conducting fin (3), the lower end of the heat-conducting fin (3) penetrates the insulating heat-conducting layer (2), the interior of the insulating heat-conducting layer (2) is sealedly connected to a curved cooling pipe (4), the front and rear ends of the insulating heat-conducting layer (2) are fixedly connected to a connecting end plate (5), the middle position of the outer end of the connecting end plate (5) is sealedly connected to a liquid guide end (6), the liquid guide end (6) is sealedly connected to the curved cooling pipe (4), and the outer end surface of the connecting end plate (5) is slidably connected to a base (7).

2. A high thermal conductivity PCB circuit board according to claim 1, Features: The middle position of the base (7) is open-type, a heat conducting pipe (8) is fixedly connected to the middle side wall of the base (7), and a heat dissipation fan (9) is fixedly connected to the inner side of the heat conducting pipe (8).

3. A high thermal conductivity PCB circuit board according to claim 1, Features: A liquid injection groove (10) is provided inside the base (7); a liquid extraction pump (11) is sealedly connected to the right side of the front end of the base (7); a liquid extraction pipe (12) is sealedly connected to the rear end of the liquid extraction pump (11); and the liquid extraction pipe (12) is sealedly connected to the base (7).

4. A high thermal conductivity PCB circuit board according to claim 3, Features: The inner rear end of the base (7) is sealedly connected with a return pipe (13).

5. A high thermal conductivity PCB circuit board according to claim 4, Features: The front end of the liquid pump (11) and the rear end of the return pipe (13) are both sealedly connected to a liquid guiding hose (14), and the outer end of the liquid guiding hose (14) is sealedly connected to a connecting pipe sleeve (15), and the connecting pipe sleeve (15) is set to be made of rubber material.

6. A high thermal conductivity PCB circuit board according to claim 1, Features: The upper sides of the front and rear ends of the base (7) are both screw-connected with limit clamps (16), and the limit clamps (16) are screw-connected to the connecting end plate (5).

7. A high thermal conductivity PCB circuit board according to claim 1, Features: The insulating heat-conducting layer (2) is made of heat-conducting silicone rubber material.

8. A high thermal conductivity PCB circuit board according to claim 1, Features: A polyimide film is attached to the surface of the heat-conducting fin (3).

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