Substrate structure and filter
The glass substrate structure with electrode plates and conductive coils addresses high-voltage resistance issues in filters by reducing substrate loss and increasing breakdown field strength, improving signal integrity and isolation performance.
Patent Information
- Application Number
- CN202420930162.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-29
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-04-29
AI Technical Summary
Traditional filters face challenges with poor high-voltage resistance due to material limitations of insulating substrates, leading to reduced isolation voltage and increased substrate loss, which affects signal transmission quality.
A substrate structure comprising glass substrates with electrode plates and conductive coils, where the capacitor is formed by opposing electrode plates connected in series or parallel with the conductive coil, utilizing glass substrates with high resistivity and low dielectric constant to reduce substrate loss and enhance isolation performance.
The glass substrate structure improves high-voltage resistance and signal integrity by reducing substrate parasitic capacitance and increasing breakdown field strength, enhancing the filter's isolation performance.
Smart Images
Figure CN222216049U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of electronic technology, and in particular to a substrate structure and a filter. Background Art
[0002] A filter is a frequency-selective device that allows specific frequencies in a signal to pass through while greatly attenuating other frequency components. It can filter out interfering noise or perform spectrum analysis.
[0003] Filters have different designs according to their applications and types. The most common ones are mechanical filters and electrical filters. Mechanical filters are composed of mechanical arrays, mechanical coupling elements and electromechanical transducers, which can prevent the transmission of mechanical vibrations on Line 4. The most common electrical filter is the RC filter, which is composed of inductors, capacitors and other electronic components and can filter out harmonics of specific frequencies.
[0004] Capacitors can achieve advantages such as higher data rates, higher signal integrity and noise immunity. However, due to material limitations, the insulating substrate of the capacitor is difficult to achieve a higher isolation voltage, which leads to poor high-voltage resistance of the resonator. At the same time, the larger the volume of the filter, the larger the size of its internal inductors, capacitors and other components will be, which may also affect the frequency characteristics of the filter. For example, larger inductors and capacitors may cause the filter's cutoff frequency to decrease, thereby affecting the aluminum foil effect and reducing the signal transmission quality. Utility Model Content
[0005] The present application aims to provide a filter to improve the high voltage resistance performance of the filter.
[0006] According to a first aspect of the present application, the present application provides a substrate structure, comprising:
[0007] A first substrate, comprising a first glass substrate, and a first electrode plate and a first conductive coil disposed on the first glass substrate in the same layer;
[0008] The second substrate includes a second glass substrate and a second electrode plate disposed on the second glass substrate, wherein the second substrate is stacked with the first substrate, and the second electrode plate is opposite to the first electrode plate, wherein:
[0009] The capacitor formed by the first electrode plate and the second electrode plate is connected in series or in parallel with the first conductive coil.
[0010] As a further filtering solution provided in the present application, the first conductive coil is arranged on the periphery of the first pole plate, and the first conductive coil has an inner end and an outer end, the inner end is connected to the first pole plate, and the outer end and the second pole plate are used to connect to an external circuit.
[0011] As a further filtering solution provided in the present application, a through hole is provided on the first glass substrate, a connecting wire is provided in the through hole, one end of the connecting wire is connected to the second electrode plate, and the other end of the connecting wire is used to connect to an external circuit.
[0012] As a further filtering solution provided in the present application, the first conductive coil is arranged on the periphery of the first pole plate, and the first conductive coil has an inner end and an outer end, the inner end is connected to the first pole plate, and the outer end is connected to the second pole plate.
[0013] As a further filtering solution provided in the present application, a through hole is provided on the first glass substrate, a connecting wire is provided in the through hole, one end of the connecting wire is connected to the second electrode plate, and the other end of the connecting wire is used to connect to the external end.
[0014] As a further filtering solution provided in the present application, the second electrode plate is located on a side of the second glass substrate that is opposite to or away from the first glass substrate.
[0015] As a further filtering solution provided in the present application, the second substrate further includes a second conductive coil, the second conductive coil is arranged in the same layer as the second electrode plate, and the second conductive coil is connected in series or in parallel with the capacitor.
[0016] According to a second aspect of the present application, the present application provides a substrate structure, including:
[0017] A first substrate, comprising a first glass substrate, and a first electrode plate and a first conductive coil disposed on the first glass substrate;
[0018] The second substrate includes a second glass substrate and a second electrode plate disposed on the second glass substrate, wherein the second substrate is stacked with the first substrate, and the second electrode plate is opposite to the first electrode plate, wherein:
[0019] The capacitor formed by the first electrode plate and the second electrode plate is connected in series or in parallel with the first conductive coil.
[0020] As a further solution of the substrate structure provided in this application,
[0021] The first glass substrate comprises a first surface and a second surface opposite to each other, the first conductive coil is located on the first surface, the second electrode plate is located on the second surface, and the first conductive coil is arranged at the periphery of the projection area of the first electrode plate on the first surface;
[0022] The second glass substrate includes a third surface, the second electrode plate is arranged on the third surface, and the second electrode plate is embedded in the inner circle of the first conductive coil.
[0023] As a further solution of the substrate structure provided in the present application, the thickness of the second pole plate is equal to the thickness of the first conductive coil.
[0024] According to a second aspect of the present application, the present application also provides a filter, comprising the substrate structure described in any one of the above items.
[0025] According to the filter of the above embodiment, the first glass substrate or the second glass substrate or the first glass substrate and the second glass substrate are used as the substrate of the capacitor formed by the first plate and the second plate. Glass is used as the material of the substrate, which not only has insulating properties, but also has a larger resistivity and a smaller dielectric constant, and can reduce the substrate loss and the substrate parasitic capacitance, thereby greatly improving the isolation performance of the capacitor. At the same time, the thickness of the first glass substrate and / or the second glass substrate as the substrate is in the order of millimeters, and has a larger breakdown field strength. Compared with substrates made of other insulating materials, it can effectively improve the high voltage resistance performance of the filter. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 The cross section of the substrate structure provided by the utility model Figure 1 ;
[0027] Figure 2 The cross section of the substrate structure provided by the utility model Figure 2 ;
[0028] Figure 3 The cross section of the substrate structure provided by the utility model Figure 3 ;
[0029] Figure 4 The cross section of the substrate structure provided by the utility model Figure 4 ;
[0030] Figure 5 The cross section of the substrate structure provided by the utility model Figure 5 ;
[0031] Figure 6 The cross section of the substrate structure provided by the utility model Figure 6 ;
[0032] Figure 7 The connection relationship diagram of the filter provided by the utility model is shown in FIG. Figure 1 ;
[0033] Figure 8 The connection relationship diagram of the filter provided by the utility model is shown in FIG. Figure 2 ;
[0034] Fig. 9 A front view schematic diagram of the filter provided by the utility model;
[0035] Fig.10 This is a schematic diagram of the back side of the filter provided by the utility model. DETAILED DESCRIPTION
[0036] The present application is further described in detail below by specific embodiments in conjunction with the accompanying drawings. Wherein similar elements in different embodiments adopt associated similar element numbers. In the following embodiments, many detailed descriptions are intended to enable the present application to be better understood. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, and methods. In some cases, some operations related to the present application are not shown or described in the specification, in order to avoid the core part of the present application being overwhelmed by too much description, and for those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.
[0037] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various implementations, and the operation steps involved in each embodiment can also be replaced or adjusted in a sequence in a manner that is obvious to those skilled in the art. Therefore, the specification and drawings are only for the purpose of clearly describing a certain embodiment and do not mean that the composition and / or sequence are necessary.
[0038] The serial numbers of the components in this document, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings).
[0039] Electronic filters use components such as inductors and capacitors in circuits to produce resonance. When the natural frequencies of the inductors and capacitors match, resonance occurs. The insulating substrate of capacitors in traditional filters is limited by material limitations, making it difficult to achieve a high isolation voltage, resulting in poor high-voltage resistance of the filter.
[0040] Embodiment 1
[0041] See also Figure 1-Figure 3 ,and Figure 7-Figure 10 As shown, the substrate structure provided in this embodiment includes: a first substrate 100 and a second substrate 200, and the first substrate 100 and the second substrate 200 are stacked. The substrate structure can be applied to a filter or a resonator, and the filter is taken as an example in this embodiment. The substrate structure can be a part of the filter, for example, the filter can also have other passive components, such as resistors, other inductors or other capacitors, etc.; the substrate structure can also be the main structural part of the filter.
[0042] The first substrate 100 includes a first glass substrate 10 , a first electrode plate 30 and a first conductive coil 50 , wherein the first electrode plate 30 and the first conductive coil 50 are disposed on the first glass substrate 10 in the same layer.
[0043] The second substrate 200 includes a second glass substrate 20 and a second electrode plate 40 disposed on the second glass substrate 20. The second electrode plate 40 is positioned opposite to the first electrode plate 30. In other words, along the stacking direction of the first substrate 100 and the second substrate 200, a projection area formed by projecting the second electrode plate 40 onto the position of the first electrode plate 30 overlaps with an area occupied by the first electrode plate 30 on the first glass substrate 10.
[0044] The first glass substrate 10 and the second glass substrate 20 are stacked on each other. The first glass substrate 10 and the second glass substrate 20 can be one of alkali-free glass, aluminosilicate glass, and soda glass, and the thickness is usually not greater than 0.7 mm. The first glass substrate 10 and the second glass substrate 20 can be made by cutting, for example.
[0045] In this embodiment, the first electrode plate 30 can be arranged on a side of the first glass substrate 10 facing or facing away from the second glass substrate 20, and the second electrode plate 40 can be arranged on a side of the second glass substrate 20 facing or facing away from the first glass substrate 10, so that at least the first glass substrate 10 (such as Figure 1 , Figure 4 As shown), or a second glass substrate 20 is provided between the first electrode plate 30 and the second electrode plate 40 (as shown Figure 2 Alternatively, a first glass substrate 10 and a second glass substrate 20 may be stacked between the first electrode plate 30 and the second electrode plate 40 (as shown in FIG. Figure 3 shown).
[0046] The first electrode plate 30 and the second electrode plate 40 disposed opposite to each other form a capacitor, which is connected in series or in parallel with the first conductive coil 50 to form a filter. The first glass substrate 10, or the second glass substrate 20, or the stacked first glass substrate 10 and the second glass substrate 20 form the substrate of the capacitor.
[0047] The first glass substrate 10, or the second glass substrate 20, or the stacked first glass substrate 10 and the second glass substrate 20 as the substrate of the capacitor has certain insulation performance, and can also provide a larger resistivity and a smaller dielectric constant, which can greatly reduce the substrate loss and the substrate parasitic capacitance, thereby greatly improving the isolation performance of the capacitor. At the same time, the thickness of the first glass substrate 10, or the second glass substrate 20, or the stacked first glass substrate 10 and the second glass substrate 20 as the substrate is in the order of millimeters or micrometers. In this embodiment, the thickness of the first glass substrate 10, or the second glass substrate 20, or the stacked first glass substrate 10 and the second glass substrate 20 can be between 10 micrometers and 5 millimeters, with a larger breakdown field strength, and compared with substrates made of other insulating materials, it can effectively improve the high voltage resistance performance of the filter.
[0048] In this embodiment, the first electrode plate 30 is prepared on the first glass substrate 10 by deposition or other chemical preparation processes, and the second electrode plate 40 is prepared on the second glass substrate 20 by deposition or other chemical preparation processes.
[0049] The first conductive coil 50 is disposed around the first electrode plate 30 and has an inner end 51 and an outer end 52 , wherein the inner end 51 is connected to the first electrode plate 30 , and the outer end 52 and the second electrode plate 40 are used to connect to an external circuit.
[0050] In this embodiment, the line width of the inductor coil may be in the range of 10-50 microns, and the distance (line spacing) between the centers of two adjacent coils may be in the range of 10-100 microns. In this way, the inductor coil has good electrical performance.
[0051] like Figure 7 As shown, the first pole of the external circuit U is connected to the external terminal 52, and the second pole of the external circuit U is connected to the second pole plate 40, thereby forming a series connection form.
[0052] It can be understood that when the inner end 51 is electrically connected to the first electrode plate 30, the outer end 52 and the second electrode plate 40 are connected to the first electrode and the second electrode of the external circuit U respectively. Figure 5 As shown, the inner end 51 is electrically connected to the first electrode plate 30, the outer end 52 is connected to the first electrode of the power source U, and the second electrode plate 40 is connected to the second electrode of the power source U, wherein the first electrode of the power source U can be the positive electrode of the power source, and the second electrode can be the negative electrode of the power source, thereby forming a series connection form, and the first electrode plate 30 and the second electrode plate 40 form a capacitor.
[0053] like Figure 1 and Figure 4 , Figure 5As shown, the first electrode plate 30 is disposed on one side of the first glass substrate 10, and the second electrode plate 40 is disposed on the side of the second glass substrate 20 facing the first glass substrate 10, and the first glass substrate 10 and the second glass substrate 20 are isolated by the second electrode plate 40. Figure 2 As shown, the first electrode plate 30 is arranged on the side of the first glass substrate 10 facing the second glass substrate 20, and the second electrode plate 40 is arranged on the side of the second glass substrate facing away from the first glass substrate 10. The first glass substrate 10 and the second glass substrate 20 are isolated by the second electrode plate 40. Figure 3 As shown, the first electrode plate 30 is arranged on one side of the first glass substrate 10, the second electrode plate 40 is arranged on the side of the second glass substrate 20 facing away from the first glass substrate 10, and the first glass substrate 10 is stacked with the second glass substrate 20. In this way, the first glass substrate 10 or the stacked first glass substrate 10 and second glass substrate 20 form a substrate of a capacitor.
[0054] like Figure 5 As shown, the inner end 51 is connected to the first electrode plate 30 , the outer end 52 is electrically connected to the positive electrode of the power source U through the resistor R, and the second electrode plate 40 is electrically connected to the negative electrode of the power source U.
[0055] In the above embodiment, the first glass substrate 10 is provided with a through hole 11 , and a connecting wire 70 is provided in the through hole 11 . One end of the connecting wire 70 is connected to the second electrode plate 40 , and the other end of the connecting wire 70 is used to connect to the external circuit U.
[0056] In one embodiment of the present application, the filter provided in this embodiment further includes: a connecting pin 60, which is connected to the first electrode plate 30 or the second electrode plate 40, and the connecting pin 60 is used to connect to an external circuit.
[0057] In this embodiment, the connecting pins 60 are disposed on one side or the other side of the first glass substrate 10 , or disposed on one side or the other side of the second glass substrate 20 , thereby saving the space for disposing the connecting pins 60 .
[0058] In a specific embodiment, the connecting pin 70 is arranged on a side of the first glass substrate 10 facing toward or facing away from the second glass substrate 20, and / or the connecting wire 70 is arranged on a side of the second glass substrate 20 facing toward or facing away from the first glass substrate 10. The connecting pin 70 is arranged on a side of the first glass substrate 10 facing away from the second glass substrate 20. The first glass substrate 10 is provided with a through hole 11, and the second glass substrate 20 is provided with a threading hole 21. The connecting wire 70 is passed through the through hole 11 and / or the threading hole 21, and one end of the connecting wire 70 is connected to the second electrode plate 40, and the other end of the connecting wire 70 is connected to the connecting pin 60. Figure 1 As shown, the connecting wire 70 is passed through the through hole 11. Figure 2-Figure 4As shown, the connecting wire 70 is passed through the through hole 11 and the threading hole 21. Figure 1-Figure 4 As shown, the connecting wire 70 is connected to the second electrode plate 40. The connecting pin 60 is arranged on the side of the first glass substrate 10 facing away from or towards the second glass substrate 20, and / or, is arranged on the side of the second glass substrate 20 facing away from or towards the first glass substrate 10. Figure 1-Figure 4 As shown, the connecting pins 60 are arranged on a side of the first glass substrate 10 facing away from the second glass substrate 20 to save component arrangement space.
[0059] In another embodiment of the present application, Figure 8 As shown, the first conductive coil 50 is arranged on the periphery of the first pole plate 30, and the first conductive coil 50 has an inner end 51 and an outer end 52, wherein the inner end 51 is connected to the first pole plate 30 and connected to the first pole of the external circuit U, and the outer end 52 is connected to the second pole plate 40 and connected to the second pole of the external circuit U, thus forming a parallel connection form.
[0060] Similarly, for the parallel connection form, a through hole 11 is provided on the first glass substrate 10, and a connecting wire 70 is provided in the through hole 11. One end of the connecting wire 70 is connected to the second electrode plate 40 and is connected to the first pole of the external circuit U. The other end of the connecting wire 70 is used to connect to the outer end 52 of the first conductive coil 50 and is connected to the second pole of the external circuit 70, thereby forming a parallel connection form.
[0061] like Figure 4 As shown, in the present application, the second substrate 200 also includes a second conductive coil 80, and the second conductive coil 80 is arranged on the second glass substrate 20 in the same layer as the second electrode plate 40. Similarly, the first electrode plate 30 and the second electrode plate 40 form a capacitor, and the second conductive coil 80 is used to be connected in series or in parallel with the capacitor.
[0062] In a specific embodiment, the first electrode plate 30 can also be arranged on the side of the first glass substrate 10 facing or facing away from the second glass substrate 20, and the second electrode plate 40 can also be arranged on the side of the second glass substrate 20 facing or facing away from the first glass substrate 10, so that the first glass substrate 10 can be arranged between the first electrode plate 30 and the second electrode plate 40, or the second glass substrate 20 can be arranged, or the first glass substrate 10 and the second glass substrate can be stacked. Figure 4 Only the case where the first glass substrate 10 is disposed between the first electrode plate 30 and the second electrode plate 40 is shown.
[0063] The other structures of arranging the second conductive coil 80 on the second substrate 200 are the same as those of arranging only the first conductive coil 50 on the first substrate 100 in the above embodiment, and the details can be referred to the above embodiment.
[0064] In practical applications, in order to improve the safety of the product, the filter provided in this embodiment also includes: a first insulating layer and a second insulating layer, the first insulating layer covers the first electrode plate 30, and the second insulating layer covers the second electrode plate 40, so as to protect the first electrode plate 30 and the second electrode plate 40 respectively through the first insulating layer and the second insulating layer.
[0065] In a preferred embodiment, the first insulating layer and the second insulating layer may be silicon oxide, silicon nitride, or a stack of silicon oxide and silicon nitride.
[0066] In this embodiment, the first conductive coil 50 is disposed on a side of the first glass substrate 10 facing toward or facing away from the second glass substrate 20, and the second conductive coil 80 is disposed on a side of the second glass substrate 20 facing toward or facing away from the first glass substrate 10. Specifically, the first conductive coil 50 is disposed on a side of the first glass substrate 10 facing away from the second glass substrate 20, so that the first conductive coil 50 surrounds the periphery of the first electrode plate 30, and similarly, the second conductive coil 80 is disposed on the periphery of the second electrode plate 40, which can save the space for the first conductive coil 40 and the first electrode plate 30 and the second conductive coil 80 and the second electrode plate 40, making the product structure more compact.
[0067] Embodiment 2
[0068] See also Figure 5-Figure 10 As shown, the filter provided in this embodiment includes: a first substrate 100 and a second substrate 200, and the first substrate 100 and the second substrate 200 are stacked.
[0069] The first substrate 100 includes a first glass substrate 10, a first electrode plate 30 and a first conductive coil 50, wherein the first electrode plate 30 and the first conductive coil 50 are arranged on the first glass substrate 10 in different layers. In other words, the first electrode plate 30 and the first conductive coil 50 are respectively arranged on two opposite surfaces of the first glass substrate 10. In a preferred embodiment, the first glass substrate 10 is a plate-like structure, and the first electrode plate 30 and the first conductive coil 50 are respectively arranged on two opposite surfaces of the first glass substrate 10 of the plate-like structure.
[0070] The second substrate 200 includes a second glass substrate 20 and a second electrode plate 40 disposed on the second glass substrate 20. The second electrode plate 40 is positioned opposite to the first electrode plate 30. In other words, along the stacking direction of the first substrate 100 and the second substrate 200, a projection area formed by projecting the second electrode plate 40 onto the position of the first electrode plate 30 overlaps with an area occupied by the first electrode plate 30 on the first glass substrate 10.
[0071] The first glass substrate 10 and the second glass substrate 20 are stacked on each other. The first glass substrate 10 and the second glass substrate 20 can be one of alkali-free glass, aluminosilicate glass, and soda glass, and the thickness is usually not greater than 0.7 mm. The first glass substrate 10 and the second glass substrate 20 can be made by cutting, for example.
[0072] In this embodiment, the first electrode plate 30 and the first conductive coil 50 are respectively arranged on opposite surfaces of the first glass substrate 10, and the second electrode plate 40 is arranged on a side of the second glass substrate 20 facing toward or facing away from the first glass substrate 10, so that at least the first glass substrate 10, or the second glass substrate 20, or the stacked first glass substrate 10 and second glass substrate 20 are arranged between the first electrode plate 30 and the second electrode plate 40.
[0073] The first electrode plate 30 and the second electrode plate 40 disposed opposite to each other form a capacitor, which is connected in series or in parallel with the first conductive coil to form a filter. The first glass substrate 10, or the second glass substrate 20, or the stacked first glass substrate 10 and the second glass substrate 20 form the substrate of the capacitor.
[0074] The first glass substrate 10, or the second glass substrate 20, or the stacked first glass substrate 10 and the second glass substrate 20 as the substrate of the capacitor has certain insulation performance, and can also provide a larger resistivity and a smaller dielectric constant, which can greatly reduce the substrate loss and the substrate parasitic capacitance, thereby greatly improving the isolation performance of the capacitor. At the same time, the thickness of the first glass substrate 10, or the second glass substrate 20, or the stacked first glass substrate 10 and the second glass substrate 20 as the substrate is in the millimeter range. In this embodiment, the thickness of the first glass substrate 10, or the second glass substrate 20, or the stacked first glass substrate 10 and the second glass substrate 20 can be between 10 microns and 5 millimeters, with a larger breakdown field strength, and compared with substrates made of other insulating materials, it can effectively improve the high voltage resistance performance of the filter.
[0075] The first conductive coil 50 is disposed around the first electrode plate 30 and has an inner end 51 and an outer end 52 , wherein the inner end 51 is connected to the first electrode plate 30 , and the outer end 52 and the second electrode plate 40 are used to connect to an external circuit.
[0076] like Figure 7 As shown, the first pole of the external circuit U is connected to the external terminal 52, and the second pole of the external circuit U is connected to the second pole plate 40, thereby forming a series connection form.
[0077] It can be understood that when the inner end 51 is electrically connected to the first electrode plate 30, the outer end 52 and the second electrode plate 40 are connected to the first electrode and the second electrode of the external circuit U respectively. Figure 5As shown, the inner end 51 is electrically connected to the first electrode plate 30, the outer end 52 is connected to the first electrode of the power source U, and the second electrode plate 40 is connected to the second electrode of the power source U, wherein the first electrode of the power source U can be the positive electrode of the power source, and the second electrode can be the negative electrode of the power source, thereby forming a series connection form, and the first electrode plate 30 and the second electrode plate 40 form a capacitor.
[0078] The inner end 51 is connected to the first electrode plate 30 , the outer end 52 is electrically connected to the positive electrode of the power source U through the resistor R, and the second electrode plate 40 is electrically connected to the negative electrode of the power source U.
[0079] In the above embodiment, the first glass substrate 10 is provided with a through hole 11 , and a connecting wire 70 is provided in the through hole 11 . One end of the connecting wire 70 is connected to the second electrode plate 40 , and the other end of the connecting wire 70 is used to connect to the external circuit U.
[0080] In one embodiment of the present application, the filter provided in this embodiment further includes: a connecting pin 60, which is connected to the first electrode plate 30 or the second electrode plate 40, and the connecting pin 60 is used to connect to an external circuit.
[0081] In this embodiment, the connecting pins 60 are disposed on one side or the other side of the first glass substrate 10 , or disposed on one side or the other side of the second glass substrate 20 , thereby saving the space for disposing the connecting pins 60 .
[0082] In a specific embodiment, the connecting pin 70 is arranged on a side of the first glass substrate 10 facing or facing away from the second glass substrate 20, and / or, the connecting wire 70 is arranged on a side of the second glass substrate 20 facing or facing away from the first glass substrate 10. The connecting pin 70 is arranged on a side of the first glass substrate 10 facing away from the second glass substrate 20. The first glass substrate 10 is provided with a through hole 11, and the second glass substrate 20 is provided with a threading hole 21. The connecting wire 70 is passed through the through hole 11 and / or the threading hole 21, and one end of the connecting wire 70 is connected to the second electrode plate 40, and the other end of the connecting wire 70 is connected to the connecting pin 60. The connecting wire 70 is passed through the through hole 11, or the connecting wire 70 is passed through the through hole 11 and the threading hole 21, and is connected to the second electrode plate 40. The connecting pin 60 is arranged on a side of the first glass substrate 10 facing away from or facing the second glass substrate 20, and / or, on a side of the second glass substrate 20 facing away from or facing the first glass substrate 10. The connecting pins 60 are disposed on a side of the first glass substrate 10 facing away from the second glass substrate 20 to save component placement space.
[0083] In another embodiment of the present application, Figure 8As shown, the first conductive coil 50 has an inner end 51 and an outer end 52, wherein the inner end 51 is connected to the first pole plate 30 and connected to the first pole of the external circuit U, and the outer end 52 is connected to the second pole plate 40 and connected to the second pole of the external circuit U, thus forming a parallel connection form.
[0084] In this embodiment, the first electrode plate 30 is prepared on the first glass substrate by deposition or other chemical preparation processes, and the second electrode plate 40 is prepared on the second glass substrate by deposition or other chemical preparation processes.
[0085] The first conductive coil 50 has an inner end 51 and an outer end 52 , wherein the inner end 51 is electrically connected to the first electrode plate 30 , and the outer end 52 is electrically connected to the second electrode plate 40 .
[0086] Combination Figure 8 As shown, the inner end 51 is connected to the first electrode plate 30 through a resistor R and connected to the first pole of the power source U, and the outer end 52 is connected to the second electrode plate 40 and connected to the second pole of the power source U, wherein the first pole of the power source U can be the positive pole of the power source, and the second pole can be the negative pole of the power source, so that the first electrode plate 30 and the second electrode plate 40 form a capacitor.
[0087] like Figure 5 and Figure 6 As shown, the first glass substrate 10 includes a first surface 12 and a second surface 13 opposite to each other, the first conductive coil 50 is located on the first surface 12, the first electrode plate 30 is located on the second surface 13, and the first conductive coil 50 is arranged at the periphery of the projection area of the first electrode plate 30 on the first surface 12. The second glass substrate 20 includes a third surface 21, and the second electrode plate 40 is arranged on the third surface 21.
[0088] In this embodiment, the third surface 21 is the side of the second glass substrate 20 facing the first glass substrate 10 . In other words, the third surface 21 and the first surface 12 are two opposite surfaces. Thus, the second electrode plate 40 is embedded in the inner circle of the first conductive coil 50 .
[0089] like Figure 5 and Figure 6 As shown, the first conductive coil 50 is disposed on the first surface 12 of the first glass substrate 10, the first electrode plate 30 is disposed on the second surface 13 of the first glass substrate 10, and the second electrode plate 40 is disposed on the third surface 21 of the second glass substrate 20, and the third surface 21 is opposite to the first surface 12, so that the first glass substrate 10 and the second glass substrate 20 are isolated by the second electrode plate 40. In this way, the first glass substrate 10 is formed as a substrate of a capacitor.
[0090] In one embodiment of the present application, the distance between the two plates of the capacitor will affect the capacitance value of the capacitor, according to the capacitor formula C=εA / d, where C is the capacitance value, ε is the dielectric constant of the medium, A is the area of the two plates, and d is the distance between the two plates. When the distance d increases, the capacitance value C will decrease, and vice versa. Regarding the filtering performance of the filter, the performance of the filter depends largely on the parameters of its capacitance and inductance components. If the capacitance value changes, the cutoff frequency and filtering characteristics of the filter will also be affected. According to the cutoff frequency formula: f_c=1 / (2π√(LC)), where L is the inductance value and C is the capacitance value. When the capacitance value decreases, the cutoff frequency will increase, and vice versa. Therefore, in this embodiment, the thickness of the second plate 40 is equal to the thickness of the first conductive coil 50 to reduce the spacing between the two plates, thereby increasing the capacitance value.
[0091] The first glass substrate 10, as the substrate of the capacitor, has certain insulation properties and can also provide a larger resistivity and a smaller dielectric constant, which can reduce the substrate loss and the substrate parasitic capacitance, thereby greatly improving the isolation performance of the capacitor. At the same time, the first glass substrate 10, as the substrate, has a thickness of the millimeter level and has a large breakdown field strength. Compared with substrates made of other insulating materials, it can effectively improve the high voltage resistance performance of the filter.
[0092] like Figure 7 As shown, the inner end 51 is connected to the first electrode plate 30 , the outer end 52 is electrically connected to the positive electrode of the power source U through the resistor R, and the second electrode plate 40 is electrically connected to the negative electrode of the power source U.
[0093] In practical applications, in order to improve the safety of the product, the filter provided in this embodiment also includes: a first insulating layer and a second insulating layer, the first insulating layer covers the first electrode plate 30, and the second insulating layer covers the second electrode plate 40, so as to protect the first electrode plate 30 and the second electrode plate 40 respectively through the first insulating layer and the second insulating layer.
[0094] In a preferred embodiment, the first insulating layer and the second insulating layer may be silicon oxide, silicon nitride, or a stack of silicon oxide and silicon nitride.
[0095] In summary, the filter provided by the present application uses the first glass substrate or the second glass substrate or the first glass substrate and the second glass substrate as the substrate of the capacitor formed by the first plate and the second plate, and uses glass as the material of the substrate, which not only has insulating properties, but also has a larger resistivity and a smaller dielectric constant, and can reduce the substrate loss and the substrate parasitic capacitance, thereby greatly improving the isolation performance of the capacitor. At the same time, the thickness of the first glass substrate and / or the second glass substrate as the substrate is in the millimeter range, and has a large breakdown field strength. Compared with substrates made of other insulating materials, it can effectively improve the high voltage resistance of the filter.
[0096] The above specific examples are used to illustrate the present invention, which are only used to help understand the present invention and are not intended to limit the present invention. For those skilled in the art of the present invention, some simple deductions, deformations or substitutions can be made based on the idea of the present invention.
Claims
1. A substrate structure, characterized in that: include: A first substrate, comprising a first glass substrate, and a first electrode plate and a first conductive coil disposed on the first glass substrate in the same layer; The second substrate includes a second glass substrate and a second electrode plate disposed on the second glass substrate, wherein the second substrate is stacked with the first substrate, and the second electrode plate is opposite to the first electrode plate, wherein: The capacitor formed by the first electrode plate and the second electrode plate is connected in series or in parallel with the first conductive coil.
2. The substrate structure according to claim 1, characterized in that: The first conductive coil is arranged on the periphery of the first electrode plate. The first conductive coil has an inner end and an outer end. The inner end is connected to the first electrode plate, and the outer end and the second electrode plate are used to connect to an external circuit.
3. The substrate structure according to claim 2, characterized in that: A through hole is provided on the first glass substrate, a connecting wire is provided in the through hole, one end of the connecting wire is connected to the second electrode plate, and the other end of the connecting wire is used to connect to an external circuit.
4. The substrate structure according to claim 1, characterized in that: The first conductive coil is arranged on the periphery of the first electrode plate. The first conductive coil has an inner end and an outer end. The inner end is connected to the first electrode plate, and the outer end is connected to the second electrode plate.
5. The substrate structure according to claim 4, characterized in that: A through hole is provided on the first glass lining plate. A connecting wire is provided in the through hole. One end of the connecting wire is connected to the second electrode plate, and the other end of the connecting wire is used to connect to the outer end.
6. The substrate structure according to claim 1, characterized in that: The second electrode plate is located on a side of the second glass substrate that is opposite to or away from the first glass substrate.
7. The substrate structure according to claim 1, characterized in that: The second substrate further includes a second conductive coil, which is disposed on the same layer as the second electrode plate, and the second conductive coil is connected in series or in parallel with the capacitor.
8. A substrate structure, characterized in that: include: A first substrate, comprising a first glass substrate, and a first electrode plate and a first conductive coil disposed on the first glass substrate; The second substrate includes a second glass substrate and a second electrode plate disposed on the second glass substrate, wherein the second substrate is stacked with the first substrate, and the second electrode plate is opposite to the first electrode plate, wherein: The capacitor formed by the first electrode plate and the second electrode plate is connected in series or in parallel with the first conductive coil.
9. The substrate structure according to claim 8, characterized in that: The first glass substrate comprises a first surface and a second surface opposite to each other, the first conductive coil is located on the first surface, the first electrode plate is located on the second surface, and the first conductive coil is arranged at the periphery of the projection area of the first electrode plate on the first surface; The second glass substrate includes a third surface, the second electrode plate is arranged on the third surface, and the second electrode plate is embedded in the inner circle of the first conductive coil.
10. A filter, comprising the substrate structure according to any one of claims 1 to 9.