Energy storage device with heat management module and energy storage system

Abstract

The embodiment of the utility model provides an energy storage device with a heat management module and an energy storage system, the energy storage device comprises a cabinet body, the heat management module and a sealing gasket, the cabinet body comprises a partition plate connected to the side wall of the cabinet body, the partition plate is provided with a through hole, and the partition plate is used for supporting the heat management module; the heat management module comprises a bottom face and a pipe opening protruding out of the bottom face, the bottom face faces the partition plate in the height direction of the cabinet body, the sealing gasket is arranged between the partition plate and the bottom face, the sealing gasket is provided with a through hole, and the pipe opening penetrates through the through hole of the sealing gasket and the through hole of the partition plate and is used for being connected with a pipeline in the lower cavity. According to the heat management module, in the installation process of the heat management module, the supporting feet support the parts, the pipe openings penetrate through the partition plates to be pressed against the bosses, meanwhile, sufficient supporting force can be provided for the heat management module through contact, other auxiliary tools or hoisting equipment do not need to be added, and installation and maintenance are easy. A rubber sealing gasket is additionally arranged at a pipe opening of the heat management module. When the pipe opening penetrates through the partition plate, the sealing gasket and the partition plate boss form self-sealing.

Description

Technical Field

[0001] The present application relates to the technical field of energy storage equipment, and in particular to an energy storage device and an energy storage system having a thermal management module. Background Art

[0002] The energy storage device in the related art includes a cabinet body, a battery module, electrical components and a thermal management module located in the cabinet body. The thermal management module is usually hung on the inner wall of the cabinet body. Since the thermal management module has multiple nozzles, there is a risk of leakage. In the energy storage device in the related art, when the thermal management module leaks, it is easy to cause electrical ignition in the gaseous electrical components, causing damage to the electrical components or even burning. Utility Model Content

[0003] Embodiments of the present application provide an energy storage device and an energy storage system having a thermal management module to reduce the probability of electrical sparks occurring in other electrical components when the thermal management module leaks.

[0004] In a first aspect, an embodiment of the present application provides an energy storage device with a thermal management module, the energy storage device comprising a cabinet, a thermal management module and a sealing gasket, the thermal management module being used to dissipate heat within the energy storage device, the cabinet comprising a partition connected to a side wall of the cabinet, the partition dividing the internal space of the cabinet into an upper chamber and a lower chamber arranged along a height direction of the cabinet, the partition being provided with a through hole, the through hole connecting the upper chamber and the lower chamber, the thermal management module being located in the upper chamber, the partition being used to support the thermal management module; the thermal management module comprising a bottom surface and a pipe opening protruding from the bottom surface, the bottom surface facing the partition along a height direction of the cabinet, the sealing gasket being arranged between the partition and the bottom surface, the sealing gasket being provided with a through hole, the pipe opening passing through the through hole of the sealing gasket and the through hole of the partition, and being used to connect with a pipeline in the lower chamber.

[0005] In this embodiment, due to the provision of the partition, not only is the upper chamber where the thermal management module is placed separated from other spaces of the cabinet, so as to prevent other electrical components from being electrically sparked when the thermal management module leaks, causing damage or fire. Moreover, since the sealing gasket is provided between the partition and the bottom surface of the thermal management module, and the through hole of the sealing gasket is also surrounded on the outside of the pipe mouth, the thermal management module is pressed on the sealing gasket located on the partition by the bottom surface of the thermal management module, so that the sealing gasket is clamped between the partition and the bottom surface of the thermal management module, thereby ensuring the sealing performance of the periphery of the opening of the through hole of the partition toward the upper chamber, and further ensuring the sealing performance between the inner side wall of the through hole of the partition and the outer side wall of the pipe mouth. Moreover, since the sealing gasket is directly provided on the bottom surface of the partition and the thermal management module, it is pressed by the gravity of the thermal management module, so that it has a self-sealing effect, and the assembly method is simple.

[0006] In addition, for the radial sealing method in which a sealing ring is provided between the outer wall of the pipe mouth and the inner wall of the through hole of the partition, it is not only necessary to open a groove for placing the sealing ring in the outer wall of the pipe mouth in advance, but also the assembly precision is required to be sufficiently accurate, because when the assembly is not accurate, the force on some parts of the sealing ring is small, and the problem of poor sealing will occur. Compared with radial sealing, the sealing gasket in this embodiment is located at the periphery of the opening of the through hole of the partition, rather than inside the inner wall of the through hole of the partition, and the pressure is applied to the sealing gasket by the gravity of the thermal management module, so the precision requirement is relatively low, and even if the assembly error is large, it will not affect the sealing performance of the sealing gasket, thereby reducing the difficulty of processing and effectively improving the sealing performance and sealing stability.

[0007] In some embodiments, the surface of the partition is provided with a protruding boss facing the upper chamber along the height direction of the cabinet, the boss is arranged around the pipe mouth, and the sealing gasket is located between the surface of the boss facing the upper chamber and the bottom surface of the thermal management module. In this embodiment, since the surface of the boss facing the upper chamber supports the bottom surface of the thermal management module, the upper surface of the partition and the bottom surface of the thermal management module can be spaced apart, and the force used to support the thermal management module is concentrated on the bottom surface of the thermal management module and the surface of the boss facing the upper chamber. Since the area of ​​the surface of the boss facing the upper chamber is smaller than the area of ​​the upper surface of the partition, when the gravity of the thermal management module remains unchanged, the smaller the surface used to support the thermal management module, the greater the pressure on the surface, so that the sealing gasket located on the surface of the boss facing the upper chamber can be subjected to greater pressure, thereby improving the sealing performance between the surface of the boss facing the upper chamber and the bottom surface of the thermal management module.

[0008] In some embodiments, the sealing gasket includes an outer peripheral edge and an inner peripheral edge, and along the height direction of the cabinet, the projection of the surface of the boss facing the upper chamber on the sealing gasket is entirely located between the outer peripheral edge and the inner peripheral edge of the sealing gasket. In this embodiment, since along the height direction of the cabinet, the projection of the surface of the boss facing the upper chamber on the sealing gasket is entirely located between the outer peripheral edge and the inner peripheral edge of the sealing gasket, when the surface of the boss facing the upper chamber applies pressure to the sealing gasket, the sealing gasket can be concave, forming a labyrinth-shaped sealing structure, so as to improve the sealing performance.

[0009] In some embodiments, the diameter of the through hole of the sealing gasket is smaller than the diameter of the outer wall of the end of the pipe opening facing the bottom surface of the thermal management module, that is, the inner wall of the through hole of the sealing gasket is attached to the outer wall of the pipe opening. In this embodiment, since the diameter of the through hole of the sealing gasket is smaller than the diameter of the outer wall of the end of the pipe opening facing the bottom surface of the thermal management module. Therefore, when the sealing gasket is pressed between the bottom surface of the thermal management module and the surface of the boss facing the upper chamber, the surface of the sealing gasket facing the bottom surface of the thermal management module contacts the bottom surface of the thermal management module, and the through hole is sleeved on the outer wall of the end of the pipe opening connected to the bottom surface of the thermal management module, and the diameter of the through hole of the sealing gasket is smaller than the diameter of the outer wall of the end of the pipe opening facing the bottom surface of the thermal management module, so that the outer wall of the pipe opening can squeeze the sealing gasket in the radial direction of the pipe opening, so that part of the sealing gasket is squeezed between the side of the boss and the outer wall of the pipe opening, and thus the sealing performance between the surface of the boss facing the upper chamber and the outer wall of the pipe opening can be effectively improved.

[0010] In some embodiments, the thermal management module further includes a support leg protruding from the bottom surface, and the surface of the support leg facing the partition is arranged on the surface of the partition facing the upper chamber. In this embodiment, since the support leg is placed on the partition, the support leg can support the thermal management module. With the support of the partition on the support leg, the thermal management module can be conveniently assembled and connected to the side wall of the cabinet without the need for a third-party lifting tool, thereby reducing the difficulty of assembling the thermal management module.

[0011] In some embodiments, the thermal management module further comprises a support leg protruding from the bottom surface, and the surface of the support leg facing the partition is arranged on the surface of the partition facing the upper chamber. In this embodiment, the manufacturing tolerance of the support leg and the partition can be eliminated by the rubber pad to improve the assembly accuracy between the thermal management module and the partition.

[0012] In some embodiments, the nozzle of the thermal management module is used to circulate liquid cooling medium. In this embodiment, since the nozzle of the thermal management module is used to circulate liquid cooling medium, liquid leakage can be prevented by effectively sealing the nozzle and the through hole.

[0013] In some embodiments, the multi-way valve includes a support plate and a pipe port protruding from a surface of the support plate facing the partition, and the surface of the support plate facing the partition is the bottom surface of the thermal management module. In this embodiment, since the pipe port is part of the multi-way valve, it is convenient to connect other components on the thermal management module through the multi-way valve.

[0014] In some embodiments, the water channel substrate includes a bottom surface facing the partition and a side surface facing the side wall of the cabinet, and the refrigerant substrate and the multi-way valve are connected to the side surface of the water channel substrate. In this embodiment, since the refrigerant substrate and the multi-way valve are connected to the side surface of the water channel substrate, and the side surface of the water channel substrate faces the side wall of the cabinet, the water channel substrate is placed in this way, which can effectively improve the space utilization rate in the height direction of the upper chamber. In addition, the support plate supports the thermal management module, and no third-party lifting tools are required. The thermal management module can be easily assembled and connected to the side wall of the cabinet, which reduces the difficulty of assembling the thermal management module.

[0015] In some embodiments, the thermal management module further includes a load-bearing member connected to the side of the water channel substrate, and the load-bearing member is used to connect to the side wall of the cabinet. In this embodiment, the load-bearing member is connected to the side wall of the cabinet, and the load-bearing member supports the thermal management module, which can also reduce the stress on the partition and increase the service life of the partition.

[0016] In some embodiments, the cabinet includes a storage compartment and a liquid cooling compartment, the storage compartment is used to accommodate battery modules and power converters, the liquid cooling compartment is arranged on the inner side wall of the cabinet door of the cabinet, the storage compartment is located on the side of the liquid cooling compartment away from the cabinet door of the cabinet, the partition separates the liquid cooling compartment into the upper chamber and the lower chamber arranged along the height direction of the cabinet, the lower chamber is used to accommodate an air-liquid heat exchanger and a fan, and the pipe mouth is used to connect the pipeline connected to the air-liquid heat exchanger. In this embodiment, the air-liquid heat exchanger in the lower chamber can dissipate heat for the electrical components of the electrical compartment, and the pipe mouth is connected to the air-liquid heat exchanger to facilitate heat exchange with the liquid cooling medium in the air-liquid heat exchanger, and the storage compartment and the liquid cooling compartment are separately arranged, so that the thermal management module, air-liquid heat exchanger, fan and battery module can be reasonably arranged, so that the space utilization in the cabinet is more reasonable. In addition, the liquid cooling chamber is arranged on the inner wall of the cabinet door, that is, on the side of the cabinet door facing the internal space of the cabinet, and the accommodating chamber is located on the side of the liquid cooling chamber away from the cabinet door, and the thermal management module, air-liquid heat exchanger, and fan of the liquid cooling unit are arranged in the liquid cooling chamber on the inner wall of the cabinet door. In this way, the unused space between the inner wall of the cabinet door and the battery module in the accommodating chamber can be fully utilized, and there is no need to set up an independent space in the cabinet for installing the liquid cooling unit, that is, there is no need to occupy the space in the cabinet for installing battery modules and electrical components, thereby improving the energy density of the energy storage device.

[0017] In a second aspect, an embodiment of the present application provides an energy storage system, comprising a power converter and an energy storage device as described in any one of the first aspects above, wherein the power converter is connected to the energy storage device to perform power conversion on a current input to the energy storage device or output from the energy storage device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0019] Figure 1 An application scenario diagram of an energy storage system provided in an embodiment of the present application;

[0020] Figure 2 A schematic diagram of the structure of an energy storage device provided in an embodiment of the present application;

[0021] Figure 3 for Figure 2 A schematic diagram of the structure of a liquid cooling chamber of an energy storage device;

[0022] Figure 4 for Figure 3 A local enlarged schematic diagram of the middle A;

[0023] Figure 5 for Figure 2 A schematic diagram of the structure of a thermal management module of an energy storage device;

[0024] Figure 6 for Figure 2 A partial enlarged schematic diagram of a thermal management module of an energy storage device;

[0025] Figure 7 for Figure 2 A partial cross-sectional view of the pipe opening of the energy storage device and the through hole assembly portion of the partition;

[0026] Figure 8 for Figure 2 A schematic diagram of a structure in which the pipe opening of the energy storage device passes through the through hole of the partition plate and is connected to the pipeline of the lower chamber;

[0027] Fig. 9 for Figure 2 A partial cross-sectional view of the assembly portion between the legs and the partition of the thermal management module of the energy storage device. Description of the drawings:

[0029] X, length direction of cabinet; Z, height direction of cabinet; 1000, energy storage system; 1, energy storage device; 2, power converter; 10, cabinet; 101, storage compartment; 102, liquid cooling compartment; 103, battery compartment; 104, upper chamber; 105, lower chamber; 106, electrical compartment; 11, shell; 14, partition; 141, upper surface of partition; 142, through hole of partition; 143, groove; 15, cabinet door; 16, boss; 161, upper surface of boss; 162, inner side of boss; 163, through hole of boss; 20, battery module; 21, battery cluster; 25, power converter; 31, air-liquid heat exchanger; 32, Fan; 40, thermal management module; 41, pipe mouth; 411, outer wall of the pipe mouth; 42, water channel substrate; 421, bottom surface of water channel substrate; 422, side surface of water channel substrate; 43, refrigerant substrate; 441, pump; 442, multi-way valve; 445, evaporation plate exchanger; 446, condensation plate exchanger; 447, coolant tank; 448, heater; 449, dehumidifier; 45, support plate; 451, bottom surface of support plate; 46, support foot; 461, contact surface; 51, pipeline of lower chamber; 60, sealing gasket; 601, through hole of sealing gasket; 61, outer peripheral edge; 62, inner peripheral edge; 70, rubber pad; 701, groove of rubber pad. DETAILED DESCRIPTION

[0030] The following first explains some terms involved in the embodiments of the present application.

[0031] The terms "first", "second", "third", "fourth", etc. in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0032] In this specification, the terms "perpendicular", "parallel", etc. are explained.

[0033] Vertical: The verticality defined in this application is not limited to an absolute vertical intersection relationship (angle of 90 degrees). It allows for non-absolute vertical intersection relationships caused by factors such as assembly tolerance, design tolerance, and influence of structural flatness. It also allows for errors in a small angle range. For example, the assembly error range of 80 to 100 degrees can be understood as a vertical relationship.

[0034] Parallelism: The parallelism defined in this application is not limited to absolute parallelism. This definition of parallelism can be understood as basic parallelism, which allows for situations where the absolute parallelism is not caused by factors such as assembly tolerance, design tolerance, and influence of structural flatness. These situations will lead to the sliding fitting part and the first door panel not being absolutely parallel, but this application also defines this situation as parallelism.

[0035] Figure 1 An application scenario diagram of an energy storage system 1000 provided in an embodiment of the present application, wherein: Figure 1 The energy storage system 1000 is shown in three scenarios: applied on the power supply side, the distribution side and the user side.

[0036] Reference Figure 1 The energy storage system 1000 includes an energy storage device 1 and a power converter 2. The energy storage device 1 is connected to the power converter 2. The energy storage device is used to store electric energy. The power converter 2 is used to perform power conversion on the current input to the energy storage device 1 or the current output from the energy storage device 1.

[0037] Among them, the energy storage system 1000 can be used on the power supply side, the distribution side and the user side. For example, the energy storage system 1000 on the power supply side provides storage and output management for the electric energy output by the DC source, the energy storage system 1000 on the distribution side provides intelligent load management for the transmission and distribution side, and the energy storage system 1000 on the user side provides users with peak shaving and valley filling mode and stable power quality management.

[0038] For example, the energy storage system is a photovoltaic energy storage system located on the power supply side. The photovoltaic energy storage system includes photovoltaic (PV) panels and photovoltaic inverters (that is, the power converter 2 mentioned above) and energy storage devices. Photovoltaic panels convert solar energy into electrical energy. Since photovoltaic panels generate direct current, it is necessary to convert direct current into alternating current through photovoltaic inverters to facilitate the transmission and utilization of electricity.

[0039] The photovoltaic energy storage system may also include a thermal management system, which cools the battery cluster, photovoltaic inverter, etc. of the energy storage device through a coolant. The thermal management system includes a thermal management module, which will be described in detail later.

[0040] Figure 2 The schematic diagram of the structure of an energy storage device 1 provided in the embodiment of the present application. The energy storage device 1 in this embodiment can be applied not only to Figure 1 The energy storage system 1000 in the embodiment may also be applied to other systems or devices that require the use of the energy storage device 1 , such as applying the energy storage device 1 to a data center.

[0041] The energy storage device 1 includes a cabinet 10, a battery module 20, electrical components and a liquid cooling unit. The battery module 20, electrical components and the liquid cooling unit are arranged in the cabinet 10. The liquid cooling unit is used to dissipate heat and cool the battery module 20 and the electrical components through a coolant.

[0042] In some embodiments, the cabinet 10 includes an outer shell 11 and a cabinet door 15 . The outer shell 11 and the cabinet door 15 are enclosed so that the cabinet 10 has an internal space.

[0043] In some embodiments, the housing 11 and the cabinet door 15 are connected via a hinge structure.

[0044] The housing 11 includes a top wall, a bottom wall, and side walls connected between the top wall and the bottom wall.

[0045] Specifically, the internal space of the cabinet 10 is divided into a plurality of chambers, and the battery module 20, the electrical components and the liquid cooling unit can be placed in the same or different chambers.

[0046] In some embodiments, the internal space of the cabinet 10 includes a storage compartment 101 and a liquid cooling compartment 102 . The storage compartment 101 is used to place the battery module 20 and electrical components, and the liquid cooling compartment 102 is used to install components of the liquid cooling unit.

[0047] In some embodiments, the liquid cooling bin 102 is disposed on the inner wall of the cabinet door 15 of the cabinet 10, that is, on the side of the cabinet door 15 facing the internal space of the cabinet 10, the accommodating bin 101 is located on the side of the liquid cooling bin 102 away from the cabinet door 15 of the cabinet 10, and the liquid cooling unit is disposed in the liquid cooling bin 102 on the inner wall of the cabinet door 15. In this way, the unused space between the inner wall of the cabinet door 15 and the battery module 20 in the accommodating bin 101 can be fully utilized, and there is no need to provide an independent space in the cabinet 10 for installing the liquid cooling unit, that is, there is no need to occupy the space in the cabinet 10 for installing the battery module 20 and electrical components, thereby improving the energy density of the energy storage device 1.

[0048] In some embodiments, the cabinet 10 is substantially in the shape of a rectangular parallelepiped. It is understandable that in some other embodiments, the cabinet 10 may also be in other prism shapes.

[0049] In some embodiments, the battery module 20 includes a plurality of battery clusters 21 .

[0050] In some embodiments, the plurality of battery clusters 21 each include a plurality of stacked battery packs, and the height of the battery pack is smaller than its width and length when the battery pack is in a rectangular shape. It is understood that the shape of the battery pack may also be cylindrical or cubic, or may be other shapes.

[0051] The multiple stacked battery packs each include multiple battery cells (not shown in the figure).

[0052] In some embodiments, the electrical components include a battery cluster management unit (Cell monitor Unit, CMU), a battery pack control unit (Battery Control Unit, BCU) for pipeline control of the battery pack, a power converter 25, etc.

[0053] A plurality of battery clusters 21 and a power converter 25 are placed in the accommodation compartment 101 .

[0054] In some embodiments, the storage compartment 101 is further divided into a battery compartment 103 and an electrical compartment 106 . The battery compartment 103 is used to accommodate a plurality of stacked battery packs, and the electrical compartment 106 is used to accommodate the power converter 25 .

[0055] In some embodiments, the liquid cooling unit includes a thermal management module 40 (as shown below): Figure 5 ), air-liquid heat exchanger 31 (as follows Figure 3 ) and fan 32 (as follows Figure 3 ), the thermal management module 40 is used to dissipate heat and cool the battery module 20 and electrical components, the air-to-liquid heat exchanger 31 is connected to the thermal management module 40, and heat exchange between the thermal management module 40 and the air-to-liquid heat exchanger 31 is realized, and the fan 32 is used to make the gas for heat exchange with the air-to-liquid heat exchanger 31 flow.

[0056] The thermal management module 40 , the air-to-liquid heat exchanger 31 and the fan 32 are all disposed in the liquid cooling chamber 102 .

[0057] Figure 3 for Figure 2 A schematic structural diagram of the liquid cooling chamber 102 of the energy storage device 1; Figure 4 for Figure 3 A local enlarged schematic diagram of point A in the middle.

[0058] Reference Figure 3 In some embodiments, the cabinet 10 further includes a partition 14, which is connected to the side wall of the cabinet 10. The partition 14 divides the internal space of the cabinet 10 into an upper chamber 104 and a lower chamber 105 arranged along the height direction Z of the cabinet 10. The partition 14 is located between the upper chamber 104 and the lower chamber 105.

[0059] It should be noted that the partition 14 can be used to divide the entire internal space of the cabinet 10 into an upper chamber 104 and a lower chamber 105 , and the partition 14 can also be used to divide a portion of the space of the cabinet 10 , such as the liquid cooling compartment 102 in the internal space, into an upper chamber 104 and a lower chamber 105 .

[0060] For example, in some embodiments, the partition 14 divides the liquid cooling chamber 102 into an upper chamber 104 and a lower chamber 105 arranged along the height direction Z of the cabinet 10, the thermal management module 40 is located in the upper chamber 104, and the air-liquid heat exchanger 31 and the fan 32 are located in the lower chamber 105. The separation of the upper chamber 104 and the lower chamber 105 can effectively prevent the fan 32 and other components in the lower chamber 105 from electrically igniting when the thermal management module 40 in the upper chamber 104 leaks, and can also effectively prevent the thermal management module 40 from leaking and flowing to the electrical chamber 106 through the lower chamber 105, thereby causing electrical ignition to the electrical components in the electrical chamber 106.

[0061] In some embodiments, the upper chamber 104 is relatively sealed relative to the lower chamber 105 or other internal spaces of the cabinet 10, thereby preventing the fan in the lower chamber 105 or the electrical components in the electrical compartment 106 from igniting electrical sparks when the thermal management module 40 in the upper chamber 104 leaks.

[0062] In some embodiments, the upper chamber 104 is provided with a door panel. The upper chamber 104 can be opened or closed by the door panel to facilitate maintenance of the thermal management module 40 of the upper chamber 104. Of course, the lower chamber 105 can also be provided with a door panel to open or close the lower chamber 105 to facilitate maintenance of the air-to-liquid heat exchanger 31 and the fan 32 of the lower chamber 105.

[0063] In some embodiments, the partition 14 includes an upper surface 141 and a lower surface facing each other, wherein the upper surface 141 of the partition 14 faces the upper chamber 104 and the lower surface of the partition 14 faces the lower chamber 105. The thermal management module 40 is placed on the upper surface 141 of the partition 14.

[0064] Reference Figure 3 and Figure 4 In some embodiments, the partition 14 is provided with a through hole 142, and the through hole 142 of the partition 14 passes through the upper surface 141 and the lower surface of the partition 14, and the through hole 142 of the partition 14 is used for the nozzle 41 (such as Figure 5 ) is connected to the lower chamber 105 through the through hole 142 of the partition 14.

[0065] The number of through holes 142 of the partition 14 mainly refers to the number of nozzles 41 through which the thermal management module 40 needs to pass through the partition 14 to connect with the pipeline of the lower chamber 105. For example, in some embodiments, the number of through holes 142 of the partition 14 is two, and the number of nozzles 41 through which the thermal management module 40 needs to connect with the pipeline of the lower chamber 105 is also two. The nozzles 41 of the thermal management module 40 pass through the through holes 142 of the partition 14 and are connected with the pipeline of the lower chamber 105. For example, the pipeline of the lower chamber 105 connected to the nozzles 41 of the thermal management module 40 can be a pipeline connected to the air-liquid heat exchanger 31. In this way, the thermal management module 40 of the upper chamber 104 can be connected to the air-liquid heat exchanger 31 of the lower chamber 105, so as to realize heat exchange between the thermal management module 40 and the liquid cooling medium in the air-liquid heat exchanger 31.

[0066] It is understandable that in some other embodiments, the number of through holes 142 of the partition 14 and the number of pipe connection nozzles 41 of the thermal management module 40 that need to pass through the through holes 142 of the partition 14 and the lower chamber 105 can also be one, three, four or more.

[0067] Reference Figure 3 and Figure 4 In some embodiments, the upper surface 141 of the partition 14 is provided with a boss 16 protruding toward the upper chamber 104 along the height direction Z of the cabinet 10, and the boss 16 is an annular structure, and the boss 16 surrounds the periphery of the through hole 142 of the partition 14 opening toward the upper chamber 104, that is, the vertical projection of the boss 16 on the upper surface 141 of the partition 14 is located at the periphery of the through hole 142 of the partition 14. The boss 16 in this embodiment is used to support the thermal management module 40.

[0068] In some embodiments, the boss 16 includes a lower surface connected to the upper surface 141 of the partition 14 , an upper surface 161 facing the upper chamber 104 , and an outer side surface and an inner side surface 162 connecting the upper surface 161 and the lower surface.

[0069] In some embodiments, the inner side surface 162 of the boss 16 forms a through hole, and the through hole 163 of the boss 16 has the same shape and radial size as the through hole 142 of the partition 14. For example, if the through hole 163 of the boss 16 and the through hole 142 of the partition 14 are both circular holes, the diameters of the through hole 163 of the boss 16 and the through hole 142 of the partition 14 are the same, and the projections of the inner walls of the through hole 163 of the boss 16 and the inner walls of the through hole 142 of the partition 14 in the direction perpendicular to the upper surface 141 of the partition 14 overlap.

[0070] It is understandable that, in some other embodiments, the diameter of the through hole 163 of the boss 16 may also be greater than the diameter of the through hole 142 of the partition 14 .

[0071] The number of the bosses 16 is consistent with the number of the through holes 142 of the partition 14 , and each through hole 142 is surrounded by a boss 16 .

[0072] In some implementations, when there are multiple bosses 16 , the upper surfaces 161 of the bosses 16 are flush in the height direction Z of the cabinet 10 .

[0073] It is understandable that the upper surface 161 of the boss 16 can be a flat surface or a curved surface.

[0074] Reference Figure 3 and Figure 4 In some embodiments, the upper surface 141 of the partition 14 is further provided with a groove 143 , and the groove 143 is used to avoid the portion of the thermal management module 40 protruding toward one side of the partition 14 .

[0075] Figure 5 for Figure 2 A schematic diagram of the structure of the thermal management module 40 of the energy storage device 1, wherein Figure 2 The thermal management module 40 is not shown. Figure 5 The thermal management module 40 in FIG. 4 is also only a schematic diagram. Figure 6 for Figure 2 A partially enlarged schematic diagram of the thermal management module 40 of the energy storage device 1 in FIG.

[0076] Reference Figure 5 In some embodiments, the thermal management module 40 includes a water channel substrate 42 , a refrigerant substrate 43 , and a plurality of thermal management components connected to the water channel substrate 42 and the refrigerant substrate 43 .

[0077] The multiple thermal management components in the thermal management module 40 of the present application are integrated. As an example and not a limitation, the multiple thermal management components of the integrated configuration may include multiple coolant end components, multiple refrigerant end components and multiple heat exchange components. Among them, the coolant end component may include a pump 441, a multi-way valve 442, etc. The refrigerant end component may include an expansion valve, etc. The heat exchange component may include: an evaporator plate exchange 445, a condenser plate exchange 446, etc. In addition, the thermal management component may also include a coolant tank 447, a heater 448 or a dehumidifier 449, etc. Since each thermal management component is integrated on the water channel substrate 42 and the refrigerant substrate 43, the comprehensive volume of each thermal management component of the thermal management module 40 can be effectively reduced, and the water channel substrate 42, the refrigerant substrate 43 and multiple thermal management components are integrated together in an integrated manner, which can effectively improve the heat dissipation capacity of the thermal management module 40 and is more convenient for maintenance.

[0078] The water circuit substrate 42 is used to connect the water-cooled end assembly, and the refrigerant substrate 43 is used to connect the refrigerant end assembly. It should be noted that the medium flowing through the water circuit substrate 42, the water-cooled end assembly, etc. mentioned in this application can not only be water, but also other coolants such as ethylene glycol. The refrigerant flowing through the refrigerant substrate 43 and the refrigerant end assembly can be ammonia water, Freon, R12 (difluoromethane), R22 (difluoromethane), R134a (tetrafluoroethane), R407c, R410a, R290 (propane) or R32 (difluoromethane), etc.

[0079] The water channel substrate 42 includes a top surface and a bottom surface 421 opposite to each other and a side surface 422 connected between the top surface and the bottom surface 421 . There are a plurality of side surfaces 422 . When the water channel substrate 42 is substantially in a rectangular parallelepiped shape, there are four side surfaces 422 .

[0080] The top surface of the water channel substrate 42 faces the top wall of the cabinet 10 , the bottom surface 421 of the water channel substrate 42 faces the partition 14 , and the side surface 422 of the water channel substrate 42 faces the side wall of the cabinet 10 .

[0081] In some embodiments, the water channel substrate 42 is roughly rectangular, and the bottom surface 421 of the water channel substrate 42 is not the largest surface, but two opposite side surfaces of the water channel substrate 42 are the largest surfaces. The water-cooled end assembly can be connected to the largest side surface of the water channel substrate 42.

[0082] The refrigerant substrate 43 is connected to the side surface 422 of the water channel substrate 42 , for example, can be connected to the largest side surface of the water channel substrate 42 .

[0083] It is understandable that the multiple thermal management components may be connected to the same side of the water channel substrate 42 , or may be connected to multiple sides of the water channel substrate 42 .

[0084] For example, in some embodiments, the evaporator plate 445 , the condenser plate 446 , etc. are connected to the refrigerant substrate 43 , and the refrigerant substrate 43 is connected to the side 422 of the water channel substrate 42 , and the multi-way valve 442 and the pump 441 are also connected to the side 422 of the water channel substrate 42 .

[0085] The multi-way valve 442 includes a support plate 45 , which is placed on the boss 16 on the upper surface 141 of the partition 14 to support the thermal management module 40 , or may be directly placed on the upper surface 141 of the partition 14 .

[0086] In some embodiments, the support plate 45 includes a bottom surface 451 facing the partition 14 along the height direction Z of the cabinet 10. The bottom surface 451 of the support plate 45 is directly opposite to the partition 14. In some embodiments, the bottom surface 451 of the support plate 45 is substantially parallel to the partition 14, and the bottom surface 451 of the support plate 45 is placed on the upper surface 161 of the boss 16 on the partition 14, so that the boss 16 supports the thermal management module 40 through the support plate 45.

[0087] Reference Figure 5 and Figure 6 In some embodiments, the thermal management module 40 further includes a nozzle 41 protruding from the bottom surface 451 of the thermal management module 40 . The thermal management module 40 is connected to the air-to-liquid heat exchanger 31 of the lower chamber 105 through the nozzle 41 .

[0088] In some embodiments, the pipe opening 41 of the thermal management module 40 is a part of the multi-way valve 442, and is the pipe opening 41 of the multi-way valve 442. The thermal management module 40 is connected to the air-to-liquid heat exchanger 31 of the lower chamber 105 through the multi-way valve 442. Other components of the thermal management module 40, such as the evaporation plate exchanger 445, the condensation plate exchanger 446, or the pump 441, etc., can also be connected to the multi-way valve 442, so that the evaporation plate exchanger 445, the condensation plate exchanger 446, or the pump 441, etc. of the thermal management module 40 are connected to the air-to-liquid heat exchanger 31 of the lower chamber 105 through the multi-way valve 442.

[0089] In some embodiments, the bottom surface 451 of the thermal management module 40 is the bottom surface 451 of the support plate 45 of the multi-way valve 442, and the protruding direction of the nozzle 41 is the direction from the upper chamber 104 to the lower chamber 105. In this embodiment, since the nozzle 41 is formed by protruding from the bottom surface 451 of the support plate 45, the outer side wall 411 of one end of the nozzle 41 is directly connected to the bottom surface 451 of the support plate 45 to ensure the sealing effect between the bottom surface 451 of the support plate 45 and the outer side wall 411 of one end of the nozzle 41.

[0090] It can be understood that the pipe mouth 41 is a tubular structure having a passage.

[0091] In some embodiments, the support plate 45 is a part of a housing of the multi-way valve 442 , and the multi-way valve 442 is fixed to the side surface 422 of the waterway substrate 42 .

[0092] It is understandable that the number of the pipe openings 41 provided on the bottom surface 451 of the support plate 45 may be one or more.

[0093] It is understandable that when there are multiple pipe openings 41 on the bottom surface 451 of the support plate 45 , one pipe opening 41 may be provided on one support plate 45 , or multiple pipe openings 41 may be provided on the same support plate 45 .

[0094] In some embodiments, the nozzle 41 is integrally formed with the support plate 45. It is understandable that in some other embodiments, the nozzle 41 may also be bonded or welded to the support plate 45.

[0095] It can be understood that the multi-way valve 442 can also include other pipe openings that are not connected to the air-liquid heat exchanger 31 of the lower chamber 105. The other pipe openings of the multi-way valve 442 can be used to connect to the liquid cooling plate exchanger (not shown in the figure) of the battery module 20 of the battery compartment 103, so as to connect the thermal management module 40 with the liquid cooling plate exchanger of the battery module 20, such as connecting the evaporation plate exchanger 445, the condensation plate exchanger 446 or the pump 441 of the thermal management module 40 with the liquid cooling plate exchanger of the battery module 20, so that the battery module 20 can be easily cooled by the thermal management module 40.

[0096] Reference Figure 6 In some embodiments, the thermal management module 40 further includes a support leg 46, which can be connected to the water channel substrate 42 or the refrigerant substrate 43. The support leg 46 is also used to support the thermal management module 40. The support leg 46 can be placed on the upper surface 141 of the partition 14, thereby supporting the thermal management module 40 through the support leg 46. It can be understood that the support leg 46 and the support plate 45 are used to support the thermal management module 40 at the same time.

[0097] It is understandable that the number of the legs 46 may be one or more. The legs 46 may be connected to the water channel substrate 42 or the refrigerant substrate 43 by welding, plugging, etc., or may be integrally formed with the water channel substrate 42 or the refrigerant substrate 43.

[0098] In some embodiments, the support leg 46 is a columnar structure protruding from the bottom surface 421 of the waterway substrate 42 .

[0099] Figure 7 for Figure 2 A partial cross-sectional view of the assembly portion of the nozzle 41 of the energy storage device 1 and the through hole 142 of the partition plate 14; Figure 8 for Figure 2 A schematic structural diagram of the pipe mouth 41 of the energy storage device 1 passing through the through hole 142 of the partition 14 and connected to the pipeline 51 of the lower chamber 105.

[0100] Reference Figure 7 and Figure 8In some embodiments, the through hole 142 of the partition 14 is used to accommodate the nozzle 41, and the nozzle 41 passes through it. At least part of the nozzle 41 is located in the through hole 142 of the partition 14, and the nozzle 41 is used to connect with the pipeline 51 of the lower chamber 105, wherein the pipeline 51 of the lower chamber 105 can be a pipeline connected to the air-cooled heat exchange plate. The nozzle 41 can be only partially located in the through hole 142 of the partition 14, and another part passes through the through hole 142 of the partition 14 and enters the lower chamber 105, and then connects with other pipelines in the lower chamber 105. It can be understood that in some other embodiments, the nozzle 41 can also be completely located in the through hole 142 of the partition 14, and the nozzle 41 is connected to the pipeline 51 of the lower chamber 105 in the through hole 142 of the partition 14.

[0101] In order to ensure the sealing performance between the pipe mouth 41 and the through hole 142 of the partition 14, since the bottom surface 451 of the support plate 45 is connected to the outer wall 411 of the pipe mouth 41, it is only necessary to ensure the sealing performance between the through hole 142 of the partition 14 and the bottom surface 451 of the support plate 45, so as to ensure the sealing performance between the outer wall 411 of the pipe mouth 41 and the inner wall of the through hole 142 of the partition 14. In some embodiments, the energy storage device 1 further includes a sealing gasket 60, which is disposed between the partition 14 and the bottom surface 451 of the support plate 45. The sealing gasket 60 is provided with a through hole 601, and the through hole 601 of the sealing gasket 60 is used to accommodate the pipe mouth 41. Specifically, the pipe mouth 41 passes through the through hole 142 of the partition 14 and the through hole 601 of the sealing gasket 60 in sequence, and is used to connect with the pipeline in the lower chamber 105 (such as the pipeline connected to the air-liquid heat exchanger 31 in the lower chamber 105). The thermal management module 40 is pressed on the sealing gasket 60 located on the partition 14 through the support plate 45, so that the sealing gasket 60 is clamped between the partition 14 and the bottom surface 451 of the support plate 45, thereby ensuring the sealing performance of the periphery of the opening of the through hole 142 of the partition 14 toward the upper chamber 104, thereby ensuring the sealing performance between the inner side wall of the through hole 142 of the partition 14 and the outer side wall 411 of the pipe mouth 41. Furthermore, since the sealing gasket 60 is directly disposed on the bottom surface 451 of the partition plate 14 and the support plate 45 , it is compressed by the gravity of the thermal management module 40 , thereby having a self-sealing effect and a simple assembly method.

[0102] In addition, for the radial sealing method in which a sealing ring is provided between the outer wall 411 of the pipe mouth 41 and the inner wall of the through hole 142 of the partition 14, it is not only necessary to open a groove for placing the sealing ring in the outer wall 411 of the pipe mouth 41 in advance, but also the assembly precision is required to be sufficiently accurate, because when the assembly is not accurate, the force on some parts of the sealing ring is small, and the problem of poor sealing will occur. Compared with radial sealing, the sealing gasket 60 in this embodiment is located at the periphery of the opening of the through hole 142 of the partition 14, rather than inside the inner wall of the through hole 142 of the partition 14, and the pressure is applied to the sealing gasket 60 by the gravity of the thermal management module 40, so the precision requirement is relatively low, and even if the assembly error is large, it will not affect the sealing performance of the sealing gasket 60, thereby reducing the difficulty of processing and effectively improving the sealing performance and sealing stability.

[0103] Reference Figure 7 In some embodiments, the sealing gasket 60 is disposed on the boss 16 on the upper surface 141 of the partition 14, and then the bottom surface 451 of the support plate 45 is pressed onto the sealing gasket 60, so that the sealing gasket 60 is located between the upper surface 161 of the boss 16 and the bottom surface 451 of the support plate 45. The upper surface 161 of the boss 16 is located on the side of the upper surface 141 of the partition 14 away from the lower chamber 105 in the height direction Z of the cabinet 10, that is, the upper surface 161 of the boss 16 is closer to the bottom wall of the cabinet 10 than the upper surface 141 of the partition 14, so that when the bottom surface 451 of the support plate 45 is supported by the upper surface 161 of the boss 16, the upper surface 141 of the partition 14 and the bottom surface 451 of the support plate 45 can be arranged at a distance, and the force for supporting the thermal management module 40 is concentrated on the support plate 45. The bottom surface 451 of the plate 45 and the upper surface 161 of the boss 16. Since the area of ​​the upper surface 161 of the boss 16 is smaller than the area of ​​the upper surface 141 of the partition 14, when the gravity of the thermal management module 40 remains unchanged, the smaller the surface used to support the thermal management module 40, the greater the pressure on the surface, so that the sealing gasket 60 located on the upper surface 161 of the boss 16 can be subjected to greater pressure, thereby improving the sealing performance between the upper surface 161 of the boss 16 and the bottom surface 451 of the support plate 45.

[0104] In some embodiments, the sealing gasket 60 completely covers the upper surface 161 of the boss 16, and the area of ​​the surface of the sealing gasket 60 facing the boss 16 is larger than the area of ​​the upper surface 161 of the boss 16. Therefore, when the upper surface 161 of the boss 16 is clamped with the sealing gasket 60, the sealing gasket 60 will be recessed under the pressure of the upper surface 161 of the boss 16, thereby forming a labyrinth-shaped sealing structure, thereby improving the sealing performance between the upper surface 161 of the boss 16 and the bottom surface 451 of the support plate 45, and also improving the stable sealing performance during vibration.

[0105] In some embodiments, since the sealing gasket 60 is an annular structure, the sealing gasket 60 has an outer peripheral edge 61 and an inner peripheral edge 62. Along the height direction Z of the cabinet 10, the projections of the upper surface 161 of the boss 16 on the sealing gasket 60 are all located between the outer peripheral edge 61 and the inner peripheral edge 62 of the sealing gasket 60. In this embodiment, since along the height direction Z of the cabinet 10, the projections of the upper surface 161 of the boss 16 on the sealing gasket 60 are all located between the outer peripheral edge 61 and the inner peripheral edge 62 of the sealing gasket 60, when the upper surface 161 of the boss 16 applies pressure to the sealing gasket 60, the sealing gasket 60 can be concave to form a labyrinth-shaped sealing structure to improve the sealing performance.

[0106] In some embodiments, the diameter of the circle enclosed by the inner edge 62 of the sealing gasket 60 is smaller than the outer diameter of the contact position between the pipe mouth 41 and the sealing gasket 60, so that the sealing gasket 60 can also be subjected to pressure in the radial direction of the pipe mouth 41, so that part of the sealing gasket 60 is squeezed by the side of the boss 16 and the outer wall 411 of the pipe mouth 41, thereby further improving the sealing performance between the outer wall 411 of the pipe mouth 41 and the inner wall of the through hole 142 of the partition 14.

[0107] Specifically, the through hole 601 of the sealing gasket 60 is used to accommodate the outer side wall 411 of the pipe mouth 41, and specifically, the through hole 601 of the sealing gasket 60 is sleeved on the outer side wall 411 of the pipe mouth 41. In the natural state, the diameter of the through hole 601 of the sealing gasket 60 is smaller than the diameter of the outer side wall 411 of the end of the pipe mouth 41 facing the support plate 45. Thus, when the sealing gasket 60 is pressed between the bottom surface 451 of the support plate 45 and the upper surface 161 of the boss 16, the surface of the sealing gasket 60 facing the bottom surface 451 of the support plate 45 contacts the bottom surface 451 of the support plate 45, and at this time, the through hole is sleeved on the outer side wall 411 of the end of the pipe mouth 41 facing the support plate 45, and the diameter of the through hole 601 of the sealing gasket 60 is smaller than the diameter of the outer side wall 411 of the end of the pipe mouth 41 facing the support plate 45, so that the outer side wall 411 of the pipe mouth 41 can squeeze the sealing gasket 60 in the radial direction of the pipe mouth 41, so that part of the sealing gasket 60 is squeezed between the inner side surface 162 of the boss 16 and the outer side wall 411 of the pipe mouth 41, and thus the sealing performance between the upper surface 161 of the boss 16 and the outer side wall 411 of the pipe mouth 41 can be effectively improved.

[0108] In some embodiments, the diameter of the outer wall 411 of the end of the nozzle 41 facing the bottom surface 451 of the support plate 45 is larger than the diameter of the outer wall 411 of the end of the nozzle 41 away from the support plate 45, and the diameter of the outer wall 411 of the end of the nozzle 41 away from the support plate 45 is smaller than the diameter of the through hole 601 of the sealing gasket 60. Therefore, the sealing gasket 60 can be conveniently sleeved on the outer wall 411 of the nozzle 41, and it can be ensured that when the sealing gasket 60 is pressed between the support plate 45 and the boss 16, the outer wall 411 of the end of the nozzle 41 facing the support plate 45 can radially squeeze the sealing gasket 60, so as to improve the sealing effect between the outer wall 411 of the nozzle 41 and the inner wall of the through hole 142 of the partition 14.

[0109] It is understandable that, in some other embodiments, the boss 16 may not be provided, but the sealing gasket 60 may be directly provided between the upper surface 141 of the partition plate 14 and the bottom surface 451 of the support plate 45 .

[0110] In some other embodiments, the boss 16 may be disposed on the bottom surface 451 of the support plate 45 , and then the sealing gasket 60 may be disposed between the surface of the boss 16 facing the partition 14 and the upper surface 141 of the partition 14 .

[0111] In some other embodiments, bosses 16 may be provided on both the bottom surface 451 of the support plate 45 and the upper surface 141 of the partition plate 14 , and the sealing gasket 60 may be provided between the bosses 16 on the support plate 45 and the bosses 16 on the partition plate 14 .

[0112] Fig. 9 for Figure 2 A partial cross-sectional view of the assembly portion between the leg 46 of the thermal management module 40 of the energy storage device 1 and the partition 14.

[0113] Reference Fig. 9 In some embodiments, the legs 46 are disposed on the upper surface 141 of the partition 14 to support the thermal management module 40. In this embodiment, the thermal management module 40 is supported by the legs 46 and the support plate 45, and the stress points of the thermal management module 40 are located on the legs 46 and the support plate 45.

[0114] In some embodiments, the support leg 46 is a columnar structure extending in the height direction Z of the cabinet 10 . The support leg 46 includes a contact surface 461 facing the partition 14 . The support leg 46 is disposed on the upper surface 141 of the partition 14 through the contact surface 461 .

[0115] In some embodiments, a rubber pad 70 is provided between the contact surface 461 of the support leg 46 and the upper surface 141 of the partition 14 . The rubber pad 70 can eliminate the manufacturing tolerance of the support leg 46 and the partition 14 to improve the assembly accuracy between the thermal management module 40 and the partition 14 .

[0116] In some embodiments, the surface of the rubber pad 70 facing the support leg 46 includes a groove 701, and the support leg 46 is disposed in the groove 701 of the rubber pad 70 to reduce the difficulty of assembling the support leg 46 and the rubber pad 70 and prevent the support leg 46 and the rubber pad 70 from moving relative to each other.

[0117] In some embodiments, the upper surface 141 of the partition 14 is provided with a groove 143, and the support leg 46 is provided in the groove 143 of the partition 14. Of course, in some other embodiments, the upper surface 141 of the partition 14 may not be provided with a groove 143. It is understood that the inner wall of the groove 143 is also a part of the upper surface 141 of the partition 14.

[0118] Reference Figure 2-Figure 9 In some embodiments, the support leg 46 and the support plate 45 are both connected to one end of the waterway substrate 42 facing the partition 14, such as Figure 5 As shown, the support leg 46 is disposed on the bottom surface 421 of the waterway substrate 42 facing the partition 14, and the support plate 45 is connected to the side surface 422 of the waterway substrate 42, but the bottom surface 451 of the support plate 45 is substantially parallel to the bottom surface 421 of the waterway substrate 42. Thus, the waterway substrate 42 and the thermal management module 40 can be supported together by the support plate 45 and the support leg 46, so that the bottom surface 421 of the waterway substrate 42 and the plurality of thermal management components are spaced apart from the partition 14. It can be understood that the support plate 45 can also be directly connected to the bottom surface 421 of the waterway substrate 42 facing the partition 14, or the bottom plate of the waterway substrate 42 facing the partition 14 can serve as the support plate 45 in this embodiment.

[0119] In some embodiments, the water channel substrate 42 includes a bottom surface 421 facing the partition 14 and a side surface 422 facing the side wall of the cabinet 10, and multiple thermal management components are connected to the side surface 422 of the water channel substrate 42. In this embodiment, since the side surface 422 of the water channel substrate 42 faces the side wall of the cabinet 10, and the side surface 422 of the water channel substrate 42 is used to integrate and install multiple thermal management components, that is, the area of ​​the side surface 422 of the water channel substrate 42 is larger than the bottom surface 421 of the water channel substrate 42, thereby reducing the area of ​​the upper surface 141 of the partition 14 occupied, so that more components can be arranged in the upper chamber 104, so as to improve the space utilization of the upper chamber 104.

[0120] In order to ensure that the thermal management module 40 can be stably fixed in the upper chamber 104, in some embodiments, the thermal management module 40 also includes a load-bearing member connected to the side 422 of the waterway substrate 42, and the load-bearing member is used to connect with the side wall of the cabinet 10. Since the support portion and the support leg 46 are placed on the partition 14, the partition 14 can support the thermal management module 40. Under the support of the partition 14, the load-bearing member can be conveniently assembled and connected with the side wall of the cabinet 10 without the need for a third-party lifting tool, thereby reducing the difficulty of assembling the thermal management module 40. In addition, by connecting the load-bearing member to the side wall of the cabinet 10 and supporting the thermal management module 40 through the load-bearing member, the stress on the partition 14 can be reduced, thereby increasing the service life of the partition 14.

[0121] In some embodiments, the side 422 of the water channel substrate 42 connected with multiple thermal management components is arranged parallel to the cabinet door 15. In this embodiment, the side of the water channel substrate 42 connected with multiple thermal management components is arranged parallel to the cabinet door 15, so that the width of the thermal management module 40 in the length direction X of the cabinet 10 is the smallest, thereby reducing the width of the liquid cooling chamber 102 in the length direction X of the cabinet 10, and the upper chamber 104 is large enough to place the thermal management module 40 in the height direction Z and width direction of the cabinet 10, so that the installation position of the thermal management module 40 is more reasonable, and the space utilization rate of the upper chamber 104 can be effectively improved.

[0122] In the embodiment of the present application, due to the provision of the partition 14, not only the upper chamber 104 where the thermal management module 40 is placed is separated from the other spaces of the cabinet 10, so as to prevent the thermal management module 40 from leaking and causing electrical ignition to other electrical components or the fan 32, thereby causing damage to the electrical components or the fan 32 or a fire. Moreover, since the through hole 142 of the partition 14 and the pipe mouth 41 of the thermal management module 40 are effectively sealed by the sealing gasket 60, it can further prevent the thermal management module 40 from leaking and causing electrical fire to other electrical components or the fan 32. It is also conducive to the assembly connection between the load-bearing parts of the thermal management module 40 and the side wall of the cabinet 10, reducing the difficulty of installing the thermal management module 40.

[0123] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. An energy storage device with a thermal management module, characterized in that: The energy storage device comprises a cabinet, a thermal management module and a sealing pad, wherein the thermal management module is used to dissipate heat in the energy storage device, the cabinet comprises a partition connected to a side wall of the cabinet, the partition divides the internal space of the cabinet into an upper chamber and a lower chamber arranged along the height direction of the cabinet, the partition is provided with a through hole, the through hole communicates the upper chamber and the lower chamber, the thermal management module is located in the upper chamber, and the partition is used to support the thermal management module; The thermal management module includes a bottom surface and a pipe opening protruding from the bottom surface, the bottom surface faces the partition along the height direction of the cabinet, the sealing gasket is arranged between the partition and the bottom surface, the sealing gasket is provided with a through hole, the pipe opening passes through the through hole of the sealing gasket and the through hole of the partition, and is used to connect with the pipeline in the lower chamber.

2. The energy storage device according to claim 1, characterized in that: A boss protruding toward the upper chamber along the height direction of the cabinet is provided on the surface of the partition, the boss is arranged around the pipe opening, and the sealing gasket is located between the surface of the boss facing the upper chamber and the bottom surface.

3. The energy storage device according to claim 2, characterized in that: The sealing gasket comprises an outer peripheral edge and an inner peripheral edge, and along the height direction of the cabinet, the projection of the surface of the boss facing the upper chamber on the sealing gasket is entirely located between the outer peripheral edge and the inner peripheral edge of the sealing gasket.

4. The energy storage device according to claim 2 or 3, characterized in that: The inner wall of the through hole of the sealing gasket is attached to the outer wall of the pipe opening.

5. The energy storage device according to claim 2, characterized in that: The thermal management module further includes a support leg protruding from the bottom surface, and a surface of the support leg facing the partition is arranged on a surface of the partition facing the upper chamber.

6. The energy storage device according to claim 5, characterized in that: A rubber pad is provided between the surface of the support foot facing the partition and the surface of the partition facing the upper chamber.

7. The energy storage device according to any one of claims 1 to 6, characterized in that: The pipe opening of the thermal management module is used for circulating liquid cooling medium.

8. The energy storage device according to any one of claims 1 to 7, characterized in that: The thermal management module includes a water channel substrate, a refrigerant substrate and a multi-way valve. The pipe opening is used to connect the multi-way valve. The water channel substrate includes a bottom surface facing the partition and a side surface facing the side wall of the cabinet. The refrigerant substrate and the multi-way valve are connected to the side surface of the water channel substrate.

9. The energy storage device according to claim 8, characterized in that: The thermal management module further includes a load-bearing member connected to a side surface of the water channel substrate, wherein the load-bearing member is used to be connected to a side wall of the cabinet.

10. The energy storage device according to any one of claims 1 to 9, characterized in that: The cabinet includes a storage compartment and a liquid cooling compartment, the storage compartment is used to accommodate a battery module and a power converter, the liquid cooling compartment is arranged on the inner side wall of the cabinet door of the cabinet, the storage compartment is located on the side of the liquid cooling compartment away from the cabinet door of the cabinet, the partition separates the liquid cooling compartment into the upper chamber and the lower chamber arranged along the height direction of the cabinet, the lower chamber is used to accommodate an air-liquid heat exchanger and a fan, and the pipe opening is used to connect a pipeline connected to the air-liquid heat exchanger.

11. An energy storage system, characterized in that: It comprises a power converter and an energy storage device as described in any one of claims 1 to 10, wherein the power converter is connected to the energy storage device to perform power conversion on the current input to or output from the energy storage device.

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