Power conversion apparatus

Abstract

The utility model provides power conversion equipment, and belongs to the technical field of electric power. A power conversion device includes a housing, a fan, a circuit board, and an intra-cavity heat sink. The shell comprises a surrounding plate, a first partition plate and a second partition plate. A containing cavity is defined by the surrounding plate and divided by the first partition plate into a first air channel and a second air channel, and the two ends of the first air channel are communicated with the two ends of the second air channel in a one-to-one mode to form a closed air channel. The second partition plate divides the first air duct into a first sub-air duct and a second sub-air duct. The fan, the circuit board and the intra-cavity radiator are arranged in the containing cavity. The power conversion equipment provided by the utility model is internally provided with the first sub-air duct and the second sub-air duct which are arranged in parallel, so that the influence of heat dissipated by electronic components in one sub-air duct on electronic components in the other sub-air duct is relatively small, and the heat dissipation effect of the power conversion equipment is relatively good.

Description

Technical Field

[0001] The present disclosure relates to the field of electric power technology, and in particular to a power conversion device. Background Art

[0002] With the development of the new energy industry, the power of power conversion equipment, such as power conversion system (PCS) and DC converter (DC-to-DC converter), has been continuously improved, and the power consumption of electronic components inside the power conversion equipment has also been continuously increased.

[0003] In the related art, some electronic components of the power conversion device are easily affected by the heat emitted by other electronic components, resulting in poor heat dissipation effect of the power conversion device. Utility Model Content

[0004] The present disclosure provides a power conversion device. The power conversion device includes two separated sub-air ducts inside, so that the heat emitted by the electronic components in one sub-air duct has a small impact on the electronic components in the other sub-air duct, and the heat dissipation effect of the power conversion device is better. The technical solution of the power conversion device is as follows.

[0005] The present disclosure provides a power conversion device. The power conversion device includes a housing, a fan, a circuit board and an intracavity heat sink. The housing includes a panel, a first partition and a second partition. The panels enclose a receiving cavity, and the first partition divides the receiving cavity into a first air duct and a second air duct. The two ends of the first air duct are respectively connected one-to-one with the two ends of the second air duct to form a closed air duct. The second partition divides the first air duct into a first sub-air duct and a second sub-air duct. The fan, the circuit board and the intracavity heat sink are arranged in the receiving cavity.

[0006] Among them, the power conversion equipment provided by the present disclosure is a power conversion system (PCS), a DC converter (DC-to-DC converter, DC-DC), an inverter, a charging module, an energy storage cabinet or a charging pile, etc. The housing is used to protect the internal electronic components and form an air duct for air cooling and heat dissipation. The intracavity radiator is used to cool the air inside the air duct to avoid the temperature in the air duct from getting higher and higher. The circuit board has a plurality of electronic components, which are arranged in the first sub-air duct, the second sub-air duct and the second air duct. The electronic components are used to realize the power conversion function of the power conversion device.

[0007] The technical solution provided by the present disclosure divides the accommodating cavity into a first air duct and a second air duct by setting a first partition, and divides the first air duct into a first sub-air duct and a second sub-air duct by setting a second partition, so that the first sub-air duct and the second sub-air duct are arranged in parallel. In this way, the heat emitted by the electronic components in one sub-air duct has a smaller impact on the electronic components in the other sub-air duct, and the heat dissipation efficiency of the power conversion device is better.

[0008] In a possible implementation, the first sub-air duct has at least a first electronic component, and the second sub-air duct has a second electronic component. The heating power of the first electronic component is higher than the heating power of the second electronic component, and the allowable ambient temperature of the first electronic component is higher than the allowable ambient temperature of the second electronic component.

[0009] The technical solution provided by the present disclosure achieves isolation of the first electronic components and the second electronic components by respectively arranging the first electronic components with high heating power and high allowable ambient temperature and the second electronic components with low heating power and low allowable ambient temperature in the first sub-air duct and the second sub-air duct, which can effectively reduce the influence of the heat dissipated by the first electronic components on the second electronic components, reduce the temperature of the second electronic components, and improve the heat dissipation effect of the power conversion equipment.

[0010] In a possible implementation, the first electronic component includes at least one of a relay, an inductor, and a leakage current protector. The second electronic component includes at least one of a lightning arrester, a capacitor, and an optical coupler. Among them, the heating power of the relay, the inductor, and the leakage current protector is relatively high and the allowable ambient temperature is relatively high, and the heating power of the lightning arrester, the capacitor, and the optical coupler is relatively low and the allowable ambient temperature is relatively low.

[0011] In a possible implementation, at least a portion of the intracavity heat sink is located in the second air duct. The second electronic component in the second sub-air duct is close to the air outlet of the first air duct and away from the air inlet of the first air duct.

[0012] The technical solution provided by the present disclosure is that the second electronic components close to the outlet end of the first air duct (i.e., the second electronic components downstream of the first air duct) are greatly affected by the heat emitted by the upstream first electronic components. Therefore, the second electronic components close to the outlet end of the first air duct are arranged in the separated second sub-air duct, which can reduce the influence of the first electronic components in the first sub-air duct on these second electronic components, and is conducive to improving the heat dissipation effect of the power conversion device.

[0013] In a possible implementation, the first sub-air duct is located between the first partition plate and the second partition plate, and the second sub-air duct is located between the enclosure plate and the second partition plate.

[0014] In a possible implementation manner, the first sub-air duct further has a second electronic component.

[0015] In the technical solution provided by the present disclosure, since the arrangement of electronic components is irregular, it is difficult to completely separate the first electronic components and the second electronic components into the first sub-duct and the second sub-duct. Therefore, by arranging some second electronic components in the first sub-duct, the difficulty of separating the first duct into the first sub-duct and the second sub-duct can be reduced.

[0016] In a possible implementation, at least a portion of the intracavity heat sink is located in the second air duct. The second electronic component in the first sub-air duct is close to the air inlet end of the first air duct and away from the air outlet end of the first air duct.

[0017] The technical solution provided by the present disclosure is that the second electronic component close to the air inlet end of the first air duct (i.e., the second electronic component located upstream of the first air duct) is less affected by the heat emitted by the downstream first electronic component. Therefore, the first electronic component and the second electronic component close to the air inlet end of the first air duct are arranged together in the first sub-air duct, which will not affect the heat dissipation effect of the power conversion device too much. In addition, it can also reduce the difficulty of separating the first air duct into the first sub-air duct and the second sub-air duct.

[0018] In a possible implementation, the first sub-duct is located between the first partition and the second partition, and the second sub-duct is located between the enclosure and the second partition. A first electronic component exists between the second electronic component in the first sub-duct and the second partition (or enclosure).

[0019] The technical solution provided by the present disclosure is that for the second electronic components between the first electronic components and the second partition, if these second electronic components are to be arranged in the second sub-air duct, the second electronic components and the first electronic components between the second electronic components and the enclosure need to be arranged together in the second sub-air duct. In this way, the heat dissipation effect of the electronic components in the second sub-air duct will be reduced. Therefore, by arranging the second electronic components between the first electronic components and the enclosure in the first sub-air duct, the heat dissipation effect of the second electronic components in the second sub-air duct is guaranteed.

[0020] In a possible implementation, the second sub-air duct includes a guide section and a heat dissipation section that are sequentially connected along the wind direction. The guide section is located in the gap between the edge of the circuit board and the enclosure. The second electronic component is located in the heat dissipation section. The guide section is used to guide the wind to the heat dissipation section.

[0021] In a possible implementation, the second partition includes a bending portion, the bending portion is bent toward the first partition, and the bending portion is spaced apart from the first partition.

[0022] In a possible implementation, a heat dissipation section is formed between the bent portion and the enclosure.

[0023] In a possible implementation, the power conversion device further includes a liquid cooling module, and the liquid cooling module is attached to the electronic components located in the second air duct.

[0024] In the technical solution provided by the present disclosure, since the liquid cooling module is attached to the electronic components in the second air duct, the electronic components in the second air duct can all be directly cooled by the liquid cooling module, and all have a good heat dissipation effect. Therefore, the electronic components in the second air duct can be placed in the same air duct without being separated into different sub-air ducts.

[0025] Since the electronic components in the first air duct are not attached to the liquid cooling module, the heat dissipation effect of the electronic components in the first air duct is poor, which makes the second electronic components in the first air duct more seriously affected by the heat emitted by the first electronic components. Therefore, the present disclosure sets a second partition to separate the first air duct into a first sub-air duct and a second sub-air duct, and sets the first electronic components and the second electronic components in the first sub-air duct and the second sub-air duct respectively, thereby improving the heat dissipation effect of the electronic components in the first air duct.

[0026] In a possible implementation, the fan includes a first fan. The first fan is located at a junction area between an air inlet end of the first air duct and an air outlet end of the second air duct.

[0027] In a possible implementation, the first fan is located in the second air duct.

[0028] In a possible implementation, the fan includes a second fan. The second fan is located at a junction area between an air outlet end of the first air duct and an air inlet end of the second air duct.

[0029] In a possible implementation, the second fan is located in the second air duct. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a three-dimensional schematic diagram of the internal structure of a power conversion device provided by an embodiment of the present disclosure;

[0031] Figure 2 is a schematic diagram of an air duct of a power conversion device provided by an embodiment of the present disclosure;

[0032] Figure 3 is an exploded view of a first power conversion device provided by an embodiment of the present disclosure;

[0033] Figure 4 is an exploded view of a second power conversion device provided by an embodiment of the present disclosure;

[0034] Figure 5 is a top view of the internal structure of a first power conversion device provided by an embodiment of the present disclosure;

[0035] Figure 6 is a top view of the internal structure of a second power conversion device provided by an embodiment of the present disclosure;

[0036] Figure 7 is a top view of the internal structure of a third power conversion device provided by an embodiment of the present disclosure;

[0037] Figure 8 is a top view of the internal structure of a fourth power conversion device provided by an embodiment of the present disclosure;

[0038] Fig. 9 is a top view of the internal structure of a fifth power conversion device provided by an embodiment of the present disclosure;

[0039] Fig.10 It is a schematic diagram of an energy storage cabinet provided in an embodiment of the present disclosure.

[0040] Legend

[0041] 01. Energy storage cabinet, 011. Battery compartment, 012. Power compartment, 02. Battery pack, 03. Energy storage converter;

[0042] 1. Shell, 11. Enclosure, 12. First baffle, 13. Second baffle, 131. Bend portion, 132. Straight portion, 14. Fourth baffle, 15. Upper cover, 110. First air duct, 111. First sub-air duct, 112. Second sub-air duct, 1121. Guide section, 1122. Heat dissipation section, 120. Second air duct;

[0043] 2. Fan, 21. First fan, 22. Second fan;

[0044] 3. Circuit board, 31. First circuit board, 311. First region, 312. Second region, 32. Second circuit board, 33. Third circuit board, 34. Fourth circuit board, 301. First electronic component, 302. Second electronic component, 303. IGBT module;

[0045] 4. Intracavity radiator;

[0046] 5. Liquid cooling module;

[0047] a. Relay, b. Inductor, c. Leakage current protector, d. Lightning arrester, e. Capacitor. DETAILED DESCRIPTION

[0048] With the development of the new energy industry, the power of power conversion equipment, such as power conversion system (PCS) and DC converter (DC-DC), has been continuously improved. The power consumption of electronic components inside the power conversion equipment has also been increasing. The electronic components inside the power conversion equipment include insulated gate bipolar transistors (IGBT), inductors, relays, capacitors, Hall and other on-board devices on printed circuit boards (PCB). The heat generation power of these electronic components varies greatly, and the allowable ambient temperature requirements are also different.

[0049] In the related art, the power conversion device has only one air duct inside, so some electronic components are easily affected by the heat emitted by other electronic components, resulting in poor heat dissipation effect of the power conversion device.

[0050] For example, due to the hardware layout and cable connection inside the power conversion equipment, some electronic components with low heat generation power and low allowable ambient temperature may be located in the downstream air duct of electronic components with high heat generation power and high allowable ambient temperature, which may easily lead to thermal cascade. Affected by the heat emitted by the electronic components with high heat generation power, the temperature of the electronic components with low allowable ambient temperature is too high, and the heat dissipation effect of the power conversion equipment is poor.

[0051] The present disclosure provides a power conversion device. Figure 1-Figure 4 As shown, the power conversion device includes a housing 1, a fan 2, a circuit board 3 and an intracavity heat sink 4. The housing 1 includes a surrounding plate 11, a first partition plate 12 and a second partition plate 13. The surrounding plate 11 encloses a receiving cavity, and the first partition plate 12 divides the receiving cavity into a first air duct 110 and a second air duct 120. The two ends of the first air duct 110 are respectively connected to the two ends of the second air duct 120 one-to-one, and form a closed air duct. The second partition plate 13 divides the first air duct 110 into a first sub-air duct 111 and a second sub-air duct 112. The fan 2, the circuit board 3 and the intracavity heat sink 4 are arranged in the receiving cavity.

[0052] Among them, the power conversion equipment provided in the embodiments of the present disclosure is an energy storage converter, a DC converter, an inverter (such as a photovoltaic inverter), a charging module, an energy storage cabinet or a charging pile, etc.

[0053] The housing 1 is used to protect the internal electronic components and form an air duct for heat dissipation. Figure 3 and Figure 4 As shown, the housing 1 includes a lower shell, an upper cover 15 , a first partition 12 and a second partition 13 , and the lower shell includes a surrounding plate 11 .

[0054] Fan 2 can be a turbulent fan. In some examples, such as Figure 5 As shown, the fan 2 includes at least one of a first fan 21 and a second fan 22. The first fan 21 is located at the air inlet end of the first air duct 110, at the junction area with the air outlet end of the second air duct 120, or in the second air duct 120. The second fan 22 is located at the air outlet end of the first air duct 110, at the junction area with the air inlet end of the second air duct 120, or in the second air duct 120.

[0055] The circuit board 3 has a plurality of electronic components, which are arranged in the first sub-air duct 111, the second sub-air duct 112 and the second air duct 120. The electronic components are used to realize the power conversion function of the power conversion device. The circuit board 3 may include a PCB.

[0056] The heat sink 4 in the cavity is used to cool the air inside the air duct to prevent the temperature inside the air duct from getting higher and higher. Figure 5 As shown, at least a portion of the intra-cavity heat sink 4 is located in the second air duct 120 .

[0057] The technical solution provided by the embodiment of the present disclosure is to divide the accommodating cavity into the first air duct 110 and the second air duct 120 by setting the first partition 12, and to divide the first air duct 110 into the first sub-air duct 111 and the second sub-air duct 112 by setting the second partition 13, so that the first sub-air duct 111 and the second sub-air duct 112 are arranged in parallel. In addition, the downstream of the first sub-air duct 111 and the second sub-air duct 112 merge into the second air duct 120, so that the air duct inside the housing 1 forms a Y-shaped air duct.

[0058] Since the first sub-duct 111 and the second sub-duct 112 are arranged in parallel, the first electronic component 301 in the first sub-duct 111 is separated from the second electronic component 302 in the second sub-duct 112, which reduces the influence of the heat emitted by the first electronic component 301 on the second electronic component 302, or the influence of the heat emitted by the second electronic component 302 on the first electronic component 301, thereby improving the heat dissipation effect of the power conversion device. The first sub-duct 111 at least has the first electronic component 301, and the second sub-duct 112 has the second electronic component 302.

[0059] The embodiment of the present disclosure does not limit the criteria for determining the first electronic component 301 and the second electronic component 302. In some examples, the first electronic component 301 and the second electronic component 302 are determined based on the heat generation power and the allowable ambient temperature of the electronic components.

[0060] Exemplarily, the heating power of the first electronic component 301 is higher than the heating power of the second electronic component 302, and the allowable ambient temperature of the first electronic component 301 is higher than the allowable ambient temperature of the second electronic component 302. For example, the allowable ambient temperature of the first electronic component 301 is higher than 85°C, and the allowable ambient temperature of the second electronic component 302 is lower than 85°C.

[0061] The technical solution provided by the embodiment of the present disclosure can effectively reduce the influence of the heat emitted by the first electronic component 301 on the second electronic component 302, reduce the temperature of the second electronic component 302, and improve the heat dissipation effect of the power conversion equipment by arranging the first electronic component 301 with high heating power and high allowable ambient temperature and the second electronic component 302 with low heating power and low allowable ambient temperature in the first sub-air duct 111 and the second sub-air duct 112 respectively.

[0062] In other examples, the first electronic component 301 and the second electronic component 302 may also be determined based on the importance of the electronic components. For example, if the importance of the second electronic component 302 is higher than that of the first electronic component 301, then after separating the first electronic component 301 and the second electronic component 302, the influence of the heat emitted by the first electronic component 301 on the second electronic component 302 can be effectively reduced, and the reliability of the second electronic component 302 is further improved.

[0063] The circuit board 3 includes a large number of electronic components with different heating powers, and the electronic components with different heating powers are not arranged in different areas. For example, a plurality of electronic components with high heating powers surround an electronic component with low heating power. This makes it very difficult to completely separate the electronic components with high heating power from the electronic components with low heating power, and to arrange them in the first sub-duct 111 and the second sub-duct 112 as the first electronic component 301 and the second electronic component 302, respectively. Therefore, in some examples, the first sub-duct 111 also has a second electronic component 302 to reduce the difficulty of duct isolation.

[0064] Next, the positions of the second electronic component 302 in the first sub-air duct 111 and the second electronic component 302 in the second sub-air duct 112 are exemplarily described.

[0065] In the first air duct 110, when the second electronic component 302 is located upstream of the first electronic component 301, the wind first flows through the second electronic component 302 with low heat generation power, and then flows through the first electronic component 301 with high heat generation power. Therefore, the second electronic component 302 is less affected by the first electronic component 301.

[0066] In the case where the second electronic component 302 is located downstream of the first electronic component 301, the wind first flows through the first electronic component 301 with high heating power and is heated, and then flows through the second electronic component 302 with low heating power. Therefore, the second electronic component 302 with low heating power is greatly affected by the first electronic component 301 with high heating power.

[0067] In summary, since the second electronic components 302 located downstream of the first air duct 110 are greatly affected by the first electronic components 301, these second electronic components 302 are arranged in the second sub-air duct 112. Figure 5-Figure 7 As shown, the second electronic component 302 in the second sub-air duct 112 is close to the air inlet end of the second air duct 120 and away from the air outlet end of the second air duct 120 .

[0068] Since the second electronic components 302 located upstream of the first air duct 110 are less affected by the first electronic components 301, the second electronic components 302 are arranged together with the first electronic components 301 in the first sub-air duct 111. Figure 8 As shown, the second electronic component 302 in the first sub-air duct 111 is close to the air outlet end of the second air duct 120 and away from the air inlet end of the second air duct 120 (such as Figure 8 The capacitor e) is located in the first sub-air duct 111.

[0069] In addition to determining in which sub-air duct the second electronic component 302 is arranged based on whether the second electronic component 302 is upstream or downstream of the first air duct 110, in other examples, the sub-air duct in which the second electronic component 302 is arranged may also be determined based on the difficulty of air duct separation.

[0070] For example, if Figure 8 As shown, the first sub-air duct 111 is located between the first partition 12 and the second partition 13. The second sub-air duct 112 is located between the enclosure 11 and the second partition 13. For the second electronic components 302 without the first electronic components 301 between the enclosure 11, these second electronic components 302 can be conveniently arranged in the second sub-air duct 112.

[0071] As for the second electronic component 302 (such as the first electronic component 301) between the first electronic component 301 and the enclosure 11, Figure 8If the second electronic components 302 are to be arranged in the second sub-air duct 112, then they need to be arranged in the second sub-air duct 112 together with the first electronic components 301 between the second electronic components 302 and the enclosure 11. In this way, the heat dissipation effect of the electronic components in the second sub-air duct 112 will be reduced. Therefore, the embodiment of the present disclosure arranges the second electronic components 302 with the first electronic components 301 between the enclosure 11 in the first sub-air duct 111, thereby ensuring the heat dissipation effect of the second electronic components 302 in the second sub-air duct 112. That is, Figure 8 As shown, the first electronic component 301 exists between the second electronic component 302 in the first sub-air duct 111 and the second partition plate 13 (or referred to as the enclosure plate 11 ).

[0072] The power conversion device has a large number of electronic components with different heating powers inside, and the locations of these electronic components are relatively scattered. Therefore, how to reasonably divide the first sub-air duct 111, the second sub-air duct 112 and the second air duct 120 to maximize the effect of air duct isolation is a key technical issue. Below, the division scheme adopted in the embodiment of the present disclosure is exemplified.

[0073] In some examples, such as Figure 1-Figure 5 As shown, the power conversion device further includes a liquid cooling module 5. The liquid cooling module 5 is attached to the electronic components located in the second air duct 120. The liquid cooling module 5 can also be called a liquid cooling plate, and the liquid cooling module 5 can also be replaced by a heat dissipation fin.

[0074] The technical solution provided by the embodiment of the present disclosure has good heat dissipation effect because the electronic components attached to the liquid cooling module 5 can directly dissipate heat through the liquid cooling module 5. Therefore, these electronic components do not need to be divided into different sub-air ducts, and the area where these electronic components are located is divided into the second air duct 120.

[0075] However, since the electronic components not attached to the liquid cooling module 5 cannot directly dissipate heat through the liquid cooling module 5, the heat dissipation effect is poor, so the second electronic component 302 is also greatly affected by the heat emitted by the first electronic component 301. Therefore, the area where the electronic components not attached to the liquid cooling module 5 are located is determined as the first air duct 110, and the first air duct 110 is divided into a first sub-air duct 111 and a second sub-air duct 112 by the second partition plate 13. Afterwards, the first sub-air duct 11 is provided with the first electronic component 301, and the second sub-air duct 112 is provided with the second electronic component 302, so as to maximize the effect of air duct isolation.

[0076] In some examples, such as Figure 4As shown, the intracavity radiator 4 is connected to the liquid cooling module 5. In this way, the heat of the intracavity radiator 4 can be quickly conducted out through the liquid cooling module 5. In addition, since the liquid cooling module 5 fits the electronic components in the second air duct 120, in order to facilitate the setting of the intracavity radiator 4, at least a part of the intracavity radiator 4 is located in the second air duct 120.

[0077] In some examples, such as Figure 2-Figure 4 As shown, the housing 1 further includes a fourth partition 14, which is located in the second air duct 120. The fourth partition 14 has a receiving portion 141, and the bottom end and both sides of the receiving portion 141 have openings, the opening at the bottom end is used for the radiator 4 in the cavity to extend into, and the openings on both sides are used to connect the air outlet end of the first air duct 110 with the air inlet end of the second air duct 120.

[0078] The following is an exemplary description of the implementation of the circuit board 3.

[0079] In some examples, such as Figure 5 As shown, the circuit board 3 includes a first circuit board 31 and a second circuit board 32. The first circuit board 31 includes a first area 311 and a second area 312. The first area 311 is located in the first sub-air duct 111, and the first area 311 has at least a first electronic component 301. The second area 312 is located in the second sub-air duct 112, and the second area 312 has a second electronic component 302. The second circuit board 32 is located in the second sub-air duct 112, and the second circuit board 32 also has a second electronic component 302. Among them, the first circuit board 31 can be called an output board.

[0080] In some examples, such as Figure 5 As shown, the second electronic component 302 located in the second area 312 of the first circuit board 31 is a lightning arrester d.

[0081] In some examples, such as Figure 5 As shown, the second electronic component 302 located on the second circuit board 32 is a capacitor e.

[0082] In some examples, such as Figure 6 As shown, the circuit board 3 includes a first circuit board 31 and a second circuit board 32. The first circuit board 31 is located in the first sub-air duct 111, and the first circuit board 31 has at least a first electronic component 301. The second circuit board 32 is located in the second sub-air duct 112, and the second circuit board 32 has a second electronic component 302. The first circuit board 31 can be called an output board.

[0083] In some examples, such as Figure 6 As shown, the second electronic component 302 includes a capacitor e.

[0084] In some examples, such as Figure 7As shown, the circuit board 3 includes a first circuit board 31. The first circuit board 31 includes a first area 311 and a second area 312. The first area 311 is located in the first sub-air duct 111, and the first area 311 has at least a first electronic component 301. The second area 312 is located in the second sub-air duct 112, and the second area 312 has a second electronic component 302. Among them, the first circuit board 31 can be called an output board.

[0085] In some examples, such as Figure 7 As shown, the second electronic component 302 includes a lightning arrester d and a capacitor e.

[0086] In some examples, such as Figure 1 , Figure 3-Figure 10 As shown, the circuit board 3 further includes a third circuit board 33. The third circuit board 33 is located in the second air duct 120 and is attached to the liquid cooling module 5.

[0087] In some examples, such as Figure 3 As shown, the third circuit board 33 includes an IGBT module 303, and the IGBT module 303 is attached to the liquid cooling module 5. The third circuit board 33 can be called a power board.

[0088] In some examples, such as Figure 1 and Figure 3-Figure 10 As shown, the circuit board 3 further includes a fourth circuit board 34. The fourth circuit board 34 may be a capacitor board, and the electronic components on the fourth circuit board 34 are capacitors.

[0089] The following is an exemplary description of the form of the second sub-air duct 112. In some examples, such as Fig. 9 As shown, the second sub-air duct 112 includes a guide section 1121 and a heat dissipation section 1122 which are connected in sequence along the wind direction. The guide section 1121 is located in the gap between the circuit board 3 and the enclosure 11. The second electronic component 302 is located in the heat dissipation section 1122. The guide section 1121 is used to guide the wind to the heat dissipation section 1122.

[0090] In some examples, such as Fig. 9 As shown, the cross-sectional area of ​​the air guide section 1121 is smaller than the cross-sectional area of ​​the heat dissipation section 1122 .

[0091] In some examples, such as Fig. 9 As shown, the cross-sectional area of ​​the air guide segment 1121 is smaller than the cross-sectional area of ​​the first sub-air duct 111 .

[0092] In some examples, such as Fig. 9As shown, the second partition 13 includes a bending portion 131, the bending portion 131 is bent toward the first partition 12, and the bending portion 131 is spaced apart from the first partition 12. A heat dissipation section 1122 is formed between the bending portion 131 and the enclosure 11. When the bending portion 131 is bent toward the first partition 12, the distance between the bending portion 131 and the enclosure 11 becomes larger, so that the heat dissipation section 1122 has enough space to accommodate the second electronic component 302. In addition, the bending portion 131 can also guide the wind toward the air inlet end of the second air duct 120.

[0093] In some examples, such as Fig. 9 As shown, the second partition plate 13 further includes a straight portion 132, and a flow guide section 1121 is formed between the straight portion 132 and the enclosure 11. The straight portion 132 may be located between the edge of the circuit board 3 and the enclosure 11.

[0094] The power conversion device provided in the embodiments of the present disclosure may be an energy storage converter. The energy storage converter is a bidirectional current controllable conversion device connecting the energy storage battery and the power grid (or load), which can control the charging and discharging process of the battery, perform AC / DC conversion, and accurately and quickly adjust the voltage, frequency, and power between the power grid and the energy storage battery to achieve constant power and constant current charging and discharging and smooth fluctuating power output.

[0095] In some examples, such as Fig.10 As shown, the energy storage converter 03 provided in the embodiment of the present disclosure is applied to the energy storage cabinet 01. The energy storage cabinet 01 has a battery compartment 011 and a power compartment 012 inside. The battery pack 02 is located in the battery compartment 011, and the energy storage converter 03 is located in the power compartment 012. Among them, the power compartment 012 can also be provided with a DC-DC and a power distribution module.

[0096] The terms used in the embodiments of the present disclosure are only used to explain the embodiments of the present disclosure, and are not intended to limit the present disclosure. Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be the common meanings understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure specification and claims do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one" or "one" do not indicate a quantity limit, but indicate that there is at least one. Similar words such as "include" or "include" mean that the elements or objects appearing in front of "include" or "include" include the elements or objects listed after "include" or "include" and their equivalents, and do not exclude other elements or objects. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly. "Multiple" refers to two or more, unless otherwise clearly defined.

[0097] The above description is only an optional embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A power conversion device, characterized in that: The power conversion device comprises a housing (1), a fan (2), a circuit board (3) and an intracavity heat sink (4); the housing (1) comprises a surrounding plate (11), a first partition plate (12) and a second partition plate (13); The enclosure (11) encloses a receiving cavity, the first partition (12) divides the receiving cavity into a first air duct (110) and a second air duct (120), two ends of the first air duct (110) are respectively connected to two ends of the second air duct (120) in a one-to-one manner to form a closed air duct, and the second partition (13) divides the first air duct (110) into a first sub-air duct (111) and a second sub-air duct (112); The fan (2), the circuit board (3) and the intra-cavity heat sink (4) are arranged in the accommodating cavity.

2. The power conversion device according to claim 1, characterized in that: The first sub-air duct (111) contains at least a first electronic component (301), and the second sub-air duct (112) contains a second electronic component (302); The heat generation power of the first electronic component (301) is higher than the heat generation power of the second electronic component (302), and the allowable ambient temperature of the first electronic component (301) is higher than the allowable ambient temperature of the second electronic component (302).

3. The power conversion device according to claim 2, characterized in that: The first electronic component (301) includes at least one of a relay (a), an inductor (b) and a leakage current protector (c), and the second electronic component (302) includes at least one of a lightning arrester (d), a capacitor (e) and an optical coupler.

4. The power conversion device according to claim 2 or 3, characterized in that: At least a portion of the intra-cavity heat sink (4) is located in the second air duct (120); The second electronic component (302) in the second sub-air duct (112) is close to the air outlet end of the first air duct (110) and away from the air inlet end of the first air duct (110).

5. The power conversion device according to claim 2 or 3, characterized in that: The first sub-air duct (111) is located between the first partition plate (12) and the second partition plate (13), and the second sub-air duct (112) is located between the enclosure plate (11) and the second partition plate (13).

6. The power conversion device according to claim 2 or 3, characterized in that: The first sub-air duct (111) also has the second electronic component (302).

7. The power conversion device according to claim 6, characterized in that: At least a portion of the intra-cavity heat sink (4) is located in the second air duct (120); The second electronic component (302) in the first sub-air duct (111) is close to the air inlet end of the first air duct (110) and away from the air outlet end of the first air duct (110).

8. The power conversion device according to claim 6, characterized in that: The first sub-air duct (111) is located between the first partition plate (12) and the second partition plate (13), and the second sub-air duct (112) is located between the enclosure plate (11) and the second partition plate (13); The first electronic component (301) is present between the second electronic component (302) in the first sub-air duct (111) and the second partition plate (13).

9. The power conversion device according to any one of claims 1 to 3, characterized in that: The second partition plate (13) comprises a bent portion (131), the bent portion (131) is bent toward the first partition plate (12), and the bent portion (131) is spaced apart from the first partition plate (12).

10. The power conversion device according to any one of claims 1 to 3, characterized in that: The power conversion device further comprises a liquid cooling module (5), wherein the liquid cooling module (5) is bonded to the electronic components located in the second air duct (120).

11. The power conversion device according to any one of claims 1 to 3, characterized in that: The fan (2) comprises a first fan (21), wherein the first fan (21) is located at the air inlet end of the first air duct (110) and the boundary area of ​​the air outlet end of the second air duct (120); Alternatively, the first fan (21) is located in the second air duct (120).

12. The power conversion device according to any one of claims 1 to 3, characterized in that: The fan (2) comprises a second fan (22), and the second fan (22) is located at the air outlet end of the first air duct (110) and the junction area with the air inlet end of the second air duct (120); Alternatively, the second fan (22) is located in the second air duct (120).

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