Sapphire wafer surface cleaning mechanism

Abstract

The utility model relates to the technical field of sapphire wafer processing, discloses a sapphire wafer surface cleaning mechanism, and solves the problem that an existing sapphire wafer surface cleaning mechanism is not thorough in cleaning. According to the sapphire surface cleaning device, the surface of sapphire can be cleaned conveniently through the cleaning assembly and the supporting column, when the sapphire surface cleaning device is used, a water inlet pipe inputs water flow into an inserting hole, the water flow enters an inserting pipe through the inserting hole, the inserting pipe inputs the water flow into a rotating disc, the rotating disc sprays water out through a spraying head, and meanwhile a second motor drives a gear to rotate; and the gear drives the turntable to rotate through the teeth, so that the spray head rotates when washing the sapphire wafer, the sapphire surface can be washed more uniformly, and residues on the surface can be prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of sapphire wafer processing, in particular to a sapphire wafer surface cleaning mechanism. Background Art

[0002] Sapphire is a very hard gemstone with a chemical composition of aluminum oxide (Al2O3). Sapphire has the advantages of high temperature resistance, high transparency, and electrical insulation. It can be used in semiconductor manufacturing and optoelectronic devices. When sapphire is processed, it will be sliced. Dirt may remain on the surface of the cut wafer, so the surface needs to be cleaned.

[0003] Chinese patent publication number CN215613602U discloses a sapphire wafer cleaning machine, which relates to the field of gemstone cleaning technology. The sapphire wafer cleaning machine includes a cleaning box for containing cleaning liquid, a telescopic driving device is fixedly installed at the bottom of the inner wall of the cleaning box, a placing plate is fixedly connected to the movable end of the telescopic driving device, a cleaning groove is arranged on the upper surface of the placing plate, a drainage hole for drainage is arranged at the bottom of the cleaning groove, and a placement groove for placing gemstone wafers is opened on the inner wall of the cleaning groove. By arranging the placement groove in the cleaning groove of the placing plate, the effect of relatively vertical placement of the gemstone wafer is achieved, and the problem of the need to turn over the surface of the gemstone wafer is avoided; by arranging the drainage hole at the bottom of the cleaning groove, the cleaning liquid with foreign matter can be effectively discharged in time; the telescopic driving device is arranged to drive the placing plate to move downward so that the gemstone wafer can be immersed in the cleaning liquid of the cleaning water tank, which effectively increases the contact area between the gemstone wafer and the cleaning liquid.

[0004] The above technical solution has the following defects: water rinsing is required when cleaning the sapphire wafer, but water is only sprayed through one nozzle during rinsing, and the sapphire wafer is only immersed to remove impurities. The surface residue is difficult to remove, resulting in residues remaining on the surface of the sapphire wafer, and a large amount of cleaning fluid is used for cleaning, resulting in a waste of resources. Utility Model Content

[0005] The utility model aims to provide a sapphire wafer surface cleaning mechanism. The device is adopted to work, thereby solving the problem that the existing sapphire wafer surface cleaning mechanism is not clean enough.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a sapphire wafer surface cleaning mechanism, comprising a main shell, a support column fixed inside the main shell, and a water inlet pipe fixed to one side of the support column, a drain pipe is fixed to one side of the main shell, a plug hole is opened at the top of the support column, a support block is fixed to the outside of the support column, a cleaning component is arranged at the top of the support column, and a fixing component is arranged above the support column;

[0007] The cleaning component includes a gear rotatably connected to the top of the support block, a second motor is installed at the bottom of one of the support blocks, a turntable is arranged above the support column, a cannula is fixed at the bottom of the turntable, teeth are fixed on the outside of the turntable, and a nozzle is fixed at the top of the turntable.

[0008] Furthermore, there are three gears, which are evenly spaced outside the turntable.

[0009] Furthermore, the rotating shaft of the second motor is fixedly connected to one of the gears, and the gear is meshed with the rotating disk through teeth.

[0010] Furthermore, the inner diameter of the jack matches the outer diameter of the cannula, and the cannula is inserted into the jack.

[0011] Furthermore, the socket is connected to the interior of the water inlet pipe, the turntable is connected to the interior of the spray head, and the insert is connected to the interior of the insert.

[0012] Furthermore, the fixing assembly includes a first support frame fixed on one side of the support column, a first motor is installed on one side of the first support frame, a first fixing ring is fixed to the rotating shaft of the first motor, a second support frame is fixed to the side of the support column away from the first support frame, a flip frame is rotatably connected to one side of the second support frame, a guide slide rod is fixed to one side of the flip frame, a spring is sleeved on the outside of the guide slide rod, a second fixing ring is arranged on the side of the first fixing ring close to the flip frame, and a through hole is opened inside the second fixing ring.

[0013] Furthermore, the spring passes through the interior of the through hole, and a side of the spring away from the flip frame is fixedly connected to the first fixing ring.

[0014] Furthermore, the second fixing ring forms a telescopic structure outside the guide slide rod through a spring, and the first fixing ring forms a flip structure on one side of the first support frame.

[0015] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0016] 1. The utility model proposes a sapphire wafer surface cleaning mechanism. The existing sapphire wafer surface cleaning mechanism does not clean thoroughly enough. The utility model can clean the sapphire surface conveniently through the cleaning component and the support column. When in use, the water inlet pipe inputs water flow into the inside of the socket. At this time, the water flow enters the inside of the plug through the socket. The plug inputs the water flow into the inside of the turntable, and the turntable sprays water through the nozzle. At the same time, the second motor drives the gear to rotate, and the gear drives the turntable to rotate through the teeth, so that the nozzle can rotate when washing the sapphire wafer, so that the sapphire surface can be washed more evenly and residues on the surface can be prevented.

[0017] 2. The sapphire wafer surface cleaning mechanism proposed by the utility model can fix the sapphire wafer conveniently through the fixing assembly. The sapphire wafer needs to be fixed during use. At this time, the second fixing ring is pulled to slide outside the guide slide rod. At this time, the spring is compressed. Then the sapphire wafer is placed between the first fixing ring and the second fixing ring. Then the second fixing ring is released. The elastic force of the spring pushes the second fixing ring to clamp the sapphire wafer to achieve a fixing effect. After cleaning one side of the sapphire wafer during use, the first motor is started to drive the first fixing ring to flip, so that the sapphire wafer can be turned over. Then the other side of the sapphire wafer can be cleaned, and multi-sided precise cleaning can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the top view structure of the utility model;

[0020] Figure 3 This is a schematic diagram of the overall structure of the cleaning component of the utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the fixing assembly of the utility model;

[0022] Figure 5 For the utility model Figure 4 Schematic diagram of the local enlarged structure at point A in the middle.

[0023] In the figure: 1. main shell; 11. drain pipe; 2. fixing assembly; 21. first support frame; 22. first motor; 23. first fixing ring; 24. second fixing ring; 241. through hole; 25. second support frame; 26. flip frame; 261. guide slide rod; 262. spring; 3. cleaning assembly; 31. turntable; 311. teeth; 312. nozzle; 32. insert pipe; 33. gear; 34. second motor; 4. support column; 41. water inlet pipe; 42. socket; 43. support block. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] In order to further understand the content of the utility model, the utility model is described in detail in conjunction with the accompanying drawings.

[0026] Combination Figure 1 and Figure 2 The sapphire wafer surface cleaning mechanism includes a main shell 1, a support column 4 fixed inside the main shell 1, and a water inlet pipe 41 fixed on one side of the support column 4. A drain pipe 11 is fixed on one side of the main shell 1.

[0027] Specifically, when in use, the sapphire wafer is fixed by the fixing assembly 2, and then water is sprayed through the nozzle 312 to clean the sapphire wafer. The cleaned water can be retained inside the main shell 1 and can be discharged to the outside through the drain pipe 11.

[0028] The utility model is further described below in conjunction with embodiments.

[0029] Embodiment 1:

[0030] See also Figure 3 A plug hole 42 is provided at the top of the support column 4, a support block 43 is fixed to the outside of the support column 4, a cleaning assembly 3 is provided at the top of the support column 4, a fixing assembly 2 is provided above the support column 4, the cleaning assembly 3 includes a gear 33 rotatably connected to the top of the support block 43, a second motor 34 is installed at the bottom of one of the support blocks 43, a turntable 31 is provided above the support column 4, a cannula 32 is fixed to the bottom of the turntable 31, a tooth 311 is fixed to the outside of the turntable 31, and a The nozzle 312 and the gears 33 are arranged in three numbers. The three gears 33 are evenly spaced outside the turntable 31. The rotating shaft of the second motor 34 is fixedly connected to one of the gears 33. The gear 33 is meshed with the turntable 31 through the teeth 311. The inner diameter of the jack 42 matches the outer diameter of the plug 32. The plug 32 is inserted into the jack 42. The jack 42 is connected to the inside of the water inlet pipe 41. The turntable 31 is connected to the inside of the nozzle 312. The plug 32 is connected to the inside of the plug 32.

[0031] Specifically, when in use, the water inlet pipe 41 inputs water into the inside of the socket 42, and the water flows into the inside of the plug 32 through the socket 42. The plug 32 inputs the water flow into the inside of the turntable 31, and the turntable 31 sprays water through the nozzle 312. At the same time, the second motor 34 drives the gear 33 to rotate, and the gear 33 drives the turntable 31 to rotate through the teeth 311, so that the nozzle 312 can rotate when rinsing the sapphire wafer, which can make the sapphire surface rinse more evenly and prevent residue from remaining on the surface.

[0032] Embodiment 2:

[0033] See also Figure 4 and Figure 5The fixing assembly 2 includes a first support frame 21 fixed to one side of the support column 4, a first motor 22 is installed on one side of the first support frame 21, a first fixing ring 23 is fixed to the rotating shaft of the first motor 22, a second support frame 25 is fixed to the side of the support column 4 away from the first support frame 21, a flip frame 26 is rotatably connected to one side of the second support frame 25, a guide slide bar 261 is fixed to one side of the flip frame 26, a spring 262 is sleeved on the outside of the guide slide bar 261, a second fixing ring 24 is provided on the side of the first fixing ring 23 close to the flip frame 26, a through hole 241 is opened inside the second fixing ring 24, a spring 262 runs through the inside of the through hole 241, and the side of the spring 262 away from the flip frame 26 is fixedly connected to the first fixing ring 23, the second fixing ring 24 forms a telescopic structure on the outside of the guide slide bar 261 through the spring 262, and the first fixing ring 23 forms a flip structure on one side of the first support frame 21.

[0034] Specifically, the sapphire wafer needs to be fixed during use. At this time, the second fixing ring 24 is pulled to slide outside the guide slide bar 261. At this time, the spring 262 is compressed, and then the sapphire wafer is placed between the first fixing ring 23 and the second fixing ring 24. Then the second fixing ring 24 is released, and the elastic force of the spring 262 pushes the second fixing ring 24 to clamp the sapphire wafer to achieve a fixing effect. After cleaning one side of the sapphire wafer during use, the first motor 22 is started to drive the first fixing ring 23 to flip, so that the sapphire wafer can be turned over, and then the other side of the sapphire wafer can be cleaned, so that multi-sided precise cleaning can be achieved.

[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A sapphire wafer surface cleaning mechanism, comprising a main housing (1), a support column (4) fixed inside the main housing (1), and a water inlet pipe (41) fixed to one side of the support column (4), characterized in that: A drainage pipe (11) is fixed to one side of the main housing (1); a plug hole (42) is provided at the top of the support column (4); a support block (43) is fixed to the outside of the support column (4); a cleaning component (3) is provided at the top of the support column (4); and a fixing component (2) is provided above the support column (4); The cleaning assembly (3) comprises a gear (33) rotatably connected to the top of a support block (43), a second motor (34) is installed at the bottom end of one of the support blocks (43), a turntable (31) is arranged above the support column (4), a cannula (32) is fixed at the bottom end of the turntable (31), teeth (311) are fixed on the outside of the turntable (31), and a nozzle (312) is fixed at the top end of the turntable (31).

2. The sapphire wafer surface cleaning mechanism according to claim 1, characterized in that: The gears (33) are provided in three numbers, and the three gears (33) are distributed at equal intervals outside the rotating disk (31).

3. The sapphire wafer surface cleaning mechanism according to claim 2, characterized in that: The rotating shaft of the second motor (34) is fixedly connected to one of the gears (33), and the gear (33) is meshingly connected to the rotating disk (31) via teeth (311).

4. The sapphire wafer surface cleaning mechanism according to claim 1, characterized in that: The inner diameter of the insertion hole (42) matches the outer diameter of the insertion tube (32), and the insertion tube (32) is inserted into the interior of the insertion hole (42).

5. The sapphire wafer surface cleaning mechanism according to claim 1, characterized in that: The insertion hole (42) is connected to the interior of the water inlet pipe (41), the rotating disk (31) is connected to the interior of the spray head (312), and the insertion tube (32) is connected to the interior of the insertion tube (32).

6. The sapphire wafer surface cleaning mechanism according to claim 1, characterized in that: The fixing assembly (2) comprises a first support frame (21) fixed to one side of a support column (4); a first motor (22) is installed on one side of the first support frame (21); a first fixing ring (23) is fixed to the rotating shaft of the first motor (22); a second support frame (25) is fixed to the side of the support column (4) away from the first support frame (21); a flip frame (26) is rotatably connected to one side of the second support frame (25); a guide slide bar (261) is fixed to one side of the flip frame (26); a spring (262) is sleeved on the outside of the guide slide bar (261); a second fixing ring (24) is arranged on the side of the first fixing ring (23) close to the flip frame (26); a through hole (241) is opened inside the second fixing ring (24).

7. The sapphire wafer surface cleaning mechanism according to claim 6, characterized in that: The spring (262) passes through the interior of the through hole (241), and the side of the spring (262) away from the flip frame (26) is fixedly connected to the first fixing ring (23).

8. The sapphire wafer surface cleaning mechanism according to claim 6, characterized in that: The second fixing ring (24) forms a telescopic structure outside the guide slide rod (261) through a spring (262), and the first fixing ring (23) forms a flipping structure on one side of the first support frame (21).

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