Coated silicon wafer heating equipment

Abstract

The utility model relates to coated silicon wafer heating equipment which comprises a main body, and a heating cavity is formed in the main body. The device further comprises a heating mechanism, the heating mechanism comprises multiple heating plate single bodies and a heating assembly, every two adjacent heating plate single bodies abut against each other, the multiple heating plate single bodies are located on the same horizontal plane, and the multiple heating plate single bodies are all located in the heating cavity. And each heating plate single body is provided with the heating assembly. The method has the effect of saving resources.

Description

Technical Field

[0001] The present application relates to the technical field of heating structures, and in particular to a coating silicon wafer heating device. Background Art

[0002] During the vacuum coating process, the silicon wafer needs to be heated. The existing heating method usually adopts radiation heating, that is, in a vacuum environment, the carrier passes through a heat source, and the heat source heats the silicon wafer in the form of thermal radiation.

[0003] At present, a coated silicon wafer heating device comprises a main body, a heating cavity is opened on the main body, a whole heating plate is placed in the heating cavity, and an electric heating wire is placed in the heating plate.

[0004] When a part of the heating plate is damaged, the entire heating plate needs to be discarded, thus causing a waste of resources. Utility Model Content

[0005] In order to save resources, the present application provides a coated silicon wafer heating device.

[0006] The present application provides a coated silicon wafer heating device, which adopts the following technical solution:

[0007] A coated silicon wafer heating device comprises a main body, in which a heating cavity is formed; and a heating mechanism, wherein the heating mechanism comprises a heating plate unit and a heating assembly, wherein a plurality of the heating plate units are provided, and two adjacent heating plate units are in contact with each other, and the plurality of heating plate units are located on the same horizontal plane, and the plurality of heating plate units are located in the heating cavity; and the heating assembly is provided on each of the heating plate units.

[0008] By adopting the above technical solution, since each heating plate monomer is connected to a separate heating component, when a certain heating plate monomer is damaged, the damaged heating plate monomer can be directly replaced, and the other heating plate monomers will not be affected during the replacement; therefore, the heating mechanism provided in the present application can replace a heating plate monomer that is damaged somewhere without affecting other heating plate monomers, thereby achieving the purpose of saving resources.

[0009] Optionally, the heating assembly includes a heating coil, a docking joint, a connecting terminal, a first fixing bolt and a second fixing bolt, the heating coil is arranged on the heating plate unit, the docking joint is arranged on the heating plate unit via the first fixing bolt, and the heating coil is connected to the docking joint; the connecting terminal is arranged on the main body via the second fixing bolt and connected to the docking joint.

[0010] By adopting the above technical solution, the butt joint is connected to the heating plate unit through the first fixing bolt, and the terminal is connected to the main body through the second fixing bolt. When the butt joint is connected to the terminal, the heating coil can be energized to achieve heating.

[0011] Optionally, a first alignment guide mechanism is provided on the docking joint, and the first alignment guide mechanism includes a first connecting block, a first guide block, a first alignment block and a first connecting bolt. A first connecting groove is provided on the docking joint, the first connecting block is clamped with the first connecting groove, and the first connecting bolt passes through the docking joint and is threadedly connected with the first connecting block; the first guide block is provided on the first connecting block, and a guide groove clamped with the first guide block is provided on the wiring terminal; the first alignment block is provided at one end of the first guide block away from the first connecting block, and the cross-sectional area of ​​the first alignment block gradually decreases in the direction away from the first guide block.

[0012] By adopting the above technical solution, the first connecting block is fixed in the first connecting groove of the docking groove by the first connecting bolt; before the docking head is electronically connected to the wiring, because the cross-sectional area of ​​the first alignment block gradually decreases in the direction away from the first guide block, the first alignment block can be easily entered into the guide groove quickly, and under the guidance of the first alignment block, the first guide block will also enter the guide groove, and when the first guide block is completely located in the guide groove, the wiring head will be connected to the wiring terminal.

[0013] Optionally, it also includes a second alignment guide mechanism, which includes a guide block, a second connecting block, a second guide block, a second alignment block and a second connecting bolt, the guide block is arranged on the heating plate unit, and a guide hole is provided on the guide block; a second connecting groove is provided on the main body to be engaged with the second connecting block, and the second connecting bolt passes through the main body and is threadedly connected to the second connecting block; the second guide block is arranged on the second connecting block, and the second alignment block is arranged at an end of the second guide block away from the second connecting block, and the cross-sectional area of ​​the second alignment block gradually decreases in the direction away from the second guide block; and when the docking joint is connected to the wiring terminal, the second alignment block and the second guide block are located in the guide hole.

[0014] By adopting the above technical solution, the second connecting block is connected to the second connecting groove through the second connecting bolt; before the docking joint is electronically connected to the wiring, because the second alignment block gradually becomes smaller in the direction of the cross-sectional area away from the second guide block, the second alignment block can quickly enter the guide hole of the guide block, and then the second guide block will follow the second alignment block into the guide hole; when the second alignment block is located in the guide hole, the docking joint is not connected to the wiring terminal, and when the second guide block is completely located in the guide hole, the docking joint is connected to the wiring terminal.

[0015] Optionally, the cross-section of the second connecting block is larger than the cross-section of the guide hole, and a stabilizing component is provided on the heating plate unit, the stabilizing component includes a stabilizing plate and a stabilizing bolt, the stabilizing plate is in contact with the heating plate unit, a first through hole is provided on the stabilizing plate, a first threaded hole is provided on the second alignment block, and the stabilizing bolt passes through the first through hole and is threadedly connected to the first threaded hole.

[0016] By adopting the above technical solution, when the second guide block is completely located in the guide hole and the joint is connected to the wiring terminal, the second connecting block will contact the heating plate unit or the guide block to play a supporting role; then the stabilizing plate will contact the heating plate unit, so that the first through hole on the stabilizing plate is connected with the first threaded hole on the second alignment block, and then the stabilizing bolt is passed through the first through hole and threadedly connected with the first threaded hole; the set stabilizing component can improve the stability of the heating plate unit on the main body.

[0017] Optionally, a lifting mechanism is provided on the heating plate unit, and the lifting mechanism includes a mounting block, a rotating shaft, a lifting block and a third fixing bolt. The mounting block is connected to the heating plate unit through the third fixing bolt, the rotating shaft is rotatably provided on the mounting block, and the lifting block is provided on the rotating shaft.

[0018] By adopting the above technical solution, when a certain heating plate monomer is damaged, the operator uses the lifting block, and the lifting block will move the heating plate monomer, thereby facilitating the operator to transfer the heating plate monomer.

[0019] Optionally, a liquid outlet hole is provided on the main body.

[0020] By adopting the above technical solution, some liquid may exist when the silicon wafer is heated. In order to reduce the accumulation of liquid, one of the heating plate units is taken out, and then the liquid flows out through the liquid outlet hole on the main body.

[0021] Optionally, a flow guide mechanism is provided on the main body, and the flow guide mechanism includes a flow guide block and a fourth fixing bolt. The flow guide block is provided on the main body through the fourth fixing bolt. A flow guide hole is provided on the flow guide block, and the flow guide hole is connected to the liquid outlet.

[0022] By adopting the above technical solution, the guide block is connected to the main body through the fourth fixing bolt, the liquid flowing out of the liquid outlet hole enters the guide hole of the guide block, and then the guide hole guides the liquid to the position where the liquid is collected; the set guide mechanism reduces the splashing phenomenon of the liquid flowing out of the liquid outlet hole.

[0023] In summary, the present application includes at least one of the following beneficial technical effects:

[0024] 1. The heating mechanism provided in the present application can replace a damaged heating plate monomer at a certain location without affecting other heating plate monomers, thereby achieving the purpose of saving resources;

[0025] 2. The provided stabilizing component can improve the stability of the heating plate unit on the main body. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the structure of a coated silicon wafer heating device in an embodiment of the present application;

[0027] Figure 2 This is a schematic diagram of the structure of the support block in the embodiment of the present application;

[0028] Figure 3 This is a schematic diagram of the structure of the heating mechanism in the embodiment of the present application;

[0029] Figure 4 This is a schematic diagram of the structure of the second alignment guide mechanism in the embodiment of the present application;

[0030] Figure 5 This is a schematic structural diagram of a first alignment guide mechanism in an embodiment of the present application;

[0031] Figure 6 This is a schematic diagram of the structure of the stabilizing component in the embodiment of the present application;

[0032] Figure 7 This is a schematic diagram of the structure of the lifting mechanism in the embodiment of the present application;

[0033] Figure 8 Schematic diagram of the structure of the reinforcement mechanism in the embodiment of the present application.

[0034] Figure numerals: 1, main body; 11, support frame; 12, support plate; 121, liquid outlet; 13, support block; 14, heating chamber; 2, heating mechanism; 21, heating plate monomer; 211, mounting groove; 22, heating assembly; 221, docking joint; 222, wiring terminal; 2221, guide groove; 223, first fixing bolt; 224, second fixing bolt; 3, first alignment guide mechanism; 31, first connecting block; 32, first guide block; 33, first alignment block; 34, first connecting bolt; 4, The second alignment guide mechanism; 41. guide block; 411. guide hole; 42. second connecting block; 43. second guide block; 44. second alignment block; 441. first threaded hole; 45. second connecting bolt; 5. stabilizing assembly; 51. stabilizing plate; 52. stabilizing bolt; 6. lifting mechanism; 61. mounting block; 62. rotating shaft; 63. lifting block; 64. third fixing bolt; 7. guide block; 71. guide hole; 8. reinforcement mechanism; 81. reinforcement block; 82. adjusting shaft; 83. gear; 84. rack. DETAILED DESCRIPTION

[0035] The following is combined with Figure 1-8 This application is described in further detail.

[0036] The embodiment of the present application discloses a coated silicon wafer heating device.

[0037] refer to Figure 1 As shown in FIG. 2 , a coated silicon wafer heating device comprises a main body 1 , a heating cavity 14 is formed on the main body 1 , and a heating mechanism 2 is placed in the heating cavity 14 .

[0038] refer to Figure 1 As shown in Figure 2, the main body 1 includes a support frame 11, to which a support plate 12 is fixedly connected, and a support block 13 is fixed to one side of the support plate 12; the space between the side of the support plate 12 away from the support block 13 and the end of the support frame 11 away from the support block 13 is a heating chamber 14.

[0039] refer to Figure 1 and Figure 3 The heating mechanism 2 includes a plurality of heating plate monomers 21 , and each heating plate monomer 21 is provided with a heating component 22 connected to the support plate 12 .

[0040] refer to Figure 4 and Figure 5The heating assembly 22 includes a heating coil fixedly connected to the heating plate unit 21; the heating plate unit 21 is provided with a first assembly groove, and a docking head 221 connected to the heating coil is clamped in the first assembly groove; a first fixing bolt 223 is provided on the docking head 221, a second through hole is provided on the docking head 221, a second threaded hole is provided on the heating plate unit 21, and the first fixing bolt 223 passes through the second through hole and is threadedly connected to the second threaded hole. A second assembly groove is provided on the support plate 12, a wiring terminal 222 is clamped in the second assembly groove, a third through hole is provided on the wiring terminal 222, a third threaded hole is provided on the support plate 12, a second fixing bolt 224 is provided on the wiring terminal 222, the second fixing bolt 224 passes through the third through hole and is threadedly connected to the third threaded hole, and the docking head 221 is connected to the wiring terminal 222, and the copper joint on the docking head 221 contacts the copper contact plate on the wiring terminal 222.

[0041] refer to Figure 4 and Figure 5 In order to quickly connect the butt joint 221 to the wiring terminal 222, a first alignment guide mechanism 3 is provided on the wiring terminal 222, a first connection groove is provided on the wiring terminal 222, a fourth through hole connected to the first connection groove is provided on the wiring terminal 222, and the first alignment guide mechanism 3 includes a first connection block 31 clamped with the first connection groove, and a fourth threaded hole is provided on the first connection block 31; a first connection bolt 34 is provided on the wiring terminal 222, and the first connection bolt 34 passes through the fourth through hole and is threadedly connected to the fourth threaded hole The first connecting block 31 is integrally provided with a first guide block 32, the cross-sectional area of ​​the first guide block 32 is larger than the cross-sectional area of ​​the first connecting block 31, and the end of the first guide block 32 away from the first connecting block 31 is fixedly connected with a first alignment block 33, and the cross-sectional area of ​​the first alignment block 33 gradually decreases in the direction away from the first guide block 32; the connecting terminal 222 is provided with a guide groove 2221, the first alignment block 33 and the first guide block 32 are located in the guide groove 2221, and the first guide block 32 and the guide groove 2221 are clamped.

[0042] When the first guide block 32 is engaged with the guide groove 2221 , the docking head 221 is connected to the wiring terminal 222 .

[0043] refer to Figure 4 and Figure 6A second alignment guide mechanism 4 is provided on the support plate 12, a second connecting groove is provided on the support plate 12, a fifth through hole connected to the second connecting groove is provided on the support plate 12, the second alignment guide mechanism 4 includes a second connecting block 42 clamped with the second connecting groove, a fifth threaded hole is provided on the second connecting block 42, a second connecting bolt 45 is provided on the support plate 12, and the second connecting bolt 45 passes through the fifth through hole and is threadedly connected to the fifth threaded hole; a second guide block 43 is fixedly connected to one end of the second connecting block 42 away from the support plate 12, and a cross section of the second guide block 43 is smaller than a cross section of the second connecting block 42; the second guide block 43 is far away A second alignment block 44 is fixedly connected to one end away from the second connection block 42, and the cross-sectional area of ​​the second alignment block 44 gradually decreases in the direction away from the second guide block 43; and the relative height of the end of the second alignment block 44 away from the support plate 12 is higher than the relative height of the end of the terminal 222 away from the support plate 12; a guide block 41 is fixedly connected to the heating plate monomer 21, and a guide hole 411 is provided on the guide block 41, and the cross-sectional area of ​​the guide hole 411 is smaller than the cross-sectional area of ​​the second connection block 42, and the second alignment block 44 and the second guide block 43 can be located in the guide hole 411 of the guide block 41, and the guide block 41 contacts the second connection block 42. When the guide block 41 contacts the second connection block 42, the terminal 222 is connected to the docking joint 221, and the end of the second alignment block 44 away from the second guide block 43 is located on the same horizontal plane as the side of the heating plate monomer 21 away from the support plate 12.

[0044] A first threaded hole 441 is provided at one end of the second alignment block 44 away from the second guide block 43, and a stabilizing component 5 is provided on the heating plate monomer 21. The stabilizing component 5 includes a stabilizing plate 51 that contacts the heating plate monomer 21, and a first through hole connected to the first threaded hole 441 is provided on the stabilizing plate 51; a stabilizing bolt 52 is provided on the stabilizing plate 51, and the stabilizing bolt 52 passes through the first through hole on the stabilizing plate 51 and is threadedly connected to the first threaded hole 441 on the second alignment block 44.

[0045] refer to Figure 3 and Figure 7 A mounting groove 211 is provided on the heating plate monomer 21, and a lifting mechanism 6 is arranged on the heating plate monomer 21. The lifting mechanism 6 includes a mounting block 61 that abuts against the bottom wall of the mounting groove 211, a sixth through hole is provided on the mounting block 61, a sixth threaded hole is provided on the bottom wall of the mounting groove 211, and a third fixing bolt 64 is provided on the mounting block 61. The third fixing bolt 64 passes through the sixth through hole and is threadedly connected to the sixth threaded hole; a rotating shaft 62 is rotatably connected to the mounting block 61, and a lifting block 63 is fixedly connected to the rotating shaft 62.

[0046] Then the operator pulls the lifting block 63 , and the lifting block 63 drives the heating plate unit 21 to move.

[0047] refer to Figure 2 and Figure 3 A liquid outlet hole 121 is provided on the support plate 12, a card slot is provided on the support plate 12, a guide mechanism is provided on the support plate 12, the guide mechanism includes a guide block 7 connected to the card slot, and the guide block 7 is provided with a liquid outlet hole 121 connected to the liquid outlet hole 121; a seventh through hole connected to the card slot is provided on the support plate 12, a seventh threaded hole is provided on the guide block 7, and a fourth fixing bolt is provided on the support plate 12, and the fourth fixing bolt passes through the seventh through hole and is threadedly connected to the seventh threaded hole.

[0048] refer to Figure 2 and Figure 8 A reinforcement mechanism 8 is provided on the support plate 12, and the reinforcement mechanism 8 includes a reinforcement block 81 slidably connected to the support plate 12, and a reinforcement groove engaged with the reinforcement block 81 is opened on the guide block 7; an adjustment shaft 82 is rotatably connected to the support plate 12, and a gear 83 is key-connected to the adjustment shaft 82; a rack 84 meshing with the gear 83 is fixedly connected to the side wall of the reinforcement block 81.

[0049] When the guide block 7 is engaged with the slot, the adjusting shaft 82 is rotated, the adjusting shaft 82 drives the gear 83 to rotate, the gear 83 drives the rack 84 to move, and the rack 84 drives the reinforcement block 81 to move, so that the reinforcement block 81 is engaged with the reinforcement slot on the guide block 7.

[0050] The implementation principle of a coated silicon wafer heating device according to an embodiment of the present application is as follows: when the docking joint 221 on the heating plate unit 21 needs to be connected to the wiring terminal 222 on the support plate 12, the heating plate unit 21 is moved toward the direction close to the support plate 12, and the second alignment block 44 will first enter the guide hole 411 of the guide block 41, and under the guidance of the second alignment block 44, the end of the second guide block 43 close to the second alignment block 44 will enter the guide hole 411 of the guide block 41; when the middle part of the second guide block 43 is located in the guide hole 411 of the guide block 41, the first alignment block 43 is moved toward the guide hole 411 of the guide block 41, and the second alignment block 43 is moved toward the guide hole 411 of the guide block 41. The block 33 will enter the guide groove 2221 of the terminal 222, and under the guidance of the first alignment block 33, the end of the first guide block 32 close to the first alignment block 33 will also enter the guide groove 2221 of the terminal 222; continue to move the heating plate monomer 21, when the second connecting block 42 contacts the guide block 41, the first guide block 32 will completely enter the guide groove 2221 of the terminal 222, and at this time, the docking joint 221 on the heating plate monomer 21 is connected to the terminal 222 on the support plate 12, so that the heating coil can generate heat.

[0051] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A coated silicon wafer heating device, comprising a main body (1), wherein a heating chamber (14) is formed in the main body (1); characterized in that: It also comprises a heating mechanism (2), the heating mechanism (2) comprising a heating plate monomer (21) and a heating assembly (22), a plurality of the heating plate monomers (21) are provided, two adjacent heating plate monomers (21) are in contact with each other, the plurality of heating plate monomers (21) are located on the same horizontal plane, and the plurality of heating plate monomers (21) are all located in the heating chamber (14); and the heating assembly (22) is provided on each of the heating plate monomers (21).

2. The coated silicon wafer heating device according to claim 1, characterized in that: The heating assembly (22) comprises a heating coil, a docking joint (221), a connecting terminal (222), a first fixing bolt (223) and a second fixing bolt (224); the heating coil is arranged on the heating plate unit (21); the docking joint (221) is arranged on the heating plate unit (21) via the first fixing bolt (223), and the heating coil is connected to the docking joint (221); the connecting terminal (222) is arranged on the main body (1) via the second fixing bolt (224) and is connected to the docking joint (221).

3. The coated silicon wafer heating device according to claim 2, characterized in that: The docking joint (221) is provided with a first alignment guide mechanism (3), the first alignment guide mechanism (3) comprising a first connection block (31), a first guide block (32), a first alignment block (33) and a first connection bolt (34); the docking joint (221) is provided with a first connection groove, the first connection block (31) is clamped with the first connection groove, and the first connection bolt (34) passes through the docking joint (221) and is threadedly connected with the first connection block (31); the first guide block (32) is provided on the first connection block (31), and the wiring terminal (222) is provided with a guide groove (2221) clamped with the first guide block (32); the first alignment block (33) is provided at one end of the first guide block (32) away from the first connection block (31), and the cross-sectional area of ​​the first alignment block (33) gradually decreases in a direction away from the first guide block (32).

4. The coated silicon wafer heating device according to claim 2, characterized in that: The heating plate body (21) further comprises a second alignment guide mechanism (4), the second alignment guide mechanism (4) comprising a guide block (41), a second connecting block (42), a second guide block (43), a second alignment block (44) and a second connecting bolt (45), the guide block (41) being arranged on the heating plate body (21), the guide block (41) being provided with a guide hole (411); the main body (1) being provided with a second connecting groove which is engaged with the second connecting block (42), the second connecting bolt (45) passing through the main body (1) and the second connecting block (42); The connecting block (42) is threadedly connected; the second guide block (43) is arranged on the second connecting block (42); the second alignment block (44) is arranged at one end of the second guide block (43) away from the second connecting block (42); the cross-sectional area of ​​the second alignment block (44) gradually decreases in a direction away from the second guide block (43); and when the docking head (221) is connected to the wiring terminal (222), the second alignment block (44) and the second guide block (43) are located in the guide hole (411).

5. The coated silicon wafer heating device according to claim 4, characterized in that: The cross section of the second connection block (42) is larger than the cross section of the guide hole (411); a stabilizing component (5) is provided on the heating plate unit (21); the stabilizing component (5) comprises a stabilizing plate (51) and a stabilizing bolt (52); the stabilizing plate (51) contacts the heating plate unit (21); a first through hole is provided on the stabilizing plate (51); a first threaded hole (441) is provided on the second alignment block (44); and the stabilizing bolt (52) passes through the first through hole and is threadedly connected to the first threaded hole (441).

6. The coated silicon wafer heating device according to claim 1, characterized in that: The heating plate unit (21) is provided with a lifting mechanism (6), the lifting mechanism (6) comprising a mounting block (61), a rotating shaft (62), a lifting block (63) and a third fixing bolt (64), the mounting block (61) is connected to the heating plate unit (21) via the third fixing bolt (64), the rotating shaft (62) is rotatably disposed on the mounting block (61), and the lifting block (63) is disposed on the rotating shaft (62).

7. The coated silicon wafer heating device according to claim 1, characterized in that: The main body (1) is provided with a liquid outlet hole (121).

8. The coated silicon wafer heating device according to claim 7, characterized in that: The main body (1) is provided with a flow guiding mechanism, the flow guiding mechanism comprising a flow guiding block (7) and a fourth fixing bolt, the flow guiding block (7) being arranged on the main body (1) via the fourth fixing bolt, the flow guiding block (7) being provided with a flow guiding hole (71), the flow guiding hole (71) being in communication with the liquid outlet hole (121).

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