Wafer bump electroforming template

Abstract

The utility model discloses a wafer bump electroforming template which comprises a bottom plate, an electrolyte box is placed above the bottom plate, a standing plate is fixedly connected to the upper surface of the bottom plate, a motor is installed on the bottom face of the standing plate, a threaded rod is fixedly connected to the output end of the motor, a threaded cylinder is in threaded connection with the outer surface of the threaded rod, and a threaded rod is installed on the threaded cylinder. The bottom end of the threaded cylinder is fixedly connected with a hanging plate, the bottom face of the hanging plate is fixedly connected with two L-shaped plates, and the front ends of the two L-shaped plates are jointly and fixedly connected with a containing frame. According to the device, the placement frame, the L-shaped plate, the hanging plate, the motor, the threaded rod and the threaded cylinder are matched, the threaded rod can be driven to rotate in the threaded cylinder by utilizing the work of the motor, the threaded cylinder can move on the threaded rod, meanwhile, the placement frame can be driven, and an electroforming template on the placement frame can be gradually separated from an electrolyte box; and a worker can conveniently take the electroforming template, so that the production efficiency of the wafer bump by the worker is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer bump electroforming, in particular to a wafer bump electroforming template. Background Art

[0002] Wafer bump electroforming template plays a key role in the wafer manufacturing process. It is mainly used to make wafer bumps. One of the key steps in making wafer bumps is to deposit the metal layer under the bumps. This metal layer not only serves as an interconnect bonding layer, but also blocks the diffusion of material atoms to the underlying metal material, bonds the underlying dielectric material and metal layer, and blocks the migration of contaminants.

[0003] Wafer bumps are formed using the principle of electrolytic deposition, but current electroforming templates are usually removed from the electrolyte manually using tools after the wafer bumps are formed. This method affects the worker's production efficiency of wafer bumps. To this end, we propose a wafer bump electroforming template to solve the above problem. Utility Model Content

[0004] The utility model aims to provide a wafer bump electroforming template to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A wafer bump electroforming template comprises a base plate, an electrolyte tank is placed above the base plate, a station plate is fixedly connected to the upper surface of the base plate, a motor is installed on the bottom surface of the station plate, a threaded rod is fixedly connected to the output end of the motor, a threaded barrel is threadedly connected to the outer surface of the threaded rod, a hanging plate is fixedly connected to the bottom end of the threaded barrel, two L-shaped plates are fixedly connected to the bottom surface of the hanging plate, a placement frame is fixedly connected to the front ends of the two L-shaped plates, and the electroforming template body is placed above the placement frame.

[0007] In a further embodiment, two positioning grooves are provided on the upper surface of the bottom plate, a positioning block is inserted into the inner wall of each positioning groove, and a top end of each positioning block is connected to the bottom surface of the electrolyte tank.

[0008] In a further embodiment, two stabilizing plates are fixedly connected to the upper surface of the hanging plate, a sliding hole is opened on the upper surface of each of the stabilizing plates, a stabilizing rod is slidably connected to the inner wall of each of the sliding holes, and the top end of each of the stabilizing rods is connected to the bottom surface of the standing plate.

[0009] In a further embodiment, the bottom ends of the two stabilizing rods are commonly fixedly connected to a support plate, and the back side of the support plate is connected to the front side of the standing plate.

[0010] In a further embodiment, handles are fixedly connected to the left and right sides of the electrolyte box.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] The device cooperates with the placement frame, L-shaped plate, hanging plate, motor, threaded rod and threaded barrel. The motor can drive the threaded rod to rotate inside the threaded barrel, and the threaded barrel will move on the threaded rod, driving the placement frame at the same time. The electroforming template on the placement frame will gradually separate from the electrolyte tank, making it convenient for the staff to take the electroforming template, thereby ensuring the staff's production efficiency of wafer bumps. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the three-dimensional structure of the wafer bump electroforming template.

[0014] Figure 2 A schematic diagram of the three-dimensional structure of a side view of a station plate of a wafer bump electroforming template.

[0015] Figure 3 A schematic diagram of the three-dimensional structure of a front cross-sectional view of an electrolyte box for a wafer bump electroforming template.

[0016] In the figure: 1. bottom plate; 2. electrolyte tank; 3. stand plate; 4. motor; 5. handle; 6. threaded rod; 7. threaded barrel; 8. stabilizing plate; 9. hanging plate; 10. L-shaped plate; 11. supporting plate; 12. sliding hole; 13. stabilizing rod; 14. electroforming template body; 15. placement frame; 16. positioning groove; 17. positioning block. DETAILED DESCRIPTION

[0017] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figure 1-3 In the utility model, a wafer bump electroforming template includes a base plate 1, an electrolyte tank 2 is placed above the base plate 1, a station plate 3 is fixedly connected to the upper surface of the base plate 1, a motor 4 is installed on the bottom surface of the station plate 3, a threaded rod 6 is fixedly connected to the output end of the motor 4, a threaded barrel 7 is threadedly connected to the outer surface of the threaded rod 6, a hanging plate 9 is fixedly connected to the bottom end of the threaded barrel 7, two L-shaped plates 10 are fixedly connected to the bottom surface of the hanging plate 9, a placement frame 15 is fixedly connected to the front ends of the two L-shaped plates 10, an electroforming template body 14 is placed above the placement frame 15, by the operation of the motor 4, the threaded barrel 7 will move on the threaded rod 6, and the placement frame 15 will gradually rise and separate from the electrolyte, so that the staff can conveniently take the electroforming template body 14, which can ensure the staff's production efficiency of wafer bumps.

[0020] Two positioning grooves 16 are provided on the upper surface of the base plate 1, and a positioning block 17 is inserted into the inner wall of each positioning groove 16. The top of each positioning block 17 is connected to the bottom surface of the electrolyte box 2. The connection between the positioning block 17 and the positioning groove 16 can stabilize the electrolyte box 2, thereby allowing the electrolyte box 2 to be stably placed above the base plate 1.

[0021] Two stabilizing plates 8 are fixedly connected to the upper surface of the hanging plate 9. A sliding hole 12 is opened on the upper surface of each stabilizing plate 8. A stabilizing rod 13 is slidably connected to the inner wall of each sliding hole 12. The top of each stabilizing rod 13 is connected to the bottom surface of the standing plate 3. The connection between the stabilizing rod 13 and the sliding hole 12 can stabilize the hanging plate 9 and prevent the hanging plate 9 from rotating, thereby ensuring that the hanging plate 9 slides up and down stably.

[0022] The bottom ends of the two stabilizing rods 13 are fixedly connected to a support plate 11, and the back of the support plate 11 is connected to the front of the standing plate 3. The support plate 11 can be used to support and stabilize the stabilizing rods 13 and limit the descending distance of the hanging plate 9.

[0023] The left and right sides of the electrolyte box 2 are fixedly connected with handles 5 , which are used to facilitate the staff to lift and carry the electrolyte box 2 and to allow the staff to clean the electrolyte box 2 conveniently.

[0024] The working principle of the utility model is: when the electroforming template body 14 needs to be taken out, the motor 4 is started to work, the motor 4 will drive the threaded rod 6 to rotate inside the threaded tube 7, and the threaded tube 7 will gradually rise on the threaded rod 6, and at the same time the L-shaped plate 10 will lift the placement frame 15 to rise and disengage from the electrolyte tank 2, the electroforming template body 14 will be separated from the electrolyte tank 2, and wait for the electrolyte remaining on the electroforming template body 14 to drip into the electrolyte tank 2, so that the electroforming template body 14 can be taken out, which can ensure the production efficiency of the wafer bumps by the staff.

[0025] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0026] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A wafer bump electroforming template, characterized in that: The invention comprises a base plate (1), an electrolyte tank (2) is placed above the base plate (1), a station plate (3) is fixedly connected to the upper surface of the base plate (1), a motor (4) is installed on the bottom surface of the station plate (3), a threaded rod (6) is fixedly connected to the output end of the motor (4), a threaded cylinder (7) is threadedly connected to the outer surface of the threaded rod (6), a hanging plate (9) is fixedly connected to the bottom end of the threaded cylinder (7), two L-shaped plates (10) are fixedly connected to the bottom surface of the hanging plate (9), the front ends of the two L-shaped plates (10) are fixedly connected to a placement frame (15), and an electroforming template body (14) is placed above the placement frame (15).

2. The wafer bump electroforming template according to claim 1, characterized in that: Two positioning grooves (16) are provided on the upper surface of the bottom plate (1), a positioning block (17) is inserted into the inner wall of each positioning groove (16), and the top end of each positioning block (17) is connected to the bottom surface of the electrolyte box (2).

3. The wafer bump electroforming template according to claim 1, characterized in that: Two stabilizing plates (8) are fixedly connected to the upper surface of the hanging plate (9), each of the stabilizing plates (8) is provided with a sliding hole (12) on the upper surface, and the inner wall of each of the sliding holes (12) is slidably connected to a stabilizing rod (13), and the top end of each of the stabilizing rods (13) is connected to the bottom surface of the standing plate (3).

4. The wafer bump electroforming template according to claim 3, characterized in that: The bottom ends of the two stabilizing rods (13) are commonly fixedly connected to a support plate (11), and the back side of the support plate (11) is connected to the front side of the standing plate (3).

5. The wafer bump electroforming template according to claim 1, characterized in that: The left and right sides of the electrolyte box (2) are both fixedly connected with handles (5).

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