Refrigeration module and refrigeration equipment
By staggering the heat dissipation module and the cooling module in the refrigeration equipment and using the heat conduction parts to conduct heat, the problem of large volume of the semiconductor refrigeration module is solved, and more efficient refrigeration and heat dissipation effects are achieved, while improving the volume ratio of the equipment and application prospects.
Patent Information
- Application Number
- CN202421083129.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-16
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-05-16
AI Technical Summary
The semiconductor refrigeration module of the existing refrigeration equipment has a large module size because the cooling module and the heat dissipation module are arranged on both sides of the semiconductor chip thickness direction, which limits the spatial layout of the refrigeration equipment.
By setting the cavity, cooling port and cooling port in the insulation module, and the heat dissipation module and cooling module are arranged in the first direction, the heat conduction parts are used to conduct heat to achieve the bidirectional functions of cooling and heat dissipation, while reducing the module group volume.
It effectively compresses the volume of the refrigeration module, improves the floor area ratio of the refrigeration equipment, and maintains low noise, environmental protection and efficient refrigeration performance.
Smart Images
Figure CN222231034U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of refrigeration equipment, in particular to a refrigeration module and refrigeration equipment. Background Art
[0002] Most refrigeration equipment such as car refrigerators are equipped with compressors and heaters, and use compressors or heaters to heat or cool. However, heating or cooling through compressors or heaters will cause problems such as mechanical noise and refrigerant pollution. Therefore, the prior art discloses a refrigeration device including a semiconductor refrigeration module, which has the following advantages: it has a two-way function of cooling and heating; it has low noise during operation; it is environmentally friendly because it does not use refrigerants; the working power is easy to adjust, and frequent starting and stopping does not increase energy consumption or affect service life, and it has strong application prospects and experience comfort.
[0003] However, the semiconductor refrigeration module of the existing refrigeration equipment generally arranges the cooling module and the heat dissipation module on two opposite sides of the semiconductor chip along the first direction, and the first direction is the thickness direction of the semiconductor chip. Figure 1 Moreover, in order to maintain the unique cooling and heat dissipation effects, the size of the cooling module and the heat dissipation module cannot be designed to be smaller, which makes the size of the semiconductor refrigeration module larger and limits the spatial layout of the refrigeration equipment. Utility Model Content
[0004] The main purpose of the utility model is to provide a refrigeration module and a refrigeration device, aiming to solve the technical problem that the existing refrigeration module is large in size and leads to limited spatial layout of the refrigeration device.
[0005] To achieve the above object, the utility model provides a refrigeration module, comprising:
[0006] A heat preservation module, comprising a cavity and a cooling port and a heat dissipation port connected to the cavity;
[0007] A refrigeration element is disposed in the cavity, and the refrigeration element has a cold end and a hot end;
[0008] A cooling module, wherein the cooling module is connected to the cold end of the refrigeration component through the cooling port;
[0009] A first heat-conducting member, one end of which is connected to the hot end of the cooling member, and the other end of which extends to the heat dissipation port; and
[0010] The heat dissipation module is connected to an end of the first heat conducting member away from the refrigeration member through the heat dissipation port, and the cooling module and the heat dissipation module are staggered along a first direction.
[0011] In one embodiment, the insulation module has a first insulation section and a second insulation section arranged along a second direction, the width of the first insulation section in the first direction is smaller than the width of the second insulation section, one of the cooling module and the heat dissipation module is arranged in the first insulation section, and the other is arranged in the second insulation section; wherein the first direction intersects with the second direction.
[0012] In one embodiment, the first heat-conducting member includes a first heat-conducting segment and a second heat-conducting segment connected to each other, the position of the first heat-conducting segment is set corresponding to the position of the first heat-insulating segment, the position of the second heat-conducting segment is set corresponding to the position of the second heat-insulating segment, the first heat-conducting segment and the second heat-conducting segment are staggered along a first direction, the first heat-conducting segment is connected to the heat dissipation module, and the second heat-conducting segment is connected to the hot end of the refrigeration element.
[0013] In one embodiment, the second direction is the height direction of the insulation module, the first insulation section is located above the second insulation section in the height direction of the insulation module, the heat dissipation module is arranged in the first insulation section, and the cooling module is arranged in the second insulation section.
[0014] In one embodiment, a second heat conducting member is disposed between the refrigeration member and the first heat conducting member, and the first heat conducting member is connected to the hot end of the refrigeration member via the second heat conducting member.
[0015] In one embodiment, the projection of the cooling element toward the second heat-conducting element all falls on the second heat-conducting element;
[0016] And / or, the projection of the second heat conducting member toward the first heat conducting member entirely falls on the first heat conducting member.
[0017] In one embodiment, the cooling module is bonded to the cold end of the refrigeration component or bonded to the cold end through a heat conducting medium;
[0018] And / or, the heat dissipation module is bonded to the first heat conducting member or bonded to the first heat conducting member through a heat conducting medium;
[0019] And / or, the first heat-conducting component is bonded to the hot end of the refrigerating component or bonded to the hot end through a heat-conducting medium.
[0020] In one embodiment, the first heat conducting member includes a heat pipe and / or a temperature homogenizing plate.
[0021] In one embodiment, the cooling element is a semiconductor cooling chip.
[0022] In addition, to achieve the above-mentioned purpose, the present invention also provides a refrigeration device, which includes the refrigeration module as described above.
[0023] In the technical solution provided by the utility model, a cavity and a cold dissipation port and a heat dissipation port connected to the cavity are formed by a heat preservation module, and a refrigeration component is arranged in the cavity, the cold dissipation module is connected to the cold end of the refrigeration component through the cold dissipation port, one end of the first heat conductor is connected to the hot end of the refrigeration component, the other end of the first heat conductor extends to the heat dissipation port, and the heat dissipation module is connected to the end of the first heat conductor away from the refrigeration component through the heat dissipation port. The cold end of the refrigeration component absorbs the heat in the refrigeration space through the cold dissipation module, so that the temperature in the refrigeration space continues to decrease, and the hot end of the refrigeration component transfers the heat of the cold end to the heat dissipation module through the first heat conductor, and the heat dissipation module forwards the heat outward, thereby realizing the two-way function of cooling and heating. On the basis of realizing the above functions, since the heat dissipation module and the cold dissipation module are staggered in the first direction, that is, the heat dissipation module and the cold dissipation module are no longer arranged relative to each other in the first direction, the volume of the refrigeration module can be compressed from the first direction, thereby improving the volumetric ratio of the refrigeration equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The accompanying drawings herein are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present utility model, and together with the description, are used to explain the principles of the present utility model.
[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0026] Figure 1 It is a structural schematic diagram of a refrigeration module in the prior art;
[0027] Figure 2 This is a schematic diagram of the structure of the refrigeration module of the utility model;
[0028] Figure 3 for Figure 2 Exploded diagram of
[0029] Figure 4 This is a schematic diagram of the structure of the first heat-conducting member in the refrigeration module of the utility model;
[0030] Figure 5 The utility model is a schematic diagram of the structure of the first heat-conducting member in the refrigeration module, the cooling module and the heat dissipation module.
[0031] Description of Figure Numbers:
[0032] 100. Refrigeration module; 1. Insulation module; 11. First insulation section; 12. Second insulation section; 13. Cooling outlet; 14. Heat dissipation outlet; 2. Refrigeration element; 21. Cold end; 22. Hot end; 3. Cooling module; 4. First heat conducting element; 41. First heat conducting section; 42. Second heat conducting section; 5. Heat dissipation module; 6. Second heat conducting element;
[0033] 100', semiconductor refrigeration module; 1', heat preservation module; 2', semiconductor chip; 3', cooling module; 4', first heat conducting member; 5', heat dissipation module.
[0034] The purpose, features and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0035] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present invention and are not used to limit the present invention.
[0036] In order to better understand the technical solution of the present utility model, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.
[0037] In refrigeration equipment such as car refrigerators, most are equipped with compressors and heaters, and heating or cooling is performed by compressors or heaters. However, heating or commanding by compressors or heaters will cause problems such as working mechanical noise and refrigerant pollution. Therefore, the prior art discloses a refrigeration device including a semiconductor refrigeration module 100', which has the following advantages: it has a two-way function effect of cooling and heating; low noise during operation; no refrigerant is used and it is environmentally friendly; the working power is easy to adjust, and frequent start and stop does not increase energy consumption or affect service life, and has strong application prospects and experience comfort.
[0038] However, the semiconductor refrigeration module 100' of the existing refrigeration equipment includes a heat preservation module 1', a semiconductor chip 2', a cooling module 3', a first heat conducting member 4' and a heat dissipation module 5', by arranging the cooling module 3' and the heat dissipation module 5' on two opposite sides of the semiconductor chip 2' along a first direction, the first direction being the thickness direction of the semiconductor chip 2', specifically as Figure 1 Furthermore, in order to maintain the unique cooling and heat dissipation effects, the sizes of the cooling module 3' and the heat dissipation module 5' cannot be designed to be smaller, so that the size of the semiconductor refrigeration module 100' is larger and the spatial layout of the refrigeration equipment is limited.
[0039] In order to solve the above problems, the present invention proposes a refrigeration module 100, which aims to solve the technical problem that the existing refrigeration module 100 is large in size, resulting in limited spatial layout of the refrigeration equipment.
[0040] See also Figures 2 to 5, Figure 2 It is a structural schematic diagram of an implementation mode of the refrigeration module 100 of the utility model. Figure 3 yes Figure 2 An exploded diagram of Figure 4 1 is a schematic structural diagram of an implementation of the first heat-conducting member 4 in the refrigeration module 100 of the utility model. Figure 5 It is a structural schematic diagram of an implementation method of assembling the first heat conducting member 4 with the cooling module 3 and the heat dissipation module 5 in the refrigeration module 100 of the utility model.
[0041] In the embodiment of the present utility model, the refrigeration module 100 is used for a refrigeration device, and the refrigeration device is specifically a vehicle refrigerator. Figure 2 and Figure 3 The refrigeration module 100 may include but is not limited to a heat preservation module 1 and a refrigeration component 2 , a cooling module 3 and a heat dissipation module 5 .
[0042] The insulation module 1 forms a cavity and a cold dissipation port 13 and a heat dissipation port 14 connected to the cavity. Specifically, the cold dissipation port 13 and the heat dissipation port 14 are staggered along a first direction, and the first direction is the thickness direction of the insulation module 1. That is, the cold dissipation port 13 and the heat dissipation port 14 are one high and one low in the height direction of the insulation module 1, and are asymmetrically arranged in the center. The size and shape of the cold dissipation port 13 and the heat dissipation port 14 are not limited here, and are specifically set according to the installation requirements of the cold dissipation module 3 and the heat dissipation module 5. The refrigeration component 2 is arranged in the cavity. Optionally, the insulation module 1 is made of a material with low thermal conductivity, such as an insulation foam layer, which mainly supports the refrigeration component 2 and other structures in the cavity and plays a role in temperature isolation for the structure outside the cavity.
[0043] The refrigeration element 2 can be implemented by using a semiconductor refrigeration chip. The refrigeration module 100 uses semiconductor chips for refrigeration, does not require the use of any refrigerant, can work continuously, has no pollution source and rotating parts, and does not produce a rotation effect. The semiconductor refrigeration chip mainly uses the Peltier effect of semiconductors. When direct current passes through a thermocouple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the thermocouple, respectively, to achieve the purpose of refrigeration. That is, the two ends of the thermocouple of the semiconductor refrigeration chip respectively form the cold end 21 and the hot end 22 of the semiconductor refrigeration chip.
[0044] According to the above content, it should be noted that the side of the heat preservation module 1 provided with the cold dissipation port 13 is one of the sides of the refrigeration space formed by the refrigeration equipment, and the side of the heat preservation module 1 provided with the heat dissipation port 14 is one of the sides of the heat dissipation space formed by the refrigeration equipment. In order to improve the refrigeration effect of the refrigeration space, the cold dissipation module 3 is located in the refrigeration space, and is connected to the cold end 21 of the refrigeration component 2 through the cold dissipation port 13 of the heat preservation module 1, so that the cold end 21 of the refrigeration component 2 can absorb the heat in the refrigeration space through the cold dissipation module 3, so that the temperature in the refrigeration space can be continuously reduced. Similarly, in order to improve the heat dissipation effect of the heat dissipation space, the heat dissipation module 5 is located in the heat dissipation space, and is connected to the hot end 22 of the refrigeration component 2 through the heat dissipation port 14 of the heat preservation module 1, so that the hot end 22 of the refrigeration component 2 transfers the heat of the cold end 21 to the heat dissipation module 5, and the heat dissipation module 5 dissipates the heat outward.
[0045] In order to improve the refrigeration efficiency of the refrigeration module 100, in the embodiment of the present utility model, the refrigeration module 100 further includes a first heat conductive member 4. One end of the first heat conductive member 4 is connected to the cold end 21 of the refrigeration element 2, and the other end of the first heat conductive member 4 extends to the heat dissipation port 14 and is connected to the heat dissipation module 5. The hot end 22 of the refrigeration element 2 transfers the heat of the cold end 21 to the first heat conductive member 4, and the first heat conductive member 4 quickly transfers the heat to the heat dissipation module 5, so that the heat in the refrigeration space is quickly reduced, and the refrigeration efficiency of the refrigeration module 100 is effectively improved.
[0046] Optionally, the first heat conducting member 4 may include a heat pipe and / or a temperature averaging plate, that is, the first heat conducting member 4 may include both a heat pipe and a temperature averaging plate, or may include only one of the heat pipe and the temperature averaging plate. Specifically, the first heat conducting member 4 includes only a temperature averaging plate. The temperature averaging plate has the characteristic of fast heat transfer speed, and can quickly transfer heat to the heat dissipation module 5 to achieve the purpose of rapid cooling.
[0047] Based on the refrigeration module 100 realizing the bidirectional functions of refrigeration and heating, in order to reduce the volume of the refrigeration module 100, in the embodiment of the present utility model, please refer to Figure 2 , the heat dissipation module 5 and the cooling module 3 are staggered along the first direction, and the first direction is the thickness direction of the thermal insulation module 1. That is, the heat dissipation module 5 and the cooling module 3 are one high and one low in the height direction of the thermal insulation module 1. They are arranged asymmetrically around the center. The heat dissipation module 5 and the cooling module 3 can be located on the same side of the thermal insulation module 1 in the height direction, or can be located one-to-one on the adjacent two sides of the thermal insulation module 1 in the height direction, or can even be located one-to-one on the opposite sides of the thermal insulation module 1, and there is no specific limitation here. With such an arrangement, the volume of the refrigeration module 100 can be compressed in the first direction, thereby increasing the volumetric efficiency of the refrigeration equipment.
[0048] In the technical solution provided by the utility model, a cavity and a cold dissipation port 13 and a heat dissipation port 14 connected to the cavity are formed by a heat preservation module 1, and a refrigeration component 2 is arranged in the cavity, the cold dissipation module 3 is connected to the cold end 21 of the refrigeration component 2 through the cold dissipation port 13, one end of the first heat conducting component 4 is connected to the hot end 22 of the refrigeration component 2, the other end of the first heat conducting component 4 extends to the heat dissipation port 14, and the heat dissipation module 5 is connected to the end of the first heat conducting component 4 away from the refrigeration component 2 through the heat dissipation port 14. The cold end 21 of the refrigeration component 2 absorbs the heat in the refrigeration space through the cold dissipation module 3, so that the temperature in the refrigeration space continues to decrease, and the hot end 22 of the refrigeration component 2 transfers the heat of the cold end 21 to the heat dissipation module 5 through the first heat conducting component 4, and the heat dissipation module 5 forwards the heat outward, realizing the two-way function of cooling and heating. On the basis of realizing the above functions, since the heat dissipation module 5 and the cooling module 3 are staggered along the first direction, that is, the heat dissipation module 5 and the cooling module 3 are no longer arranged relative to each other along the first direction, the volume of the refrigeration module 100 can be compressed from the first direction to improve the volumetric efficiency of the refrigeration equipment.
[0049] There are many forms of implementation of the thermal insulation module 1. In the embodiments of the present utility model, please refer to Figure 2 , the heat preservation module 1 has a first heat preservation section 11 and a second heat preservation section 12 arranged along the second direction, wherein the first heat preservation section 11 and the second heat preservation section 12 can be straight sections or curved sections, which are not specifically limited here. In the first direction, the width of the first heat preservation section 11 is smaller than the width of the second heat preservation section 12, and one of the cooling module 3 and the heat dissipation module 5 is arranged in the first heat preservation section 11, and the other is arranged in the second heat preservation section 12. For example, if the cooling module 3 is arranged in the first heat preservation section 11, then the heat dissipation module 5 is arranged in the second heat preservation section 12; or, if the heat dissipation module 5 is arranged in the first heat preservation section 11, then the cooling module 3 is arranged in the second heat preservation section 12. Among them, the first direction is the thickness direction of the heat preservation module 1, and the second direction is the height direction of the heat preservation module 1. By limiting the width relationship between the first insulation section 11 and the second insulation section 12, the volume of the insulation module 1 is compressed in the first direction. At the same time, the heat dissipation module 5 and the cooling module 3 are rationally arranged. Specifically, the heat dissipation module 5 and the cooling module 3 are one-to-one arranged in the first insulation section 11 and the second insulation section 12, thereby achieving the purpose of reducing the volume of the refrigeration module 100.
[0050] In order to further reduce the volume, in the embodiment of the present utility model, please refer to Figures 2 to 4, the first heat-conducting member 4 is arranged in the cavity and extends along the second direction. The first heat-conducting member 4 includes a first heat-conducting section 41 and a second heat-conducting section 42 connected to each other. The position of the first heat-conducting section 41 corresponds to the position of the first heat-insulating section 11 along the first direction, and the position of the second heat-conducting section 42 corresponds to the position of the second heat-insulating section 12 along the first direction. The first heat-conducting section 41 and the second heat-conducting section 42 are staggered along the first direction, that is, the first heat-conducting section 41 and the second heat-conducting section 42 are not correspondingly arranged along the second direction. The first heat-conducting section 41 is connected to the heat dissipation module 5, and the second heat-conducting section 42 is connected to the hot end 22 of the refrigeration element 2. It can be seen that the specific shape of the first heat-conducting member 4 is set according to the width of the first heat-insulating section 11 and the second heat-insulating section 12, so that the volume of the heat-insulating module 1 can be compressed in the first direction, thereby reducing the volume of the refrigeration module 100.
[0051] Based on the above embodiments, in order to improve the heat transfer effect, in the embodiments of the present utility model, please refer to Figure 2 In the height direction of the insulation module 1, the first insulation section 11 is located above the second insulation section 12, wherein the heat dissipation module 5 is arranged in the first insulation section 11, and the cooling module 3 is arranged in the second insulation section 12. The cooling module 3 transfers heat to the cold end 21 of the refrigeration component 2 and then to the hot end 22. The heat of the hot end 22 of the refrigeration component 2 can be quickly conducted to the heat dissipation module 5 through the first heat conducting member 4 along the natural convection direction, thereby improving the heat transfer effect of the refrigeration module 100.
[0052] In one embodiment of the present invention, please refer to Figure 2 A second heat conducting member 6 is provided between the refrigerating member 2 and the first heat conducting member 4. The second heat conducting member 6 is used to conduct the heat of the refrigerating member 2 to the heat dissipation module 5 more efficiently. Specifically, the second heat conducting member 6 can be implemented by using a cooling aluminum brick with a high thermal conductivity. The first heat conducting member 4 is connected to the hot end 22 of the refrigerating member 2 via the cooling aluminum brick.
[0053] Optionally, the cross-sectional area of the second heat-conducting member 6 may be equal to or greater than the cross-sectional area of the refrigerating member 2, so that the projection of the refrigerating member 2 toward the second heat-conducting member 6 may all fall on the second heat-conducting member 6, so that most of the heat of the hot end 22 of the refrigerating member 2 is transferred to the second heat-conducting member 6, thereby improving the heat conduction efficiency of the second heat-conducting member 6. Optionally, the cross-sectional area of the first heat-conducting member 4 may be equal to or greater than the cross-sectional area of the second heat-conducting member 6, so that the projection of the second heat-conducting member 6 toward the first heat-conducting member 4 may all fall on the first heat-conducting member 4, so that most of the heat of the first heat-conducting member 4 is transferred to the first heat-conducting member 4, thereby improving the heat conduction efficiency of the first heat-conducting member 4.
[0054] In one embodiment of the present invention, please refer to Figure 2In order to improve the refrigeration efficiency and heat dissipation efficiency of the refrigeration module 100, the cooling module 3 is attached to the cold end 21 of the refrigeration element 2 or attached through a heat-conducting medium; one end of the second heat-conducting element 6 is attached to the hot end 22 of the refrigeration element 2 or attached through a heat-conducting medium; the other end of the second heat-conducting element 6 is attached to the first heat-conducting element 4 or attached through a heat-conducting medium; the end of the first heat-conducting element 4 away from the second heat-conducting element 6 is attached to the heat dissipation module 5 or attached through a heat-conducting medium. The heat-conducting medium can be a high thermal conductivity product such as thermal grease, thermal adhesive, or thermal paste.
[0055] The utility model also provides a refrigeration device, which includes a refrigeration module 100 .
[0056] The refrigeration equipment provided by the utility model adopts the refrigeration module 100 in the above embodiment, which can solve the technical problem that the existing refrigeration module 100 is large in size, resulting in limited spatial layout of the refrigeration equipment. Compared with the prior art, the beneficial effects of the refrigeration equipment provided by the utility model are the same as the beneficial effects of the refrigeration module 100 provided in the above embodiment, and other technical features in the refrigeration equipment are the same as the features disclosed in the above embodiment method, which will not be repeated here.
[0057] In an embodiment of the present invention, the refrigeration device may be a vehicle-mounted refrigerator or an air conditioner. Specifically, the refrigeration device is a vehicle-mounted refrigerator.
[0058] The above descriptions are only some embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A refrigeration module, characterized in that: include: A heat preservation module, comprising a cavity and a cooling port and a heat dissipation port connected to the cavity; A refrigeration element is disposed in the cavity, and the refrigeration element has a cold end and a hot end; A cooling module, wherein the cooling module is connected to the cold end of the refrigeration component through the cooling port; A first heat-conducting member, one end of which is connected to the hot end of the refrigerating member, and the other end of which extends to the heat dissipation port; as well as The heat dissipation module is connected to an end of the first heat conducting member away from the refrigeration member through the heat dissipation port, and the cooling module and the heat dissipation module are staggered along a first direction.
2. The refrigeration module according to claim 1, characterized in that: The insulation module has a first insulation section and a second insulation section arranged along a second direction, the width of the first insulation section in the first direction is smaller than the width of the second insulation section, one of the cooling module and the heat dissipation module is arranged in the first insulation section, and the other is arranged in the second insulation section; wherein the first direction intersects with the second direction.
3. The refrigeration module according to claim 2, characterized in that: The first heat-conducting member includes a first heat-conducting segment and a second heat-conducting segment connected to each other, the position of the first heat-conducting segment is set corresponding to the position of the first heat-insulating segment, the position of the second heat-conducting segment is set corresponding to the position of the second heat-insulating segment, the first heat-conducting segment and the second heat-conducting segment are staggered along a first direction, the first heat-conducting segment is connected to the heat dissipation module, and the second heat-conducting segment is connected to the hot end of the refrigeration element.
4. The refrigeration module according to claim 2, characterized in that: The second direction is the height direction of the insulation module. In the height direction of the insulation module, the first insulation section is located above the second insulation section. The heat dissipation module is arranged in the first insulation section, and the cooling module is arranged in the second insulation section.
5. The refrigeration module according to claim 1, characterized in that: A second heat conducting member is disposed between the refrigeration member and the first heat conducting member, and the first heat conducting member is connected to the hot end of the refrigeration member via the second heat conducting member.
6. The refrigeration module according to claim 5, characterized in that: The projection of the refrigeration element toward the second heat-conducting element all falls on the second heat-conducting element; And / or, the projection of the second heat conducting member toward the first heat conducting member entirely falls on the first heat conducting member.
7. The refrigeration module according to claim 1, characterized in that: The cooling module is bonded to the cold end of the refrigeration component or bonded to the cold end through a heat-conducting medium; And / or, the heat dissipation module is bonded to the first heat conducting member or bonded to the first heat conducting member through a heat conducting medium; And / or, the first heat-conducting component is bonded to the hot end of the refrigerating component or bonded to the hot end through a heat-conducting medium.
8. The refrigeration module according to claim 1, characterized in that: The first heat conducting member includes a heat pipe and / or a temperature averaging plate.
9. The refrigeration module according to any one of claims 1 to 8, characterized in that: The refrigeration element is a semiconductor refrigeration chip.
10. A refrigeration device, characterized in that: The refrigeration equipment comprises a refrigeration module as claimed in any one of claims 1 to 9.