Pressing and covering testing mechanism for self-strength of storage chip
By introducing a connecting rod system driven by the servo in the memory chip overlay testing mechanism, the movement of the cover plate and the top plate is achieved, and the difficulty of chip removal in the prior art is solved, which improves the convenience of testing and simplicity of operation.
Patent Information
- Application Number
- CN202420598396.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-26
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-03-26
AI Technical Summary
The prior art lacks a device that can easily lift the chip after the memory chip overlay test is completed, thereby realizing the removal of the chip.
A compression test mechanism including a base, placing frame, push plate, cover plate and perspective plate was designed. The connecting rod system driven by an electron microscope and servo can realize the swing of the cover plate and the movement of the top plate, which facilitates the chip. Take out the
It realizes a chip strength test with simple operation, and can easily lift the chip after the test, simplifying the chip removal process. At the same time, when the cover is closed, the top plate is hidden under the bottom plate of the placement frame to ensure the convenience of testing.
Smart Images
Figure CN222232200U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of testing, in particular to a compression testing mechanism for the strength of a memory chip. Background Art
[0002] The chip pressure test is a necessary step in the self-test of the memory chip, so as to determine the strength between the inner connection bar and the pin part at the outer shell layer. Insufficient pin strength will cause chip connection failure. The existing technology, such as the utility model with the authorization announcement number CN218994933U, realizes the chip adhesion test.
[0003] Currently, there is still a lack of a device that can facilitate the top plate to eject the chip at the end of the test, so that the chip is separated from the bottom plate of the placement frame to facilitate the removal of the chip. Utility Model Content
[0004] The technical problem to be solved by the utility model is to provide a compression test mechanism for the strength of a storage chip, which is conducive to realizing chip strength testing and chip removal after testing.
[0005] The utility model adopts the following technical solutions to achieve the invention purpose:
[0006] A compression test mechanism for the strength of a storage chip, characterized in that it includes: a base, which is hollow inside, the base is fixedly connected to a control display, the control display is fixedly connected to an electron microscope, and the base is fixedly connected to a symmetrical mounting seat; a placement frame, which is arranged on the upper side of the base and connected to the base; a pushing plate, which is arranged in the placement frame, the placement frame is connected to an electric push rod, and the push rod of the electric push rod passes through the placement frame and is connected to the pushing plate; a cover plate, which matches the placement frame, the cover plate is fixedly connected to a rotating shaft, the rotating shaft is rotatably connected to the symmetrical mounting seat, and the cover plate is installed with a perspective plate corresponding to the placement frame. The deformation of the tested chip can be seen through the perspective plate on the control display through the electron microscope, thereby completing the chip strength test.
[0007] As a further limitation of the technical solution, the base is fixedly connected to the U-plate, the U-plate is fixedly connected to the U-frame, and the U-frame is fixedly connected to the guide cylinder. By providing the U-plate, the installation of related components is achieved.
[0008] As a further limitation of the technical solution, the U plate is fixedly connected to the steering gear, the output shaft of the steering gear is fixedly connected to the turntable, the edge of the turntable is fixedly connected to the round block, a guide rod is arranged in the guide cylinder, the guide rod is fixedly connected to the lower slide groove, the round block is arranged in the lower slide groove, at least one end of the lower slide groove is rotatably connected to the connecting rod, the connecting rod is rotatably connected to the T plate, the vertical plate of the T plate passes through the top plate of the base, the T plate is fixedly connected to the upper slide groove, the rotating shaft is fixedly connected to the L rod, and the round rod of the L rod is arranged in the upper slide groove. By adopting the steering gear to drive and the connecting rod to rotate and connect, etc., power support is provided for the movement of the cover plate.
[0009] As a further limitation of the technical solution, the T-plate is fixedly connected to the L-slot plate, the L-slot plate passes through the top plate of the base and the bottom plate of the placement frame, and the L-slot plate is fixedly connected to the top plate. By providing the top plate, after the test is completed, the cover plate swings open while the top plate moves upward to lift the chip, thereby facilitating chip removal.
[0010] As a further limitation of the technical solution, the placement frame is provided with a hidden groove, and the top plate matches the hidden groove. By adopting the hidden groove, when the cover plate is closed, the top plate is in the hidden groove, lower than the upper side of the placement frame bottom plate, which is convenient for testing. The size of the top plate is smaller than the chip size.
[0011] Compared with the related art, the compression test mechanism for the strength of a memory chip provided by the utility model has the following beneficial effects:
[0012] (1) The device is driven by a steering gear to realize the movement of the cover plate and the top plate, which is simple to operate and easy to use;
[0013] (2) After the test of the device is completed, the cover plate swings open and the top plate moves upward to lift the chip, making it easier to remove the chip;
[0014] (3) The device adopts a hidden groove. When the cover is closed, the top plate is in the hidden groove and is lower than the upper side of the bottom plate of the placement frame. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 The three-dimensional structure of the utility model is shown in FIG. Figure 1 .
[0016] Figure 2 It is a schematic diagram of the local three-dimensional structure of the utility model Figure 1 .
[0017] Figure 3 It is a schematic diagram of the local three-dimensional structure of the utility model Figure 2 .
[0018] Figure 4It is a schematic diagram of the local three-dimensional structure of the utility model Figure 3 .
[0019] Figure 5 The three-dimensional structure of the utility model is shown in FIG. Figure 2 .
[0020] In the figure: 1, control display, 2, electron microscope, 4, placement frame, 5, base, 6, mounting seat, 7, electric push rod, 8, pushing plate, 10, hidden groove, 11, rotating shaft, 12, cover plate, 13, perspective plate, 14, guide cylinder, 15, U frame, 16, U plate, 17, L rod, 18, upper slide groove, 19, T plate, 20, top plate, 21, L groove plate, 22, connecting rod, 23, guide rod, 24, lower slide groove, 25, steering gear, 26, turntable, 27, round block. DETAILED DESCRIPTION
[0021] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.
[0022] Embodiment 1: A compression test mechanism for the strength of a storage chip, comprising: a base 5, which is hollow inside, the base 5 is fixedly connected to a control display 1, the control display 1 is fixedly connected to an electron microscope 2, the base 5 is fixedly connected to a symmetrical mounting seat 6; a placement frame 4, which is arranged on the upper side of the base 5 and connected to the base 5; a pushing plate 8, which is arranged in the placement frame 4, the placement frame 4 is connected to an electric push rod 7, the push rod of the electric push rod 7 passes through the placement frame 4 and is connected to the pushing plate 8; a cover plate 12, which matches the placement frame 4, the cover plate 12 is fixedly connected to a rotating shaft 11, the rotating shaft 11 is rotatably connected to the symmetrical mounting seat 6, and the cover plate 12 is installed with a perspective plate 13 corresponding to the placement frame 4. The deformation of the chip being tested can be seen through the perspective plate 13 on the control display 1 through the electron microscope 2, thereby completing the chip strength test.
[0023] The control display 1 has a built-in STM32F103VCT6 chip.
[0024] The base 5 is fixedly connected to the U-plate 16, the U-plate 16 is fixedly connected to the U-frame 15, and the U-frame 15 is fixedly connected to the guide cylinder 14. By providing the U-plate 16, the installation of related components is achieved.
[0025] The U plate 16 is fixedly connected to the steering engine 25, the output shaft of the steering engine 25 is fixedly connected to the turntable 26, the edge of the turntable 26 is fixedly connected to the round block 27, the guide cylinder 14 is provided with a guide rod 23, the guide rod 23 is fixedly connected to the lower slide groove 24, the round block 27 is arranged in the lower slide groove 24, at least one end of the lower slide groove 24 is rotatably connected to the connecting rod 22, the connecting rod 22 is rotatably connected to the T plate 19, the vertical plate of the T plate 19 passes through the top plate of the base 5, the T plate 19 is fixedly connected to the upper slide groove 18, the rotating shaft 11 is fixedly connected to the L rod 17, the round rod of the L rod 17 is arranged in the upper slide groove 18. By adopting the steering engine 25 to drive, the connecting rod is rotatably connected, etc., the movement of the cover plate 12 is provided with power support.
[0026] The electron microscope 2 , the electric push rod 7 , and the steering gear 25 are electrically connected to the control display 1 , respectively.
[0027] The working principle of a compression test mechanism for the strength of a memory chip provided by the utility model is as follows:
[0028] In the initial state, the cover plate 12 is tilted upward. The chip is placed in the placement frame 4, and the display 1 is controlled to control the steering gear 25 to rotate, the steering gear 25 drives the turntable 26 to rotate, the turntable 26 drives the round block 27 to move in the lower slide groove 24, the round block 27 drives the lower slide groove 24 to move, the lower slide groove 24 drives the guide rod 23 to move along the guide cylinder 14, the lower slide groove 24 drives the connecting rod 22 to swing, the connecting rod 22 drives the T plate 19 to move downward, the T plate 19 drives the upper slide groove 18 to move downward, the upper slide groove 18 drives the L rod 17 to swing, the L rod 17 drives the rotating shaft 11 to rotate, the rotating shaft 11 drives the cover plate 12 and the perspective plate 13 to swing, so that the cover plate 12 covers the placement frame 4.
[0029] The electric push rod 7 is extended by the control display 1, and the electric push rod 7 drives the pushing plate 8 to move, so that the pushing plate 8 and the placement frame 4 squeeze the chip. The deformation of the tested chip can be seen through the perspective plate 13 on the control display 1 through the electron microscope 2, thereby completing the chip strength test.
[0030] Embodiment 2: The T-plate 19 is fixedly connected to the L-slot plate 21, the L-slot plate 21 passes through the top plate of the base 5 and the bottom plate of the placement frame 4, and the L-slot plate 21 is fixedly connected to the top plate 20. By setting the top plate 20, after the test is completed, the cover plate 12 swings open and the top plate 20 moves upward to lift the chip, so that the chip can be easily taken out.
[0031] The working principle of a compression test mechanism for the strength of a memory chip provided by the utility model is as follows:
[0032] In the initial state, the cover plate 12 is tilted upward, and the top plate 20 is flush with the upper side of the placement frame 4. The chip is placed on the top plate 20. When the steering engine 25 rotates, the T plate 19 drives the L slot plate 21 and the top plate 20 to move downward, so that the top plate 20 drives the chip downward into the placement frame 4.
[0033] Embodiment 3: The placement frame 4 is provided with a hidden groove 10, and the top plate 20 matches the hidden groove 10. By adopting the hidden groove 10, when the cover plate 12 is closed, the top plate 20 is in the hidden groove 10, lower than the upper side of the bottom plate of the placement frame 4, which is convenient for testing. The size of the top plate 20 is smaller than the chip size.
[0034] The working principle of a compression test mechanism for the strength of a memory chip provided by the utility model is as follows:
[0035] When the cover plate 12 contacts the placement frame 4 , the top plate 20 enters the hidden groove 10 and is lower than the upper side of the bottom plate of the placement frame 4 .
[0036] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. A compression test mechanism for the strength of a memory chip, characterized in that: include: A base (5) is hollow inside, the base (5) is fixedly connected to the control display (1), the control display (1) is fixedly connected to the electron microscope (2), and the base (5) is fixedly connected to a symmetrical mounting base (6); A placement frame (4), arranged on the upper side of the base (5) and connected to the base (5); A pushing plate (8) is arranged in the placement frame (4), the placement frame (4) is connected to an electric push rod (7), and a push rod of the electric push rod (7) passes through the placement frame (4) and is connected to the pushing plate (8); The cover plate (12) matches the placement frame (4), the cover plate (12) is fixedly connected to the rotating shaft (11), the rotating shaft (11) is rotationally connected to the symmetrical mounting seat (6), and the cover plate (12) is installed with a perspective plate (13) corresponding to the placement frame (4).
2. The compression test mechanism for the memory chip's own strength according to claim 1 is characterized in that: The base (5) is fixedly connected to a U plate (16), the U plate (16) is fixedly connected to a U frame (15), and the U frame (15) is fixedly connected to a guide cylinder (14).
3. The compression test mechanism for the memory chip's own strength according to claim 2, characterized in that: The U plate (16) is fixedly connected to a steering gear (25), the output shaft of the steering gear (25) is fixedly connected to a turntable (26), the edge of the turntable (26) is fixedly connected to a round block (27), a guide rod (23) is arranged in the guide cylinder (14), the guide rod (23) is fixedly connected to a lower slide groove (24), the round block (27) is arranged in the lower slide groove (24), at least one end of the lower slide groove (24) is rotatably connected to a connecting rod (22), the connecting rod (22) is rotatably connected to a T plate (19), the vertical plate of the T plate (19) passes through the top plate of the base (5), the T plate (19) is fixedly connected to an upper slide groove (18), the rotating shaft (11) is fixedly connected to an L rod (17), the round rod of the L rod (17) is arranged in the upper slide groove (18).
4. The compression test mechanism for the memory chip's own strength according to claim 3 is characterized by: The T-plate (19) is fixedly connected to the L-slot plate (21), the L-slot plate (21) passes through the top plate of the base (5) and the bottom plate of the placement frame (4), and the L-slot plate (21) is fixedly connected to the top plate (20).
5. The compression test mechanism for the memory chip's own strength according to claim 4 is characterized in that: The placement frame (4) is provided with a hidden groove (10), and the top plate (20) matches the hidden groove (10).