DDR5 desktop computer mainboard device with radiator mounting structure

Abstract

The utility model belongs to the technical field of desktop computer mainboards, and discloses a DDR5 desktop computer mainboard device with a radiator mounting structure, which comprises a substrate, and a central processing unit, a memory slot, a power interface, a PCIE (Peripheral Component Interconnect Express) interface, an IO (Input / Output) control chip, a BIOS (Basic Input / Output System) storage chip, a data transmission interface, a radiating fin and a hard disk interface which are mounted on the substrate, support buckles are arranged on the two sides of the central processing unit, and radiators are connected to the support buckles in a buckled mode; according to the utility model, the pair of support fasteners are arranged on the two sides of the central processing unit, so that the radiator can be quickly mounted or dismounted, the mainboard can be efficiently assembled or overhauled by a worker, and meanwhile, the support fasteners can support a larger radiator, so that the overall heat dissipation effect of the mainboard can be effectively improved, and in addition, the heat dissipation efficiency of the mainboard is improved. The system also has the beneficial effects of high-efficiency and stable data transmission and the like.

Description

Technical Field

[0001] The utility model relates to the technical field of desktop motherboards, and in particular to a DDR5 desktop motherboard device provided with a radiator mounting structure. Background Art

[0002] The motherboard, also called the mainboard, systemboard, or motherboard, is one of the most basic and important components of a computer. The main circuit system and heat dissipation components (devices) that make up the computer are installed on the motherboard. The main circuit system generally includes BIOS chips, I / O control chips, keyboard and panel control switch interfaces, indicator light connectors, expansion slots, DC power supply connectors for the motherboard and plug-in cards, and other components. In the prior art, the heat dissipation components (devices) are generally fixed directly on the substrate by screws / bolts, which is not conducive to the installation or removal of the heat dissipation components (devices), and thus not conducive to the efficient assembly or maintenance of the motherboard by the staff. Utility Model Content

[0003] In view of this, the purpose of the present utility model is to provide a DDR5 desktop motherboard device provided with a heat sink mounting structure, aiming to achieve rapid installation or removal of heat dissipation components (devices).

[0004] To achieve the above objectives, the utility model discloses a DDR5 desktop motherboard device with a radiator mounting structure, including a substrate and a central processing unit, a memory slot, a power interface, a PCIE interface, an IO control chip, a BIOS storage chip, a data transmission interface, a heat sink and a hard disk interface installed on the substrate, bracket fasteners are provided on both sides of the central processing unit, and a radiator is connected to the bracket fasteners.

[0005] The utility model is further configured as follows: the bracket fasteners are symmetrically distributed on both sides of the central processing unit.

[0006] The utility model is further configured as follows: the bracket fastener is fixedly arranged on the base plate by threaded connection.

[0007] The utility model is further configured as follows: the heat sink abuts against the radiator.

[0008] The utility model is further configured as follows: the central processing unit is a BGA central processing unit.

[0009] The utility model is further configured as follows: the memory slot is a dual DDR5 UDIMM slot.

[0010] The utility model is further configured to include an audio interface installed on the substrate.

[0011] The utility model is further configured to include: a plurality of tantalum capacitors mounted on the substrate.

[0012] The utility model is further configured as follows: the hard disk interface is an M.2 hard disk interface.

[0013] The utility model is further configured as follows: a plurality of tantalum capacitors are evenly distributed in a linear manner.

[0014] To sum up, compared with the prior art, the utility model provides a DDR5 desktop motherboard device with a radiator mounting structure. By arranging a pair of bracket clips on both sides of the central processing unit, the radiator can be quickly installed or disassembled, which is beneficial for the staff to efficiently assemble or repair the motherboard. At the same time, because the bracket clips can support a larger radiator, the overall heat dissipation effect of the motherboard can be effectively improved. In addition, the utility model also has the beneficial effects of efficient and stable data transmission, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 This embodiment provides a DDR5 desktop motherboard device with a heat sink mounting structure.

[0017] Schematic diagram of the three-dimensional structure;

[0018] Figure 2 1 is a schematic rear view of a DDR5 desktop motherboard device provided with a heat sink mounting structure provided in this embodiment.

[0019] Figure numerals: 1. substrate; 2. central processing unit; 3. memory slot; 4. power interface; 5. PCIE interface; 6. IO control chip; 7. BIOS storage chip; 8. data transmission interface; 9. heat sink; 10. hard disk interface; 11. bracket fastener; 12. audio interface; 13. tantalum capacitor. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of the utility model more clearly understood, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0021] In the description of the present invention, it should be noted that the terms "front", "rear", "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0022] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can also be the internal connection of two components, it can be a wireless connection, or it can be a wired connection. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0023] In addition, the technical features involved in the different embodiments of the present invention described above can be combined with each other as long as they do not conflict with each other.

[0024] A DDR5 desktop motherboard device with a heat sink mounting structure, such as Figure 1 and Figure 2 As shown, it includes a substrate 1 and a central processing unit 2, a memory slot 3, a power interface 4, a PCIE interface 5, an IO control chip 6, a BIOS storage chip 7, a data transmission interface 8, a heat sink 9 and a hard disk interface 10 installed on the substrate 1. Bracket fasteners 11 are provided on both sides of the central processing unit 2, and a heat sink (not shown) is connected to the bracket fastener 11 by a buckle.

[0025] In this embodiment, the bracket fasteners 11 are symmetrically distributed on both sides of the CPU 2, and the heat sink 9 abuts against the radiator; the heat sink 9 efficiently concentrates most of the heat generated by the electronic components of the motherboard during operation, and then quickly dissipates the heat to the outside through the radiator.

[0026] It should be noted that, compared with the traditional motherboard structure in which the radiator is directly fixed to the substrate 1 by screws, the present motherboard structure, through the setting of a pair of bracket fasteners 11 on both sides of the central processing unit 2, and then by connecting the radiator clip to the bracket fastener 11, can achieve rapid installation or removal of the radiator, which is beneficial for the staff to efficiently assemble or repair the motherboard. At the same time, because the bracket fastener 11 can support a larger radiator, it can effectively improve the overall heat dissipation effect of the motherboard.

[0027] In this embodiment, the bracket fastener 11 is fixed on the base plate 1 by threaded connection.

[0028] It should be noted that, in some embodiments, the connection and fixing method between the bracket fastener 11 and the base plate 1 can be selectively set according to actual needs, and is not limited to the threaded connection method, and is not specifically limited here.

[0029] It should be noted that the full name of PCIE is Peripheral Component Interconnect Express, which is a high-speed serial computer expansion bus standard. PCIE belongs to high-speed serial point-to-point dual-channel high-bandwidth transmission. The connected devices are allocated exclusive channel bandwidth and do not share bus bandwidth. It mainly supports active power management, error reporting, end-to-end reliable transmission, hot plugging, and quality of service.

[0030] In this embodiment, the CPU 2 is a BGA CPU.

[0031] In this embodiment, memory slot 3 is a dual DDR5 UDIMM slot.

[0032] It should be noted that UDIMM, the full name of which is Unbuffered DIMM, means that the address and control signals directly reach the DRAM chip on the DIMM without going through a buffer or making any timing adjustments. Since UDIMM does not have any cache between the CPU and the memory, the latency is smaller at the same frequency.

[0033] In this embodiment, the BIOS storage chip 7 is a QFN packaged BIOS storage chip.

[0034] It should be noted that compared with the SOP packaged chips used in traditional motherboard structures, the QFN packaged BIOS storage chip used in this motherboard structure has the physical advantages of small size, light weight and large storage capacity, and the quality advantages of strong heat dissipation, good electrical performance and high reliability, which can make the data transmission between the BGA central processor and the dual DDR5 UDIMM slots more efficient and stable.

[0035] Furthermore, this embodiment also includes an audio interface 12 mounted on the substrate 1 .

[0036] It should be noted that, in the specific implementation process, the power interface 4 is used to electrically connect to an external power source, the data transmission interface 8 is used to transmit data to an external electronic device, the audio interface 12 is used to connect to an audio device, and the hard disk interface 10 is used to connect to a hard disk.

[0037] In this embodiment, the hard disk interface 10 is an M.2 hard disk interface.

[0038] It should be noted that, in some embodiments, the model of the hard disk interface 10 can be selectively set according to actual needs, and is not specifically limited here.

[0039] Furthermore, the present embodiment further includes a plurality of tantalum capacitors 13 mounted on the substrate 1 , and the plurality of tantalum capacitors 13 are evenly distributed in a linear manner.

[0040] It should be noted that, compared with the aluminum electrolytic capacitors used on traditional motherboards, the tantalum capacitors 13 on this motherboard structure have the advantages of high energy density, high reliability, high stability of electrical properties, and a wider operating temperature range, which can make the data transmission and line current between the BGA central processor and the dual DDR5 UDIMM slots more stable.

[0041] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.

Claims

1. A DDR5 desktop motherboard device provided with a heat sink mounting structure, comprising a substrate (1) and a central processing unit (2), a memory slot (3), a power interface (4), a PCIE interface (5), an IO control chip (6), a BIOS storage chip (7), a data transmission interface (8), a heat sink (9) and a hard disk interface (10) mounted on the substrate (1), characterized in that: Bracket fasteners (11) are provided on both sides of the central processing unit (2), and a heat sink is buckled and connected to the bracket fasteners (11).

2. The DDR5 desktop motherboard device with a heat sink mounting structure as claimed in claim 1, characterized in that: The bracket fasteners (11) are symmetrically distributed on both sides of the central processing unit (2).

3. The DDR5 desktop motherboard device with a heat sink mounting structure as claimed in claim 2, characterized in that: The bracket fastener (11) is fixedly arranged on the base plate (1) by means of a threaded connection.

4. The DDR5 desktop motherboard device with a heat sink mounting structure as claimed in claim 2 or 3, characterized in that: The heat sink (9) abuts against the radiator.

5. The DDR5 desktop motherboard device with a heat sink mounting structure according to any one of claims 1 to 3, characterized in that: The central processing unit (2) is a BGA central processing unit.

6. The DDR5 desktop motherboard device with a heat sink mounting structure according to any one of claims 1 to 3, characterized in that: The memory slot (3) is a dual DDR5 UDIMM slot.

7. The DDR5 desktop motherboard device with a heat sink mounting structure as claimed in claim 1, wherein: It also includes an audio interface (12) mounted on the substrate (1).

8. The DDR5 desktop motherboard device with a heat sink mounting structure as claimed in claim 1, wherein: It also includes a plurality of tantalum capacitors (13) mounted on the substrate (1).

9. The DDR5 desktop motherboard device with a heat sink mounting structure as claimed in claim 1 or 7, characterized in that: The hard disk interface (10) is an M.2 hard disk interface.

10. The DDR5 desktop motherboard device with a heat sink mounting structure as claimed in claim 8, characterized in that: The plurality of tantalum capacitors (13) are evenly distributed in a linear manner.

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