Charged particle beam generator and ion beam etching equipment

The lead-out area of ​​the charged particle beam generator is adjusted through the lead-out control device, which solves the problem of low elicitation performance and efficiency, adapts to changes in plasma density, and improves stability and efficiency.

CN222233575UActive Publication Date: 2024-12-24BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Application Number
CN202323387510.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-12
Publication Date
2024-12-24
Estimated Expiration
2033-12-12

AI Technical Summary

Technical Problem

The existing charged particle beam generators have problems with low elicitation performance and efficiency, and cannot adapt to the morphological changes of the sheath layer caused by changes in plasma density, resulting in a decrease in elicitation efficiency.

Method used

The outlet lead-out control device is adopted to adjust the outlet lead-out area through structures such as the shielding assembly and annular mounting member, and adjust the outlet lead-out area according to the plasma density to adapt to the morphological changes of the sheath layer and improve the outlet efficiency.

Benefits of technology

It effectively improves the performance and stability of the charged particle beam generator, so that the elicitation efficiency is always maintained at a large amplitude, and optimizes the process effect.

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Abstract

The utility model provides a charged particle beam generator and ion beam etching equipment, and the charged particle beam generator comprises a charged particle beam generation cavity which is provided with an outlet; and the lead-out opening control device is used for adjusting the lead-out area of the lead-out opening. According to the scheme, the leading-out port control device is controlled to adjust the leading-out area of the leading-out port according to the magnitude of the plasma density amplitude in the charged particle beam generation cavity, so that the leading-out area can adapt to the form change of a plasma sheath, the leading-out efficiency of charged particles is always maintained at a relatively large amplitude, and the quality of the charged particles is improved. Therefore, the performance and the stability of the charged particle beam generator are effectively improved.
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Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing, in particular to a charged particle beam generator and ion beam etching equipment. Background Art

[0002] With the development of micro-nano processing technology, the requirements for etching technology are getting higher and higher. At present, in principle, etching can be divided into wet etching and dry etching. Most dry etching uses the principle of radio frequency coupling to generate a plasma source, including inductively coupled plasma (ICP) and capacitively coupled plasma (CCP), and then uses ions or free radicals in the plasma source to perform the required etching process. Compared with wet etching, dry etching has high etching accuracy, high controllability, and good anisotropy, and therefore has received more and more attention.

[0003] For dry etching systems, in addition to ion sources, electron sources also play an important role. For example, for high vacuum (for example: pressure less than 10 -5 Torr or less) etching system, due to the scarcity of seed electrons, successful ignition becomes one of the difficulties affecting the stability of the system. One of the ways to improve the ignition stability of the RF system is to increase the number of seed electrons; in addition, in the ion beam etching system, in order to reduce the repulsive force between ions, improve the uniformity of the ion beam flow, reduce the charge accumulation on the wafer surface, and increase the etching rate, before the etching process, it is necessary to provide a sufficient amount of electron beam flow to neutralize the extracted ion beam. Both of the above aspects require the provision of high-density, stable output electron beam flow.

[0004] Charged particle beam generator, such as an electron beam generator that generates an electron beam or a positive ion beam generator that generates positive ions. Taking the ICP electron beam generator as an example, the ICP electron beam generator is a high-performance electron beam generating device. Compared with other types of electron beam generators, the ICP electron beam generator has a wide range of applicable process scenarios and a long life. Therefore, it has received more and more attention in recent years. The working principle of the ICP electron beam generator is as follows: plasma is generated through inductive coupling. Among them, under the action of the space electric field, positive ions move toward the ion collector (cathode) with a negative potential, and electrons are extracted from the extraction port. The balance of these two processes maintains the stability of the operation of the ICP electron beam generator.

[0005] However, the charged particle beam generator in the prior art has the problem of low charged particle extraction performance and efficiency. Utility Model Content

[0006] The utility model aims to solve at least one of the technical problems existing in the prior art, and proposes a charged particle beam generator and ion beam etching equipment, which can solve the problems of low charged particle extraction performance and efficiency of the charged particle beam generator in the prior art.

[0007] In order to achieve the purpose of the utility model, a charged particle beam generator is provided, comprising:

[0008] A charged particle beam generating cavity having an outlet;

[0009] The outlet control device is used to adjust the outlet area of ​​the outlet.

[0010] Optionally, the outlet control device includes a shielding component, and the shielding component can be movably arranged outside the charged particle beam generating cavity;

[0011] The shielding component is configured to shield the outlet, and the outlet area of ​​the outlet can be adjusted by adjusting the position of the shielding component.

[0012] Optionally, the shielding assembly includes a plurality of shielding plates arranged in sequence in the circumferential direction, the inner circumferential surfaces of the plurality of shielding plates together enclose an outlet control port, and the outlet control port is arranged corresponding to the outlet port;

[0013] The plurality of shielding plates are all capable of moving in the radial direction of the outlet control port, and surround the outlet control port with different opening areas at different positions in the radial direction of the outlet control port.

[0014] Optionally, the outlet control port is coaxial with the outlet port.

[0015] Optionally, the outlet control device further comprises an annular mounting member, and the annular hole of the annular mounting member is coaxially arranged with the outlet;

[0016] The annular mounting member is provided with a plurality of guide grooves arranged in sequence along the circumferential direction of the annular mounting member, and each of the guide grooves is provided with an opening on the inner circumferential surface of the annular mounting member; each of the baffle plates is arranged in each of the guide grooves in a one-to-one correspondence, and can extend into the annular hole through the opening along the radial direction of the lead-out control port, and the inner circumferential surface of each of the baffle plates and the opening are both facing the annular hole.

[0017] Optionally, a portion of each shielding plate extending into the annular hole partially overlaps with portions of two adjacent shielding plates extending into the annular hole in the axial direction of the annular mounting member.

[0018] Optionally, the overlapping parts of each shielding plate and two adjacent shielding plates are respectively located on different sides of the two adjacent shielding plates.

[0019] Optionally, a moving channel is formed on the side of each guide groove relative to the opening and passes through the radial direction of the outlet control port to the outer peripheral surface of the annular mounting member;

[0020] The outlet control device also includes a plurality of connecting rods and a plurality of linear drive sources, each of the connecting rods being correspondingly arranged in each of the moving channels, and one end of each of the connecting rods being correspondingly connected to each of the baffles, and the other end being correspondingly connected to each of the linear drive sources; each of the linear drive sources is used to drive the corresponding baffle to move radially along the outlet control port through the corresponding connecting rod.

[0021] Optionally, the outlet control device further comprises an annular fixing member, which is fixedly connected to the annular mounting member and is used to restrict each of the shielding plates in the corresponding guide groove.

[0022] Optionally, a positioning structure is provided between the annular fixing member and the annular mounting member, for defining the relative position of the annular fixing member and the annular mounting member.

[0023] Optionally, the positioning structure includes a protruding structure formed on the surface of the annular mounting member where the guide groove is located, and the protruding structure constitutes a positioning groove on the annular mounting member for limiting the relative position of the annular fixing member on the annular mounting member.

[0024] Optionally, the protrusion structure includes an annular protrusion arranged along the outer peripheral edge of the surface of the annular mounting member where the guide groove is located, and a protrusion arranged on the inner peripheral edge of the surface of the annular mounting member where the guide groove is located and located between each adjacent two guide grooves, the inner peripheral surface of the annular protrusion cooperates with the outer peripheral surface of the annular fixing member; the surface of the protrusion relative to the annular protrusion cooperates with the inner peripheral surface of the annular fixing member.

[0025] Optionally, the outlet control device further includes a plurality of limit rods;

[0026] A plurality of limiting channels are formed on the surface of the annular fixing member facing the annular mounting member, each of the limiting channels extends in the radial direction of the lead-out control port, and a channel opening is formed on the inner circumferential surface of the annular fixing member; each of the limiting rods is correspondingly arranged in each of the limiting channels, and can extend into the annular hole of the annular fixing member through the channel opening in the radial direction of the lead-out control port;

[0027] The limiting rods are overlapped one by one on the surface of each shielding plate adjacent to the annular fixing member, and one end of each limiting rod facing the channel opening is fixedly connected to the inner peripheral edge of the corresponding shielding plate.

[0028] Optionally, one end of each of the limiting rods facing the passage opening is provided with a bent portion bent in a direction close to the shielding plate; a fixing hole is formed at the inner peripheral edge of the surface of each of the shielding plates adjacent to the annular fixing member;

[0029] The bent portion of each of the limiting rods is arranged in the fixing hole of each of the corresponding shielding plates.

[0030] As another technical solution, the utility model also provides an ion beam etching device, including a process chamber, and an ion source generating device and a carrying device arranged in the process chamber relative to each other in a first direction, and also including the above-mentioned charged particle beam generator provided by the utility model, wherein the charged particle beam generator is arranged on the cavity body of the process chamber, and the lead-out port is connected to the process chamber and faces a second direction for leading a charged particle beam into the process chamber, wherein the second direction is at an angle to the first direction.

[0031] Optionally, a sensor is further included, wherein the sensor is used to obtain the plasma density in the charged particle beam generating cavity, and the outlet control device is further used to adjust the outlet area of ​​the outlet according to the plasma density obtained by the sensor.

[0032] The utility model has the following beneficial effects:

[0033] The charged particle beam generator provided by the utility model can adjust the extraction area of ​​the extraction port of the charged particle beam generating cavity through the extraction port control device. Since the extraction performance and efficiency of the charged particle beam are closely related to the plasma sheath morphology on the extraction port surface, and the plasma sheath morphology on the extraction port surface is closely related to the plasma density generated inside the charged particle beam generating cavity, based on this, since the extraction area of ​​the extraction port in the related art is fixed, it can only adapt to one working condition of the charged particle beam generator, that is, a certain plasma density inside the charged particle beam generating cavity and the corresponding plasma sheath morphology on the extraction port surface, under the condition that the working condition remains unchanged, the extraction area of ​​the extraction port can achieve the optimal extraction performance and efficiency. However, when the working condition changes, that is, the plasma density inside the charged particle beam generating cavity changes, the plasma sheath morphology also changes accordingly, and the fixed extraction area cannot adapt to the change of the plasma sheath morphology, so that the charged particle extraction efficiency cannot always be maintained at a relatively large value. In this regard, the solution of the utility model controls the lead-out area of ​​the lead-out port by controlling the lead-out port control device according to the amplitude of the plasma density inside the charged particle beam generating cavity during the movement of charged particles such as electrons and positive ions. The lead-out area can be adapted to the changes in the plasma sheath morphology, so that the charged particle extraction efficiency is always maintained at a relatively large amplitude, thereby effectively improving the performance and stability of the charged particle beam generator.

[0034] The ion beam etching equipment provided by the utility model can always maintain the electron extraction efficiency at a relatively large value by adopting the charged particle beam generator provided by the utility model, thereby optimizing the process effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A cross-sectional view of a charged particle beam generator provided by an embodiment of the utility model;

[0036] Figure 2 A positional relationship diagram of a shielding component and a charged particle beam generating cavity used in an embodiment of the utility model;

[0037] Figure 3A A three-dimensional structural diagram of another shielding component used in an embodiment of the utility model at a viewing angle;

[0038] Figure 3B A three-dimensional structural diagram of another shielding component used in an embodiment of the utility model at another viewing angle;

[0039] Figure 4 A three-dimensional cross-sectional view of another shielding assembly used in an embodiment of the utility model;

[0040] Figure 5AA three-dimensional cross-sectional view of the annular mounting member used in the embodiment of the utility model at a viewing angle;

[0041] Figure 5B A three-dimensional cross-sectional view of the annular mounting member used in the embodiment of the utility model at another viewing angle;

[0042] Figure 6 An exploded view of the annular mounting member and the shielding assembly used in the embodiment of the utility model;

[0043] Figure 7 A three-dimensional diagram of an annular fixing member used in an embodiment of the utility model;

[0044] Figure 8 The structure and distribution diagram of the limit rod used in the embodiment of the utility model;

[0045] Fig. 9 An exploded view of the annular mounting member, the shielding assembly and the annular fixing member used in the embodiment of the utility model;

[0046] Fig.10 An assembly diagram of the annular mounting member, the shielding assembly and the annular fixing member used in the embodiment of the utility model;

[0047] Fig.11 A schematic structural diagram of an ion beam etching device provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0048] In order to enable those skilled in the art to better understand the technical solution of the present invention, the charged particle beam generator and ion beam etching equipment provided by the present invention are described in detail below in conjunction with the accompanying drawings.

[0049] See also Figure 1 , an embodiment of the utility model provides a charged particle beam generator 100, comprising a charged particle beam generating cavity 1 having an extraction port 101. In some optional embodiments, the charged particle beam generator 100 further comprises an extraction electrode 6, a shielding cavity 3, a radio frequency coil 4 and an ion collector 5, wherein the charged particle beam generating cavity 1 has the above-mentioned extraction port 101, and the charged particles in the charged particle beam generating cavity 1 can move from the extraction port 101 to the outside of the charged particle beam generating cavity 1. The above-mentioned charged particles are, for example, electrons, positive ions, and the like. The extraction port 101 can specifically be a through hole set in the cavity wall (for example, the lower cavity wall) of the charged particle beam generating cavity 1, and the through hole can be a straight through hole or a variable diameter hole, such as a tapered hole, and the diameter of the tapered hole increases along the moving direction of the charged particles.

[0050] The extraction electrode 6 is arranged outside the charged particle beam generating cavity 1, and is located at intervals on the side where the extraction port 101 is located. The extraction electrode 6 has a first extraction port 61, and the first extraction port 61 is arranged corresponding to the extraction port 101. The first extraction port 61 is greater than or equal to the extraction port 101, and is used to guide the movement of the charged particles. The above-mentioned charged particle beam generating cavity 1 is arranged inside the shielding cavity 3, and can be fixed to the upper cavity wall of the shielding cavity 3 by a fastener 11. The shielding cavity 3 is used to shield the electric field in the charged particle beam generating cavity 1 to avoid interference with external parts. A second extraction port 33 for passing charged particles is arranged on the cavity wall of the shielding cavity 3 adjacent to the extraction port 101. The second extraction port 33 is arranged corresponding to the extraction port 101 (for example, coaxially arranged), and the second extraction port 33 is greater than or equal to the extraction port 101 to avoid affecting the movement of the charged particles. Specifically, the shielding cavity 3 includes a shielding cavity body 31 with one end open and a shielding cavity cover 32 sealed and connected to the shielding cavity body 31. The shielding cavity cover 32 is superimposed on the outer surface of the cavity wall where the second outlet 33 of the charged particle beam generating cavity 1 is located, and is used to seal the open end of the shielding cavity body 31. The above-mentioned second outlet 33 is, for example, a through hole arranged in the shielding cavity cover 32.

[0051] An annular space 34 is provided between the inner surface of the shielding cavity 3 and the outer surface of the charged particle beam generating cavity 1 in the circumferential direction. The annular space 34 is, for example, formed by the inner circumferential surface of the shielding cavity body 31, the outer circumferential surface of the charged particle beam generating cavity 1, the inner surface of the upper cavity wall of the shielding cavity body 31, and the inner surface of the shielding cavity cover 32. The radio frequency coil 4 is arranged in the annular space 34 and surrounds the charged particle beam generating cavity 1. The radio frequency coil 4 is used to be electrically connected to the radio frequency source. The radio frequency source includes, for example, a radio frequency power supply and an impedance matcher. The radio frequency power supply is electrically connected to the radio frequency coil 4 through the impedance matcher, and is used to load radio frequency power to the radio frequency coil 4 to excite the gas (for example, an inert gas) in the charged particle beam generating cavity 1 to form plasma.

[0052] One end of the ion collector 5 sequentially penetrates the shielding cavity 3 and the charged particle beam generating cavity 1 from the side of the shielding cavity 3 away from the second outlet 33 (e.g., the upper side of the shielding cavity 3), and extends to the interior of the charged particle beam generating cavity 1. The ion collector 5 is provided with an air inlet channel for connecting to a gas source, and the air inlet 51 of the air inlet channel is connected to the interior of the charged particle beam generating cavity 1, and is used to introduce gas (e.g., inert gas) into the charged particle beam generating cavity 1. In some optional embodiments, the ion collector 5 is tubular, and the internal space of the tube is the above-mentioned air inlet channel. There are multiple air inlets 51, which are evenly distributed in the tube wall along the circumferential direction. The air inlet 51 is, for example, a through hole that penetrates the tube wall in the radial direction.

[0053] When the charged particle beam generator is working, taking the electron beam generator as an example, an inert gas is introduced into the charged particle beam generating cavity 1 through the ion collecting electrode 5, and the RF source is turned on to load RF power to the RF coil 4 to excite the inert gas inside the charged particle beam generating cavity 1 to form plasma, and the ion collecting electrode 5 has a positive potential, and the extraction electrode 6 has a negative potential, and a spatial electric field is formed between the two. The positive ions in the plasma move toward the ion collecting electrode 5 with a negative potential, and the electrons in the plasma move toward the extraction electrode 6 with a positive potential, and move from the extraction port 101 to the outside of the charged particle beam generating cavity 1.

[0054] The inventors found that the extraction performance and efficiency of the charged particle beam are closely related to the plasma sheath morphology on the surface of the extraction port 101, and the plasma sheath morphology on the surface of the extraction port 101 is closely related to the plasma density generated inside the charged particle beam generating cavity 1. Based on this, since the extraction area of ​​the extraction port 101 in the related art is fixed, it can only adapt to one working condition of the charged particle beam generator, that is, a certain plasma density inside the charged particle beam generating cavity and the corresponding plasma sheath morphology on the surface of the extraction port 101. Under the condition that the working condition remains unchanged, the above-mentioned fixed extraction area of ​​the extraction port 101 can achieve the optimal extraction performance and efficiency. In other words, an extraction area of ​​the extraction port 101 can only be the optimal size that maintains the charged particle extraction efficiency at a relatively large value under a certain working condition. However, when the working conditions change, that is, the plasma density inside the charged particle beam generating cavity changes, the plasma sheath morphology also changes accordingly. At this time, the fixed extraction area cannot adapt to the change in the plasma sheath morphology, and thus the charged particle extraction efficiency cannot always be maintained at a large value, resulting in a decrease in the extraction performance and efficiency of the charged particle beam.

[0055] In order to solve the above problems, the charged particle beam generator provided in the embodiment of the utility model further includes an outlet control device 102, which is used to adjust the extraction area of ​​the outlet 101. Specifically, the outlet control device 102 is, for example, arranged outside the charged particle beam generating cavity 1 and located on the side where the outlet 101 is located, for example, arranged between the charged particle beam generating cavity 1 and the extraction electrode 6. In the case where a shielding cavity 3 is provided, such as Figure 1 As shown, the outlet control device 102 can also be arranged between the shielding cavity 3 and the extraction electrode 6.

[0056] The outlet control device 102 is used to adjust the extraction area of ​​the outlet 101. The extraction area of ​​the outlet 101 refers to the radial cross-sectional area of ​​the opening through which charged particles can pass. In the process of charged particle movement, by controlling the outlet control device to adjust the extraction area of ​​the outlet 101 according to the magnitude of the plasma density amplitude inside the charged particle beam generating cavity 1, the extraction area can be adapted to the change in the plasma sheath morphology, so that the charged particle extraction efficiency is always maintained at a relatively large amplitude, thereby effectively improving the performance and stability of the charged particle beam generator.

[0057] The outlet control device can adjust the outlet area of ​​the outlet 101 in various ways, for example: Figure 2 As shown, the outlet control device includes a shielding component 2, which can be movably arranged outside the charged particle beam generating cavity 1, for example, arranged on the side of the outlet 101 outside the charged particle beam generating cavity 1. The shielding component 2 is configured to shield the outlet 101, and the lead-out area of ​​the outlet 101 can be adjusted by adjusting the position of the shielding component 2. In other words, by adjusting the position of the shielding component 2, the area of ​​the outlet 101 shielded by the shielding component 2 can be adjusted to adjust the lead-out area of ​​the outlet 101, that is, the shielding component 2 can be adjusted to shield a partial area A of the outlet 101, and the opening area of ​​the unshielded area B of the outlet 101 is the lead-out area of ​​the outlet 101. It is easy to understand that the opening area of ​​the outlet 101 itself is fixed, and as the position of the shielding component 2 changes, the area of ​​the shielded area A of the outlet 101 changes accordingly, and the area of ​​the unshielded area B of the outlet 101 also changes accordingly, and the area of ​​the area B is the outlet area of ​​the outlet 101. The shielding component 2 can move in a variety of ways, such as translating and / or rotating in a plane parallel to the radial direction of the outlet 101, and the embodiment of the utility model has no particular limitation on this.

[0058] Figure 2 The shielding assembly 2 shown in the figure does not have an opening itself, and relies on its own structure to shield a part of the lead-out outlet 101 to adjust the lead-out area of ​​the lead-out outlet 101. However, the embodiment of the utility model is not limited to this. In some optional embodiments, for example, Figure 1 As shown, the shielding component in the outlet control device 102 may also have an outlet control port 201, which is arranged corresponding to the outlet 101; the shielding component 2 is arranged to be able to adjust the opening area of ​​the outlet control port 201, that is, to adjust the area corresponding to the outlet 101 and the outlet control port 201 (that is, Figure 1 The area of ​​the region C) in the lead-out outlet 101 can be adjusted. It is easy to understand that the shielding component 2 can shield the lead-out outlet 101. Figure 1Other areas outside area C in .

[0059] The shielding component 2 that realizes the above functions can have various structures, for example, Figure 3A and Figure 3B As shown, the shielding assembly 2 includes a plurality of shielding plates 21 arranged in sequence in the circumferential direction, and the inner circumferential surfaces 21a of the plurality of shielding plates 21 enclose the extraction control port 201; optionally, the extraction control port 201 is coaxial with the extraction port 101, which is conducive to improving the extraction performance and efficiency of the charged particle beam. The plurality of shielding plates 21 can be arranged in a radial direction (i.e., Figure 3A The plurality of shielding plates 21 are arranged to move in the direction of the arrow in the figure, and at different positions in the radial direction of the lead-out control port 201, they are enclosed to form lead-out control ports 201 with different opening areas. Optionally, the inner circumferences 21a of the plurality of shielding plates 21 are all arc surfaces, and they are enclosed to form a circular lead-out control port 201. Of course, in practical applications, according to different requirements, the inner circumferences 21a of the plurality of shielding plates 21 can also be planes or surfaces of other shapes, so as to enclose lead-out control ports 201 of different shapes.

[0060] Specifically, the shielding plate 21 is, for example, a flat plate with four side surfaces, one of which is the inner peripheral surface 21a, for example, an arc surface, and the other three side surfaces are all planes, wherein the plane opposite to the inner peripheral surface is the outer peripheral surface 21b, and the outer peripheral surface 21b is perpendicular to the other two planes 21c, and the other two planes 21c are parallel to the moving direction of the shielding plate 21 (i.e., parallel to the radial direction of the lead-out control port 201). When the plurality of shielding plates 21 are located at the maximum opening position, the opening area of ​​the lead-out control port 201 formed by the inner peripheral surfaces 21a of the plurality of shielding plates 21 is the largest, and at this time, there may be no overlap between the plurality of shielding plates 21 in the thickness direction (parallel to the axial direction of the lead-out control port 201); when the plurality of shielding plates 21 move from the maximum opening position along the radial direction of the lead-out control port 201 toward the center of the lead-out control port 201, the plurality of shielding plates 21 partially overlap in the thickness direction to reduce the opening area of ​​the lead-out control port 201. Optionally, the overlapping portion of each shielding plate 21 and two adjacent shielding plates 21 are respectively located on different sides of the two adjacent shielding plates 21. Specifically, Figure 4 As shown, for each of the three adjacent shielding plates 21, they are the first shielding plate 21A, the second shielding plate 21B and the third shielding plate 21C, the second shielding plate 21B is located between the first shielding plate 21A and the third shielding plate 21C, and the portion where the first shielding plate 21A overlaps with the second shielding plate 21B (i.e. Figure 4 The portion in the dashed line frame D1 is located on the side of the second shielding plate 21B close to the outlet 101, and the portion where the third shielding plate 21C overlaps with the second shielding plate 21B (ie Figure 4The portion in the dotted line frame D2 is located on the side of the second shielding plate 21B away from the outlet 101. In this way, the first shielding plate 21A and the third shielding plate 21C can be prevented from causing motion interference due to being located on the same side of the second shielding plate 21B.

[0061] In some optional embodiments, considering the damage resistance of the shielding plate 21, the thickness of the shielding plate 21 is greater than or equal to 0.5 mm.

[0062] In some optional embodiments, please refer to Figure 5A , Figure 5B and Figure 6 The outlet control device 102 further includes an annular mounting member 7, which is disposed on a surface of the side where the outlet 101 of the charged particle beam generating cavity 1 is located, for example, on a surface of the shielding cavity cover 32 away from the charged particle beam generating cavity 1. The annular hole 73 of the annular mounting member 7 is coaxially disposed with the outlet 101, and the opening area of ​​the annular hole 73 should be greater than or equal to the maximum opening area of ​​the outlet control port 201.

[0063] The annular mounting member 7 is formed with a plurality of guide grooves 74 arranged in sequence along the circumferential direction of the annular mounting member 7, and each guide groove 74 is formed with an opening 741 on the inner circumferential surface of the annular mounting member 7; each shielding plate 21 is arranged in each guide groove 74 in a one-to-one correspondence, and can extend into the annular hole 73 through the opening 741 along the radial direction of the lead-out control port 201, and the inner circumferential surface of each shielding plate 21 and the opening 741 are both facing the annular hole 73. Specifically, when each shielding plate 21 is fully retracted into the corresponding guide groove 74, the opening area of ​​the lead-out control port 201 is the opening area of ​​the annular hole 73. When each shielding plate 21 extends into the annular hole 73 through the opening 741 along the radial direction of the lead-out control port 201, the plurality of shielding plates 21 shield the edge area of ​​the annular hole 73 of the annular mounting member 7, and at the same time, the inner circumferential surfaces of the plurality of shielding plates 21 are enclosed in the annular hole 73 to form the lead-out control port 201. Optionally, the orthographic projection shape of the guide groove 74 on the radial cross section of the annular mounting member 7 is adapted to the orthographic projection shape of the baffle plate 21 on the radial cross section of the annular mounting member 7. For example, the baffle plate 21 is a flat plate with four side surfaces, one of which is the inner peripheral surface 21a mentioned above, such as an arc surface, and the other three side surfaces are all planes, wherein the plane opposite to the inner peripheral surface 21a is the outer peripheral surface 21b, and the outer peripheral surface 21b is perpendicular to the other two planes 21c, and the other two planes 21c are parallel to the moving direction of the baffle plate 21 (that is, parallel to the radial direction of the lead-out control port 201). In this case, correspondingly, Figure 5AAs shown, the guide groove 74 has three side surfaces, which respectively correspond to the three side surfaces of the baffle plate 21 except the inner circumferential surface. One of the side surfaces 742 is opposite to the opening 741. The other two side surfaces 743 of the guide groove 74 parallel to the radial direction of the lead-out control port 201 can guide the baffle plate 21 so that the baffle plate 21 can move radially along the lead-out control port 201.

[0064] In some optional embodiments, the portion of each shielding plate 21 extending into the annular hole 73 partially overlaps with the portions of two adjacent shielding plates 21 extending into the annular hole 73 in the axial direction of the annular mounting member 7. In this way, the opening area of ​​the lead-out control port 201 can be reduced. Specifically, as Figure 5B As shown, the bottom surface of the guide groove 74 is an inclined surface inclined relative to the radial section of the annular mounting member 7, and the multiple guide grooves 74 are inclined in the same direction, that is, the depth of each guide groove 74 increases from one side surface 743 to the other side surface 743. In this way, under the guiding action of the guide groove 74, the part of the shielding plate 21 extending into the annular hole 73 is also inclined to achieve the overlap between adjacent shielding plates 21 and avoid motion interference. Further, for two adjacent guide grooves 74, the maximum depth of one guide groove 74 is d11 and the minimum depth is d12; the maximum depth of the other guide groove 74 is d21 and the minimum depth is d22. In this case, the absolute value of the difference between the minimum depth d12 of one guide groove 74 and the maximum depth d21 of the other guide groove 74 is equal to the thickness of the shielding plate 21, so that the two adjacent shielding plates 21 can be ensured to be in contact, thereby forming a closed lead-out control port 201.

[0065] In some optional embodiments, a moving channel 75 is formed on the side of each guide groove 74 relative to the opening 741 and penetrates to the outer peripheral surface of the annular mounting member 7 along the radial direction of the lead-out control port 201; and Figure 3A and Figure 3B As shown, the outlet control device 102 further includes a plurality of connecting rods 22 and a plurality of linear drive sources 23, each connecting rod 22 is correspondingly disposed in each moving channel 75, and one end of each connecting rod 22 is correspondingly connected to each shielding plate 21, and the other end is correspondingly connected to each linear drive source 23; each linear drive source 23 is used to drive the corresponding shielding plate 21 to move along the radial direction of the outlet control port 201 through the corresponding connecting rod 22. The linear drive source 23 is, for example, a stepping motor, and a plurality of stepping motors can drive a plurality of shielding plates 21 to move synchronously.

[0066] In some optional embodiments, such as Figure 7As shown, the outlet control device 102 further includes an annular fixing member 8, which is fixedly connected to the annular mounting member 7 and is used to limit each shielding plate 21 in the corresponding guide groove 74. The annular fixing member 8 and the annular mounting member 7 are fixedly connected by, for example, a plurality of screws. The annular hole 82 of the annular fixing member 8 is coaxially arranged with the outlet 101, and the opening area of ​​the annular hole 82 is, for example, the same as the opening area of ​​the annular hole 73 of the annular mounting member 7.

[0067] In some optional embodiments, a positioning structure is provided between the annular fixing member 8 and the annular mounting member 7 to define the relative position of the annular fixing member 8 and the annular mounting member 7. The positioning structure may have a variety of structures, for example, the positioning structure includes a surface where the guide groove 74 is formed on the annular mounting member 7 (i.e., Figure 5A and Figure 6 The convex structure on the surface 71 in the annular mounting member 7 forms a positioning groove on the annular mounting member 7, which is used to define the relative position of the annular fixing member 8 on the annular mounting member 7. The embodiment of the utility model has no particular limitation on the convex structure, as long as it can define the relative position of the annular fixing member 8 on the annular mounting member 7, for example, Figure 5A , Figure 5B , Fig. 9 and Fig.10 As shown, the protruding structure includes a surface along the guide groove 74 of the annular mounting member 7 (ie, Figure 5A and Figure 6 The annular protrusion 75 is provided on the outer peripheral edge of the surface 71 in the annular mounting member 7, and the guide groove 74 is provided on the surface where the annular mounting member 7 is located (ie, Figure 5A and Figure 6 The inner peripheral edge of the surface 71 in the annular projection 75 and the protrusion 76 located between each adjacent two guide grooves 74, the inner peripheral surface of the annular projection 75 matches the outer peripheral surface of the annular fixing member 8; the surface of the protrusion 76 relative to the annular projection 75 matches the inner peripheral surface of the annular fixing member 8. In other words, the annular fixing member 8 is located in the annular groove formed by the annular projection 75 and each protrusion 76. The shape of the protrusion 76 located between each adjacent two guide grooves 74 can be adapted to the shape of the interval between each adjacent two guide grooves 74, for example, a triangular protrusion 76, and located at the inner peripheral edge of the interval.

[0068] In some optional embodiments, please refer to Figures 7 to 10 The outlet control device also includes a plurality of limit rods 84; the surface of the annular fixing member 8 facing the annular mounting member 7 (ie, Figure 7A plurality of limiting channels 83 are formed on the surface 81 in the middle, each limiting channel 83 extends in the radial direction of the lead-out control port 201, and a channel opening 831 is formed on the inner circumference of the annular fixing member 8; each limiting rod 84 is arranged in each limiting channel 83 in a one-to-one correspondence, and can extend into the annular hole 73 of the annular fixing member 8 through the channel opening 831 in the radial direction of the lead-out control port 201; each limiting rod 84 is overlapped in a one-to-one correspondence on the surface of each shielding plate 21 adjacent to the annular fixing member 8, and one end of each limiting rod 84 facing the channel opening 831 is fixedly connected to the inner circumferential edge of the corresponding shielding plate 21. When the shielding plate 21 moves in the radial direction of the lead-out control port 201, since each limiting rod 84 is fixedly connected to the corresponding shielding plate 21, the limiting rod 84 will slide along the limiting channel 83 driven by the shielding plate 21. With the help of the limiting rod 84, the corresponding shielding plate 21 can be limited to prevent the shielding plate 21 from tilting up.

[0069] There are many ways to fix each limiting rod 84 with the corresponding shielding plate 21. In some optional embodiments, one end of each limiting rod 84 facing the passage opening 831 is provided with a bent portion 841 bent in a direction close to the shielding plate 21; a fixing hole 211 is formed at the inner peripheral edge of the surface of each shielding plate 21 adjacent to the annular fixing member 8; and the bent portion 841 of each limiting rod 84 is arranged in the fixing hole 211 of the corresponding shielding plate 21. In this way, the installation and removal of the limiting rod 84 can be facilitated.

[0070] In some optional embodiments, such as Figure 1 As shown, the extraction port control device 102 is arranged between the charged particle beam generating cavity 1 and the extraction electrode 6, and the annular mounting member 7 and the annular fixing member 8 are both made of insulating materials, which are used to electrically insulate the charged particle beam generating cavity 1 from the extraction electrode 6. In this way, the extraction electrode 6 can be arranged on the surface of the annular fixing member 8 away from the annular mounting member 7 (i.e., on the side of the annular fixing member 8 that is away from the annular mounting member 7). Figure 7 The surface 81 in the middle is opposite to the surface 81 in the middle), so as to facilitate the installation of the lead-out electrode 6. In addition, the shielding plate 21 can be made of insulating material, or can also be made of metal material.

[0071] In summary, the charged particle beam generator provided by the embodiment of the utility model can adjust the extraction area of ​​the extraction outlet of the charged particle beam generating cavity through the extraction outlet control device. In the process of movement of charged particles such as electrons, positive ions, etc., by controlling the extraction outlet control device to adjust the extraction area of ​​the extraction outlet according to the magnitude of the plasma density amplitude inside the charged particle beam generating cavity, the extraction area can be adapted to the change of the plasma sheath morphology, so that the charged particle extraction efficiency is always maintained at a relatively large amplitude, thereby effectively improving the performance and stability of the charged particle beam generator.

[0072] As another technical solution, see Fig.11 The embodiment of the utility model also provides an ion beam etching device, including a process chamber 200, and an ion source generating device 300 and a carrying device 400 arranged in the process chamber 200 in a first direction relative to each other, wherein the ion source generating device 300 is used to generate an ion beam and lead it into the process chamber 200 along the first direction so that the ion beam can move toward the carrying device 400 on the opposite side. The carrying device 400 is used to carry a wafer and can also be used to load radio frequency power to the wafer.

[0073] The ion beam etching device also includes the charged particle beam generator 100 provided in the embodiment of the utility model, which is arranged on the cavity of the process chamber 200, and the outlet of the charged particle beam generating cavity is connected to the process chamber 200 and faces the second direction, for leading the charged particle beam (e.g., electron beam) into the process chamber 200. The second direction is at an angle with the first direction, for example, at an angle of 90°. Specifically, the first direction is, for example, a horizontal direction, and the second direction is a vertical direction.

[0074] In some embodiments, a sensor is further included, the sensor is used to obtain the plasma density in the charged particle beam generating cavity, and the outlet control device is also used to adjust the outlet extraction area according to the plasma density obtained by the sensor. In this way, the outlet extraction area can be adapted to the change of the plasma sheath morphology, so that the charged particle extraction efficiency is always maintained at a relatively large value, thereby effectively improving the performance and stability of the charged particle beam generator.

[0075] The ion beam etching equipment provided by the embodiment of the utility model can always maintain the electron extraction efficiency at a relatively large value by adopting the above-mentioned charged particle beam generator provided by the embodiment of the utility model, thereby optimizing the process effect.

[0076] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A charged particle beam generator, characterized in that: include: A charged particle beam generating cavity having an outlet; The outlet control device is used to adjust the outlet area of ​​the outlet.

2. The charged particle beam generator according to claim 1, characterized in that: The outlet control device includes a shielding component, and the shielding component can be movably arranged outside the charged particle beam generating cavity; The shielding component is configured to shield the outlet, and the outlet area of ​​the outlet can be adjusted by adjusting the position of the shielding component.

3. The charged particle beam generator according to claim 2, characterized in that: The shielding assembly includes a plurality of shielding plates arranged in sequence in the circumferential direction, the inner circumferential surfaces of the plurality of shielding plates together enclose an outlet control port, and the outlet control port is arranged corresponding to the outlet; The plurality of shielding plates are all capable of moving in the radial direction of the outlet control port, and surround the outlet control port with different opening areas at different positions in the radial direction of the outlet control port.

4. The charged particle beam generator according to claim 3, characterized in that: The outlet control port is coaxial with the outlet port.

5. The charged particle beam generator according to claim 3, characterized in that: The outlet control device further comprises an annular mounting member, wherein the annular hole of the annular mounting member is coaxially arranged with the outlet; The annular mounting member is provided with a plurality of guide grooves arranged in sequence along the circumferential direction of the annular mounting member, and each of the guide grooves is provided with an opening on the inner circumferential surface of the annular mounting member; each of the baffle plates is arranged in each of the guide grooves in a one-to-one correspondence, and can extend into the annular hole through the opening along the radial direction of the lead-out control port, and the inner circumferential surface of each of the baffle plates and the opening are both facing the annular hole.

6. The charged particle beam generator according to claim 5, characterized in that: The portion of each shielding plate extending into the annular hole partially overlaps with the portions of two adjacent shielding plates extending into the annular holes in the axial direction of the annular mounting member.

7. The charged particle beam generator according to claim 6, characterized in that: The overlapping parts of each shielding plate and two adjacent shielding plates are respectively located on different sides of the two adjacent shielding plates.

8. The charged particle beam generator according to claim 5, characterized in that: A moving channel is formed on the side of each guide groove relative to the opening and passes through the radial direction of the lead-out control port to the outer peripheral surface of the annular mounting member; The outlet control device also includes a plurality of connecting rods and a plurality of linear drive sources, each of the connecting rods being correspondingly arranged in each of the moving channels, and one end of each of the connecting rods being correspondingly connected to each of the baffles, and the other end being correspondingly connected to each of the linear drive sources; each of the linear drive sources is used to drive the corresponding baffle to move radially along the outlet control port through the corresponding connecting rod.

9. The charged particle beam generator according to claim 5, characterized in that: The outlet control device further comprises an annular fixing member, which is fixedly connected to the annular mounting member and is used to restrict each of the shielding plates in the corresponding guide groove.

10. The charged particle beam generator according to claim 9, characterized in that: A positioning structure is provided between the annular fixing member and the annular mounting member, for limiting the relative position of the annular fixing member and the annular mounting member.

11. The charged particle beam generator according to claim 10, characterized in that: The positioning structure comprises a protruding structure formed on the surface of the annular mounting member where the guide groove is located. The protruding structure forms a positioning groove on the annular mounting member for limiting the relative position of the annular fixing member on the annular mounting member.

12. The charged particle beam generator according to claim 11, characterized in that: The protrusion structure includes an annular protrusion arranged along the outer peripheral edge of the surface of the annular mounting member where the guide groove is located, and a protrusion arranged on the inner peripheral edge of the surface of the annular mounting member where the guide groove is located and located between each adjacent two guide grooves, the inner peripheral surface of the annular protrusion matches the outer peripheral surface of the annular fixing member; the surface of the protrusion relative to the annular protrusion matches the inner peripheral surface of the annular fixing member.

13. The charged particle beam generator according to claim 9, characterized in that The outlet control device also includes a plurality of limit rods; A plurality of limiting channels are formed on the surface of the annular fixing member facing the annular mounting member, each of the limiting channels extends in the radial direction of the lead-out control port, and a channel opening is formed on the inner circumferential surface of the annular fixing member; each of the limiting rods is correspondingly arranged in each of the limiting channels, and can extend into the annular hole of the annular fixing member through the channel opening in the radial direction of the lead-out control port; The limiting rods are overlapped one by one on the surface of each shielding plate adjacent to the annular fixing member, and one end of each limiting rod facing the channel opening is fixedly connected to the inner peripheral edge of the corresponding shielding plate.

14. The charged particle beam generator according to claim 13, characterized in that: Each of the limiting rods is provided with a bent portion bent in a direction close to the shielding plate at one end facing the channel opening; each of the shielding plates is formed with a fixing hole at the inner peripheral edge of the surface adjacent to the annular fixing member; The bent portion of each of the limiting rods is arranged in the fixing hole of each of the corresponding shielding plates.

15. An ion beam etching device, comprising a process chamber, and an ion source generating device and a carrying device arranged in the process chamber in a first direction relative to each other, characterized in that: It also includes a charged particle beam generator as described in any one of claims 1 to 14, wherein the charged particle beam generator is arranged on the cavity body of the process chamber, and the outlet is connected to the process chamber and faces a second direction for leading a charged particle beam into the process chamber, wherein the second direction forms an angle with the first direction.

16. The ion beam etching device according to claim 15, characterized in that: It also includes a sensor, which is used to obtain the plasma density in the charged particle beam generating cavity. The outlet control device is also used to adjust the outlet area of ​​the outlet according to the plasma density obtained by the sensor.