Suction head structure
By providing a reference structure outside the suction head body, the positioning deviation problem caused by the obstruction of the suction head is solved, and more accurate chip positioning is achieved.
Patent Information
- Application Number
- CN202420032603.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-05
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-01-05
AI Technical Summary
After the existing suction nozzle absorbs the wafer, the contour of the suction nozzle is blocked due to the large wafer, and the camera cannot obtain the wafer position information, resulting in a large positioning deviation.
A reference structure is provided outside the tip body, and the outline of the reference structure is identified by the camera, and the wafer position is determined to avoid positioning deviations.
Even if the nozzle profile is covered by the wafer, the camera can still obtain the profile of the reference structure, confirm the wafer position, reduce positioning deviation, and improve positioning accuracy.
Smart Images
Figure CN222233604U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer grabbing and positioning, in particular to a suction head structure. Background Art
[0002] The suction nozzle in the placement machine absorbs the wafer and moves the wafer to the next station by moving the nozzle. The nozzle uses a camera to capture the position of the wafer during the movement. When the position of the wafer on the nozzle is found to be offset, the position of the wafer can be adjusted by the suction head.
[0003] However, after the existing suction nozzle adsorbs the wafer, the wafer is large, causing the wafer to block the outline of the suction nozzle, resulting in a lack of reference in the image information of the wafer captured by the camera, and the position of the wafer cannot be obtained, resulting in a large positioning deviation of the wafer. Utility Model Content
[0004] The main purpose of the utility model is to provide a suction head structure, aiming to solve the problem of large wafer positioning deviation.
[0005] In order to achieve the above-mentioned purpose, the suction head structure proposed by the utility model includes:
[0006] The suction head body includes a suction nozzle; and
[0007] The reference structure is arranged outside the suction head body, and the outline of the reference structure is used for the camera to identify when positioning the wafer.
[0008] Optionally, the profile of the reference structure is configured as a centrally symmetrical profile.
[0009] Optionally, the reference structure is arranged close to the suction nozzle of the suction head body.
[0010] Optionally, the suction head body is configured as a conical structure.
[0011] Optionally, the reference structure is configured as a step, and the contour of the step is used as a reference when positioning the wafer.
[0012] Optionally, the suction head body is made of a hard material.
[0013] Optionally, the step is configured as a polished step.
[0014] Optionally, the reference structure is configured as a protrusion, the protrusion is fixedly arranged outside the suction head body, and the contour of the protrusion is used as a reference for wafer positioning.
[0015] Optionally, the protrusion is configured as a single-sided light-transmitting structure.
[0016] Optionally, the protrusion is fixed to the outside of the suction head body by bonding.
[0017] The technical solution of the utility model adopts the method of setting a reference structure on the outside of the suction head body. When the suction nozzle adsorbs the wafer, the wafer is photographed by a camera. Even if the outline of the suction nozzle is covered by the wafer and cannot be displayed, the camera can obtain the outline of the reference structure, so that the image information photographed by the camera contains the outlines of the wafer structure and the reference structure. By using the outline of the reference structure as a reference for the wafer, the position of the wafer can be confirmed, the adjustment and positioning of the wafer can be convenient, and large deviations in wafer positioning can be avoided, thereby solving the technical problems existing in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0019] Figure 1 This is a structural schematic diagram of an embodiment of the suction head structure of the utility model;
[0020] Figure 2 for Figure 1 A partial enlarged view of the middle A;
[0021] Figure 3 This is a structural schematic diagram of another embodiment of the suction head structure of the utility model;
[0022] Figure 4 for Figure 3 A partial enlarged view of point B in the middle.
[0023] Description of Figure Numbers:
[0024] Label name Label name 100 Tip body 110 Nozzle 120 Adsorption pipe 200 Reference Structure 210 Stairs 220 Protrusion
[0025] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0028] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0029] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0030] The utility model provides a suction head structure.
[0031] In one embodiment of the utility model, the suction head structure includes a suction head body 100 and a reference structure 200; the suction head body 100 includes a suction nozzle 110, and the suction head body 100 can adjust the position of the wafer by sucking the wafer through the suction nozzle 110; the reference structure 200 is arranged on the outside of the suction head body 100, and the outline of the reference structure 200 is used for the camera to identify when the wafer is positioned. In this embodiment, when the suction nozzle 110 is sucked onto the wafer, the outline of the reference structure 200 can be identified by the camera, so that the camera captures the image information of the wafer with the outline of the reference structure 200. At this time, the outline of the reference structure 200 can be used as a reference to determine the position of the wafer on the suction nozzle 110, and the suction head body 100 adjusts the wafer according to the position of the wafer, so that the wafer is positioned at a suitable position to avoid a large position deviation of the wafer during positioning; Figure 1 , Figure 2 shown.
[0032] The technical solution of the utility model adopts a reference structure 200 set outside the suction head body 100. When the suction nozzle 110 sucks the wafer, the wafer is photographed by a camera. Even if the outline of the suction nozzle 110 is covered by the wafer and cannot be displayed, the camera can obtain the outline of the reference structure 200, so that the image information photographed by the camera has the outline of the wafer structure and the reference structure 200. By using the outline of the reference structure 200 as a reference for the wafer, the position of the wafer can be confirmed, the adjustment and positioning of the wafer can be facilitated, and large deviations in wafer positioning can be avoided, thereby solving the technical problems existing in the prior art.
[0033] In one embodiment, the outline of the reference structure 200 is configured as a centrally symmetrical outline. In this embodiment, the centrally symmetrical outline can be a circular outline, a square outline, a rectangular outline, etc., and there is no limitation here. Under the effect of the centrally symmetrical outline, reference positioning can be facilitated.
[0034] In one embodiment, reference Figure 1 , Figure 2 The reference structure 200 is arranged near the nozzle 110 of the suction head body 100. In the present embodiment, by arranging the reference structure 200 near the nozzle 110 of the suction head body 100, on the one hand, it is to ensure the distance between the reference structure 200 and the camera, so that the camera can clearly capture the outline of the reference structure 200, and avoid the outline of the reference structure 200 captured by the camera due to the depth of field problem as a virtual image, resulting in the outline of the reference structure 200 in the graphic information being unusable. At the same time, in the present embodiment, the specific position of the reference structure 200 is not limited, and the user can select the specific position of the reference structure 200 according to their own needs while satisfying the camera shooting.
[0035] In one embodiment, reference Figure 1 The suction head body 100 is configured as a conical structure. In the present embodiment, the suction nozzle 110 is located at the conical head of the suction head body 100. Under this structure, the suction head body 100 can conveniently adsorb the wafer. When the suction head body 100 is adsorbing the wafer, the structure of the suction head body 100 can be prevented from affecting other wafers that are not adsorbed.
[0036] In one embodiment, reference Figure 2, the reference structure 200 is configured as a step 210, the contour of the step 210 is used as a reference for wafer positioning; in this embodiment, the step 210 can be configured as a single step 210, wherein the depth of the step 210 can be determined according to the contour of the step 210. Since the structure of the suction head body 100 is selected as a conical structure, the greater the depth of the step 210, the greater the outer contour of the reference structure 200; conversely, the smaller the depth of the step 210, the smaller the outer contour of the reference structure 200; wherein the depth of the step 210 can be calculated by the user according to the contour of the reference structure 200 and the taper of the conical structure to obtain a suitable depth. In other embodiments, the step 210 can also be configured as a stepped step 210.
[0037] In one embodiment, the material of the suction head body 100 is a hard material. In this embodiment, the material of the suction head body 100 is ceramic, and this structure can facilitate the use of the suction head body 100. In other embodiments, the suction head body 100 can also be made of other materials.
[0038] In one embodiment, reference Figure 2 , the step 210 is configured as a polished step 210; in the present embodiment, the step 210 can be formed by polishing, and after polishing, the adsorption channel inside the suction head body 100 can be retained to form an adsorption pipe 120, and under the action of the adsorption pipe 120, the position of the suction nozzle 110 can be ensured not to change, which is convenient for use.
[0039] In one embodiment, reference Figure 3 , Figure 4 The reference structure 200 is configured as a protrusion 220, and the protrusion 220 is fixedly arranged outside the suction head body 100. The outline of the protrusion 220 is used as a reference for wafer positioning. In this embodiment, the camera can identify the outline of the protrusion 220 when capturing the image information of the wafer, and the position of the wafer can be referenced and positioned according to the outline of the protrusion 220. At the same time, the protrusion 220 also adopts a central symmetrical structure, such as a circular, square, rectangular or other structure.
[0040] In one embodiment, the protrusion 220 is configured as a single-sided light-transmitting structure. In this embodiment, the single-sided light-transmitting structure has a side of the protrusion 220 facing the camera that is opaque, so that the camera can obtain the outer contour of the protrusion 220 when capturing image information, and a side of the protrusion 220 facing away from the camera is light-transmitting, which can facilitate the suction head body 100 to determine the position of the wafer to be adsorbed, and facilitate the suction nozzle 110 to adsorb the wafer. In this embodiment, the single-sided light-transmitting structure can be a single-sided light-transmitting material, or a one-way film can be combined with a fully light-transmitting material to form a single-sided light-transmitting structure.
[0041] In one embodiment, the protrusion 220 is fixed to the outside of the suction head body 100 by bonding. In this embodiment, the protrusion 220 can be conveniently connected to the suction head body 100 by bonding.
[0042] The above description is only an optional embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A suction head structure, characterized in that: include: The suction head body includes a suction nozzle; and The reference structure is arranged outside the suction head body, and the outline of the reference structure is used for the camera to identify when positioning the wafer.
2. The suction head structure according to claim 1, characterized in that: The profile of the reference structure is configured as a centrally symmetrical profile.
3. The suction head structure according to claim 1, characterized in that: The reference structure is arranged close to the suction nozzle of the suction head body.
4. The suction head structure according to claim 3, characterized in that: The suction head body is configured as a conical structure.
5. The suction head structure according to claim 4, characterized in that: The reference structure is configured as a step, and the contour of the step is used as a reference when positioning the wafer.
6. The suction head structure according to claim 5, characterized in that: The suction head body is made of a hard material.
7. The suction head structure according to claim 6, characterized in that: The step is configured as a grinding step.
8. The suction head structure according to claim 4, characterized in that: The reference structure is configured as a protrusion, which is fixed outside the suction head body, and the contour of the protrusion is used as a reference for wafer positioning.
9. The suction head structure according to claim 8, characterized in that: The protrusion is configured as a single-sided light-transmitting structure.
10. The suction head structure according to claim 8, characterized in that: The protrusion is fixed to the outside of the suction head body by bonding.