BT board LED packaging structure

Abstract

The utility model discloses a BT board LED packaging structure, which comprises a BT substrate, a first metal layer, a second metal layer, a plurality of first metal pads and a plurality of second metal pads, the first metal layer and the second metal layer are stacked on the top surface and the bottom surface of the BT substrate, the first metal pads are arranged on the first metal layer, and the second metal pads are arranged on the second metal layer. The first metal bonding pad comprises a plurality of bonding pad groups consisting of positive bonding pads and negative bonding pads, the second metal bonding pad comprises a first welding bonding pad corresponding to the bottom of each positive bonding pad and a second welding bonding pad corresponding to the bottom of each negative bonding pad, each negative bonding pad is provided with an LED wafer, the LED wafer is provided with a positive gold wire and a negative gold wire, and the positive gold wire and the negative gold wire are connected with the first welding bonding pad and the second welding bonding pad respectively. The positive gold wire and the negative gold wire are both in a bent arc shape, the tail ends of the positive gold wire and the negative gold wire are flat wire attaching ends, the positive gold wire is flat attached to the positive bonding pad, the negative gold wire is flat attached to the negative bonding pad, and packaging glue is arranged on the LED wafer, the positive gold wire, the negative gold wire, the positive bonding pad and the negative bonding pad for fixing. The bent arc-shaped flat attachment of the positive electrode gold wire and the negative electrode gold wire is beneficial to the reliability of gold wire connection.

Description

Technical Field

[0001] The utility model relates to the technical field of LED display, in particular to a BT board LED packaging structure. Background Art

[0002] With the development of technology, LED (Light Emitting Diode) lighting, also known as light-emitting diode lighting, is a semiconductor solid-state light-emitting device. Its advantages, such as high luminous efficiency, low power consumption, no need for high voltage, and high safety, have made it widely used in various lighting fields. It uses a solid semiconductor chip as the luminescent material. Carrier recombination within the semiconductor releases excess energy, causing photon emission, directly emitting red, yellow, blue, and green light. Furthermore, by utilizing the principle of the three primary colors and adding phosphors, it can emit light of any color. The semiconductor chip is a PN junction that directly converts electricity into light. The semiconductor chip is an LED chip containing a semiconductor. One end of the LED chip is attached to a lead frame (substrate), with one end being the negative terminal and the other end connected to the positive terminal of the power supply. The entire LED chip is then encapsulated with epoxy resin to form the LED package structure. Existing LED packaging structures typically use PPA material as the substrate, which is not suitable for high temperatures during application and is prone to melting and deformation of the shell. In addition, existing gold wire welding uses a straight line connection. When the packaging glue is used to package and fix the package, the stress released by the packaging glue is easily directly impacted by the gold wire, which is prone to breakage and affects the yield rate of product production. Utility Model Content

[0003] In order to overcome the above-mentioned deficiencies of the prior art, the present invention provides a BT board LED packaging structure to solve the problems that the packaging structure of the existing LED lamp beads is not resistant to high temperatures and the gold wire is easily broken.

[0004] The technical solution adopted by the utility model is: a BT board LED packaging structure, including a BT substrate, a first metal layer stacked on the top and bottom surfaces of the BT substrate, a second metal layer, a plurality of first metal pads arranged on the first metal layer, and a plurality of second metal pads arranged on the second metal layer, wherein the first metal pads include a plurality of pad groups consisting of positive electrode pads and negative electrode pads, the second metal pads include a first welding pad corresponding to the bottom of each positive electrode pad, a second welding pad corresponding to the bottom of each negative electrode pad, and each positive electrode pad. The pad is conductively connected to the corresponding first welding pad, and each negative pad is conductively connected to the corresponding second welding pad. An LED chip is arranged on each negative pad, and the LED chip is provided with a positive gold wire and a negative gold wire. The positive gold wire and the negative gold wire are both curved arc-shaped, and the ends are flat-attached wire ends. The positive gold wire is flat on the positive pad, and the negative gold wire is flat on the negative pad. A solid crystal area is formed on each LED chip and the corresponding positive gold wire, negative gold wire, positive pad, and negative pad, and the solid crystal area is fixed with packaging glue.

[0005] Furthermore, each positive electrode pad is connected to the corresponding first welding pad, and each negative electrode pad is connected to the corresponding second welding pad through a copper sinking hole.

[0006] Furthermore, the encapsulation adhesive is cured into an isosceles terrace shape with a small top surface and a large bottom surface.

[0007] Furthermore, the surface of the LED chip is coated with a phosphor layer.

[0008] Furthermore, the packaging glue is transparent epoxy resin or silicone.

[0009] The BT board LED packaging structure designed by this technical solution has the following beneficial effects:

[0010] First, it uses PCB printing technology to form multiple first metal pads and second metal pads on the BT substrate. The BT substrate is mainly white BT resin + glass cloth reinforcement layer. The BT substrate has greatly improved expansion coefficient and rigidity performance, which makes the size of the BT substrate stable when it passes through the reflow process temperature, improving the yield of processes such as solid crystal.

[0011] Second, the gold wire connecting the positive and negative poles of the LED chip is curved, and the end is designed to be flat. In this way, the gold wire connects the positive pad and the negative pad to achieve a flat arc. This helps to reduce the impact of the stress release of the packaging glue on the wire and reduce the possibility of wire breakage. Compared with using a straight line, the stress release directly impacts the straight line, which is easy to cause wire breakage, thus causing the problem of dead light.

[0012] Third, the encapsulation glue is in the shape of an isosceles terrace with a small top surface and a large bottom surface. This structure is conducive to demoulding and is convenient for production. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the top surface of the LED packaging structure of the present invention.

[0014] Figure 2 This is a schematic diagram of the bottom surface of the LED packaging structure of the present invention.

[0015] Figure 3 This is a side view of the LED packaging structure of the present invention. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0017] See also Figures 1 to 3 A BT board LED packaging structure includes a BT substrate 1, a first metal layer and a second metal layer stacked on the top and bottom surfaces of the BT substrate 1, a plurality of first metal pads arranged on the first metal layer, and a plurality of second metal pads arranged on the second metal layer, wherein the first metal pads include a plurality of pad groups consisting of positive electrode pads 101 and negative electrode pads 102, the second metal pads include a first welding pad 103 corresponding to the bottom of each positive electrode pad 101, and a second welding pad 104 corresponding to the bottom of each negative electrode pad 102, each positive electrode pad 101 is conductively connected to the corresponding first welding pad 103, and each negative electrode pad 102 is conductively connected to the corresponding first welding pad 103. The positive electrode pad 102 is conductively connected to the corresponding second welding pad 104. An LED chip 2 is arranged on each negative electrode pad 102. The LED chip 2 is provided with a positive electrode gold wire 201 and a negative electrode gold wire 202. The positive electrode gold wire 201 and the negative electrode gold wire 202 are both curved arc-shaped, and the ends are flat-attached line ends a. The positive electrode gold wire 201 is flat on the positive electrode pad 101, and the negative electrode gold wire 202 is flat on the negative electrode pad 102. A solid crystal area is formed on each LED chip 2 and the corresponding positive electrode gold wire 201, negative electrode gold wire 202, positive electrode pad 101, and negative electrode pad 102, and the solid crystal area is fixed with packaging glue 3.

[0018] The first metal layer and the second metal layer form a copper-clad board with the BT substrate 1. Multiple first metal pads and second metal pads are formed on the BT substrate 1 using PCB printing technology. The BT substrate 1 is mainly white BT resin + glass cloth reinforcement layer. The BT substrate has greatly improved expansion coefficient and rigidity performance, which makes the size of the BT substrate 1 stable when passing through the reflow process temperature, and improves the yield of processes such as solid crystal. Among them, the first welding pad 103 and the second welding pad 104 are used to realize the welding of LED lamp beads on the lamp strip or lamp board.

[0019] Reference Figure 3In this solution, the gold wire connecting the positive and negative electrodes of the LED chip 2 is curved, and the end is designed to be flat-attached to the wire end a. In this way, the gold wire connects the positive electrode pad 101 and the negative electrode pad 102 to achieve a flat wire arc, which is beneficial to reduce the impact of the stress release of the package 3 on the wire and reduce the possibility of wire breakage. Compared with using a straight line, the stress release directly impacts the straight line, which is easy to cause wire breakage, thereby causing the problem of dead light.

[0020] Furthermore, each positive electrode pad 101 is connected to the corresponding first welding pad 103 , and each negative electrode pad 102 is connected to the corresponding second welding pad 104 via copper-plated holes.

[0021] Furthermore, the encapsulation glue 3 is cured into an isosceles terrace shape with a small top surface and a large bottom surface. This shape design is convenient for glue dispensing and demoulding, and is easy to produce.

[0022] Furthermore, the surface of the LED chip 2 is coated with a phosphor layer.

[0023] Furthermore, the packaging glue 3 is transparent epoxy resin or silicone.

[0024] The above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Obvious changes or modifications derived from the essence of the present invention are still within the scope of protection of the present invention.

Claims

1. A BT board LED packaging structure, characterized in that: The invention comprises a BT substrate (1), a first metal layer and a second metal layer stacked on the top and bottom surfaces of the BT substrate (1), a plurality of first metal pads arranged on the first metal layer, and a plurality of second metal pads arranged on the second metal layer, wherein the first metal pads comprise a plurality of pad groups consisting of positive electrode pads (101) and negative electrode pads (102), the second metal pads comprise a first welding pad (103) corresponding to the bottom of each positive electrode pad (101) and a second welding pad (104) corresponding to the bottom of each negative electrode pad (102), each positive electrode pad (101) is electrically connected to the corresponding first welding pad (103), and each negative electrode pad (102) is electrically connected to the corresponding second welding pad (104). The plates (104) are electrically connected, an LED chip (2) is arranged on each negative electrode pad (102), and the LED chip (2) is provided with a positive electrode gold wire (201) and a negative electrode gold wire (202), the positive electrode gold wire (201) and the negative electrode gold wire (202) are both in the shape of curved arcs, and the ends are flat line ends (a), the positive electrode gold wire (201) is flat on the positive electrode pad (101), and the negative electrode gold wire (202) is flat on the negative electrode pad (102), and a crystal bonding area is formed on each LED chip (2) and the corresponding positive electrode gold wire (201), negative electrode gold wire (202), positive electrode pad (101), and negative electrode pad (102), and the crystal bonding area is provided with packaging glue (3) for fixing.

2. The BT board LED packaging structure according to claim 1, characterized in that: Each positive electrode pad (101) and the corresponding first welding pad (103), and each negative electrode pad (102) and the corresponding second welding pad (104) are connected by providing copper-plated holes.

3. The BT board LED packaging structure according to claim 1, characterized in that: The packaging glue (3) is cured to form an isosceles terrace shape with a small top surface and a large bottom surface.

4. The BT board LED packaging structure according to claim 1, characterized in that: The surface of the LED chip (2) is coated with a phosphor layer.

5. The BT board LED packaging structure according to claim 1, characterized in that: The packaging glue (3) is transparent epoxy resin or silica gel.

Images