Liquid crystal polymer (LCP) rigid copper-clad plate

Abstract

The utility model belongs to the field of copper-clad plates, and particularly relates to a liquid crystal polymer (LCP) rigid copper-clad plate which comprises a base layer, a first heat-conducting medium layer is arranged at the top of the base layer, a copper foil layer is arranged at the top of the first heat-conducting medium layer, a first insulating layer is arranged at the guide top of the copper foil layer, and a groove is formed in the first insulating layer. A protruding block is arranged in the groove, and a copper foil layer is arranged at the bottom of the protruding block. By designing the first heat-conducting medium layer, the copper foil layer, the groove, the bump, the second heat-conducting medium layer, the liquid crystal polymer layer and other parts, the first heat-conducting medium layer and the second heat-conducting medium layer dissipate heat for the whole, the copper foil layer enables the heat-conducting film to have good conductivity, and the copper foil layer and the first insulating layer are firmer through the cooperation of the groove and the bump; the liquid crystal polymer layer provides high strength and stability, so that the copper-clad plate is durable.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid crystal polymer (LCP) rigid copper clad laminates, in particular to a liquid crystal polymer (LCP) rigid copper clad laminate. Background Art

[0002] Copper clad laminate is a basic material commonly used in electronic engineering and is used to manufacture circuit boards. It is widely used in electronic equipment. For example, the utility model patent with the patent authorization announcement number CN202463044U proposes a copper clad laminate, including: a reinforcing material, a resin layer arranged on both sides of the reinforcing material, and a copper foil arranged on the resin layer. The copper clad laminate of the utility model is directly made by laminating the copper foil, the resin layer and the reinforcing material, which effectively solves the defects of the prepreg in the prior art, such as stripes and bubbles, and the sedimentation and uneven dispersion of the filler, and the appearance of the prepreg is unqualified. The resin layer can be made of resin glue with different functions as needed, and copper clad laminates with different functional layers and different thickness layers can be realized. In the prior art, the copper clad laminate does not have heat dissipation, high strength and stability, resulting in the copper clad laminate being not durable. Therefore, the prior art is improved. Summary of the invention

[0003] The utility model aims to provide a liquid crystal polymer (LCP) rigid copper clad laminate, which solves the problem that the copper clad laminate does not have heat dissipation, high strength and stability, resulting in the copper clad laminate being not durable.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a liquid crystal polymer (LCP) rigid copper clad laminate, comprising a base layer, a first heat-conducting medium layer is arranged on the top of the base layer, a copper foil layer is arranged on the top of the first heat-conducting medium layer, a first insulating layer is arranged on the top of the copper foil layer, a groove is opened inside the first insulating layer, a bump is arranged inside the groove, a copper foil layer is arranged at the bottom of the bump, a second heat-conducting medium layer is arranged at the bottom of the base layer, a liquid crystal polymer layer is arranged at the bottom of the second heat-conducting medium layer, and a second insulating layer is arranged at the bottom of the liquid crystal polymer layer.

[0005] Preferably, the first heat-conducting medium layer is made of aluminum material, and the thickness of the first heat-conducting medium layer is 0.3 mm. By designing the first heat-conducting medium layer, heat can be dissipated as a whole.

[0006] Preferably, the copper foil layer is made of copper material, and the thickness of the copper foil layer is 0.2 mm. The copper foil layer can be used for conducting electricity and connecting electronic components by designing the copper foil layer.

[0007] Preferably, the first insulating layer is made of organic resin material, and the thickness of the first insulating layer is 0.3 mm. The first insulating layer can play an insulating role by designing it.

[0008] Preferably, there are a plurality of protrusions, and the plurality of protrusions are symmetrically distributed on the top of the copper foil layer. By designing the protrusions, the first insulating layer and the copper foil layer can be made more secure.

[0009] Preferably, the liquid crystal polymer layer is a polymer material, and the thickness of the liquid crystal polymer layer is 0.2 mm. By designing the liquid crystal polymer layer, the whole structure can have high strength and stability.

[0010] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0011] The utility model designs components such as a first heat-conducting medium layer, a copper foil layer, grooves, bumps, a second heat-conducting medium layer and a liquid crystal polymer layer. The first heat-conducting medium layer and the second heat-conducting medium layer dissipate heat for the whole. The copper foil layer has good electrical conductivity. The combination of the grooves and the bumps can make the copper foil layer and the first insulating layer more firm. The liquid crystal polymer layer provides high strength and stability, making the copper clad laminate durable. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a three-dimensional diagram of the overall structure of the utility model;

[0013] Figure 2 For this utility model Figure 1 A front cross-sectional view of

[0014] Figure 3 For this utility model Figure 2 Enlarged view of point A.

[0015] In the figure: 1, base layer; 2, first thermal conductive medium layer; 3, copper foil layer; 4, first insulating layer; 5, groove; 6, bump; 7, second thermal conductive medium layer; 8, liquid crystal polymer layer; 9, second insulating layer. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] See also Figure 1-Figure 3A liquid crystal polymer (LCP) rigid copper clad laminate comprises a base layer 1, a first heat-conducting medium layer 2 is arranged on the top of the base layer 1, the first heat-conducting medium layer 2 is made of aluminum material, the thickness of the first heat-conducting medium layer 2 is 0.3 mm, and the first heat-conducting medium layer 2 can be designed to dissipate heat as a whole, a copper foil layer 3 is arranged on the top of the first heat-conducting medium layer 2, the copper foil layer 3 is made of copper material, the thickness of the copper foil layer 3 is 0.2 mm, and the copper foil layer 3 can be used for conducting electricity and connecting electronic components.

[0018] See also Figure 1-Figure 3 A first insulating layer 4 is arranged on the top of the copper foil layer 3. The first insulating layer 4 is made of organic resin material. The thickness of the first insulating layer 4 is 0.3 mm. By designing the first insulating layer 4, it can play an insulating role. A groove 5 is opened inside the first insulating layer 4. A bump 6 is arranged inside the groove 5. There are multiple bumps 6, and the multiple bumps 6 are symmetrically distributed on the top of the copper foil layer 3. By designing the bumps 6, the first insulating layer 4 and the copper foil layer 3 can be made more firm.

[0019] See also Figure 1-Figure 3 A copper foil layer 3 is provided at the bottom of the bump 6, a second thermal conductive medium layer 7 is provided at the bottom of the base layer 1, a liquid crystal polymer layer 8 is provided at the bottom of the second thermal conductive medium layer 7, the liquid crystal polymer layer 8 is a polymer material, and the thickness of the liquid crystal polymer layer 8 is 0.2 mm. By designing the liquid crystal polymer layer 8, the whole can have high strength and stability, and a second insulating layer 9 is provided at the bottom of the liquid crystal polymer layer 8.

[0020] The specific implementation process of the utility model is as follows: first, the first insulating layer 4 and the second insulating layer 9 provide mechanical support. The cooperation of the groove 5 and the protrusion 6 can make the copper foil layer 3 and the first insulating layer 4 more firm. The copper foil layer 3 has good electrical conductivity. The first thermal conductive medium layer 2 and the second thermal conductive medium layer 7 can conduct heat and dissipate heat as a whole. The liquid crystal polymer layer 8 provides high strength and stability, making the copper clad laminate durable.

[0021] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A liquid crystal polymer (LCP) rigid copper clad laminate, comprising a base layer (1), characterized in that: A first heat-conducting medium layer (2) is arranged on the top of the base layer (1), a copper foil layer (3) is arranged on the top of the first heat-conducting medium layer (2), a first insulating layer (4) is arranged on the top of the copper foil layer (3), a groove (5) is provided inside the first insulating layer (4), a bump (6) is provided inside the groove (5), the copper foil layer (3) is arranged at the bottom of the bump (6), a second heat-conducting medium layer (7) is arranged at the bottom of the base layer (1), a liquid crystal polymer layer (8) is arranged at the bottom of the second heat-conducting medium layer (7), and a second insulating layer (9) is arranged at the bottom of the liquid crystal polymer layer (8).

2. The liquid crystal polymer (LCP) rigid copper clad laminate according to claim 1, characterized in that: The first heat-conducting medium layer (2) is made of aluminum material, and the thickness of the first heat-conducting medium layer (2) is 0.3 mm.

3. The liquid crystal polymer (LCP) rigid copper clad laminate according to claim 1, characterized in that: The copper foil layer (3) is made of copper material, and the thickness of the copper foil layer (3) is 0.2 mm.

4. The liquid crystal polymer (LCP) rigid copper clad laminate according to claim 1, characterized in that: The first insulating layer (4) is made of organic resin material, and the thickness of the first insulating layer (4) is 0.3 mm.

5. The liquid crystal polymer (LCP) rigid copper clad laminate according to claim 1, characterized in that: There are a plurality of the bumps (6), and the plurality of the bumps (6) are symmetrically distributed on the top of the copper foil layer (3).

6. The liquid crystal polymer (LCP) rigid copper clad laminate according to claim 1, characterized in that: The liquid crystal polymer layer (8) is a polymer material, and the thickness of the liquid crystal polymer layer (8) is 0.2 mm.

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