Tool for cleaning wafer

Abstract

The utility model belongs to the technical field of semiconductor production auxiliary equipment, and particularly relates to a tool for cleaning a wafer. The tool comprises a cleaning panel, at least one clamp is arranged on the cleaning panel, and each clamp comprises a fixing block, at least one clamping block and a clamping block, at least one moving block is connected to the cleaning panel in a sliding manner; a plurality of protrusions are arranged in an area defined by the movable blocks and the fixed blocks on the cleaning panel, the movable blocks move to push to-be-cleaned wafers placed on the protrusions to move, and the to-be-cleaned wafers are fixed between the movable blocks and the fixed blocks. According to the utility model, the plurality of bulges are adopted to support the wafer, the movable moving block is arranged on the cleaning panel, and the wafer is fixed relative to the fixed block through the movement of the moving block, so that the wafer is prevented from shaking in the cleaning process.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor production auxiliary equipment, in particular to a tooling for cleaning wafers. Background Art

[0002] The purpose of wafer cleaning is to remove residual impurities, particles, etc. on the surface without changing or damaging the wafer surface.

[0003] Manufacturing integrated circuits requires hundreds of precise processing steps, depending on the type of chip device. About 20% of these steps involve wafer cleaning.

[0004] In the prior art, a cleaning basket is generally used. Although the cleaning basket can hold multiple wafers at one time, the wafers will shake during the cleaning process. The shaking of the wafers will collide with the basket, which may cause damage to the wafer surface or even breakage. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide a tool for cleaning wafers, which can clamp and fix the wafers so that the wafers will not shake during cleaning.

[0006] The technical solution proposed by the utility model is:

[0007] A tool for cleaning a wafer, comprising a cleaning panel, wherein at least one fixture is arranged on the cleaning panel, and the fixture comprises:

[0008] A fixing block, at least one fixing block is fixedly arranged on the cleaning panel;

[0009] A moving block, at least one moving block is slidably connected to the cleaning panel;

[0010] A plurality of protrusions are arranged in the area surrounded by the moving block and the fixed block on the cleaning panel. The moving block pushes the wafer to be cleaned placed on the protrusions to move, and fixes the wafer to be cleaned between the moving block and the fixed block.

[0011] Optionally, a plurality of clamps are provided on the cleaning panel.

[0012] Optionally, the cleaning panel has a first direction and a second direction that are perpendicular to each other;

[0013] At least one fixed block forms a first fixed group along the first direction, at least one fixed block forms a second fixed group along the second direction, at least one movable block is arranged relative to the first fixed group along the second direction, and at least one movable block is arranged relative to the second fixed group along the first direction.

[0014] Optionally, the cross-section of the cleaning panel is circular, and four clamps are provided, and the four clamps are distributed in a rectangular array.

[0015] Optionally, two clamps that are close to each other along the first direction share a second fixing group; and two clamps that are close to each other along the second direction share a first fixing group.

[0016] Optionally, the surface of the cleaning panel on which the fixture is provided is a conical surface.

[0017] Optionally, the protrusion is in a spherical crown shape, and the fixing block is a cylinder.

[0018] Optionally, a slide groove is provided on the cleaning panel, and the moving block is slidably connected to the slide groove.

[0019] Optionally, the moving block includes:

[0020] substrate;

[0021] A slide plate, at least one slide plate is connected to the base plate, and the slide plate is slidably connected in the slide groove;

[0022] The first limiting plate is arranged on the base plate and is L-shaped.

[0023] Optionally, the moving block further includes:

[0024] The second limiting plate is L-shaped and connected to the first limiting plate. The first limiting plate and the second limiting plate are arranged in a stepped shape.

[0025] Optionally, also include:

[0026] A fixing member fixes the moving block relative to the cleaning panel.

[0027] Compared with the prior art, the beneficial effects of the utility model are:

[0028] The utility model supports the wafer through a plurality of protrusions during cleaning, and a movable moving block is arranged on the cleaning panel, the wafer is pushed by the movement of the moving block, and the wafer is fixed between the moving block and the fixed block, so as to avoid shaking of the wafer during the cleaning process. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention.

[0030] Figure 1 It is a three-dimensional diagram of the utility model;

[0031] Figure 2 For this utility model Figure 1 A top view of

[0032] Figure 3 This is a front view of the moving block of the utility model;

[0033] Figure 4 It is a three-dimensional diagram of the moving block of the utility model;

[0034] Figure 5 This is a schematic diagram of the structure of the utility model when clamping a circular wafer;

[0035] Figure 6 This is a schematic structural diagram of a rectangular cleaning panel of the utility model.

[0036] In the figure: 1. cleaning panel; 2. protrusion; 3. fixed block; 4. moving block; 5. slide groove; 6. base plate; 7. slide plate; 8. first limit plate; 9. second limit plate; 10. bolt; 11. slotted hole; 12. threaded hole. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0038] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0039] Example 1

[0040] Please refer to Figure 1-6 A tool for cleaning a wafer, comprising a cleaning panel 1, on which at least one fixture is arranged, the fixture comprising:

[0041] A fixing block 3, at least one fixing block 3 is fixedly arranged on the cleaning panel 1;

[0042] A moving block 4, at least one moving block 4 is slidably connected to the cleaning panel 1;

[0043] A plurality of protrusions 2 are arranged in the area surrounded by the moving block 4 and the fixed block 3 on the cleaning panel 1 . The moving block 4 pushes the wafer to be cleaned placed on the protrusion 2 to move, and fixes the wafer to be cleaned between the moving block 4 and the fixed block 3 .

[0044] As a further solution, the protrusion 2 is spherical cap-shaped. The use of the spherical cap-shaped protrusion 2 can reduce the contact area between the protrusion 2 and the wafer, thereby ensuring the effect of wafer cleaning.

[0045] As a further solution, the fixing block 3 is a cylinder. By setting the fixing block 3 as a cylindrical structure, the contact area between the cylinder and the wafer can be reduced.

[0046] Furthermore, the end of the cylinder away from the cleaning panel 1 is rounded. By setting the rounded corner, the risk of scratching the surface of the cleaning wafer can be reduced.

[0047] As a further solution, a plurality of clamps are provided on the cleaning panel, and a plurality of clamps are provided to clamp a plurality of wafers at the same time.

[0048] Specifically, the wafer to be clamped is placed on the plurality of protrusions 2 , and then the moving block 4 is pushed, and the moving block 4 pushes the wafer to move toward the plurality of fixed blocks 3 , so that the wafer is clamped and fixed by the fixed blocks 3 and the moving block 4 .

[0049] It should be noted that, in the present embodiment, the shape of the wafer to be cleaned is not limited, and may also be circular, polygonal, etc.

[0050] Example 2

[0051] refer to Figure 2 , Figure 6 , for a rectangular wafer, the arrangement of the fixing block 3 and the protrusion 2 in the present invention is described in detail.

[0052] The cleaning panel 1 has a first direction and a second direction perpendicular to each other. When the wafer to be cleaned is rectangular, at least one fixed block 3 forms a first fixed group along the first direction, at least one fixed block 3 forms a second fixed group along the second direction, at least one moving block 4 is arranged relative to the first fixed group along the second direction, and at least one moving block 4 is arranged relative to the second fixed group along the first direction. The first fixed group and at least one moving block 4 are arranged on both sides of the wafer to be cleaned along the second direction, and the second fixed group and at least one moving block 4 are arranged on both sides of the wafer to be cleaned along the first direction.

[0053] During clamping, the two moving blocks 4 move in the first direction and the second direction respectively, and push the rectangular wafer so that the rectangular wafer is closely attached to the fixed block 3. In this solution, the fixed block 3 is used as the positioning reference, which can ensure that after the wafer is clamped and fixed, the wafer is in uniform contact with the plurality of protrusions 2.

[0054] It should be noted that when multiple fixing blocks 3 are arranged in the same direction, gaps are left between adjacent fixing blocks 3 to facilitate the discharge of the cleaning liquid.

[0055] As a further solution, the cross section of the cleaning panel 1 is set to be circular, and four clamps are provided, and the four clamps are distributed in a rectangular array.

[0056] Furthermore, two clamps approaching each other along the first direction share a second fixing group; and two clamps approaching each other along the second direction share a first fixing group.

[0057] By adopting this solution, four wafers can be clamped at the same time, the utilization rate of the cleaning panel 1 is high, and the clamping operation is also more convenient.

[0058] It should be noted that, obviously, only one, two or three clamps may be provided on the cleaning panel 1 according to requirements.

[0059] As a further solution, the surface of the cleaning panel 1 on which the clamp is provided is a conical surface. With this solution, the cleaning liquid can be discharged through the inclined cleaning panel 1, thereby preventing the cleaning liquid and impurities from remaining on the cleaning panel 1.

[0060] Example 3

[0061] refer to Figure 1 , Figure 3 , Figure 4 , a detailed description is given of the structure of the movable block 4 in the utility model for achieving sliding.

[0062] The cleaning panel 1 is provided with a chute 5, and the moving block 4 is slidably connected to the chute 5. The cross-sectional shape of the chute 5 is not limited, and can be a dovetail shape, a T-shape, a rectangle, etc. In this solution, the chute 5 extends out of the outer wall of the cleaning panel 1, and the cleaning liquid and impurities can be discharged along the chute 5 during cleaning.

[0063] As a further solution, moving block 4 includes:

[0064] substrate 6;

[0065] Slide plate 7, at least one slide plate 7 is connected to the base plate 6, and the slide plate 7 is slidably connected in the slide groove 5;

[0066] The first limiting plate 8 is L-shaped, the vertical end of the first limiting plate 8 is connected to the base plate 6, the vertical end of the first limiting plate 8 cooperates with the fixed block 3 to limit the position of the chip in the horizontal direction, and the horizontal end of the first limiting plate 8 cooperates with the protrusion 2 to limit the position of the chip in the vertical direction.

[0067] Obviously, a standard slider can also be used in conjunction with a guide rail to enable the moving block 4 to slide on the cleaning panel 1 .

[0068] It should be noted that, in the present embodiment, the slide plate 7 is provided in two pieces, which are spaced apart along the length direction of the slide slot 5 , and a pair of slide plates 7 are located on both sides of the slot hole 11 .

[0069] By providing the first limiting plate 8, the position of the wafer in the vertical direction can be further limited.

[0070] As a further solution, in order to better limit the vertical position of the chip, a limit groove can be set on the outer wall of the fixed block 3. When clamping the chip, the chip is inserted into the limit groove and cooperates with the first limit plate 8 to fix the chip in the vertical direction.

[0071] In order to accommodate wafers of different thicknesses, the fixing block 3 and the cleaning panel 1 may be detachably connected, and the detachable manner may be a threaded connection.

[0072] As a further solution, the moving block 4 further comprises:

[0073] The second limiting plate 9 is L-shaped, and both the vertical end and the horizontal end of the second limiting plate 9 are in contact with the wafer. The first limiting plate 8 and the second limiting plate 9 are arranged in a stepped shape.

[0074] By providing the second limiting plate 9, the first limiting plate 8 or the second limiting plate 9 can be selected for clamping according to the thickness of the wafer.

[0075] As a further solution, the fixing member is a bolt 10, the base plate 6 is provided with a slot hole 11, and at least one threaded hole 12 is provided on the bottom surface of the slide groove 5. The screw rod of the bolt 10 passes through the slot hole 11 and is threadedly connected to the threaded hole 12, and the bolt head of the bolt 10 is restricted from passing through the slot hole 11.

[0076] When one threaded hole 12 is provided, the movable distance of the moving block 4 is equal to the movable distance of the screw rod of the bolt 10 in the slotted hole 11 .

[0077] Specifically, after the sliding moving block 4 reaches a predetermined position, the bolt 10 is screwed, and the bolt head 10 of the bolt 10 cooperates with the cleaning panel to clamp and fix the moving block 4.

[0078] It should be noted that the moving block 4 and the slide slot 5 are detachably connected. When cleaning the utility model, the moving block 4 and the bolt 10 are disassembled for more thorough cleaning.

[0079] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A tool for cleaning a wafer, characterized in that: The cleaning panel comprises at least one fixture provided on the cleaning panel, wherein the fixture comprises: A fixing block, at least one fixing block is fixedly arranged on the cleaning panel; A moving block, at least one moving block is slidably connected to the cleaning panel; A plurality of protrusions are arranged in the area surrounded by the moving block and the fixed block on the cleaning panel. The moving block pushes the wafer to be cleaned placed on the protrusions to move, and fixes the wafer to be cleaned between the moving block and the fixed block.

2. The tooling according to claim 1, characterized in that: A plurality of clamps are provided on the cleaning panel.

3. The tooling according to claim 2, characterized in that: The cleaning panel has a first direction and a second direction perpendicular to each other; In a fixture, at least one fixed block forms a first fixed group along a first direction, at least one fixed block forms a second fixed group along a second direction, at least one movable block is arranged relative to the first fixed group along the second direction, and at least one movable block is arranged relative to the second fixed group along the first direction.

4. The tooling according to claim 3, characterized in that: The cross section of the cleaning panel is circular, and four clamps are arranged, and the four clamps are distributed in a rectangular array.

5. The tooling according to claim 4, characterized in that: The surface of the cleaning panel on which the clamp is arranged is a conical surface.

6. The tooling according to any one of claims 1 to 5, characterized in that: The protrusion is in a spherical crown shape, and the fixing block is in a cylindrical shape.

7. The tooling according to any one of claims 1 to 5, characterized in that: The cleaning panel is provided with a slide groove, and the moving block is slidably connected with the slide groove.

8. The tooling according to claim 7, characterized in that: The moving block includes: substrate; A slide plate, at least one slide plate is connected to the base plate, and the slide plate is slidably connected in the slide groove; The first limiting plate is arranged on the base plate and is L-shaped.

9. The tooling according to claim 8, characterized in that: The moving block also includes: The second limiting plate is L-shaped and connected to the first limiting plate. The first limiting plate and the second limiting plate are arranged in a stepped shape.

10. The tooling according to any one of claims 1 to 5, characterized in that: Also includes: A fixing member fixes the moving block relative to the cleaning panel.

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