Soldering flux recovery device for microelectronic device

Abstract

The utility model discloses a microelectronic device scaling powder recovery device which comprises a funnel, a temporary storage box communicated with a discharge port located at the lower end of the funnel, an opening formed in one side of the temporary storage box, and an air compressor located on the side, opposite to the opening, of the temporary storage box and located below the funnel. A multi-way pipeline is arranged between the air compressor and the temporary storage box, an air jet hole is formed in the end, located in the temporary storage box, of the multi-way pipeline, a heating cavity internally provided with a heating pipe is formed between the multi-way pipeline and an air outlet of the air compressor, and the top and the bottom, close to the open side, of the temporary storage box are each provided with a strip-shaped through hole. The upper strip-shaped through hole and the lower strip-shaped through hole are correspondingly communicated, the upper portion and the lower portion of the temporary storage box are each provided with a rotating shaft, and a metal filter screen is arranged between the two rotating shafts in a sleeved mode. According to the scaling powder recycling device, scaling powder can be filtered twice, the content of impurities in the scaling powder is greatly reduced, and the scaling powder can be recycled conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of soldering flux recovery devices, in particular to a soldering flux recovery device for microelectronic devices. Background Art

[0002] In the packaging of microelectronic devices, flux is a chemical substance that can help and promote the welding process, and at the same time has a protective effect and prevents oxidation reactions. Flux is usually a mixture with rosin as the main component, and is an auxiliary material to ensure the smooth progress of the welding process. Welding is the main process in electronic assembly, and flux is an auxiliary material used in welding. The main function of flux is to remove oxides on the surface of solder and the base material to be welded, so that the metal surface reaches the necessary cleanliness.

[0003] After searching, the patent publication number CN115070158A discloses "a flux recovery device and recovery method", including a shell assembly, a fan assembly, a tensioning assembly, a cooling assembly, a filtering assembly and a recovery assembly, wherein the fan assembly is ventilatedly connected to the shell assembly; the shell assembly includes a box, an air inlet and an air outlet, wherein the air inlet is connected to the welding chamber of the welding equipment, and the air outlet is connected to another position of the welding chamber of the welding equipment; along the flow direction of the flux vapor, the filtering assembly, the cooling assembly and the recovery assembly are successively connected, and the tensioning assembly, the cooling assembly, the filtering assembly and the recovery assembly are airtightly connected and arranged in the shell assembly. The device can ensure the recovery effect of the recovery device on the flux, and make the flux condense in the recovery assembly as much as possible, so as to facilitate cleaning and maintenance.

[0004] In the prior art, excess soldering flux in the welding process is recycled. However, during the recycling process, the soldering flux is easily entrained with impurities, thereby affecting the secondary use of the soldering flux. Utility Model Content

[0005] The utility model aims to provide a soldering flux recovery device for microelectronic devices, which can filter the soldering flux twice, greatly reducing the impurity content inside the soldering flux and facilitating the recycling of the soldering flux.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a microelectronic device solder flux recovery device, comprising: a funnel, a discharge port at the lower end of the funnel is connected to a temporary storage box, one side of the temporary storage box is provided with an opening, an air compressor is provided on the side of the temporary storage box opposite to the opening and below the funnel, a multi-way pipe is provided between the air compressor and the temporary storage box, and an air jet is provided at one end of the multi-way pipe located inside the temporary storage box, and a heating chamber with a built-in heating pipe is provided between the multi-way pipe and the air outlet of the air compressor;

[0007] A strip through hole is respectively opened at the top and bottom of the temporary storage box near the open side, and the upper and lower strip through holes are connected to each other. A rotating shaft is respectively arranged above and below the temporary storage box, and a metal filter is sleeved between the two rotating shafts. One side of the metal filter passes through the two strip through holes, and the other side covers the open opening.

[0008] The further improved scheme in the above technical scheme is as follows:

[0009] 1. In the above scheme, each of the rotating shafts is rotatably installed between two bearing seats.

[0010] 2. In the above scheme, a synchronous wheel is installed on the circumferential outer wall of the rotating shaft, and a synchronous belt is sleeved between the upper and lower synchronous wheels.

[0011] 3. In the above scheme, a first connecting frame is provided on one side of one of the bearing seats, and a stepping motor for driving the rotating shaft to rotate is installed on the first connecting frame.

[0012] 4. In the above solution, the air compressor and the heating chamber are connected via a connecting pipe.

[0013] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0014] The utility model discloses a solder flux recovery device for microelectronic devices, which is located at a side of a temporary storage box opposite to an open opening and an air compressor is arranged below a funnel, a multi-channel pipe is arranged between the air compressor and the temporary storage box, and an air jet is arranged at one end of the multi-channel pipe located inside the temporary storage box, and a heating chamber with a built-in heating tube is arranged between the multi-channel pipe and the air outlet of the air compressor; a strip through hole is respectively opened at the top and bottom of the temporary storage box near the open opening, and the upper and lower strip through holes are correspondingly connected, a rotating shaft is respectively arranged above and below the temporary storage box, and a metal filter is sleeved between the two rotating shafts, and a temporary storage box with an open opening is arranged at the discharge port of the funnel, so that the airflow sprayed by the air compressor is heated by the heating chamber and then sprayed to the solder flux inside the temporary storage box, and the melted solder flux is blown to the metal filter, and filtered twice by the metal filter, so that the impurity content inside the solder flux is greatly reduced, and the solder flux is convenient for recycling. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Attached Figure 1 This is a schematic diagram of the structure of the recovery device of the utility model;

[0016] Attached Figure 2 This is a partial structural exploded view of the soldering flux recovery device of the utility model;

[0017] Attached Figure 3 It is a partial structural cross-sectional view of the soldering flux recovery device of the utility model.

[0018] In the above drawings: 1, temporary storage box; 101, open mouth; 201, rotating shaft; 202, stepping motor; 203, first connecting frame; 204, synchronous belt; 205, synchronous wheel; 206, bearing seat; 301, funnel; 302, second connecting frame; 303, air compressor; 304, multi-pass pipeline; 305, jet nozzle; 306, metal filter; 307, strip through hole; 4, heating chamber; 5, heating tube; 6, connecting tube. DETAILED DESCRIPTION

[0019] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0020] Embodiment 1: A solder flux recovery device for microelectronic devices, comprising: a funnel 301, a discharge port at the lower end of the funnel 301 is connected to a temporary storage box 1, an opening 101 is provided on one side of the temporary storage box 1, an air compressor 303 is provided on the side of the temporary storage box 1 opposite to the opening 101 and below the funnel 301, a multi-way pipe 304 is provided between the air compressor 303 and the temporary storage box 1, and an air jet 305 is provided at one end of the multi-way pipe 304 located inside the temporary storage box 1, and a heating chamber 4 with a built-in heating tube 5 is provided between the multi-way pipe 304 and the air outlet of the air compressor 303;

[0021] When the liquid flux slides into the funnel, it falls into the temporary storage box along the funnel for temporary storage, and then the external gas is extracted through the air compressor. After the gas is heated by the heating tube in the heating chamber, it is ejected from multiple jet ports through the multi-pass pipeline, acting on the flowing flux liquid and driving it to pass through the metal filter for filtration;

[0022] A strip through hole 307 is respectively opened at the top and bottom of the temporary storage box 1 near the opening 101, and the upper and lower strip through holes 307 are correspondingly connected. A rotating shaft 201 is respectively arranged above and below the temporary storage box 1, and a metal filter 306 is sleeved between the two rotating shafts 201. One side of the metal filter 306 passes through the two strip through holes 307, and the other side shields the opening 101.

[0023] After the welding flux passes through the metal filter under the action of high-pressure gas, the particles attached inside the welding process can be directly filtered out, and the flux liquid can be fully filtered. In addition, the stepper motor is started to drive the rotating shaft to rotate, and the metal filter can rotate synchronously with the two rotating shafts through the synchronous wheel and synchronous belt, thereby continuously changing the passing position of the flux liquid to avoid the accumulation of flux in the local part of the metal filter.

[0024] A synchronous wheel 205 is installed on the circumferential outer wall of the rotating shaft 201 , and a synchronous belt 204 is sleeved between the upper and lower synchronous wheels 205 .

[0025] A first connecting frame 203 is disposed on one side of one of the bearing seats 206 , and a stepping motor 202 for driving the rotating shaft 201 to rotate is installed on the first connecting frame 203 .

[0026] The air compressor 303 is connected to the heating chamber 4 via a connecting pipe 6 .

[0027] Embodiment 2: A solder flux recovery device for microelectronic devices, comprising: a funnel 301, a discharge port at the lower end of the funnel 301 is connected to a temporary storage box 1, an opening 101 is provided on one side of the temporary storage box 1, an air compressor 303 is provided on the side of the temporary storage box 1 opposite to the opening 101 and below the funnel 301, a multi-way pipe 304 is provided between the air compressor 303 and the temporary storage box 1, and an air jet 305 is provided at one end of the multi-way pipe 304 located inside the temporary storage box 1, and a heating chamber 4 with a built-in heating tube 5 is provided between the multi-way pipe 304 and the air outlet of the air compressor 303;

[0028] A strip through hole 307 is respectively opened at the top and bottom of the temporary storage box 1 near the opening 101, and the upper and lower strip through holes 307 are correspondingly connected. A rotating shaft 201 is respectively arranged above and below the temporary storage box 1, and a metal filter 306 is sleeved between the two rotating shafts 201. One side of the metal filter 306 passes through the two strip through holes 307, and the other side shields the opening 101.

[0029] By arranging an open temporary storage box at the discharge port of the funnel, the air flow sprayed by the air compressor is heated by the heating chamber and then sprayed to the flux inside the temporary storage box, and the melted flux is blown to the metal filter screen. After being filtered twice by the metal filter screen, the impurity content inside the flux is greatly reduced, which facilitates the recycling of the flux.

[0030] Each of the rotating shafts 201 is rotatably mounted between two bearing seats 206 .

[0031] A synchronous wheel 205 is installed on the circumferential outer wall of the rotating shaft 201 , and a synchronous belt 204 is sleeved between the upper and lower synchronous wheels 205 .

[0032] A first connecting frame 203 is disposed on one side of one of the bearing seats 206 , and a stepping motor 202 for driving the rotating shaft 201 to rotate is installed on the first connecting frame 203 .

[0033] The air compressor 303 is disposed on a second connecting frame 302 , and the second connecting frame 302 is fixedly connected to the outer wall of the funnel 301 .

[0034] The working principle is:

[0035] When in use, after the liquid soldering flux slides into the funnel, it falls into the temporary storage box along the funnel for temporary storage, and then the external gas is extracted through the air compressor. After the gas is heated by the heating tube in the heating chamber, it is ejected from multiple jet ports through the multi-pass pipeline, acts on the flowing soldering flux liquid, and drives it to pass through the metal filter for filtration;

[0036] After the welding flux passes through the metal filter under the action of high-pressure gas, the particles attached inside the welding process can be directly filtered out, and the flux liquid can be fully filtered. In addition, the stepper motor is started to drive the rotating shaft to rotate, and the metal filter can rotate synchronously with the two rotating shafts through the synchronous wheel and synchronous belt, thereby continuously changing the passing position of the flux liquid to avoid the accumulation of flux in the local part of the metal filter.

[0037] When the above-mentioned flux recovery device is used, an open temporary storage box is arranged at the discharge port of the funnel, so that the air flow sprayed by the air compressor is heated by the heating chamber and then sprayed to the flux inside the temporary storage box, and the melted flux is blown to the metal filter. After being filtered twice by the metal filter, the impurity content inside the flux is greatly reduced, which facilitates the recycling of the flux.

[0038] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A soldering flux recovery device for microelectronic devices, comprising: A funnel (301), characterized in that: a discharge port at the lower end of the funnel (301) is connected to a temporary storage box (1), one side of the temporary storage box (1) is provided with an opening (101), an air compressor (303) is provided on the side of the temporary storage box (1) opposite to the opening (101) and below the funnel (301), a multi-way pipe (304) is provided between the air compressor (303) and the temporary storage box (1), and an air jet (305) is provided at one end of the multi-way pipe (304) located inside the temporary storage box (1), and a heating chamber (4) with a built-in heating pipe (5) is provided between the multi-way pipe (304) and the air outlet of the air compressor (303); A strip through hole (307) is respectively provided at the top and bottom of the temporary storage box (1) on the side close to the opening (101), and the upper and lower strip through holes (307) are connected to each other. A rotating shaft (201) is respectively provided above and below the temporary storage box (1), and a metal filter (306) is sleeved between the two rotating shafts (201). One side of the metal filter (306) passes through the two strip through holes (307), and the other side shields the opening (101).

2. The microelectronic device soldering flux recovery device according to claim 1, characterized in that: Each of the rotating shafts (201) is rotatably mounted between two bearing seats (206).

3. The microelectronic device soldering flux recovery device according to claim 2, characterized in that: A synchronous wheel (205) is mounted on the circumferential outer wall of the rotating shaft (201), and a synchronous belt (204) is sleeved between the upper and lower synchronous wheels (205).

4. The microelectronic device soldering flux recovery device according to claim 3, characterized in that: A first connecting frame (203) is provided on one side of one of the bearing seats (206), and a stepping motor (202) for driving the rotating shaft (201) to rotate is installed on the first connecting frame (203).

5. The microelectronic device soldering flux recovery device according to claim 1, characterized in that: The air compressor (303) is connected to the heating chamber (4) via a connecting pipe (6).

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