Positioning and clamping mechanism of automatic soldering machine

Abstract

The utility model relates to the technical field of welding equipment, in particular to a positioning and clamping mechanism of an automatic soldering machine, which comprises a base plate, a clamping plate, a positioning mechanism and a positioning mechanism, the limiting assembly is used for limiting the clamping plate; the positioning assembly is used for determining the position of the substrate relative to the automatic soldering machine; the two limiting assemblies are fixedly connected with the base plate, each limiting assembly is located at one corner in the length direction of the clamping plate, the two limiting assemblies are distributed diagonally, each limiting assembly is distributed in a right-angle mode, and each right-angle side abuts against the outer side face of the clamping plate; during welding, the clamping plate only needs to be directly placed at the corresponding position on the base plate, operation is simple and convenient, the position of the clamping plate is limited through the limiting assembly arranged in a right-angle mode, and the situation that the accuracy of welding positioning is affected due to shaking in the welding process is avoided; the mounting position of the base plate relative to the workbench is determined through the positioning assembly, so that the mounting position of the clamping plate is determined, and the rapid and accurate coordinate positioning effect is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of welding equipment, in particular to a positioning and clamping mechanism of an automatic soldering machine. Background Art

[0002] An automatic soldering machine is a device used for soldering electronic components. When in use, the circuit board and electronic components are usually placed on a work platform, and the solder head is moved to the coordinate position of the electronic component on the work platform through the motion system. The solder control system then controls the solder head to automatically apply solder to the pad of the electronic component, thereby soldering the electronic component to the circuit board to achieve the welding function. It is widely used in the electronics manufacturing industry.

[0003] In order to improve the welding efficiency, multiple electronic components and circuit boards are usually placed on a pallet, and then the pallet is set at a set position on the workbench, so that the soldering of multiple electronic components can be completed after the soldering head has been positioned once. In order to ensure the accuracy of welding and improve the welding efficiency, the position of the pallet needs to be manually aligned each time during the placement process, or the automatic soldering machine needs to be re-positioned after each placement, which makes the operation cumbersome, makes it difficult to improve the welding efficiency, and cannot guarantee the accuracy and precision of each welding.

[0004] The information disclosed in this background technology section is only intended to deepen the understanding of the overall background technology of the present invention, and should not be regarded as an admission or any form of implication that the information constitutes the prior art known to those skilled in the art. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide a positioning and clamping mechanism for an automatic soldering machine, so as to realize the rapid and accurate positioning of the clamping plate by the automatic soldering machine.

[0006] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a positioning and engaging mechanism of an automatic soldering machine, comprising:

[0007] A base plate, used to receive a card board equipped with electronic components and circuit boards;

[0008] A limiting component, used to limit the position of the pallet;

[0009] A positioning component, used to determine the position of the substrate relative to the automatic soldering machine;

[0010] Among them, there are two groups of limit components, which are fixedly connected to the base plate, each group of the limit components is located at a corner in the length direction of the card plate, and the two groups of the limit components are diagonally distributed, each group of the limit components is distributed at right angles, and each right-angled side of the limit components is abutted against the outer side surface of the card plate.

[0011] Furthermore, each group of the limit assembly includes a first limit block and a second limit block which are separately arranged, the first limit block and the second limit block are arranged perpendicular to each other, and form a guide surface toward one side of the card plate, and the guide surface abuts against the outer side surface of the card plate.

[0012] Furthermore, the first limit block and the second limit block have the same structure, both comprising a bottom film and a plurality of side films, one side of the bottom film is fixedly connected to the base plate, a plurality of side films are arranged in sequence and fixed on the other side of the bottom film, and the outer side surfaces of the side films corresponding to the card plate are arranged relative to each other.

[0013] Furthermore, the plurality of side panels are arranged at intervals along the length direction of the bottom panel, and gaps are formed between adjacent side panels.

[0014] Furthermore, the side piece arranged close to one side of the cardboard is bent at one end away from the bottom piece toward the side where the adjacent side piece is located, so that the guide surface has a curved arc.

[0015] Furthermore, the positioning assembly includes four positioning blocks, which are respectively arranged corresponding to the four corners of the substrate, and the top of each positioning block is locally recessed toward the middle of the substrate to form a positioning surface, and an induction head is correspondingly arranged on the positioning surface.

[0016] Furthermore, each of the positioning blocks is provided with two assembly holes, the assembly holes are set through the top of the positioning block, and the assembly parts pass through the assembly holes from the top of the positioning block to connect the positioning block and the substrate.

[0017] Furthermore, the substrate is provided with a plurality of fixing holes, the fixing holes are through-set, and the connecting parts pass through the corresponding fixing holes to connect the substrate and the automatic soldering machine.

[0018] Furthermore, the fixing holes are arranged along the length direction of the substrate to form two groups, and the two groups of fixing holes are symmetrically distributed on both sides of the central axis in the width direction of the substrate.

[0019] Furthermore, both sides of the substrate along the length direction are respectively recessed toward the middle to form arc-shaped connecting surfaces, and the two connecting surfaces are symmetrically arranged.

[0020] The beneficial effects of the utility model are as follows: the utility model arranges a base plate on the workbench of the automatic soldering machine to receive and support a card board equipped with electronic components and circuit boards, and under the action of an upper limit assembly fixed on the base plate, the relative position of the card board and the base plate is limited. The staff only needs to place the card board directly at the corresponding position on the base plate, which is simple and convenient. During the welding process, the position of the card board is limited by the limit assembly arranged at right angles to avoid shaking during the welding process and affecting the accuracy of welding positioning. After the assembly is completed, the automatic soldering machine can determine the installation position of the substrate relative to the workbench through the positioning assembly, thereby determining the installation position of the card board, thereby achieving a fast and accurate coordinate positioning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 This is a structural schematic diagram of the positioning and engaging mechanism of the automatic soldering machine in the embodiment of the utility model;

[0023] Figure 2 It is a top view of the positioning and engaging mechanism of the automatic soldering machine in the embodiment of the utility model;

[0024] Figure 3 This is a schematic diagram of the structure of the limit assembly in the embodiment of the utility model;

[0025] Figure 4 This is a schematic diagram of the structure of the first limit block in the embodiment of the utility model;

[0026] Figure 5 This is a schematic diagram of the structure of the positioning block in the embodiment of the utility model;

[0027] Figure 6 Schematic diagram of the structure of the substrate in the embodiment of the utility model.

[0028] Figure numerals: 10, substrate; 10a, fixing hole; 10b, connecting surface; 11, connecting piece; 20, limiting assembly; 20a, right-angle side; 21, first limiting block; 21a, guide surface; 211, bottom film; 212, side film; 22, second limiting block; 30, positioning assembly; 31, positioning block; 31a, positioning surface; 31b, assembly hole; 32, sensor head. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0030] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0032] like Figures 1 to 6 The automatic soldering machine positioning and engaging mechanism shown includes:

[0033] The base plate 10 is used to receive the card board equipped with electronic components and circuit boards;

[0034] The limiting component 20 is used to limit the position of the card plate;

[0035] A positioning assembly 30, used to determine the position of the substrate 10 relative to the automatic soldering machine;

[0036] Among them, there are two groups of limit components 20, which are fixedly connected to the base plate 10, each group of limit components 20 is located at a corner in the length direction of the card plate, and the two groups of limit components 20 are diagonally distributed, each group of limit components 20 is distributed at right angles, and each right-angled side 20a of the limit components 20 is set in contact with the outer side surface of the card plate.

[0037] The utility model arranges a substrate 10 on the workbench of the automatic soldering machine to receive and support a card board equipped with electronic components and circuit boards. Under the action of an upper limit assembly 20 fixed on the substrate 10, the relative position of the card board and the substrate 10 is limited. The staff only needs to place the card board directly at the corresponding position on the substrate 10, which is simple and convenient. During the welding process, the position of the card board is limited by the limit assembly 20 arranged at a right angle to avoid shaking during the welding process and affecting the accuracy of welding positioning. After the assembly is completed, the automatic soldering machine can determine the installation position of the substrate 10 relative to the workbench through the positioning assembly 30, thereby determining the installation position of the card board, thereby achieving a fast and accurate coordinate positioning effect.

[0038] It should be noted that two or even more groups of positioning and locking mechanisms can be installed on the workbench of the automatic soldering machine to work in turns. When one group of positioning and locking mechanisms is in working state, a card plate can be assembled on the other group of positioning and locking mechanisms to realize rotation, which greatly shortens the working interval time of the automatic soldering machine and improves work efficiency.

[0039] On the basis of the above embodiments, each group of limit assembly 20 includes a first limit block 21 and a second limit block 22 which are separately arranged. The first limit block 21 and the second limit block 22 are arranged perpendicular to each other and form a guide surface 21a toward one side of the card plate, and the guide surface 21a abuts against the outer side surface of the card plate. The card plate is arranged on the base plate 10 from above the base plate 10 through the guiding effect of the guide surfaces 21a on both sides of the first limit block 21 and the second limit block 22, and the abutment effect of the guide surface 21a with the side surface of the card plate can effectively prevent the card plate from sliding relative to the base plate 10, thereby ensuring the accuracy of positioning during the welding process.

[0040] On the basis of the above-mentioned embodiment, the first limit block 21 and the second limit block 22 have the same structure, both including a bottom film 211 and a plurality of side films 212, one side of the bottom film 211 is fixedly connected to the base plate 10, and the plurality of side films 212 are arranged in sequence and fixed on the other side of the bottom film 211, and the side films 212 are arranged relative to the outer side surface of the side corresponding to the card plate, and the setting position of the card plate is limited by the setting position of the bottom film 211, and the contact area with the side surface of the card plate is increased by the relatively arranged side films 212, thereby further ensuring the accuracy and stability of the position of the card plate when it is set.

[0041] On the basis of the above embodiment, a plurality of side panels 212 are arranged at intervals along the length direction of the bottom panel 211, and gaps are formed between adjacent side panels 212. To ensure the stability of the position after assembly, when the card board is assembled from above the base plate 10, the card board needs to contact and apply force to the innermost side panel 212, so that the gap space between each side panel 212 is subjected to force reduction, which facilitates the assembly of the card board. After fully entering, the side panel 212 forms a reverse force on the outer side of the card board, effectively preventing the card board from shaking and ensuring the accuracy of positioning.

[0042] On the basis of the above embodiment, in order to avoid excessive wear of the card plate due to contact with the side piece 212 during assembly, which affects the accuracy and stability of subsequent assembly, the side piece 212 arranged close to one side of the card plate and away from the bottom piece 211 is bent toward the side where the adjacent side piece 212 is located, so that the guide surface 21a has a curved arc; when assembling, the card plate will directly contact the curved guide surface 21a and cause the curved guide surface 21a to deform toward the gap, thereby avoiding damage to the card plate by the top of the side piece 212, ensuring assembly accuracy, and extending the service life of the positioning engaging mechanism and the card plate.

[0043] On the basis of the above embodiment, the positioning component 30 includes four positioning blocks 31, and the positioning blocks 31 are respectively arranged in one-to-one correspondence with the four corners of the substrate 10, and the top of each positioning block 31 is locally recessed toward the middle of the substrate 10 to form a positioning surface 31a, and a sensor head 32 is correspondingly arranged on the positioning surface 31a. The position of the sensor head 32 is set by the positioning block 31 and the positioning surface 31a on the positioning block 31 to ensure the accuracy of the relative position between the sensor head 32 and the substrate 10; the automatic soldering machine can determine the position of the substrate 10 through the assembly position of the sensor head 32, and then can accurately determine the required welding position, ensure the accuracy of positioning, and can be reused after only one coordinate positioning setting, greatly reducing the workload.

[0044] On the basis of the above embodiment, each positioning block 31 is provided with two assembly holes 31b, and the assembly hole 31b is set through the top of the positioning block 31. The assembly part passes through the assembly hole 31b from the top of the positioning block 31 to connect the positioning block 31 and the substrate 10. The positioning block 31 is installed by setting two assembly holes 31b, which further ensures the accuracy of the position of the sensor head 32 and the stability of the connection.

[0045] On the basis of the above embodiment, a plurality of fixing holes 10a are provided on the substrate 10, and the fixing holes 10a are provided through-goingly. The connecting parts 11 pass through the corresponding fixing holes 10a to connect the substrate 10 and the automatic soldering machine. By providing the connecting parts 11 and the fixing holes 10a, the substrate 10 is fixed on the workbench of the automatic soldering machine, which is simple, convenient and stable.

[0046] On the basis of the above embodiment, the fixing holes 10a are arranged along the length direction of the substrate 10 to form two groups, and the two groups of fixing holes 10a are symmetrically distributed on both sides of the central axis in the width direction of the substrate 10. Through the multiple groups of fixing holes 10a arranged in pairs, the relative position of the substrate 10 with respect to the workbench of the automatic soldering machine can be changed according to actual welding requirements, and suitable fixing holes 10a can be selected for connection, which greatly improves the flexibility of the use of the positioning and locking mechanism, so as to adapt to different welding requirements.

[0047] On the basis of the above embodiment, the two sides of the substrate 10 along the length direction are respectively recessed toward the middle to form an arc-shaped connecting surface 10b. The two connecting surfaces 10b are symmetrically arranged. By setting the two sides of the substrate 10 as arc-shaped connecting surfaces 10b, the distance between the two side surfaces is shortened, which is convenient for workers to grasp and assemble.

[0048] Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the description are only for explaining the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which are within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A positioning and locking mechanism for an automatic soldering machine, characterized in that: include: Base plate, used to receive the card board assembled with electronic components and circuit boards; A limiting component, used to limit the position of the pallet; A positioning component, used to determine the position of the substrate relative to the automatic soldering machine; Among them, there are two groups of limit components, which are fixedly connected to the base plate, each group of the limit components is located at a corner in the length direction of the card plate, and the two groups of the limit components are diagonally distributed, each group of the limit components is distributed at right angles, and each right-angled side of the limit components is abutted against the outer side surface of the card plate.

2. The automatic soldering machine positioning and engaging mechanism according to claim 1, characterized in that: Each group of the limiting components includes a first limiting block and a second limiting block which are separately arranged. The first limiting block and the second limiting block are arranged perpendicular to each other and form a guide surface toward one side of the card plate, and the guide surface abuts against the outer side surface of the card plate.

3. The automatic soldering machine positioning and engaging mechanism according to claim 2, characterized in that: The first limit block and the second limit block have the same structure, both comprising a bottom plate and a plurality of side plates, one side of the bottom plate is fixedly connected to the base plate, a plurality of side plates are arranged in sequence and fixed on the other side of the bottom plate, and the outer side surfaces of the side plates corresponding to the card plate are arranged relative to each other.

4. The automatic soldering machine positioning and engaging mechanism according to claim 3, characterized in that: The plurality of side panels are arranged at intervals along the length direction of the bottom panel, and gaps are formed between adjacent side panels.

5. The automatic soldering machine positioning and engaging mechanism according to claim 4, characterized in that: The side piece arranged close to one side of the cardboard and away from one end of the bottom piece is bent toward the side where the adjacent side piece is located, so that the guide surface has a curved arc.

6. The automatic soldering machine positioning and engaging mechanism according to claim 1, characterized in that: The positioning assembly includes four positioning blocks, which are respectively arranged corresponding to the four corners of the substrate, and the top of each positioning block is locally recessed toward the middle of the substrate to form a positioning surface, and an induction head is correspondingly arranged on the positioning surface.

7. The automatic soldering machine positioning and engaging mechanism according to claim 6, characterized in that: Each of the positioning blocks is provided with two assembly holes, the assembly holes are set through the top of the positioning block, and the assembly parts pass through the assembly holes from the top of the positioning block to connect the positioning block and the base plate.

8. The automatic soldering machine positioning and engaging mechanism according to claim 1, characterized in that: The substrate is provided with a plurality of fixing holes, the fixing holes are through-set, and the connecting pieces pass through the corresponding fixing holes to connect the substrate and the automatic soldering machine.

9. The automatic soldering machine positioning and engaging mechanism according to claim 8, characterized in that: The fixing holes are arranged along the length direction of the substrate to form two groups, and the two groups of fixing holes are symmetrically distributed on both sides of the central axis in the width direction of the substrate.

10. The automatic soldering machine positioning and engaging mechanism according to claim 1, characterized in that: The two sides of the substrate along the length direction are respectively recessed toward the middle to form an arc-shaped connecting surface, and the two connecting surfaces are symmetrically arranged.

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