Semi-conductive shielding material preparation equipment

Abstract

The utility model belongs to the technical field of semi-conductive material production, and discloses semi-conductive shielding material preparation equipment, which comprises a two-in-one vulcanizing machine, a matched mold and the like, an upper pressing plate, a lower pressing plate and a mold which are combined in an embedded manner, and the mold is provided with a forming groove and a functional groove. And a detachable plug board and a heat-resistant metal wire are arranged in the functional groove. On the premise that normal forming of materials is not affected, in order to improve the follow-up overall performance of the materials and increase the content of carbon black, carbon black floating points oxidized at high temperature are scraped out of a forming area through a metal wire; meanwhile, in consideration of the problems of difficulty in later demolding, inaccurate component positioning, mounting and checking, inconvenience in operation at high temperature and the like, the pressing plate and the mold are designed into an embedded structure, and demolding, loading and unloading and other actions are performed at high temperature by means of the supporting plate, thereby being convenient and quick.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductive material production, and more specifically, to a semiconductive shielding material preparation device. Background Art

[0002] With the rapid development and technological progress of my country's power industry, high-voltage direct current transmission technology has received widespread attention and development. Compared with AC transmission, high-voltage direct current transmission has the advantages of large transmission capacity, small line loss, no reactive power, convenient power connection, and easy control and adjustment. It can also timely control and adjust the direction and size of the transmitted power, has the ability not to increase the short-circuit current of the original power system, and is not limited by the stability of the system; unlike AC cable lines, DC cable lines only have core resistance losses and are highly reliable. The role of the semi-conductive shielding layer is mainly reflected in making the electric field distribution more uniform to prevent partial discharge and reduce conductor losses. The cable structure is composed of multiple layers of materials with different properties. When the interfaces of the materials are not well bonded, the insulation layer will produce electrical dendrites, and eventually the insulation layer will break down as the electrical dendrites develop. The performance of the high-voltage DC cable shielding layer affects its service life and operational safety, which is related to the smoothness of the shielding, the bonding performance of the shielding and insulation, and the migration of impurities.

[0003] For example, application number CN202110971819.2 discloses a vulcanizer. The vulcanizer includes a machine body, which includes a base and a lifting component; a mold assembly, which is detachably arranged on the base, and includes an upper mold and a lower mold, and the upper mold and the lower mold form a vulcanization molding space for accommodating the vulcanized part; a demoulding device, which is arranged below the lifting component, and can be connected to the upper mold. When the machine body drives the demoulding device to drive the upper mold to separate from the lower mold, the upper mold can drive at least a part of the demoulding device to rotate circumferentially.

[0004] The above documents basically explain the relevant operating principles of the vulcanizer, but the volume resistivity of the semi-conductive shielding material mainly depends on the conductive carbon black filler, that is, the volume resistivity of the semi-conductive shielding material can meet the qualified standard only by selecting an appropriate amount of conductive carbon black filler. At the same time, carbon black with good conductivity can meet the resistivity requirements of the shielding material by adding a relatively small amount. Therefore, the conductivity of carbon black will directly affect the mechanical strength and processing technology of the material. After the carbon black is added to the premix to form a blend, it needs to be preheated to a molten state at 120°C on the first vulcanizer, and then hot-pressed at 175°C on the second vulcanizer, and the pressure of the flat vulcanizer should be maintained at not less than 15Mpa. During the preheating process, a certain amount of carbon black content needs to be increased. Therefore, compared with the original hot pressing process, after preheating, related oxide floating points will be formed on the surface of the blend due to the characteristics of carbon black. If they are not removed in time, it will affect subsequent production. There is currently no design specifically for this type of treatment. Generally, the most primitive manual part removal and mold scraping method is used. The sudden cooling and contact with cold air will undoubtedly affect the quality of the product. In addition, the method is primitive, time-consuming and labor-intensive. Utility Model Content

[0005] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a semi-conductive shielding material preparation device to solve one or more of the above-mentioned problems.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A semi-conductive shielding material preparation device, comprising

[0008] The vulcanizing machine has a preheating zone and a hot pressing zone arranged in parallel up and down;

[0009] The mold has a molding groove on the top surface and a through functional groove on the side surface;

[0010] The upper pressing plate and the lower pressing plate have an embedding groove in the center;

[0011] A plugging plate, which is detachably inserted into the functional groove of the mold to cover the molding groove of the mold;

[0012] A heat-resistant metal wire which can be detachably inserted into the functional groove of the mold

[0013] The mold is detachably embedded between the upper pressing plate and the lower pressing plate. After installation, the upper pressing plate, the mold and the lower pressing plate are sequentially placed in the preheating zone and the hot pressing zone.

[0014] Furthermore, the cross-section of the through surface of the functional groove is a concave structure.

[0015] Furthermore, the main body of the plugging plate has a concave cross-section, and side support plates are provided at both ends.

[0016] Furthermore, one or both of the plug plate and the heat-resistant metal wire are inserted into the functional groove.

[0017] Furthermore, a protective film is fixedly provided on the bottom surface of the plugging plate and the inner bottom surface of the forming groove of the mold.

[0018] Furthermore, four guide columns are arranged inside the vulcanizer, and a lower pressing piece, a fixing piece and an upper pressing piece are sequentially sleeved on the four guide columns. The lower pressing piece, the fixing piece and the upper pressing piece are all made of heat-conducting materials and have heat-generating components arranged inside.

[0019] Furthermore, the fixing member is fixedly arranged at the center position of the guide column, the lower pressing member is arranged above the fixing member, and the upper pressing member is arranged below the fixing member.

[0020] Furthermore, corresponding hydraulic systems are respectively provided above the lower pressing member and below the upper pressing member, and the lower pressing member is driven downward by the hydraulic system, and the upper pressing member is driven upward by the hydraulic system.

[0021] In summary, the utility model has the following beneficial effects:

[0022] Through the detachable plug plate, under the premise of ensuring the normal shaping of the material, the plug plate is removed, and the oxidation floating points floating on the top of the molten blend are scraped away outside the shaping area using heat-resistant metal wire, which facilitates subsequent shaping and improves product quality;

[0023] By setting a support plate at the edge of the plugging plate, the plate body can be easily disassembled and assembled. The protective film originally simply covered on the opposite surface of the cover plate can be transferred to the plugging plate and the mold and fixed, so as to avoid misalignment affecting production and facilitate subsequent demolding.

[0024] The embedded pressure plate structure makes it easy to quickly and accurately position and align production elements, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of the structure of a vulcanizing machine according to an embodiment of the present invention;

[0026] Figure 2 A schematic diagram of the assembly structure of the main components of an implementation scheme provided by the utility model;

[0027] Figure 3 A schematic diagram of the structure of a lower pressing plate according to an embodiment of the present invention;

[0028] Figure 4A schematic diagram of a mold structure of an implementation method provided by the utility model;

[0029] Figure 5 for Figure 4 The enlarged schematic diagram of point A in the middle;

[0030] Figure 6 A schematic diagram of the plugging plate structure of an implementation mode provided by the utility model;

[0031] Figure 7 A schematic diagram of the heat-resistant metal wire structure of an implementation method provided by the utility model.

[0032] In the figure: 10, vulcanizer; 11, preheating zone; 12, hot pressing zone; 13, guide column; 14, lower pressing piece; 15, fixing piece; 16, upper pressing piece; 20, mold; 21, molding groove; 22, functional groove; 30, embedding groove; 31, upper pressing plate; 32, lower pressing plate; 40, plugging plate; 41, support plate; 50, heat-resistant metal wire. DETAILED DESCRIPTION Example

[0033] The following is combined with Figure 1-7 The utility model is described in further detail.

[0034] A semi-conductive shielding material preparation device, the main body of which is a two-in-one vulcanizing machine 10, such as Figure 1 As shown, the vulcanizer 10 is provided with operating areas such as control buttons and emergency stop buttons on the outside, as well as a production area isolation door that can be opened and closed. The production area inside the isolation door is mainly divided into a preheating area 11 and a hot pressing area 12 designed to be parallel to each other.

[0035] Specifically, the production area is provided with four vertically arranged guide columns 13, on which a lower pressing piece 14, a fixing piece 15 and an upper pressing piece 16 are provided, and these three parts are basically the same as the heating and pressing parts of the traditional vulcanizer 10, wherein the fixing piece 15 is fixed in the middle position of the guide column 13, and the upper pressing piece 16 and the lower pressing piece 14 can both move up and down along the guide column 13. Corresponding hydraulic systems are provided below the upper pressing piece 16 and above the lower pressing piece 14 to drive the lower pressing piece 14 to complete the downward pressing action, and the upper pressing piece 16 to complete the upward pressing action, so as to realize the hot pressing and shaping function of the vulcanizer 10. The preheating zone 11 is between the lower pressing piece 14 and the fixing piece 15, and the hot pressing zone 12 is between the upper pressing piece 16 and the fixing piece 15.

[0036] like Figure 2 As shown, such a structure is used in conjunction with the vulcanizer 10. The upper pressing plate 31 and the lower pressing plate 32 press the mold 20 in the center and send it into the preheating zone 11 or the hot pressing zone 12 of the vulcanizer 10 for related reactions and operations.

[0037] Specifically, Figure 3 As shown, the lower pressure plate 32 is a rectangular thin plate with an embedding groove 30 in the center. The depth of the embedding groove 30 is generally small, and only needs to meet the installation and positioning of the mold 20. The depth dimension generally cannot affect the subsequent installation and scraping actions of the mold 20, that is, the edge of the embedding groove 30 must be as far away from the plug plate 40 and the support plate 41 as possible.

[0038] The structures of the upper pressing plate 31 and the lower pressing plate 32 are completely the same. When in use, the embedding groove 30 of the upper pressing plate 31 opens downward, and the embedding groove 30 of the lower pressing plate 32 opens upward.

[0039] like Figure 4 As shown, the mold 20 is a rectangular plate with a molding groove 21 in the center and a through functional groove 22 on the side. The functional groove 22 is a concave structure, which can be generally understood as the symmetrical splicing of two L-shaped structures. A protective film is fixedly provided on the inner bottom surface of the molding groove 21 of the mold 20.

[0040] like Figure 5 and Figure 6 As shown, the plugging plate 40 is a plate member with a similar structure to the functional slot 22. Its main cross section is also a concave structure. Support plates 41 are provided on both sides to extend outward in parallel or obliquely symmetrically. The support plates 41 are convenient for manual or machine gripping in the later stage. The plugging plate 40 body can be detachably inserted into the functional slot 22, and can cover the molding slot 21 of the mold 20 to prevent the material from being deformed by compression molding in the later stage. A fixed protective film is provided on the bottom surface of the plugging plate 40.

[0041] like Figure 7 As shown, the melting point of the heat-resistant metal wire 50 is at least above 325° C., and it has a certain hardness and corrosion resistance. The heat-resistant metal wire 50 can be detachably inserted into the functional groove 22 .

[0042] Due to the existence of processing errors in actual production, it is actually allowed that the heat-resistant metal wire 50 and the plug plate 40 are inserted into the functional groove 22 at the same time, and the two can also be used separately.

[0043] For example, the mold 20 has a thickness of 2.4 mm, a length of 150 mm, and a width of 90 mm;

[0044] The actual depth of the molding groove 21 of the mold 20 is 2.2 mm, the length is 100 mm, the width is 60 mm, the functional depth is 2 mm, and 0.2 mm is reserved for the functional groove 22 on the side;

[0045] The actual length of the functional groove 22 is 102mm, the width is 90mm, the top is 0.1mm away from the top surface of the mold 20, the feet at both ends are 0.1mm deep and 1mm wide, the depth of the main body transverse groove is 0.07mm, the width is 100mm, and a 0.03mm swing height is reserved for storing the heat-resistant metal wire 50 and the silted carbon black oxidation floating point;

[0046] The size of the plugging plate 40 is roughly the same as that of the functional slot 22, and there can be a processing error of 0.008-0.01mm, which is also convenient for disassembly and assembly of the plugging plate 40 in the functional slot 22. The width of the support plate 41 on one side shall not be less than 3mm, otherwise it is inconvenient to take the plugging plate 40;

[0047] The depth of the embedding groove 30 of the upper pressing plate 31 and the lower pressing plate 32 does not exceed 0.1 mm, and is generally more suitable to be 0.085, which can effectively sense the successful embedding position and will not affect the use of components such as the plug plate 40.

[0048] When in use, the carbon black and other materials are processed and poured into the molding groove 21 of the mold 20, and the plugging plate 40 is inserted from the side. The protective film on the plugging plate 40 and the mold 20 replaces the original film paper to prevent the finished material from sticking to the mold 20 and the plugging plate 40. The lower pressing plate 32 and the upper pressing plate 31 are embedded outside the mold 20 to form a clamping structure, and sent to the preheating zone 11 of the vulcanizer 10 for preheating and mixing. After processing, the plate is taken out, the plugging plate 40 is pulled out with the help of the support plate 41, and the heat-resistant metal wire 50 is inserted. The floating points on the top surface of the actual molding area of ​​the mold 20 are repeatedly scraped, and the bottom surface of the plugging plate 40 is cleaned, and the plugging plate 40 is reinserted and sent to the hot pressing zone 12 for subsequent processing. The plugging plate 40 ensures the sealing of the molding groove 21 in the vulcanizer 10, ensuring the basic requirements for material molding. The detachable plugging plate 40 and the heat-resistant metal wire 50 are contacted to scrape off the oxidation floating points caused by the excessive addition of carbon black. At the same time, the embedded structure is easier to demold. The heat-resistant metal wire 50 can also help separate the plugging plate 40 from the mold 20, ultimately improving the conductivity and other properties of the material. The fixed design of the protective film not only reduces the waste caused by the one-time use of the film paper, but also prevents the dislocation from affecting the molding quality.

[0049] It should be noted that this specific embodiment is merely an explanation of the present utility model, and it is not a limitation of the present utility model. After reading this specification, those skilled in the art can make non-creative modifications to the present embodiment as needed, but as long as it is within the scope of the claims of the present utility model, it is protected by the patent law.

Claims

1. A semi-conductive shielding material preparation device, characterized in that: include A vulcanizing machine (10) having a preheating zone (11) and a hot pressing zone (12) arranged in parallel up and down; The mold (20) has a molding groove (21) on its top surface and a through functional groove (22) on its side surface; An upper pressing plate (31) and a lower pressing plate (32), each having an embedding groove (30) formed in the center thereof; A plugging plate (40) which is detachably inserted into the functional groove (22) of the mold (20) to cover the molding groove (21) of the mold (20); A heat-resistant metal wire (50) which is detachably inserted into the functional groove (22) of the mold (20); The mold (20) is detachably embedded between the upper pressing plate (31) and the lower pressing plate (32); after installation, the upper pressing plate (31), the mold (20) and the lower pressing plate (32) are placed in the preheating zone (11) and the hot pressing zone (12) in sequence.

2. The semi-conductive shielding material preparation device according to claim 1, characterized in that: The cross-section of the through surface of the functional groove (22) is a concave structure.

3. The semi-conductive shielding material preparation device according to claim 2, characterized in that: The main cross-section of the plugging plate (40) is a concave structure, and side support plates (41) are provided at both ends.

4. The semi-conductive shielding material preparation device according to claim 1, characterized in that: One or both of the plugging plate (40) and the heat-resistant metal wire (50) are inserted into the functional groove (22).

5. The semi-conductive shielding material preparation device according to claim 1, characterized in that: The bottom surface of the plugging plate (40) and the inner bottom surface of the molding groove (21) of the mold (20) are both fixedly provided with a protective film.

6. The semi-conductive shielding material preparation device according to claim 1, characterized in that: Four guide columns (13) are arranged inside the vulcanizer (10), and a lower pressing piece (14), a fixing piece (15) and an upper pressing piece (16) are sequentially sleeved on the four guide columns (13). The lower pressing piece (14), the fixing piece (15) and the upper pressing piece (16) are all made of heat-conducting materials and have heat-generating components arranged therein.

7. The semi-conductive shielding material preparation device according to claim 6, characterized in that: The fixing member (15) is fixedly arranged at the center position of the guide column (13), the lower pressing member (14) is arranged above the fixing member (15), and the upper pressing member (16) is arranged below the fixing member (15).

8. The semi-conductive shielding material preparation device according to claim 7, characterized in that: Corresponding hydraulic systems are respectively provided above the lower pressing member (14) and below the upper pressing member (16); the lower pressing member (14) is driven downward by the hydraulic system, and the upper pressing member (16) is driven upward by the hydraulic system.

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