Novel semiconductor equipment tail gas pipeline airflow stabilizing device

Abstract

The utility model discloses a novel semiconductor equipment tail gas pipeline airflow stabilizing device which comprises a processing mechanism and a control mechanism, the processing mechanism comprises a main adsorption barrel and an auxiliary adsorption barrel, the bottom of one side of the main adsorption barrel is fixedly provided with an inlet main pipe, and the top of the inlet main pipe is fixedly provided with an inlet pressure gauge; and a discharge main pipe is fixedly mounted at the top of the main adsorption barrel. According to the novel semiconductor equipment tail gas pipeline airflow stabilizing device, the instability of a fan of a factory service system is compensated and adjusted by additionally arranging the axial flow fan, and the operating frequency of the axial flow fan can be intelligently controlled according to data fed back to the PLC by the inlet pressure gauge and the outlet pressure gauge; the pressure and flow velocity of the gas in the tail gas pipeline can be adjusted in time, the stability of the airflow of the whole tail gas exhaust system can be optimized, the stable flowing of the airflow can be achieved, and the working requirements that the flow velocity and pressure of the MOCVD tail gas are constant and continuous are met.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor epitaxial material growth, in particular to a novel semiconductor equipment tail gas pipeline airflow stabilizing device. Background Art

[0002] MOCVD is a device for growing semiconductor epitaxial materials. It consists of a raw material intake system, a reaction chamber growth system, an exhaust system, etc. The growth of semiconductor epitaxial materials will use highly toxic gases and metal organics such as arsine, phosphine, trimethylaluminum, and trimethylgallium. The highly toxic gases are saturated raw materials during the growth process. A small part of the highly toxic gases and organic sources complete chemical reactions, and some highly toxic gases and metal organic sources are discharged into the tail gas collection device with the tail gas pipeline for collection or treatment. The usual practice in the tail gas treatment system industry is to collect the tail gas of semiconductor equipment for unified treatment. The tail gas treatment system generally has dry, wet and combustion types. Because the airflow control operation of the tail gas system is unstable, the equipment pump is often shut down due to abnormal pressure, and the equipment stops working abnormally, resulting in the incomplete treatment of untreated toxic gases and metal organics and direct discharge into the factory exhaust system. In severe cases, it will affect the atmosphere, pollute the environment, and have a serious impact on the normal operation of semiconductor equipment. For this reason, we have designed a new semiconductor equipment tail gas pipeline airflow stabilization device to solve the above problems. Utility Model Content

[0003] In view of the shortcomings of the prior art, the utility model provides a novel semiconductor equipment exhaust pipe airflow stabilization device, which solves the problem of unstable airflow control operation of the exhaust system. In actual applications, due to the unstable airflow control operation of the exhaust system, the equipment's large pump often shuts down due to abnormal pressure, and the equipment stops working abnormally.

[0004] To achieve the above purpose, the utility model is implemented through the following technical solutions: a novel semiconductor equipment tail gas pipeline airflow stabilization device, including a processing mechanism and a control mechanism, the processing mechanism includes a main adsorption barrel and an auxiliary adsorption barrel, the bottom of one side of the main adsorption barrel is fixedly installed with an inlet main pipe, and the top of the inlet main pipe is fixedly installed with an inlet pressure gauge, the top of the main adsorption barrel is fixedly installed with an outlet main pipe, the top of the outlet main pipe is fixedly connected with an exhaust pipe body, and the other side of the exhaust pipe body is fixedly installed with an exhaust pressure gauge, the top of the exhaust pipe body is fixedly installed with an axial flow fan, the bottom of the auxiliary adsorption barrel is fixedly installed with an inlet auxiliary pipe, the top of the auxiliary adsorption barrel is fixedly installed with an exhaust auxiliary pipe, and one side of the exhaust pipe body is fixedly connected with a branch pipe connected to the exhaust auxiliary pipe;

[0005] The control mechanism includes a control cabinet, a PLC controller is fixedly installed inside the control cabinet, a door panel is movably installed above the front of the control cabinet, a human-machine interaction panel is fixedly installed on the front of the door panel, an operation button is fixedly installed on one side of the human-machine interaction panel, and an alarm light is fixedly installed on the other side of the top of the control cabinet.

[0006] Preferably, the inlet main pipe and the inlet auxiliary pipe are connected via a three-way valve, and a valve wheel is fixedly mounted on the bottom of the three-way valve.

[0007] Preferably, a sampling tube is fixedly installed below the discharge pressure gauge, and a temperature probe is fixedly installed below the sampling tube.

[0008] Preferably, a nitrogen purge pipe is fixedly installed on one side of the inlet pressure gauge, and a nitrogen valve is fixedly installed on the nitrogen purge pipe.

[0009] Preferably, a safety lock is fixedly installed on one side of the front side of the door panel, and a plurality of ventilation holes are arranged above both sides of the control cabinet.

[0010] Preferably, movable wheels are fixedly installed around the bottom of the control cabinet, and a brake lever is movably installed on the movable wheels.

[0011] Beneficial Effects

[0012] The utility model provides a novel semiconductor equipment tail gas pipeline airflow stabilization device. Compared with the prior art, it has the following beneficial effects:

[0013] This new semiconductor equipment exhaust duct airflow stabilization device compensates for and adjusts the instability of the factory system fan by adding an axial flow fan. The operating frequency of the axial flow fan can be fed back to the PLC controller according to the inlet pressure gauge and the outlet pressure gauge for intelligent control. The gas pressure and flow rate in the exhaust duct can be adjusted in time, which can optimize the stability of the airflow of the entire exhaust system and achieve stable airflow, meeting the MOCVD exhaust gas flow rate and pressure constant and continuous working requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the processing mechanism of the utility model;

[0015] Figure 2 It is a schematic diagram of the control mechanism of the utility model;

[0016] Figure 3 This is a schematic diagram of the structure of the PLC controller of the utility model;

[0017] Figure 4 This is a schematic diagram of the tailpipe structure of the utility model;

[0018] In the figure: 1. treatment mechanism; 2. main adsorption barrel; 201. inlet main pipe; 202. inlet pressure gauge; 203. outlet main pipe; 3. three-way valve; 301. valve wheel; 4. nitrogen purge pipe; 401. nitrogen valve; 5. auxiliary adsorption barrel; 501. inlet auxiliary pipe; 502. outlet auxiliary pipe; 6. tail gas pipe body; 601. branch pipe; 602. temperature probe; 603. sampling tube; 604. outlet pressure gauge; 7. axial flow fan; 8. control mechanism; 9. control cabinet; 901. moving wheel; 902. brake lever; 903. ventilation hole; 10. door panel; 1001. safety lock; 11. human-machine interaction panel; 1101. operation button; 12. PLC controller; 13. alarm light. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-4 The utility model provides a technical solution: a novel semiconductor equipment tail gas pipeline airflow stabilization device, comprising a processing mechanism 1 and a control mechanism 8, the processing mechanism 1 comprises a main adsorption barrel 2 and an auxiliary adsorption barrel 5, the bottom of one side of the main adsorption barrel 2 is fixedly installed with an inlet main pipe 201, and the top of the inlet main pipe 201 is fixedly installed with an inlet pressure gauge 202, the top of the main adsorption barrel 2 is fixedly installed with an outlet main pipe 203, the top of the outlet main pipe 203 is fixedly connected with an exhaust pipe body 6, and the other side of the exhaust pipe body 6 is fixedly installed with an exhaust pressure gauge 604, the top of the exhaust pipe body 6 is fixedly installed with an axial flow fan 7, the bottom of the auxiliary adsorption barrel 5 is fixedly installed with an inlet auxiliary pipe 501, the top of the auxiliary adsorption barrel 5 is fixedly installed with an outlet auxiliary pipe 502, and one side of the exhaust pipe body 6 is fixedly connected with a branch pipe 601 connected to the outlet auxiliary pipe 502;

[0021] The control mechanism 8 includes a control cabinet 9, an alarm light 13 is fixedly installed inside the control cabinet 9, a door panel 10 is movably installed above the front of the control cabinet 9, a human-machine interaction panel 11 is fixedly installed on the front of the door panel 10, and an operation button 1101 is fixedly installed on one side of the human-machine interaction panel 11, and an alarm light 13 is fixedly installed on the other side of the top of the control cabinet 9.

[0022] Based on the above-mentioned structural setting, the novel semiconductor equipment tail gas pipeline airflow stabilization device is composed of a processing mechanism 1 and a control mechanism 8, wherein the processing mechanism 1 is mainly used to stabilize the airflow discharged from the tail gas pipeline, and the control mechanism 8 can perform intelligent control when the processing mechanism 1 is in operation. Specifically, during the working process, the incompletely reacted process waste gas pipe of the MOCVD (metal organic vapor deposition system) equipment is connected to the main pipe 201, so that the MOCVD process waste gas can be discharged into the main adsorption barrel 2, and the particulate matter in the MOCVD process waste gas can be adsorbed and filtered through the main adsorption barrel 2. The auxiliary adsorption barrel 5 can be in the main adsorption barrel 2 through the auxiliary pipe 501 and the auxiliary pipe 502. The adsorption barrel 2 is used during the inspection and maintenance to avoid the need to shut down for subsequent routine maintenance. The inlet pressure gauge 202 can detect the pressure of the process waste gas when it enters the main adsorption barrel 2. The process waste gas after adsorption and filtration by the main adsorption barrel 2 is discharged through the discharge main pipe 203 and the tail gas pipe body 6. The process waste gas after adsorption and filtration by the auxiliary adsorption barrel 5 is discharged through the branch pipe 601 and the tail gas pipe body 6. The axial flow fan 7 can compensate and adjust the pressure of the process gas when it is discharged in the tail gas pipe body 6. The discharge pressure gauge 604 can detect the pressure of the process waste gas when it is discharged. The PLC controller 12 in the control mechanism 8 can collect the data detected by the discharge pressure gauge 604. The alarm light 1 3 can warn the staff when the data collected by the PLC controller 12 is abnormal. The PLC controller 12 contains various related processing units, wherein the operator can set the normal working value (50kpa-100kpa) of the outlet pressure gauge through the human-machine interaction panel 11 and the operation button 1101. After being processed and logically operated by the processing unit of the PLC controller 12, the calculation result of the difference between the received pressure data and the set outlet pressure gauge value is transmitted to the frequency converter controlling the axial flow fan 7, and then the PLC controller 12 automatically changes the operating frequency of the axial flow fan 7 through the electronic control unit to achieve a stable tail exhaust pressure, that is, if the outlet pressure increases, the PLC controller 12 will control the axial flow fan 7 to achieve a stable tail exhaust pressure. The frequency converter inside the axial flow fan 7 reduces its operating power, and the outlet pressure is reduced by reducing the operating frequency of the axial flow fan 7, so that it returns to the normal working range; on the contrary, if the outlet pressure of the exhaust pipe body 6 decreases, the PLC controller 12 controls the frequency converter inside the axial flow fan 7 to increase its operating power, and the outlet pressure is increased by increasing the operating frequency of the axial flow fan 7, thereby controlling the speed of the axial flow fan 7 to increase until the outlet pressure is restored to the normal range. Therefore, the gas pressure and flow rate in the exhaust pipe can be adjusted in time by the axial flow fan 7, which can optimize the stability of the airflow of the entire exhaust system, and meet the working requirements of constant and continuous airflow rate and pressure at the exhaust end of MOCVD.

[0023] Furthermore, the main pipe 201 and the auxiliary pipe 501 are connected via a three-way valve 3, and a valve wheel 301 is fixedly installed at the bottom of the three-way valve 3. The staff can adjust and control the three-way valve 3 by rotating the valve wheel 301, thereby controlling the process waste gas to enter the main adsorption barrel 2 and the auxiliary adsorption barrel 5, thereby realizing the function of the main adsorption barrel 2 and the auxiliary adsorption barrel 5 being circulated.

[0024] Furthermore, a sampling tube 603 is fixedly installed below the discharge pressure gauge 604, and a temperature probe 602 is fixedly installed below the sampling tube 603. The sampling tube 603 facilitates the staff to sample and test the discharged gas later, which increases the convenience of the staff in sampling the gas, and the temperature probe 602 can monitor the temperature of the gas in real time when it is discharged.

[0025] Furthermore, a nitrogen purge pipe 4 is fixedly installed on one side of the pressure gauge 202, and a nitrogen valve 401 is fixedly installed on the nitrogen purge pipe 4. When the process waste gas enters the main adsorption barrel 2, the nitrogen purge pipe 4 can inject nitrogen purge into the inside thereof, and harmful substances in the process waste gas can be removed by the nitrogen purge, thereby preventing harmful substances in the process waste gas from entering the factory exhaust system. The nitrogen valve 401 can control the opening and closing of the nitrogen purge pipe 4.

[0026] Furthermore, a safety lock 1001 is fixedly installed on one side of the front of the door panel 10, and multiple groups of ventilation holes 903 are arranged above both sides of the control cabinet 9. The door panel 10 can close and protect the PLC controller 12 when it is working, thereby increasing the safety of the PLC controller 12 when it is working, and the safety lock 1001 can lock the door panel 10 when it is closed, thereby increasing the firmness of the door panel 10 when it is closed.

[0027] Furthermore, moving wheels 901 are fixedly installed around the bottom of the control cabinet 9, and brake levers 902 are movably installed on the moving wheels 901. The moving wheels 901 can move the control cabinet 9, which increases the flexibility of the control cabinet 9 and facilitates the operation of the staff during the later maintenance of the control cabinet 9. The brake lever 902 can lock the moving wheels 901, thereby increasing the stability of the control cabinet 9 when it is placed and used.

[0028] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A novel semiconductor equipment tail gas pipeline airflow stabilization device, characterized by: The invention comprises a treatment mechanism (1) and a control mechanism (8), wherein the treatment mechanism (1) comprises a main adsorption barrel (2) and an auxiliary adsorption barrel (5), wherein an inlet main pipe (201) is fixedly installed at the bottom of one side of the main adsorption barrel (2), and an inlet pressure gauge (202) is fixedly installed at the top of the inlet main pipe (201), an outlet main pipe (203) is fixedly installed at the top of the main adsorption barrel (2), an exhaust pipe body (6) is fixedly connected to the top of the exhaust pipe body (203), and an exhaust pressure gauge (604) is fixedly installed on the other side of the exhaust pipe body (6), an axial flow fan (7) is fixedly installed on the top of the exhaust pipe body (6), an inlet auxiliary pipe (501) is fixedly installed at the bottom of the auxiliary adsorption barrel (5), an exhaust auxiliary pipe (502) is fixedly installed at the top of the auxiliary adsorption barrel (5), and a branch pipe (601) connected to the exhaust auxiliary pipe (502) is fixedly connected to one side of the exhaust pipe body (6); The control mechanism (8) comprises a control cabinet (9), a PLC controller (12) is fixedly installed inside the control cabinet (9), a door panel (10) is movably installed above the front of the control cabinet (9), a human-machine interaction panel (11) is fixedly installed on the front of the door panel (10), an operation button (1101) is fixedly installed on one side of the human-machine interaction panel (11), and an alarm light (13) is fixedly installed on the other side of the top of the control cabinet (9).

2. A novel semiconductor equipment tail gas pipeline airflow stabilization device according to claim 1, characterized in that: The inlet main pipe (201) and the inlet auxiliary pipe (501) are connected via a three-way valve (3), and a valve wheel (301) is fixedly mounted on the bottom of the three-way valve (3).

3. The novel semiconductor equipment tail gas pipeline airflow stabilization device according to claim 1 is characterized by: A sampling tube (603) is fixedly installed below the discharge pressure gauge (604), and a temperature probe (602) is fixedly installed below the sampling tube (603).

4. The novel semiconductor equipment tail gas pipeline airflow stabilization device according to claim 1 is characterized by: A nitrogen purge pipe (4) is fixedly installed on one side of the inlet pressure gauge (202), and a nitrogen valve (401) is fixedly installed on the nitrogen purge pipe (4).

5. The novel semiconductor equipment tail gas pipeline airflow stabilization device according to claim 1 is characterized by: A safety lock (1001) is fixedly mounted on one side of the front of the door panel (10), and a plurality of ventilation holes (903) are arranged above both sides of the control cabinet (9).

6. The novel semiconductor equipment tail gas pipeline airflow stabilization device according to claim 1 is characterized by: Moving wheels (901) are fixedly installed around the bottom of the control cabinet (9), and a brake rod (902) is movably installed on the moving wheels (901).

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