Substrate conveying assembly, sample feeding and sampling chamber and MBE equipment
By installing a heating device on the flange of the molecular beam epitaxial device, the fastening screws are in a heat-expanded state, which solves the problem of high maintenance costs caused by rail deformation, reduces the risk of equipment leakage, and achieves lower cost and efficient Equipment maintenance.
Patent Information
- Application Number
- CN202421017729.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-11
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-11
AI Technical Summary
In existing molecular beam epitaxial equipment, the guide rail fixing screws are deformed due to heating expansion and cooling, resulting in high maintenance costs and leaks are prone to occur during the degassing process.
Design a substrate conveying component, including installing a heating device on the flange, and putting it in a heat-expanded state by heating the fastening screw, reducing the probability of loosening, and reducing thermal expansion and contraction through natural cooling, reducing equipment maintenance costs and leakage Point probability.
It effectively reduces the cost of rail deformation and equipment maintenance, reduces the frequency and labor time of regular maintenance, and reduces the risk of equipment leakage.
Smart Images
Figure CN222251119U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor epitaxy technology, and in particular to a substrate conveying component, a sampling chamber and an MBE device. Background Art
[0002] Molecular beam epitaxy (MBE for short) is a physical deposition technology for compound semiconductor multilayer films. Its basic principle is to heat the elements that make up the film into directional molecular beams in their respective source furnaces under ultra-high vacuum conditions, and then irradiate them onto the heated substrate wafer for film growth. The molecular beam epitaxy equipment consists of multiple processing chambers such as the sampling chamber, pretreatment chamber, and growth chamber. Among them, the sampling chamber is mainly composed of trolley guide rails, heating wires, trolleys, gate valves, etc., and is mainly used for substrate transmission and preliminary degassing of the substrate.
[0003] In order to better maintain ultra-high vacuum, the current molecular beam epitaxy equipment needs to perform preliminary degassing on the substrate after it is placed in the injection chamber before it can enter the chamber behind it, and then enter the growth chamber for material growth. Generally, the unused substrate is placed on the trolley through the molybdenum tray, and then the sample transfer trolley is placed in the injection chamber, and finally the substrate is subjected to preliminary degassing at about 200°C. However, as the number of times the equipment is degassed increases, the fixing screws of the trolley guide rail will slowly loosen or even fall off completely due to the heating expansion during the degassing process and the continuous contraction during cooling. Therefore, with the long-term use of the equipment, it is inevitable that the guide rail of the trolley will be deformed, and then the roller and the trolley guide rail will be stuck. Once this happens, the equipment needs to be repaired and maintained, otherwise the sample cannot be transferred normally. However, the equipment repair and maintenance requires a series of operations such as breaking the vacuum, removing the flange, vacuuming, and picking up leaks. The equipment maintenance is more troublesome, and the labor and time costs are high.
[0004] Therefore, it is urgent to provide a new solution to solve the technical problem of high maintenance cost of equipment caused by the easy deformation of the guide rail. Utility Model Content
[0005] In view of this, the purpose of the present application is to provide a substrate conveying component, a sampling chamber and an MBE device to solve the technical problem of high equipment maintenance costs caused by the easy deformation of the guide rail.
[0006] In order to achieve the above technical purpose, the present application provides a substrate conveying assembly, including a conveying chamber, a guide rail and a fastening screw;
[0007] A flange is fixedly connected to the bottom of the conveying chamber;
[0008] The guide rail is laid in the conveying chamber and is provided with a threaded hole threadedly connected to the fastening screw;
[0009] The threaded rod end of the fastening screw passes through the conveying chamber through the inside of the flange and is connected to the threaded hole, so as to fasten the guide rail to the conveying chamber;
[0010] Also includes a heating device;
[0011] The heating device is installed on the flange and is used for heating the fastening screws.
[0012] Furthermore, the heating device is installed outside the flange, and is used to heat the fastening screws by heating the flange.
[0013] Furthermore, the outer peripheral surface of the flange is coated with a first heat conducting layer.
[0014] Furthermore, the first heat-conducting layer is an aluminum foil layer.
[0015] Furthermore, the heating device is installed in the flange.
[0016] Furthermore, a portion of the fastening screw located within the flange is covered with a second heat conducting layer.
[0017] Furthermore, the second heat-conducting layer is an aluminum foil layer.
[0018] Furthermore, the heating device is a heating wire.
[0019] The present application also discloses a sampling chamber, including a conveying vehicle and the substrate conveying assembly;
[0020] The transport vehicle is slidably matched with a guide rail in the substrate transport assembly.
[0021] The present application also discloses an MBE device, comprising the sampling chamber.
[0022] It can be seen from the above technical solutions that the substrate conveying assembly designed in this application heats the fastening screws by installing a heating device on the flange, so that the fastening screws can be continuously in a state of thermal expansion, so that the fastening screws are not easy to loosen, greatly reducing the probability of deformation of the guide rail and reducing the cost of regular maintenance. Moreover, during the degassing and cooling process, since the equipment is in a state of natural cooling, adding a heating device can also effectively reduce the cooling rate and reduce the probability of leakage in the equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0024] Figure 1 A front view of a substrate conveying assembly provided in the present application;
[0025] Figure 2 A bottom view of a substrate conveying assembly provided in the present application;
[0026] Figure 3 A side view of a substrate conveying assembly provided in the present application;
[0027] In the figure: 1. conveying chamber; 11. flange; 2. guide rail; 3. fastening screws; 4. heating device. DETAILED DESCRIPTION
[0028] The technical solutions of the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. All other embodiments obtained by ordinary technicians in this field without creative work based on the embodiments in the embodiments of the present application are within the scope of protection of the embodiments of the present application.
[0029] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.
[0030] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a replaceable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.
[0031] An embodiment of the present application discloses a substrate conveying component.
[0032] See also Figure 2 , an embodiment of a substrate conveying component provided in the embodiments of the present application includes:
[0033] Transport chamber 1, guide rail 2 and fastening screw 3.
[0034] A flange 11 is fixedly connected to the bottom of the conveying chamber 1, and the number of flanges 11 is specifically two, which are arranged at intervals. The guide rail 2 is laid in the conveying chamber 1 and is provided with a threaded hole threadedly connected to the fastening screw 3; the threaded rod end of the fastening screw 3 passes through the conveying chamber 1 through the flange 11 and is connected to the threaded hole, which is used to fasten the guide rail 2 to the conveying chamber 1. When there are multiple flanges 11, each flange 11 has a fastening screw 3 for fastening the guide rail 2. The specific matching relationship and specific structure between the above-mentioned conveying chamber 1, guide rail 2 and fastening screw 3 are existing designs and will not be repeated.
[0035] The key improvement of the present application is to add a heating device 4. The heating device 4 is installed on the flange 11 to heat the fastening screw 3.
[0036] By installing a heating device 4 on the flange 11, the fastening screw 3 is heated, so that the fastening screw 3 can be continuously in a state of thermal expansion, so that the fastening screw 3 is not easy to loosen, which greatly reduces the probability of deformation of the guide rail 2 and reduces the cost of regular maintenance. In addition, during the degassing and cooling process, since the equipment is in a state of natural cooling, adding a heating device 4 can also effectively reduce the cooling rate and reduce the probability of leakage in the equipment.
[0037] The above is an embodiment of a substrate conveying assembly provided in the embodiment of the present application. The following is an embodiment of a substrate conveying assembly provided in the embodiment of the present application. For details, please refer to Figures 1 to 3 .
[0038] Based on the solution of the above embodiment 1:
[0039] Furthermore, if Figure 2 As shown, the heating device 4 can be installed outside the flange 11 to heat the fastening screws 3 by heating the flange 11 .
[0040] Furthermore, the outer peripheral surface of the flange 11 is coated with a first heat-conducting layer (not shown in the figure), and the heating device 4 is installed on the first heat-conducting layer to heat the flange 11 through the first heat-conducting layer.
[0041] By providing the first heat-conducting layer, the flange 11 can be heated more evenly, and the rapid heat loss during cooling can be prevented, so as to reduce the cooling speed, effectively reduce the output power of the heating device 4, and save electricity costs. At the same time, it can also effectively avoid leaving marks on the flange 11 due to long-term continuous heating, which affects the appearance of the equipment.
[0042] Furthermore, the first heat-conducting layer may be an aluminum foil layer, that is, a layer of aluminum foil is wrapped around the outer circumference of the flange 11 .
[0043] Furthermore, the heating device 4 can also be installed in the flange 11 to heat the inside of the flange 11 to heat the fastening screws 3 inside the flange 11, or the heating device 4 directly contacts the fastening screws 3 to heat the fastening screws 3.
[0044] Furthermore, the portion of the fastening screw 3 located within the flange 11 is coated with a second heat-conducting layer (not shown in the figure), and the heating device 4 is connected to the fastening screw 3 through the second heat-conducting layer to achieve heat transfer to the fastening screw 3 through the second heat-conducting layer.
[0045] The effect of the second heat-conducting layer in the above-mentioned external heating device 4 is equivalent to that of the second heat-conducting layer. By covering the fastening screw 3 with the second heat-conducting layer, the fastening screw 3 can be heated more evenly, and the rapid heat loss during cooling can be prevented, so as to achieve the purpose of reducing the cooling speed, effectively reduce the output power of the heating device 4, and save electricity costs. At the same time, it can also effectively avoid leaving marks on the fastening screw 3 due to long-term continuous heating.
[0046] Of course, the second heat-conducting layer can also be laid on the inner circumference of the flange 11, so as to heat the fastening screws 3 by heating the flange 11. Alternatively, the second heat-conducting layer can be laid on both the fastening screws 3 and the inner circumference of the flange 11, and there is no specific limitation.
[0047] Furthermore, the second heat-conducting layer may also be an aluminum foil layer.
[0048] In order to reduce heat loss, the flange 11 may be covered with a layer of thermal insulation structure. Take the external design of the heating device 4 as an example:
[0049] The flange 11 is coated with a first heat-conducting layer, the heating device 4 is installed on the first heat-conducting layer, and then the heating device 4 is coated with a heat-insulating structure layer to prevent heat loss.
[0050] Take the built-in design of heating device 4 as an example:
[0051] The thermal insulation structure layer is directly coated on the outside of the flange 11.
[0052] The thermal insulation structure layer can be made of thermal insulation materials such as rock wool, without limitation.
[0053] Furthermore, the heating device 4 can be a heating wire in terms of structural design.
[0054] Taking the external design of the heating device 4 as an example, the heating device 4 is preferably a heating wire, which can be wound around the outside of the flange 11 to better heat the flange 11. Note that the heating wires cannot overlap to avoid damage.
[0055] Taking the built-in design of the heating device 4 as an example, the heating device 4 can be a heating wire fixed in a winding manner or a heating rod.
[0056] Of course, the heating device 4 can also be a heating plate, which is mounted on the inner and outer surfaces of the flange 11 and on the fastening screws 3. Those skilled in the art can make appropriate design changes based on this, and there is no specific limitation.
[0057] In addition, in this application Figure 1 As shown, when there are two flanges 11, there are two corresponding heating devices 4. The two heating devices 4 can be connected in series and controlled together, without any specific limitation.
[0058] Taking the heating device 4 as a heating wire and an external setting as an example, the specific implementation process can be as follows:
[0059] 1. Wrap a layer of aluminum foil on the outer circumference of the flange 11 to form a first heat-conducting layer;
[0060] 2. Wind the heating wire evenly on the first heat-conducting layer, and then connect the heating wire control module;
[0061] 3. When degassing the substrate, the temperature in the conveying chamber 1 is raised to 200°C. After the degassing is completed, the temperature is lowered from 200°C to room temperature, and the heating wire begins to heat during the cooling. The temperature is adjusted by slowly increasing the heating power of the heating wire, which is roughly between 0-50V, increasing the power by 5V every 10 minutes; between 50-100V, increasing the power by 5V every 15 minutes; between 100-150V, increasing the power by 5V every 20 minutes. When the target temperature is about to be reached, the power is slowly reduced. After multiple adjustments, the flange 11 is maintained within the required target temperature range. Due to the heating effect of the heating wire, the fastening screw 3 will be in a linear and controllable cooling state, realizing unnatural cooling, thereby ensuring that it is in a state of continuous metal expansion, slowing down the characteristics of thermal expansion and contraction, reducing the risk of loosening of the fastening screw 3, and solving the problem of frequent cavity opening for maintenance.
[0062] The present application also discloses a sampling chamber, comprising a transport vehicle and the substrate transport assembly of the above-mentioned embodiment 1 or embodiment 2, wherein the transport vehicle is in sliding cooperation with the guide rail 2 in the substrate transport assembly.
[0063] The present application also discloses an MBE device, comprising the above-mentioned sampling chamber.
[0064] The above is a detailed introduction to a substrate transport component, a sampling chamber and an MBE device provided in the present application. For a person skilled in the art, according to the ideas of the embodiments of the present application, there may be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.
Claims
1. A substrate conveying assembly, comprising a conveying chamber (1), a guide rail (2) and a fastening screw (3); A flange (11) is fixedly connected to the bottom of the conveying chamber (1); The guide rail (2) is laid in the conveying chamber (1) and is provided with a threaded hole threadably connected to the fastening screw (3); The threaded rod end of the fastening screw (3) passes through the interior of the flange (11) through the conveying chamber (1) and is connected to the threaded hole, so as to fasten the guide rail (2) to the conveying chamber (1); It is characterized in that Also includes a heating device (4); The heating device (4) is mounted on the flange (11) and is used to heat the fastening screws (3).
2. A substrate conveying assembly according to claim 1, characterized in that: The heating device (4) is installed outside the flange (11) and is used to heat the fastening screw (3) by heating the flange (11).
3. A substrate conveying assembly according to claim 2, characterized in that: The outer peripheral surface of the flange (11) is coated with a first heat conducting layer.
4. A substrate conveying assembly according to claim 3, characterized in that: The first heat-conducting layer is an aluminum foil layer.
5. A substrate conveying assembly according to claim 1, characterized in that: The heating device (4) is installed in the flange (11).
6. A substrate conveying assembly according to claim 5, characterized in that: The portion of the fastening screw (3) located inside the flange (11) is covered with a second heat-conducting layer.
7. A substrate conveying assembly according to claim 6, characterized in that: The second heat-conducting layer is an aluminum foil layer.
8. A substrate conveying assembly according to claim 1, characterized in that: The heating device (4) is a heating wire.
9. A sampling chamber, characterized in that: It comprises a transport vehicle and a substrate transport assembly as claimed in any one of claims 1 to 8; The transport vehicle is slidably matched with a guide rail (2) in the substrate transport component.
10. An MBE device, characterized in that: Comprising the sampling chamber as claimed in claim 9.