N-type silicon wafer firing furnace tube

Abstract

The utility model relates to the technical field of silicon wafer firing furnace tubes, in particular to an N-type silicon wafer firing furnace tube which comprises a furnace tube body, the side wall of the furnace tube body is rotationally connected with a cover door through a rotating shaft, and the side wall of the cover door is connected with the side wall of the furnace tube body through a plurality of bolts; the air inlet mechanism comprises an annular groove formed in the furnace tube body and close to the side wall of the cover door, a plurality of air inlet holes communicated with the inner wall of the furnace tube body are formed in the inner wall of the annular groove, a circular ring is fixedly connected to the side wall of the cover door, and an air inlet pipe is fixedly connected to the side wall of the cover door. According to the utility model, through the arrangement of the gas inlet mechanism, oxygen can flow out through a plurality of gas inlet holes, so that the oxygen is uniformly sprayed on the N-type silicon wafer, the N-type silicon wafer is uniformly formed, the production efficiency is improved, and the problem that the N-type silicon wafer needs to be placed in a furnace tube to be oxidized for a long time due to non-uniform oxygen distribution in the prior art is solved. And the forming efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon slice firing furnace tubes, in particular to an N-type silicon slice firing furnace tube. Background Art

[0002] N-type silicon wafer refers to silicon wafer material doped with a certain amount of heteroatoms, such as phosphorus, arsenic, etc., making it a negative semiconductor with a higher doping concentration.

[0003] N-type silicon wafers need to be placed on the ark before molding, and then transported to the furnace tube and added with oxygen for oxidation molding. Currently, oxygen is transported to the furnace tube directly from the furnace tube mouth, that is, oxygen first contacts the N-type silicon wafer close to the furnace tube mouth, and then contacts the N-type silicon wafer far from the furnace tube mouth. This will cause uneven oxidation on the N-type silicon wafer during initial use. The N-type silicon wafer needs to be placed in the furnace tube for a long time for oxidation, and during the contact process, oxygen cannot be evenly sprayed on the surface of the N-type silicon wafer, thereby increasing its molding efficiency. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes an N-type silicon wafer firing furnace tube.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] An N-type silicon wafer firing furnace tube, comprising:

[0007] A furnace tube body, wherein the side wall of the furnace tube body is rotatably connected to a cover door via a rotating shaft, and the side wall of the cover door is connected to the side wall of the furnace tube body via a plurality of bolts;

[0008] An air intake mechanism comprises an annular groove provided on the side wall of the furnace tube body close to the cover door, a plurality of air intake holes connected to the inner wall of the furnace tube body are provided on the inner wall of the annular groove, a circular ring is fixedly connected to the side wall of the cover door, an air intake pipe is fixedly connected to the side wall of the cover door, and the inner wall of the air intake pipe is connected to the side wall of the circular ring away from the cover door through a plurality of connecting pipes.

[0009] Preferably, two supporting plates are fixedly connected to the inner wall of the furnace tube body, and arks for placing N-type silicon wafers are arranged on the two supporting plates.

[0010] Preferably, two connecting plates are fixedly connected to the top and bottom of the furnace tube body, and the side walls of the two connecting plates away from the furnace tube body are commonly fixedly connected to a thermocouple.

[0011] Preferably, the side wall of the cover door is fixedly connected with an exhaust pipe, and the inner wall of the air inlet pipe and the inner wall of the exhaust pipe are both installed with manual regulating valves.

[0012] The utility model has the following beneficial effects:

[0013] By setting up an air intake mechanism, oxygen will flow out through multiple air intake holes, thereby spraying oxygen evenly on the N-type silicon wafer, thereby evenly molding the N-type silicon wafer, improving production efficiency, avoiding the need to place the N-type silicon wafer in a furnace tube for a long time of oxidation due to uneven oxygen distribution in the prior art, and increasing its molding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the structure of an N-type silicon wafer firing furnace tube proposed by the utility model;

[0015] Figure 2 for Figure 1 A vertical cross-sectional structural schematic diagram of ;

[0016] Figure 3 for Figure 1 Schematic diagram of the structure of the middle furnace cover.

[0017] In the figure: 1. furnace tube body; 2. cover door; 3. bolts; 4. air inlet pipe; 5. exhaust pipe; 6. annular groove; 7. air inlet hole; 8. ring; 9. connecting pipe; 10. bearing plate; 11. connecting plate; 12. thermocouple. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0019] Reference Figure 1-3 A N-type silicon wafer firing furnace tube comprises a furnace tube body 1, a side wall of the furnace tube body 1 is rotatably connected with a cover door 2 through a rotating shaft, the side wall of the cover door 2 is connected to the side wall of the furnace tube body 1 through a plurality of bolts 3, further, the side wall of the cover door 2 is provided with a sealing rubber pad to ensure the sealing between the furnace tube body 1 and the cover door 2 after the two are connected.

[0020] Two supporting plates 10 are fixedly connected to the inner wall of the furnace tube body 1 , and the two supporting plates 10 are provided with an ark for placing N-type silicon wafers, which is the prior art and can stably place the N-type silicon wafers in the furnace tube body 1 for molding.

[0021] The top and bottom of the furnace tube body 1 are fixedly connected to two connecting plates 11, and the two connecting plates 11 are fixedly connected to the side walls away from the furnace tube body 1 with thermocouples 12 for heating the N-type silicon wafer to improve its molding efficiency, which is the prior art.

[0022] The air intake mechanism includes an annular groove 6 opened on the side wall of the furnace tube body 1 close to the cover door 2, the inner wall of the annular groove 6 is opened with multiple air intake holes 7 connected with the inner wall of the furnace tube body 1, a circular ring 8 is fixedly connected to the side wall of the cover door 2, the side wall of the cover door 2 is fixedly connected to the air intake pipe 4, and the inner wall of the air intake pipe 4 is connected with the side wall of the circular ring 8 away from the cover door 2 through multiple connecting pipes 9.

[0023] It should be noted that the ring 8 is inserted into the annular groove 6 , and there is a large gap between the side wall of the ring 8 and the inner wall of the annular groove 6 , so that when the cover door 2 rotates, the ring 8 can freely enter and exit the annular groove 6 .

[0024] Furthermore, after the furnace tube body 1 is connected to the cover door 2, the ring 8 enters the annular groove 6, and then oxygen enters the annular groove 6 through the air inlet pipe 4 and multiple connecting pipes 9, and flows out through multiple air inlet holes 7, thereby evenly spraying oxygen on the N-type silicon wafer, thereby evenly molding the N-type silicon wafer, improving production efficiency, avoiding the need to place the N-type silicon wafer in the furnace tube for a long time of oxidation due to uneven oxygen distribution in the prior art, and increasing its molding efficiency.

[0025] The side wall of the cover door 2 is fixedly connected with an exhaust pipe 5, and the inner walls of the air inlet pipe 4 and the exhaust pipe 5 are both installed with manual regulating valves.

[0026] When preparing N-type silicon wafers, firstly, the ark with the N-type silicon wafers is placed on two supporting plates 10 located in the furnace tube body 1, then the cover door 2 is rotated, and the furnace tube body 1 and the cover door 2 are connected by a plurality of bolts 3, and then the thermocouple 12 is powered to heat the furnace tube body 1 to accelerate the molding of the N-type silicon wafers;

[0027] Then, the manual valve on the air inlet pipe 4 is opened, and oxygen is transported into the air inlet pipe 4, and then the oxygen enters the annular groove 6 through the air inlet pipe 4 and the multiple connecting pipes 9, and flows out through the multiple air inlet holes 7, so that oxygen is evenly sprayed on the N-type silicon wafer, so that the N-type silicon wafer is evenly molded, thereby improving production efficiency, avoiding the need to place the N-type silicon wafer in the furnace tube for a long time due to uneven oxygen distribution in the prior art, and increasing its molding efficiency;

[0028] After the N-type silicon wafer is completed, the manual valve on the air inlet pipe 4 is closed, and the manual valve on the exhaust pipe 5 is opened to discharge the gas in the furnace tube body 1.

[0029] The above are only preferred specific implementation methods of the utility model, but the protection scope of the utility model is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the utility model, who makes equivalent replacements or changes based on the technical scheme and utility model concept of the utility model, should be covered by the protection scope of the utility model.

Claims

1. An N-type silicon wafer firing furnace tube, characterized in that: include: A furnace tube body (1), the side wall of the furnace tube body (1) being rotatably connected to a cover door (2) via a rotating shaft, and the side wall of the cover door (2) being connected to the side wall of the furnace tube body (1) via a plurality of bolts (3); An air intake mechanism, the air intake mechanism comprising an annular groove (6) provided on the side wall of the furnace tube body (1) close to the cover door (2), the inner wall of the annular groove (6) being provided with a plurality of air intake holes (7) connected to the inner wall of the furnace tube body (1), a circular ring (8) being fixedly connected to the side wall of the cover door (2), an air intake pipe (4) being fixedly connected to the side wall of the cover door (2), the inner wall of the air intake pipe (4) being connected to the side wall of the circular ring (8) away from the cover door (2) via a plurality of connecting pipes (9).

2. The N-type silicon wafer firing furnace tube according to claim 1, characterized in that: Two supporting plates (10) are fixedly connected to the inner wall of the furnace tube body (1), and an ark for placing N-type silicon wafers is provided on the two supporting plates (10).

3. The N-type silicon wafer firing furnace tube according to claim 1, characterized in that: The top and bottom of the furnace tube body (1) are both fixedly connected to two connecting plates (11), and the side walls of the two connecting plates (11) away from the furnace tube body (1) are commonly fixedly connected to a thermocouple (12).

4. The N-type silicon wafer firing furnace tube according to claim 1, characterized in that: The side wall of the cover door (2) is fixedly connected to an exhaust pipe (5), and the inner wall of the air inlet pipe (4) and the inner wall of the exhaust pipe (5) are both installed with manual regulating valves.

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