High-temperature control support

Abstract

The utility model discloses a high-temperature temperature control support which comprises a thermocouple distribution support, a temperature feedback sampling support and a heat insulation support, a miniature thermocouple is arranged in the thermocouple distribution support, a crystal is arranged in the thermocouple distribution support, a temperature feedback device is arranged in the temperature feedback sampling support, and the thermocouple distribution support is connected with the temperature feedback sampling support. The thermal insulation support is provided with a clearance groove, and the thermocouple distribution support and the temperature feedback sampling support are at least partially located in the clearance groove. A receding groove is formed in a heat insulation support, a thermocouple distribution support used for containing a crystal and a temperature feedback sampling support used for containing a temperature feedback device are both located in the receding groove, temperature measurement control is achieved through a miniature thermocouple, and the heat insulation effect of the device is enhanced through the receding groove; the disturbance influence of the thermocouple on the surrounding environment during temperature control is reduced, and the high-stability constant-value temperature control effect can be achieved.

Description

Technical Field

[0001] The present application belongs to the field of auxiliary work of crystal devices, and specifically relates to a high-temperature temperature control bracket. Background Art

[0002] In nonlinear applications of optical crystals, under certain working conditions, the operating temperature of the crystal needs to be higher than 100°C to achieve effective operation of the crystal, while conventional temperature controllers in the prior art generally operate in the range of room temperature to 60°C. If the semiconductor electrothermal effect is used as a temperature control method, such devices require additional heat dissipation structures to assist the semiconductor devices, which will make the device installation structure more complicated, and when the temperature is higher than 100°C, the working efficiency of the heat dissipation structure will drop sharply, resulting in poor use effect. Utility Model Content

[0003] The present application provides a high-temperature temperature control bracket, which realizes accurate temperature control of crystal devices under high temperature conditions through a simple structure, thereby ensuring working efficiency and working stability.

[0004] The technical solution adopted in this application is:

[0005] A high-temperature temperature control bracket comprises a thermocouple distribution bracket, a temperature feedback sampling bracket and an insulation bracket, wherein a micro-thermocouple is arranged in the thermocouple distribution bracket, a crystal is arranged in the thermocouple distribution bracket, a temperature feedback device is arranged in the temperature feedback sampling bracket, the thermocouple distribution bracket is connected to the temperature feedback sampling bracket, the insulation bracket is provided with an air avoidance groove, and the thermocouple distribution bracket and the temperature feedback sampling bracket are at least partially located in the air avoidance groove.

[0006] In a preferred implementation of a high-temperature temperature control bracket, the air avoidance slot includes a first slot body and a second slot body, the temperature feedback sampling bracket is located in the first slot body, and the thermocouple distribution bracket is located in the second slot body.

[0007] In a preferred implementation of a high-temperature temperature control bracket, the top of the thermocouple distribution bracket is connected to the bottom of the temperature feedback sampling bracket, and the insulation bracket includes a first bracket located above the temperature feedback sampling bracket and a second bracket located below the thermocouple distribution bracket. The first bracket is concave upward to form a first trough body, and the second bracket is concave downward to form a second trough body.

[0008] In a preferred implementation of the high-temperature temperature control bracket, the notch of the first slot body is butted against the notch of the second slot body.

[0009] In a preferred implementation of a high-temperature temperature control bracket, a first mounting groove is provided on a side wall of the first bracket, a second mounting groove is provided on a side wall of the second bracket, and the high-temperature temperature control bracket includes an aperture located in the first mounting groove and the second mounting groove.

[0010] In a preferred implementation of a high-temperature temperature control bracket, first mounting grooves are provided on both sides of the first bracket, second mounting grooves are provided on both sides of the second bracket, and the aperture abuts against the inner wall of the first mounting groove and the inner wall of the second mounting groove.

[0011] In a preferred implementation of a high-temperature temperature control bracket, the thermocouple distribution bracket is provided with a crystal limiting groove, the aperture is provided with a light-through hole, and the projection of the light-through hole in the radial direction falls into the crystal limiting groove.

[0012] In a preferred implementation of the high-temperature temperature control bracket, the opening width of the first slot body is adapted to the width of the temperature feedback sampling bracket, and the opening width of the second slot body is adapted to the width of the thermocouple distribution bracket.

[0013] In a preferred implementation of a high-temperature temperature control bracket, the thermal insulation bracket is provided with a temperature feedback device wiring hole and a thermocouple power supply wiring port.

[0014] In a preferred implementation of the high-temperature temperature control bracket, the high-temperature temperature control bracket also includes a base, and the insulation bracket is fixed to the base.

[0015] Due to the adoption of the above technical solution, the beneficial effects achieved by this application are as follows:

[0016] (1) An air-avoiding groove is set on the insulating bracket, and the thermocouple distribution bracket for placing the crystal and the temperature feedback sampling bracket for placing the temperature feedback device are both located in the air-avoiding groove, and the temperature measurement control is realized by a micro-thermocouple. The air-avoiding groove enhances the insulation effect of the device, and at the same time helps to reduce the influence of the external environment on the operation of the crystal device, and reduces the disturbance effect of the thermocouple on the surrounding environment during temperature control, which is conducive to achieving a high-stability constant-value temperature control effect.

[0017] (2) The first bracket and the second bracket are arranged to be connected in alignment through the first mounting groove, the second mounting groove and the aperture located in the first mounting groove and the second mounting groove, thereby avoiding exposure of the thermocouple distribution bracket and the temperature feedback sampling bracket, and further cooperating with the air avoidance groove to achieve the temperature control effect, and the radial projection of the light-through hole is located in the limiting groove, cooperating with the docking first bracket and the second bracket, avoiding the existence of other gaps except the light-through hole, reducing the thermal convection effect, and facilitating the efficient and stable operation of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0019] Figure 1 This is an exploded view of a high temperature temperature control bracket in one embodiment of the utility model;

[0020] Figure 2 This is a schematic diagram of the external structure of a high-temperature temperature control bracket in one embodiment of the utility model;

[0021] Figure 3 It is a schematic diagram of the internal structure of the first bracket in one embodiment of the utility model.

[0022] Description of reference numerals:

[0023] 1-thermocouple distribution bracket, 11-crystal limiting groove; 2-temperature feedback sampling bracket; 3-insulation bracket, 31-first bracket, 311-first slot body, 312-temperature feedback device wiring hole, 313-first mounting slot, 32-second bracket, 321-second slot body, 322-thermocouple power supply wiring port, 323-second mounting slot; 4-aperture, 41-light hole; 5-base. DETAILED DESCRIPTION

[0024] In order to more clearly illustrate the overall concept of the present application, a detailed description is given below in an illustrative manner in conjunction with the accompanying drawings.

[0025] In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present application is not limited by the specific embodiments disclosed below. It should be noted that the embodiments of the present application and the features in each embodiment may be combined with each other without conflict.

[0026] In addition, in the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "top", "bottom", "inside", "outside", "axial", "radial", "circumferential", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0027] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] In the present application, unless otherwise clearly specified and limited, a first feature "above" or "below" a second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more embodiments or examples.

[0029] The present application provides a high temperature temperature control bracket, such as Figures 1 to 3 As shown, it includes a thermocouple distribution bracket 1, a temperature feedback sampling bracket 2 and an insulation bracket 3. A micro thermocouple is arranged in the thermocouple distribution bracket 1, and a crystal is arranged in the thermocouple distribution bracket 1. A temperature feedback device is arranged in the temperature feedback sampling bracket 2. The thermocouple distribution bracket 1 is connected to the temperature feedback sampling bracket 2. The insulation bracket 3 is provided with an air avoidance groove. The thermocouple distribution bracket 1 and the temperature feedback sampling bracket 2 are at least partially located in the air avoidance groove.

[0030] An air-avoiding groove is provided on the insulating bracket 3, and the thermocouple distribution bracket 1 for placing the crystal and the temperature feedback sampling bracket 2 for placing the temperature feedback device are both located in the air-avoiding groove. Temperature measurement and control are achieved through a micro-thermocouple, and the insulation effect of the device is enhanced through the air-avoiding groove, which reduces the disturbance effect of the surrounding environment when the thermocouple is performing temperature control, which is conducive to achieving a high-stability constant-value temperature control effect.

[0031] It should be noted that the thermocouple distribution bracket 1 and the temperature feedback sampling bracket 2 in this solution are both made of high thermal conductivity materials, and micro thermocouples are symmetrically distributed in the thermocouple distribution bracket 1, so that it can achieve fast and uniform heat transfer to the wrapped crystal device and improve the heat transfer effect.

[0032] In addition, this solution can make use of existing technology. The temperature feedback device is driven by a PID algorithm, and real-time temperature feedback is made according to the sampling signal to control the thermal power of the thermocouple and cooperate with the thermocouple to achieve constant temperature control.

[0033] Micro thermocouple elements are used as temperature control working elements and are symmetrically distributed around the optical crystal device. Combined with the setting of high thermal conductivity materials and high thermal insulation bracket 3, accurate temperature control of the crystal device can be achieved under high temperature conditions (100-250°C).

[0034] Furthermore, the air avoidance slot includes a first slot body 311 and a second slot body 321 , the temperature feedback sampling bracket 2 is located in the first slot body 311 , and the thermocouple distribution bracket 1 is located in the second slot body 321 .

[0035] In one embodiment, the top of the thermocouple distribution bracket 1 is connected to the bottom of the temperature feedback sampling bracket 2, and the insulation bracket 3 includes a first bracket 31 located above the temperature feedback sampling bracket 2 and a second bracket 32 ​​located below the thermocouple distribution bracket 1. The first bracket 31 is concave upward to form a first groove body 311, and the second bracket 32 ​​is concave downward to form a second groove body 321.

[0036] The air avoidance groove is formed according to the connection and installation form of the thermocouple distribution bracket 1 and the temperature feedback sampling bracket 2. The processing method is simple, and it has a certain guiding effect on the installation of the temperature feedback sampling bracket 2 and the thermocouple distribution bracket 1, which is beneficial to the accuracy of the installation position.

[0037] It should be noted that the insulation bracket 3 is made of high insulation material, and the air-avoiding groove is used to further enhance the insulation effect, thereby achieving high-stability constant-value temperature control.

[0038] Preferably, the notch of the first slot body 311 is butted against the notch of the second slot body 321. In this embodiment, the butt joint surface of the thermocouple distribution bracket 1 and the temperature feedback sampling bracket 2 when connected is flush with the notch.

[0039] In one embodiment, a first mounting groove 313 is provided on the side wall of the first bracket 31 , a second mounting groove 323 is provided on the side wall of the second bracket 32 ​​, and the high-temperature temperature control bracket includes an aperture 4 located in the first mounting groove 313 and the second mounting groove 323 .

[0040] Furthermore, first mounting grooves 313 are provided on both sides of the first bracket 31 , and second mounting grooves 323 are provided on both sides of the second bracket 32 ​​. The diaphragm 4 abuts against inner walls of the first mounting groove 313 and inner walls of the second mounting groove 323 .

[0041] The aperture 4 connects the first mounting groove 313 and the second mounting groove 323. In this embodiment, the aperture 4 is made of a material with a high melting point and low thermal conductivity, and the aperture 4 and the first mounting groove 313 and the second mounting groove 323 are precisely fixed after docking, further avoiding the existence of unexpected gaps except for the light-through hole 41.

[0042] Preferably, the thermocouple distribution bracket 1 is provided with a crystal limiting groove 11 , and the aperture 4 is provided with a light-through hole 41 , and the projection of the light-through hole 41 in the radial direction falls into the crystal limiting groove 11 .

[0043] It can be understood that in this embodiment, the light hole 41 is opposite to the side opening of the crystal limiting groove 11, and the size of the light hole 41 is almost consistent with the size of the side opening of the crystal limiting groove 11. The size of the crystal limiting groove 11 is set according to the actual requirements of the crystal device used, and there is no specific limitation on this.

[0044] In one embodiment, the opening width of the first slot body 311 is adapted to the width of the temperature feedback sampling bracket 2 , and the opening width of the second slot body 321 is adapted to the width of the thermocouple distribution bracket 1 .

[0045] In one embodiment, the thermal insulation bracket 3 is provided with a temperature feedback device wiring hole 312 and a thermocouple power supply wiring port 322. It should be noted that a glass fiber sheath is used to insulate the wiring during wiring to prevent high temperature (100°C and above) from causing line aging.

[0046] It is understandable that the thermocouple distribution bracket 1 is provided with a wiring port aligned with the thermocouple power supply wiring port 322 , and the temperature feedback sampling bracket 2 is provided with a wiring hole aligned with the temperature feedback device wiring hole 312 .

[0047] In one embodiment, the high temperature temperature control bracket further includes a base 5, and the heat insulating bracket 3 is fixed to the base 5. Specifically, after the first bracket 31, the second bracket 32, the thermocouple distribution bracket 1, the temperature feedback bracket and the aperture 4 are assembled, the second bracket 32 ​​is fixed to the base 5, so as to facilitate the fixed connection between the device and the optical system through the base 5. The base 5 is made of high-strength materials to enhance the overall connection stability and use stability of the device.

[0048] It is understandable that the fixed connection between the components in the present application can be achieved by fasteners such as bolts, and washers are provided to cooperate with the fasteners to enhance the cooperation effect. The position relationship between the position of the temperature feedback device and the crystal in the present application is set according to the actual function requirements, for example, the temperature feedback device is set parallel to the crystal to make it have a higher response speed.

[0049] Anything not described in this application can be achieved by adopting or drawing on existing technologies.

[0050] The various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0051] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A high temperature temperature control bracket, characterized in that: It includes a thermocouple distribution bracket, a temperature feedback sampling bracket and an insulation bracket, wherein a micro-thermocouple is arranged in the thermocouple distribution bracket, a crystal is arranged in the thermocouple distribution bracket, a temperature feedback device is arranged in the temperature feedback sampling bracket, the thermocouple distribution bracket is connected to the temperature feedback sampling bracket, the insulation bracket is provided with an air avoidance groove, and the thermocouple distribution bracket and the temperature feedback sampling bracket are at least partially located in the air avoidance groove.

2. A high temperature temperature control bracket according to claim 1, characterized in that: The air avoidance slot comprises a first slot body and a second slot body, the temperature feedback sampling bracket is located in the first slot body, and the thermocouple distribution bracket is located in the second slot body.

3. A high temperature temperature control bracket according to claim 2, characterized in that: The top of the thermocouple distribution bracket is connected to the bottom of the temperature feedback sampling bracket, and the insulation bracket includes a first bracket located above the temperature feedback sampling bracket and a second bracket located below the thermocouple distribution bracket, the first bracket is concave upward to form the first trough body, and the second bracket is concave downward to form the second trough body.

4. A high temperature temperature control bracket according to claim 3, characterized in that: The notch of the first slot body is butted against the notch of the second slot body.

5. A high temperature temperature control bracket according to claim 3, characterized in that: The side wall of the first bracket is provided with a first mounting groove, the side wall of the second bracket is provided with a second mounting groove in an opposite position, and the high-temperature temperature control bracket includes an aperture located in the first mounting groove and the second mounting groove.

6. A high temperature temperature control bracket according to claim 5, characterized in that: The first mounting grooves are disposed on both sides of the first bracket, the second mounting grooves are disposed on both sides of the second bracket, and the aperture abuts against the inner wall of the first mounting groove and the inner wall of the second mounting groove.

7. A high temperature temperature control bracket according to claim 5, characterized in that: The thermocouple distribution bracket is provided with a crystal limiting groove, and the aperture is provided with a light-through hole, and the projection of the light-through hole in the radial direction falls into the crystal limiting groove.

8. A high temperature temperature control bracket according to claim 2, characterized in that: The opening width of the first slot body is adapted to the width of the temperature feedback sampling bracket, and the opening width of the second slot body is adapted to the width of the thermocouple distribution bracket.

9. A high temperature temperature control bracket according to claim 1, characterized in that: The thermal insulation bracket is provided with a temperature feedback device wiring hole and a thermocouple power supply wiring port.

10. The high temperature temperature control bracket according to claim 1, characterized in that: The high-temperature temperature control bracket also includes a base, and the insulation bracket is fixed to the base.

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