Buckle type common mode inductor

Abstract

The utility model discloses a buckle type common mode inductor which comprises a magnetic core module, the magnetic core module comprises two first side plates, magnetic core middle columns are arranged at the two ends between the two first side plates, grooves are formed in the two ends of the tops of the first side plates, and hardware terminals are fixedly bonded to the inner bottom faces of the grooves. According to the utility model, the hardware terminals are bonded and fixed on the inner bottom surface of the groove, and the two ends of the coil are placed in the middle of the buckles on the hardware terminals, so that the buckles on the four hardware terminals are tinned at low temperature after the placement is completed; hidden hidden dangers such as short circuit of copper wires in the coil and dark crack of the magnetic core caused by high-temperature impact of the magnetic core module are avoided by utilizing low-temperature tin plating, the hardware terminal is mounted in the groove, and the end part of the coil is mounted in the hardware terminal, so that the phenomenon that the PAD surface of the buckle type common-mode inductor is not flat after tin plating is avoided, and the service life of the buckle type common-mode inductor is prolonged. And subsequent polishing treatment is not needed, and manpower and working hours are saved.

Description

Technical Field

[0001] The utility model relates to the technical field of common mode inductors, in particular to a snap-on common mode inductor. Background Art

[0002] Common mode inductors, also called common mode chokes, are often used in computer switching power supplies to filter common mode electromagnetic interference signals. In board design, common mode inductors also play the role of EMI filtering, which is used to suppress the electromagnetic waves generated by high-speed signal lines from radiating outward. Common mode inductors are widely used in various electronic fields. At present, when common mode inductors are used in the soldering station of the process, the copper wire needs high temperature to be plated with tin. In production, the entire PAD surface needs to be immersed in the high temperature tin surface for tinning. The soldering temperature reaches about 420°. The product is prone to hidden dangers such as dark cracks in the magnetic core and short circuit of the copper wire due to high temperature impact. In addition, because the copper wire in and out are placed in the PAD surface wire slot, the PAD surface will be uneven after tinning, which requires grinding operation later, which consumes manpower and time. The magnetic core and cover assembly of the common mode inductor are fixed with glue. When used in some places, they are in an environment of vibration or high and low temperature differences in operating temperature. They are easy to loosen and separate, and the anti-seismic effect is poor, thus affecting the reliability and stability of the product. Utility Model Content

[0003] The purpose of the utility model is to provide a snap-on common-mode inductor to solve the problems raised in the above background technology.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A snap-on common-mode inductor comprises a magnetic core module, wherein the magnetic core module comprises two side panels (1), both ends of the two side panels (1) are provided with a magnetic core center column, both ends of the top of the side panel (1) are provided with grooves, a hardware terminal is bonded and fixed to the inner bottom surface of the groove, a coil is rolled and fixed on the outer side of the magnetic core center column, both ends of the coil are respectively located in the middle of the buckles on the hardware terminals at corresponding positions, and the outer side of the buckles on the hardware terminals are wrapped with a low-temperature tin-plated layer, a positioning hole is provided in the middle position of the top of the side panel (1), a cover plate is provided on the top of the two side panels (1), and two rectangular holes are provided on the cover plate, and two snap-on modules are provided at the bottom of the cover plate, and the snap-on module comprises a pin (1), the pin (1) is slidably plugged into the positioning hole at the corresponding position, and one end of the bottom of the pin (1) is in extrusion contact with the inner side wall of the positioning hole at the corresponding position.

[0006] Furthermore, a wedge-shaped notch is provided at one end of the bottom of the pin 1, and the height of the pin 1 is smaller than the height inside the positioning hole.

[0007] Furthermore, baffle plates 2 are fixedly connected at middle positions of both ends of the bottom of the cover plate, and the baffle plates 2 are located between the two side plates 1.

[0008] Preferably, a baffle plate 1 is fixedly connected to the middle position of the bottom of the cover plate, and the baffle plate 1 is located at the middle position between the two magnetic core center columns.

[0009] Preferably, the length of the cover plate is the same as the length of the side plate 1, and the length of the baffle plate 1 is the same as the length of the baffle plate 2.

[0010] Furthermore, the magnetic core module also includes two side panels 2, and the top of the side panels 2 is fixedly connected to the bottom of the cover plate, a convex groove is opened at the middle position of the top of the side panels 2, and the snap-in module also includes two pins 2, and the two pins 2 are opposite to each other, and the pins 2 are snap-connected with the convex grooves at the corresponding positions.

[0011] Furthermore, a wedge-shaped notch 2 is provided at one end of the bottom of the second pin, and the length of the second pin is the same as the length of the inside of the convex groove.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The hardware terminals are bonded and fixed to the bottom surface of the groove, and the two ends of the coil are placed in the middle of the buckles on the hardware terminals. After the placement is completed, the buckles on the four hardware terminals are tinned at low temperature. The low-temperature tinning avoids the short circuit of the copper wire in the coil and the dark cracks of the core module due to high temperature impact. The hardware terminals are installed in the groove and the coil ends are installed in the hardware terminals. The unevenness of the PAD surface of the snap-on common-mode inductor after tinning is avoided, and there is no need for subsequent grinding, which saves manpower and working hours. Glue is applied to the inside of the positioning hole and the cover plate is closed. The two pins one are respectively squeezed into contact with the corresponding positioning holes, thereby fixing the position of the pin one and the cover plate, and then the glue inside the positioning hole is baked and cured, thereby reducing the risk of the cover plate falling off. If the pin two is clamped with the convex groove, the snap-in common-mode inductor does not need to inject glue into the convex groove to fix the position of the pin two and the cover plate, reducing the working steps in the production of the snap-in common-mode inductor, improving the production efficiency of the snap-in common-mode inductor, and the installed and fixed cover plate will not fall off, thereby improving the anti-vibration effect of the snap-in common-mode inductor, and ensuring the reliability and stability of the snap-in common-mode inductor when in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 It is a schematic diagram of the positional relationship between the side plate 1 and the central column of the magnetic core in the utility model;

[0016] Figure 3It is a schematic diagram of the position relationship between the cover plate and the pin 1 in the utility model;

[0017] Figure 4 It is a schematic diagram of the positional relationship between the coil and the hardware terminal in the utility model;

[0018] Figure 5 It is a schematic diagram of the position relationship between the cover plate and the pin 2 in the utility model.

[0019] In the figure: 100, magnetic core module; 110, side panel 1; 111, positioning hole; 112, groove; 120, side panel 2; 121, convex groove; 130, magnetic core center column; 140, coil; 150, hardware terminal; 200, cover plate; 201, rectangular hole; 210, baffle 1; 220, baffle 2; 230, snap-on module; 231, pin 1; 2311, wedge-shaped notch 1; 232, pin 2; 2321, wedge-shaped notch 2. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] Embodiment 1

[0022] See also Figure 1-5 In the embodiment of the utility model, a snap-on common-mode inductor includes a magnetic core module 100, the magnetic core module 100 includes two side panels 110, both ends of the two side panels 110 are provided with a magnetic core center column 130, both ends of the top of the side panel 110 are provided with grooves 112, the bottom surface of the groove 112 is bonded and fixed with a hardware terminal 150, the outer side of the magnetic core center column 130 is rolled and fixed with a coil 140, the two ends of the coil 140 are respectively located in the middle of the buckle on the hardware terminal 150 at the corresponding position, and the hardware terminal 1 The outer side of the buckle on 50 is wrapped with a low-temperature tin plating layer, a positioning hole 111 is opened at the middle position of the top of the side plate 110, a cover plate 200 is set on the top of the two side plates 110, and two rectangular holes 201 are opened on the cover plate 200, and two card connection modules 230 are set at the bottom of the cover plate 200, and the card connection module 230 includes a pin 231, and the pin 231 is slidably plugged with the positioning hole 111 at the corresponding position, and one end of the bottom of the pin 231 is squeezed and contacted with the inner wall of the positioning hole 111 at the corresponding position.

[0023] Specifically, the hardware terminal 150 is conveniently bonded to the inside of the groove 112 by using glue, and the glue is baked to fix the hardware terminal 150, and the coil 140 is wound on the magnetic core center column 130, and then the two ends of the coil 140 are placed in the middle of the buckle on the hardware terminal 150. After the placement is completed, the buckles on the four hardware terminals 150 are low-temperature tinned, and the low-temperature tinning is used to avoid the short circuit of the copper wire in the coil 140 and the dark cracking of the magnetic core module 100 due to high temperature impact. The hardware terminal 150 is installed in the groove 112, and the end of the coil 140 is installed in the middle of the buckle on the hardware terminal 150. The interior of the hardware terminal 150 avoids the unevenness of the PAD surface of the snap-on common-mode inductor after tinning, and no grinding is required afterwards, which saves manpower and working hours. Glue is applied to the inside of the positioning hole 111, and the cover plate 200 is closed, so that the pin 231 is plugged into the inside of the positioning hole 111, and the two pins 231 are oriented in opposite directions, so that the two pins 231 are respectively squeezed and contacted with the corresponding positioning holes 111, thereby fixing the positions of the pin 231 and the cover plate 200, and then the glue inside the positioning hole 111 is baked and cured, thereby reducing the risk of the cover plate 200 falling off.

[0024] like Figure 1-5 As shown, in the present embodiment, a wedge-shaped notch 2311 is provided at one end of the bottom of the pin 231, and the height of the pin 231 is less than the height inside the positioning hole 111, baffles 220 are fixedly connected at the middle positions of both ends of the bottom of the cover plate 200, and the baffles 220 are located between the two side plates 110, and baffles 1 210 are fixedly connected at the middle position of the bottom of the cover plate 200, and the baffles 1 210 are located at the middle position between the two magnetic core middle columns 130, and the length of the baffles 1 210 is the same as the length of the baffles 2 20.

[0025] In a specific implementation, when pin 231 is inserted into the positioning hole 111, the wedge-shaped notch 2311 is first squeezed and contacted with the side wall of the positioning hole 111, so that the pin 231 will be deformed when inserted into the positioning hole 111. The deformed pin 231 will be squeezed and contacted with the side wall of the positioning hole 111 at the corresponding position. The deformed pin 231 improves the squeezing and fixing effect of the pin 231 when inserted into the positioning hole 111.

[0026] Embodiment 2

[0027] On the basis of the first embodiment, in order to improve the fixing effect of the cover plate 200 after installation in the first embodiment.

[0028] like Figure 1-5As shown, the magnetic core module 100 also includes two side panels 120, and the top of the side panel 120 is fixedly connected to the bottom of the cover plate 200, and a convex groove 121 is provided at the middle position of the top of the side panel 120, and the snap-in module 230 also includes two pins 232, and the two pins 232 are opposite to each other, and the pins 232 are snap-fitted with the convex groove 121 at the corresponding position, and a wedge-shaped notch 2321 is provided at one end of the bottom of the pin 232, and the length of the pin 232 is the same as the length inside the convex groove 121.

[0029] In specific implementation, by closing the cover plate 200, the four pins 232 are respectively plugged into the convex grooves 121 at the corresponding positions, and when the wedge-shaped notch 2321 contacts the convex groove 121, the wedge-shaped notch 2321 is used to deform the bottom of the pin 232, and when the bottom of the pin 232 moves to the bottom of the inner side of the convex groove 121, the pin 232 is restored, so that the bottom of the pin 232 is snapped with the bottom of the convex groove 121 at the corresponding position, and after the pin 232 is snapped with the convex groove 121, the position of the cover plate 200 is fixed, and it is not necessary to inject glue into the convex groove 121 to fix the position of the pin 232 and the cover plate 200, thereby reducing the working steps in the production of the snap-in common-mode inductor and improving the production efficiency of the snap-in common-mode inductor.

[0030] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0031] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A snap-on common-mode inductor, comprising a magnetic core module (100), characterized in that: The magnetic core module (100) comprises two side panels (110), a magnetic core center column (130) is arranged at both ends between the two side panels (110), grooves (112) are opened at both ends of the top of the side panel (110), a hardware terminal (150) is bonded and fixed to the inner bottom surface of the groove (112), a coil (140) is rolled up and fixed on the outer side of the magnetic core center column (130), the two ends of the coil (140) are respectively located in the middle of the buckle on the hardware terminal (150) at the corresponding position, and the outer side of the buckle on the hardware terminal (150) is wrapped with a low-temperature tinned A layer, a positioning hole (111) is provided at the middle position of the top of the side plate one (110), a cover plate (200) is provided on the top of the two side plates one (110), and two rectangular holes (201) are provided on the cover plate (200), and two card-connecting modules (230) are provided at the bottom of the cover plate (200), and the card-connecting module (230) includes a pin one (231), and the pin one (231) is slidably plugged with the positioning hole (111) at the corresponding position, and one end of the bottom of the pin one (231) is in compression contact with the inner wall of the positioning hole (111) at the corresponding position.

2. A snap-on common mode inductor according to claim 1, characterized in that: A wedge-shaped notch (2311) is provided at one end of the bottom of the pin one (231), and the height of the pin one (231) is smaller than the height inside the positioning hole (111).

3. The snap-on common mode inductor according to claim 1, characterized in that: Baffle plate 2 (220) is fixedly connected at the middle positions of both ends of the bottom of the cover plate (200), and baffle plate 2 (220) is located between the two side plates 1 (110).

4. The snap-on common mode inductor according to claim 3, characterized in that: A baffle plate 1 (210) is fixedly connected to the middle position of the bottom of the cover plate (200), and the baffle plate 1 (210) is located at the middle position between the two magnetic core middle columns (130).

5. The snap-on common mode inductor according to claim 4, characterized in that: The length of the cover plate (200) is the same as that of the side plate 1 (110), and the length of the baffle plate 1 (210) is the same as that of the baffle plate 2 (220).

6. The snap-on common mode inductor according to claim 1, characterized in that: The magnetic core module (100) further comprises two side panels (120), and the top of the side panels (120) is fixedly connected to the bottom of the cover plate (200), and a convex groove (121) is provided at the middle position of the top of the side panels (120), and the clamping module (230) further comprises two pins (232), and the two pins (232) are opposite to each other, and the pins (232) are clamped with the convex grooves (121) at corresponding positions.

7. The snap-on common mode inductor according to claim 6, characterized in that: A wedge-shaped notch 2 (2321) is provided at one end of the bottom of the second pin (232), and the length of the second pin (232) is the same as the length inside the convex groove (121).

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