Silicon wafer placing assembly and transfer equipment with same

Abstract

The utility model relates to a silicon wafer placement assembly and transfer equipment with the same, the silicon wafer placement assembly comprises a fixed frame body, at least two waist rod bodies and a bottom rod body, the fixed frame body comprises two mounting plate bodies which are arranged in parallel, and the mounting plate bodies are provided with a plurality of limiting structures and a plurality of mounting positions; adjusting structures are arranged at the two ends of the waist rod body; the two ends of the bottom rod body are detachably connected with the corresponding installation positions of the two installation plate bodies respectively. Through the arrangement of the waist rod body and the bottom rod body, the silicon wafers with different sizes can be adapted, so that the enclosed space can be adapted to the sizes of the silicon wafers, stable and reliable silicon wafer placement is formed, the adaptability is higher, and the use of the silicon wafer placement assembly can also be reduced. According to the invention, the problem that the factory operation cost and the maintenance cost are increased because the silicon wafer placement assembly in the prior art cannot adapt to silicon wafers with multiple sizes is effectively solved.

Description

Technical Field

[0001] The present application relates to the technical field of silicon wafer placement equipment, and in particular to a silicon wafer placement component and a transfer device having the same. Background Art

[0002] In the manufacturing process of silicon wafers, silicon wafers need to be transferred to the next process after completing some processes, and placement racks are often used for transfer. With the development of silicon wafer-related technologies, the size and thickness of silicon wafers can be processed to a larger range. This leads to the installation of more silicon wafers of different sizes on the production line according to different customer needs. Existing transfer carriers are usually set according to some fixed-size silicon wafers to ensure the stability of the transfer carriers. This means that silicon wafers of some sizes cannot use the transfer carriers. Direct placement will lead to the risk of jams, and in severe cases, the entire basket of debris will stop production. Selecting and purchasing new transfer carriers based on size will greatly increase factory operating and maintenance costs. Utility Model Content

[0003] The present application provides a silicon wafer placement component and a transfer device having the same, so as to solve the problem that the silicon wafer placement component in the prior art cannot adapt to silicon wafers of multiple sizes, resulting in increased factory operating costs and maintenance costs.

[0004] In the first aspect, the present application provides a silicon wafer placement assembly, comprising: a fixed frame, at least two waist rods and a bottom rod, the fixed frame comprising two mounting plates arranged parallel to each other, the mounting plates being provided with a plurality of limiting structures and a plurality of mounting positions; both ends of the waist rod are provided with adjustment structures, the adjustment structure and the limiting structure are slidably connected, the adjustment structure and the limiting structure have a clamping position, and the clamping position can be adjusted arbitrarily along the sliding direction of the adjustment structure; the two ends of the bottom rod are respectively detachably connected to the mounting positions corresponding to the two mounting plates.

[0005] According to some embodiments of the present application, sliding sections are provided at both ends of the waist rod body, and the mounting plate body is provided with a sliding cavity. The end of the sliding section close to the waist rod body is detachably connected to the adjustment structure, and the sliding section is slidably provided in the sliding cavity.

[0006] According to some embodiments of the present application, the sliding cavity is a linear cavity, and the sliding direction of the waist rod is a linear direction.

[0007] According to some embodiments of the present application, the limiting structure is a toothed plate, which is fixedly connected to a side of the mounting plate body away from the other mounting plate body, and the teeth of the toothed plate are arranged in sequence along the sliding direction of the waist rod body, and the adjustment structure is provided with an engaging portion that engages with the teeth of the toothed plate.

[0008] According to some embodiments of the present application, the meshing portion is a plurality of tooth-shaped structures sequentially arranged along the sliding direction of the waist rod body, and the tooth-shaped structures are adapted to the tooth portion.

[0009] According to some embodiments of the present application, the tooth spacing between the tooth-shaped structure and the tooth portion is between 0.4 mm and 0.8 mm.

[0010] According to some embodiments of the present application, the mounting plate is provided with a locking structure, and the adjustment structure is correspondingly provided with a locking portion, and the locking structure and the locking portion have multiple locking positions along the sliding direction of the adjustment structure.

[0011] According to some embodiments of the present application, the installation position is a plurality of interconnected snap-in holes, and the two ends of the bottom rod body can adjust the connection position between the bottom rod body and the installation position through channels between the plurality of snap-in holes.

[0012] According to some embodiments of the present application, a first buffer layer is provided on the outer side of the waist rod, and a second buffer layer is provided on the outer side of the bottom rod. The first buffer layer and the second buffer layer are one or more of foam and silicone sleeve.

[0013] In the second aspect, the present application provides a transfer device, which includes a device body, a displacement assembly and a silicon wafer placement assembly. The silicon wafer placement assembly is the above-mentioned silicon wafer placement assembly, which is detachably connected to the device body, and the device body is moved by the displacement assembly.

[0014] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:

[0015] The silicon wafer placement assembly and the transfer equipment with the same provided by the embodiment of the present application include: a fixed frame, at least two waist rods and a bottom rod, the fixed frame includes two mounting plates arranged in parallel with each other, and the mounting plates are provided with multiple limiting structures and multiple mounting positions; both ends of the waist rod are provided with adjustment structures, the adjustment structure and the limiting structure are slidably connected, the adjustment structure and the limiting structure have a clamping position, and the clamping position can be arbitrarily adjusted along the sliding direction of the adjustment structure; the two ends of the bottom rod are respectively detachably connected with the mounting positions corresponding to the two mounting plates. The arrangement of the waist rod and the bottom rod can adapt to silicon wafers of different sizes, so that the enclosed space can adapt to the size of the silicon wafer, forming a stable and reliable silicon wafer placement, with stronger adaptability, and can also reduce the use of silicon wafer placement assemblies. The present application effectively solves the problem that the silicon wafer placement assembly in the prior art cannot adapt to silicon wafers of multiple sizes, resulting in increased factory operating costs and maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings herein are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present utility model, and together with the description, are used to explain the principles of the present utility model.

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0018] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0019] Figure 1 A schematic diagram of the three-dimensional structure of a silicon wafer placement assembly provided in an embodiment of the present application is shown;

[0020] Figure 2 Shows Figure 1 A schematic diagram of the front view of the silicon wafer placement assembly;

[0021] Figure 3 Shows Figure 1 A schematic side view of the silicon wafer placement assembly;

[0022] Figure 4 Shows Figure 1 A schematic front view of a mounting plate of a silicon wafer placement assembly;

[0023] Figure 5 Shows Figure 1 A partial three-dimensional schematic diagram of the waist rod of the silicon wafer placement assembly;

[0024] Figure 6 Shows Figure 5 A partial side view schematic diagram of the waist rod.

[0025] The above drawings contain the following reference numerals:

[0026] 10. Fixed frame; 11. Frame rod; 12. Mounting plate; 121. Limiting structure; 122. Mounting position; 123. Sliding cavity; 124. Locking structure; 20. Waist rod; 21. Adjustment structure; 211. Engaging part; 212. Locking part; 22. Sliding section; 23. First buffer layer; 30. Bottom rod; 31. Second buffer layer. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0028] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention may repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0029] For ease of description, spatial relative terms may be used herein to describe the relative positional relationship or movement of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip or a change in posture or a change in motion state, then these directional indications also change accordingly, for example: an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used herein are interpreted accordingly.

[0030] like Figures 1 to 3As shown, in the first aspect, the embodiment of the present application provides a silicon wafer placement assembly, comprising: a fixed frame 10, at least two waist rods 20 and a bottom rod 30, the fixed frame 10 comprises two mounting plates 12 arranged in parallel with each other, and the mounting plates 12 are provided with a plurality of limiting structures 121 and a plurality of mounting positions 122; both ends of the waist rod 20 are provided with adjustment structures 21, the adjustment structure 21 is slidably connected with the limiting structure 121, and the adjustment structure 21 and the limiting structure 121 have a clamping position, and the clamping position can be adjusted arbitrarily along the sliding direction of the adjustment structure 21; the two ends of the bottom rod 30 are respectively detachably connected with the mounting positions 122 corresponding to the two mounting plates 12. Through the arrangement of the waist rod 20 and the bottom rod 30, silicon wafers of different sizes can be adapted, so that the enclosed space can adapt to the size of the silicon wafer, forming a stable and reliable silicon wafer placement, with stronger adaptability, and can also reduce the use of silicon wafer placement assemblies. The present application effectively solves the problem in the prior art that the silicon wafer placement assembly cannot adapt to silicon wafers of multiple sizes, resulting in increased factory operating costs and maintenance costs.

[0031] It should be noted that the two waist rods 20 and the one bottom rod 30 are vertically connected to the two mounting plates 12, that is, the axes of the two waist rods 20 and the one bottom rod 30 are parallel to each other, so that the space surrounded by the three is regular and suitable for stacked silicon wafers, and meets the placement conditions. The silicon wafers can pass through between the two waist rods 20, and the space between the two waist rods 20 and the one bottom rod 30 is not enough for the silicon wafers to pass through, that is, it can form a support for the silicon wafers. The two mounting plates 12 are arranged correspondingly and fixedly connected by the frame rod 11. The frame rod 11 includes a connecting rod arranged parallel to the mounting plate 12, which is conducive to increasing the structural strength to facilitate the transportation of more silicon wafers.

[0032] Furthermore, there may be multiple bottom rods 30 to expand and support the bottom area, which is beneficial to disperse the supporting points of the silicon wafer, avoid the silicon wafer from being broken due to excessive pressure, and the structural stability is relatively better.

[0033] like Figures 1 to 6As shown, in the technical solution of this embodiment, sliding sections 22 are provided at both ends of the waist rod body 20, and the mounting plate body 12 is provided with a sliding cavity 123. The end of the sliding section 22 close to the waist rod body 20 is detachably connected to the adjustment structure 21, and the sliding section 22 is slidably arranged in the sliding cavity 123. The setting of the sliding cavity 123 is used to cooperate with the sliding section 22 to adjust the position. After the adjustment is completed, the sliding section 22 contacts the bottom of the sliding cavity 123 to form a limit, which is used to share the weight of the waist rod body 20, and avoids concentrating its weight and the force of the silicon chip on the clamping position of the adjustment structure 21 and the limit structure 121. On the one hand, it can improve the bearing capacity of the waist rod body 20 and the fixed frame body 10, and on the other hand, the structure is compact, which is also conducive to improving the strength and service life of the parts.

[0034] like Figure 4 As shown, in the technical solution of this embodiment, the sliding cavity 123 is a linear cavity, and the sliding direction of the waist rod body 20 is a linear direction. The setting of the linear cavity is conducive to the processing and precision control of the sliding cavity 123, and at the same time, the position control accuracy between the waist rod bodies 20 is higher, and it is more compatible with the placement of silicon wafers. It should be noted that the width of the sliding cavity 123 is greater than the diameter of the sliding section 22, so that the sliding section 22 can be displaced in the height direction of the sliding cavity 123, thereby realizing the unlocking of the adjustment structure 21 and the limiting structure 121, and at the same time, it can ensure that the sliding of the sliding section 22 will not be affected by the processing accuracy, resulting in the situation that it cannot slide over.

[0035] like Figure 4 and Figure 5 As shown, in the technical solution of this embodiment, the limiting structure 121 is a toothed plate, which is fixedly connected to the side of the mounting plate body 12 away from the other mounting plate body 12, and the toothed portion of the toothed plate is sequentially arranged along the sliding direction of the waist rod body 20, and the adjustment structure 21 is provided with a meshing portion 211 that meshes with the toothed portion of the toothed plate. The setting of the toothed portion and the meshing portion 211 is used to form a clamping position, and such a setting can ensure a good fixing effect after the clamping, and will not shake after the clamping, and maintain a meshing state under the action of gravity, so that the silicon wafer can be stably framed, so as to facilitate the placement and transfer of the silicon wafer. Further, the meshing portion 211 can be a gear, and the clamping is formed by the meshing of the gear and the bar-shaped toothed portion, and the clamping is kept fixed under the action of gravity, and the clamping can be performed by rolling the waist rod body 20. Such a setting is better for assembly, and after forming a stable clamping, the waist rod body 20 can be further clamped or set to tighten the knob to make the waist rod body 20 and the mounting plate body 12 tightly combined.

[0036] like Figure 4 and Figure 5As shown, in the technical solution of this embodiment, the meshing portion 211 is a plurality of tooth-shaped structures sequentially arranged along the sliding direction of the waist rod 20, and the tooth-shaped structures are adapted to the toothed portion. Such an arrangement realizes the meshing and clamping of the racks, and the meshing position of such an arrangement belongs to a fixed clamping position, which can effectively control the position and length of the clamping, and a single tooth spacing can achieve the precise matching requirements of different positions. In this way, the structure is compact, the combination is higher, the matching is better, and the formed clamping will not have the risk of direct separation, and the practicality is stronger.

[0037] In the technical solution of this embodiment, the tooth spacing between the tooth structure and the tooth portion is between 0.4 mm and 0.8 mm. The tooth spacing setting within the above range is convenient for processing and also convenient for controlling the displacement distance. In a specific embodiment, the tooth spacing is specifically 0.5 mm, which can make the adjustment accuracy within 0.5 mm and can cope with most diameters or sizes of silicon wafers.

[0038] like Figures 1 to 4 As shown, in the technical solution of this embodiment, the mounting plate 12 is provided with a locking structure 124, and the adjustment structure 21 is correspondingly provided with a locking portion 212. The locking structure 124 and the locking portion 212 have multiple locking positions along the sliding direction of the adjustment structure 21. The setting of the locking structure 124 is used to lock the adjustment structure 21 after the adjustment is completed, so that the waist rod body 20 will not move, and the requirement of accurate adaptation to the silicon wafer will not be lost. The locking portion 212 can be a long hole, and the corresponding locking structure 124 is a threaded hole or a through hole. After the adjustment is completed, the screw is passed through the long hole and the locking structure 124 in sequence for fastening, so that the nut end of the screw and the locking structure 124 clamp the long hole, and the adjustment structure 21 and the limiting structure 121 have a clamping position to form the locking of the waist rod body 20. At this time, it prevents multiple silicon wafers from moving the waist rod body 20, and can effectively protect the silicon wafer from damage.

[0039] like Figures 1 to 4 As shown, in the technical solution of this embodiment, the installation position 122 is a plurality of interconnected clamping holes, and the two ends of the bottom rod body 30 can adjust the connection position between the bottom rod body 30 and the installation position 122 through the channels between the plurality of clamping holes. The setting of the plurality of clamping holes enables the bottom rod body 30 to have a plurality of positions that can be adjusted, which can adapt to the positions of different waist rod bodies 20 on the one hand, and can be adjusted according to the actual size and shape of the silicon wafer on the other hand, so as to meet the contact of the silicon wafer in both the vertical direction and the horizontal direction.

[0040] Furthermore, if Figures 1 to 4As shown, in the technical solution of this embodiment, there are two bottom rod bodies 30, and the ends of the bottom rod bodies 30 are fixed by two independent installation positions 122. The installation positions 122 include at least five clamping holes that can accommodate the bottom rod bodies 30. The side of the clamping hole close to the bottom is an arc-shaped surface, so that the bottom rod body 30 will not move left and right after entering the clamping hole. The top of the clamping hole is equivalent to an opening and is interconnected, so that the bottom rod body 30 can switch between multiple clamping holes.

[0041] like Figure 1 and Figure 5 As shown, in the technical solution of this embodiment, a first buffer layer 23 is arranged on the outer side of the waist rod body 20, and a second buffer layer 31 is arranged on the outer side of the bottom rod body 30. The first buffer layer 23 and the second buffer layer 31 are both one or more of foam and silicone sleeve. The first buffer layer 23 and the second buffer layer 31 are arranged to make elastic contact with the silicon wafer. Such an arrangement is conducive to the storage of the silicon wafer. During the transfer process, part of the kinetic energy can be absorbed through elastic deformation to avoid the kinetic energy being transferred to the silicon wafer, thereby causing the silicon wafer to be hard contact and ruptured. Specifically, the second buffer layer 31 of the bottom rod body 30 is made of silicone material. The bottom rod body 30 needs to bear a certain weight of the silicon wafer, so a material with strong kinetic energy absorption is required. The physical properties of silicone are more suitable, and the deformation degree is relatively small, and it can also recover after deformation. The first buffer layer 23 of the waist rod body 20 is made of instant noodles. The deformation degree of the instant noodles is large, which is suitable for buffering and guiding during assembly, avoiding the situation of abutment damage to the moving silicon wafer. In addition, the surface of the foam is relatively smooth, and it is not easy to rub against the silicon wafer. The surface of the silicone has a certain viscosity, which makes the silicon wafer have greater friction when placed, so that the silicon wafer will not move and has better stability.

[0042] The silicon wafer placement assembly of this embodiment is mainly used in the process of silicon wafer debonding. During the process of silicon wafer cutting and insertion, an inappropriately sized debonding rack will cause silicon wafer jams or even fragments, seriously affecting the operation of debonding and subsequent process steps and reducing the overall yield. Continuously purchasing debonding racks of new sizes will greatly increase factory operating costs and affect benefits.

[0043] In order to solve the problem that the existing silicon wafer placement assembly cannot adapt to silicon wafers of different sizes, in the silicon wafer placement assembly of this embodiment, the frame rod 11 is connected to two parallel mounting plates 12 by welding, and the waist rod 20 and the bottom rod 30 are respectively fixedly connected between the two mounting plates 12. The waist rod 20 can slide and the bottom rod 30 can select a corresponding position, thereby achieving the requirements of adapting to silicon wafers of different sizes.

[0044] In the second aspect, the present application provides a transfer device, which includes a device body, a displacement assembly and a silicon wafer placement assembly. The silicon wafer placement assembly is the silicon wafer placement assembly of the above embodiment, and the silicon wafer placement assembly is detachably connected to the device body, and the device body is moved by the displacement assembly. The application of the silicon wafer placement assembly in the above embodiment can realize the safe transportation of silicon wafers, adapt to silicon wafers of more sizes, reduce the required number of silicon wafer placement assemblies of the transfer device, and is more practical and more conducive to the operation of the factory and cost savings.

[0045] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0046] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0047] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but should conform to the widest scope consistent with the principles and novel features applied herein.

Claims

1. A silicon wafer placement assembly, characterized in that: include: A fixed frame (10), the fixed frame (10) comprising two mounting plates (12) arranged parallel to each other, the mounting plates (12) being provided with a plurality of limiting structures (121) and a plurality of mounting positions (122); At least two waist rods (20), both ends of the waist rods (20) are provided with adjustment structures (21), the adjustment structures (21) are slidably connected to the limiting structure (121), the adjustment structures (21) and the limiting structure (121) have a clamping position, and the clamping position can be adjusted arbitrarily along the sliding direction of the adjustment structure (21); A bottom rod body (30), two ends of which are detachably connected to the mounting positions (122) corresponding to the two mounting plate bodies (12).

2. The silicon wafer placement assembly according to claim 1, characterized in that: The two ends of the waist rod body (20) are provided with sliding sections (22), the mounting plate body (12) is provided with a sliding cavity (123), the end of the sliding section (22) close to the waist rod body (20) is detachably connected to the adjustment structure (21), and the sliding section (22) is slidably arranged in the sliding cavity (123).

3. The silicon wafer placement assembly according to claim 2, characterized in that: The sliding cavity (123) is a linear cavity, and the sliding direction of the waist rod body (20) is a linear direction.

4. The silicon wafer placement assembly according to claim 3, characterized in that: The limiting structure (121) is a toothed plate, which is fixedly connected to a side of the mounting plate body (12) away from the other mounting plate body (12), and the teeth of the toothed plate are arranged in sequence along the sliding direction of the waist rod body (20), and the adjustment structure (21) is provided with an engaging portion (211) that engages with the teeth of the toothed plate.

5. The silicon wafer placement assembly according to claim 4, characterized in that: The meshing portion (211) is a plurality of tooth-shaped structures arranged in sequence along the sliding direction of the waist rod body (20), and the tooth-shaped structures are adapted to the tooth portion.

6. The silicon wafer placement assembly according to claim 5, characterized in that: The tooth spacing between the tooth-shaped structure and the tooth portion is between 0.4 mm and 0.8 mm.

7. The silicon wafer placement assembly according to any one of claims 1 to 6, characterized in that: The mounting plate body (12) is provided with a locking structure (124), and the adjustment structure (21) is correspondingly provided with a locking portion (212); along the sliding direction of the adjustment structure (21), the locking structure (124) and the locking portion (212) have a plurality of locking positions.

8. The silicon wafer placement assembly according to claim 7, characterized in that: The installation position (122) is a plurality of interconnected clamping holes, and the two ends of the bottom rod body (30) can adjust the connection position between the bottom rod body (30) and the installation position (122) through channels between the plurality of clamping holes.

9. The silicon wafer placement assembly according to claim 7, characterized in that: A first buffer layer (23) is provided on the outer side of the waist rod (20), and a second buffer layer (31) is provided on the outer side of the bottom rod (30). The first buffer layer (23) and the second buffer layer (31) are both one or more of foam and silicone sleeve.

10. A transfer device, characterized in that: The transfer equipment includes an equipment body, a displacement assembly and a silicon wafer placement assembly. The silicon wafer placement assembly is the silicon wafer placement assembly described in any one of claims 1 to 9. The silicon wafer placement assembly is detachably connected to the equipment body, and the equipment body is moved by the displacement assembly.

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