Positioning system of field effect transistor

Abstract

The utility model provides a positioning system of a field effect transistor. The positioning system of the field effect transistor comprises a carrier plate, a positioning tool, a cooling fin and the field effect transistor, wherein the positioning tool is fixedly connected with the carrier plate, and the positioning tool is provided with a plurality of holes; the plurality of radiating fins are respectively embedded into the plurality of open holes and are placed on the carrier plate; the plurality of field effect transistors are respectively embedded in the plurality of openings, and at least one field effect transistor is placed on the surface of one side of the cooling fin back to the carrier plate. According to the embodiment of the invention, the plurality of holes are designed on the positioning tool to serve as the MOS tube positioning grooves and the radiating fin avoiding grooves respectively, the MOS tubes are embedded into the MOS tube positioning grooves, and the radiating fins are embedded into the radiating fin avoiding grooves, so that the alignment difficulty of manual positioning is simplified, the problem that different MOS tubes and ceramic radiating fins are difficult to install and position and are inclined can be effectively solved, and the positioning tool is simple in structure and convenient to use. Design can be adjusted according to needs, modular standard production is easy to achieve, production efficiency is improved, and production labor cost is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of transistor installation, and in particular, to a positioning system for a field effect transistor. Background Art

[0002] At present, the Metal-Oxide-Semiconductor Field-Effect Transistor (MOS tube) used in chargers is generally required to be equipped with a metal heat sink.

[0003] The existing operation of installing MOS tube heat sinks requires manual installation of MOS tubes into metal heat sinks, and each piece needs to be operated independently. Since MOS tubes are relatively small compared to human fingers, operators need to hold the MOS tube tightly with one hand and the metal heat sink tightly with the other hand during operation. Then, after inserting the MOS tube into the metal heat sink, they need to hold the two tightly with their hands. This processing method not only wastes manpower and increases the fatigue of operators, but also reduces work efficiency. Since the operation needs to be performed by fingers, the wear of operators' fingers will also increase. In order to avoid this problem, finger cots need to be added during operation, which is also easy to cause the wear of finger cots and increase the use of finger cots. It is impossible to mass produce, and manual single alignment assembly is required; the assembly quality cannot be guaranteed, and the position angle of each MOS tube pin cannot be consistent; pure manual operation is inefficient and requires repeated alignment.

[0004] In summary, the existing MOS tube installation process has technical problems such as high labor cost, low work efficiency and assembly quality. Utility Model Content

[0005] In view of the shortcomings of the existing methods, the present application proposes a positioning system for field effect transistors to solve the technical problems of high labor costs, low work efficiency and low assembly quality in the existing technology.

[0006] The embodiment of the present application provides a positioning system for a field effect transistor, including a carrier, a positioning tool, a heat sink, and a field effect transistor:

[0007] The positioning fixture is fixedly connected to the carrier plate, and the positioning fixture has a plurality of openings;

[0008] The plurality of heat sinks are respectively embedded in the plurality of openings and placed on the carrier board;

[0009] The plurality of field effect transistors are respectively embedded in the plurality of openings, the orthographic projection of each field effect transistor on the plane where the positioning tool is located is located in one of the openings, at least one field effect transistor is placed on a surface of the heat sink facing away from the carrier and is in indirect contact with the carrier through the heat sink, and at least one field effect transistor is in direct contact with the carrier.

[0010] In some embodiments of the present application, the orthographic projection of each of the heat sinks on the plane where the positioning tool is located is located in one of the openings, and the orthographic projection of at least one of the heat sinks at least partially overlaps with the orthographic projection of the field effect transistor.

[0011] In some embodiments of the present application, the substrate contour of at least one of the field effect transistors is rectangular, the outer contour of at least one of the heat sinks is rectangular, and the inner contour of at least one of the openings is rectangular.

[0012] In some embodiments of the present application, the thickness of the positioning tool is greater than the thickness of the heat sink.

[0013] In some embodiments of the present application, the positioning tool is made of transparent material.

[0014] In some embodiments of the present application, a first bolt is further included, the positioning tool has a first through hole, the carrier plate has a first blind hole, the first bolt passes through the first through hole and is threadedly connected to the first blind hole, and the positioning tool is detachably connected to the carrier plate.

[0015] In some embodiments of the present application, a second bolt is further included, the field effect transistor has a second through hole, the carrier has a second blind hole, the second bolt passes through the second through hole and is threadedly connected to the second blind hole, and the field effect transistor is detachably connected to the carrier.

[0016] In some embodiments of the present application, a tooling pick-up and placement armrest is further included, and the tooling pick-up and placement armrest is arranged on a side of the positioning tool facing away from the carrier plate.

[0017] The beneficial technical effects brought about by the technical solution provided by the embodiment of the present application include: the embodiment of the present application simplifies the difficulty of manual positioning by designing multiple openings on the positioning tool as MOS tube positioning grooves and heat sink avoidance grooves, and by embedding the MOS tube into the MOS tube positioning groove and the heat sink into the heat sink avoidance groove, and can effectively solve the problems of difficult installation and positioning and skewness of different MOS tubes and ceramic heat sinks. The structure is simple, the design can be adjusted according to needs, and modular standard production can be easily realized, thereby improving production efficiency and reducing production labor costs.

[0018] Additional aspects and advantages of the present application will be partially given in the following description, which will become apparent from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0020] Figure 1 It is a schematic diagram of an exploded view of a positioning system for a field effect transistor in an embodiment of the present application;

[0021] Figure 2 A top view of a positioning system for a field effect transistor in an embodiment of the present application;

[0022] Figure 3 A side view of a positioning system for a field effect transistor in an embodiment of the present application;

[0023] Figure 4 This is a schematic diagram of the reverse side of the positioning tool in the embodiment of the present application;

[0024] Figure 5 It is a front schematic diagram of the positioning tool in the embodiment of the present application.

[0025] Reference numerals:

[0026] 1-carrier board, 2-positioning tool, 3-heat sink, 4-field effect transistor, 5-first bolt, 21-opening hole. DETAILED DESCRIPTION

[0027] The embodiments of the present application are described below in conjunction with the drawings in the present application. It should be understood that the implementation methods described below in conjunction with the drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions of the embodiments of the present application.

[0028] Those skilled in the art will appreciate that, unless expressly stated otherwise, the singular forms "a", "an", "above", and "the" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present application refers to the presence of the features, integers, steps, operations, elements, and / or components, but does not exclude the implementation of other features, information, data, steps, operations, elements, components, and / or combinations thereof supported by the technical field. It should be understood that when we refer to an element as being "connected" to another element, the element may be directly connected to the other element, or may refer to a connection relationship between the element and the other element established through an intermediate element. In addition, the "connection" used herein may include a wireless connection.

[0029] In order to make the purpose, technical solution and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings. It should be noted that the following implementation methods can refer to, learn from or combine with each other, and the same terms, similar features and similar implementation steps in different implementation methods will not be described repeatedly.

[0030] In view of the shortcomings of the existing methods, the present application proposes a positioning system for field effect transistors 4 to solve the technical problems of high labor costs, low work efficiency and low assembly quality in the existing technology.

[0031] The present application embodiment provides a positioning system for a field effect transistor 4, such as Figure 1~Figure 5 As shown, Figure 1 It is a schematic diagram of an exploded view of a positioning system of a field effect transistor 4 in an embodiment of the present application; Figure 2 It is a top view of the positioning system of the field effect transistor 4 in the embodiment of the present application; Figure 3 It is a side view of the positioning system of the field effect transistor 4 in the embodiment of the present application; Figure 4 This is a schematic diagram of the reverse side of the positioning tool 2 in the embodiment of the present application; Figure 5 It is a front schematic diagram of the positioning tool 2 in the embodiment of the present application.

[0032] A positioning system for a field effect transistor 4 includes a carrier board 1, a positioning tool 2, a heat sink 3 and a field effect transistor 4:

[0033] The positioning fixture 2 is fixedly connected to the carrier plate 1, and the positioning fixture 2 has a plurality of openings 21;

[0034] The plurality of heat sinks 3 are respectively embedded in the plurality of openings 21 and placed on the carrier board 1;

[0035] The plurality of field effect transistors 4 are respectively embedded in the plurality of openings 21, and the orthographic projection of each field effect transistor 4 on the plane where the positioning tool 2 is located is located in one of the openings 21. At least one field effect transistor 4 is placed on the surface of the heat sink 3 facing away from the carrier 1 and is in indirect contact with the carrier 1 through the heat sink 3, and at least one field effect transistor 4 is in direct contact with the carrier 1.

[0036] In the embodiment of the present application, a plurality of openings 21 are designed on the positioning tool 2 as the MOS tube 4 positioning groove and the heat sink 3 avoidance groove respectively. The MOS tube 4 is embedded in the MOS tube 4 positioning groove, the heat sink 3 is embedded in the heat sink 3 avoidance groove, and then the MOS tube 4 is stacked on the heat sink 3. This simplifies the difficulty of manual positioning, and can effectively solve the problems of difficult installation and positioning and skewness of different MOS tubes 4 and ceramic heat sinks 3. The structure is simple, the design can be adjusted according to needs, and modular standard production is easy to achieve, thereby improving production efficiency and reducing production labor costs.

[0037] In this embodiment, each field effect transistor 4 is located at a preset position on the carrier board 1 by the limiting function of the opening 21 of the positioning tool 2 .

[0038] In some embodiments of the present application, the orthographic projection of each heat sink 3 on the plane where the positioning fixture 2 is located is located in one of the openings 21 , and the orthographic projection of at least one heat sink 3 at least partially overlaps with the orthographic projection of the field effect transistor 4 .

[0039] In this embodiment, each heat sink 3 is located at a preset position on the carrier 1 through the limiting effect of the opening 21 of the positioning tool 2. Some field effect transistors 4 are in contact with the carrier 1 through the heat sink 3, and the heat on the field effect transistor 4 is transferred to the carrier 1 through the heat sink 3 to prevent the field effect transistor 4 from overheating.

[0040] In some embodiments of the present application, the substrate contour of at least one of the field effect transistors 4 is rectangular, the outer contour of at least one of the heat sinks 3 is rectangular, and the inner contour of at least one of the openings 21 is rectangular.

[0041] In this embodiment, the inner rectangular area of ​​the opening 21 is the largest, which is larger than both the substrate matrix area of ​​the field effect transistor 4 and the outer matrix area of ​​the heat sink 3 .

[0042] Optionally, the heat sink 3 is made of ceramic.

[0043] In some embodiments of the present application, the thickness of the positioning tool 2 is greater than the thickness of the heat sink 3 .

[0044] In this embodiment, the thickness of the positioning fixture 2 is relatively large, and after the heat sink 3 is embedded in the opening 21, the upper surface of the opening 21 is higher than the upper surface of the heat sink 3. The opening 21 still has a limiting effect on the MOS tube 4 stacked on the heat sink 3, preventing the lower surface of the MOS tube 4 from being higher than the upper surface of the opening 21, and the position of the MOS tube 4 is offset to cause misalignment.

[0045] In some embodiments of the present application, the positioning tool 2 is made of transparent material.

[0046] In this embodiment, the alignment of the heat sink 3 and the MOS tube 4 can be observed through the transparent positioning tool 2. Optionally, the positioning tool 2 is made of acrylic.

[0047] This system solves the problem of heat sink 3 and MOS tube 4 not being properly assembled, and can accurately position heat sink 3 and MOS tube 4 at the same time. This system improves the consistency of assembly process, avoids the situation that MOS tube 4 is skewed during manual operation, and the pins are not properly inserted into the printed circuit board (PCB board) in the later stage; this system significantly improves production efficiency, improves the new process of assembling MOS tube 4, and avoids repeated disassembly and assembly of manual assembly, which wastes production efficiency.

[0048] In some embodiments of the present application, a first bolt 5 is further included, the positioning tool 2 has a first through hole, the carrier plate 1 has a first blind hole, the first bolt 5 passes through the first through hole and is threadedly connected to the first blind hole, and the positioning tool 2 is detachably connected to the carrier plate 1.

[0049] In some embodiments of the present application, a second bolt is further included, the field effect transistor 4 has a second through hole, the carrier 1 has a second blind hole, the second bolt passes through the second through hole and is threadedly connected to the second blind hole, and the field effect transistor 4 is detachably connected to the carrier 1.

[0050] In this embodiment, after the positioning tool 2 is aligned with the carrier 1, in order to prevent the positioning tool 2 from being offset in the subsequent process, a plurality of first bolts 5 are used to fix the position between the positioning tool 2 and the carrier 1. After the heat sink 3 and the MOS tube 4 are all aligned, the first bolts 5 are removed and the positioning tool 2 is withdrawn.

[0051] After the field effect transistor 4 is aligned with the heat sink 3 or the carrier 1 through the opening 21 of the positioning tool 2, in order to avoid position displacement of the field effect transistor 4 after the positioning tool 2 is removed, a plurality of second bolts are used to fix the position between the field effect transistor 4 and the carrier 1. After the field effect transistor 4 is aligned with the carrier 1, the positioning tool 2 is removed.

[0052] In some embodiments of the present application, a tooling pick-up and placement armrest is further included, and the tooling pick-up and placement armrest is arranged on a side of the positioning tooling 2 facing away from the carrier plate 1 .

[0053] In this embodiment, a tooling pick-up and placement handrail is provided to facilitate installation of the positioning tooling 2 on the carrier plate 1 and removal of the positioning tooling 2 from the carrier plate 1 .

[0054] A method for positioning a field effect transistor 4, using a positioning system for a field effect transistor 4 in the above embodiment, comprises the following steps:

[0055] Place the heat sink 3 at the corresponding position of the carrier board 1, and cover the back of the positioning tool 2 on the carrier board 1. Through the transparent material, it can be clearly seen whether the heat sink 3 is embedded in the opening 21. At the same time, the heat sink 3 can also be accurately positioned. The first bolt 5 is tightened to fix the positioning tool 2 on the carrier board 1, and the corresponding MOS tube 4 is placed in the opening 21. The MOS tube 4 is fixed to the carrier board 1 with the second bolt, and finally the positioning tool 2 is removed.

[0056] The operator can use the positioning tool 2 to accurately position the heat sink 3 and the MOS tube 4 at the same time, which can greatly improve the consistency of production and prepare for the subsequent process of inserting the PCB board;

[0057] The operator can quickly take the tooling through the pick-up and placement handrail of the positioning tooling 2. At the same time, through the precise positioning of the tooling, it can be successful in one go, avoiding repeated manual disassembly and assembly, which can greatly improve production efficiency.

[0058] Compared with the prior art, the application of the embodiments of the present application can at least achieve the following beneficial effects: the embodiments of the present application design a plurality of openings 21 on the positioning tool 2 as the MOS tube 4 positioning groove and the heat sink 3 avoidance groove respectively, and embed the MOS tube 4 into the MOS tube 4 positioning groove, embed the heat sink 3 into the heat sink 3 avoidance groove, and then stack the MOS tube 4 on the heat sink 3, thereby simplifying the difficulty of manual positioning, and effectively solving the problems of difficult and skewed installation and positioning of different MOS tubes 4 and ceramic heat sinks 3, and the structure is simple, and the design can be adjusted according to needs, so that modular standard production can be easily realized, production efficiency can be improved, and production labor costs can be reduced.

[0059] In the description of the present application, the directions or positional relationships indicated by words such as "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the exemplary directions or positional relationships shown in the accompanying drawings. They are for the convenience of describing or simplifying the description of the embodiments of the present application, and do not indicate or imply that the referred device or component must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present application.

[0060] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0061] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0062] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0063] Those skilled in the art will appreciate that the various operations, methods, steps, measures, and schemes in the processes discussed in this application may be alternated, altered, combined, or deleted. Further, other steps, measures, and schemes in the various operations, methods, and processes discussed in this application may also be alternated, altered, rearranged, decomposed, combined, or deleted. Further, the steps, measures, and schemes in the prior art that are similar to those disclosed in this application may also be alternated, altered, rearranged, decomposed, combined, or deleted.

[0064] The above is only a partial implementation method of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the technical concept of the scheme of the present application, other similar implementation methods based on the technical ideas of the present application are also within the protection scope of the embodiments of the present application.

Claims

1. A positioning system for a field effect transistor, characterized in that: include: Carrier board; A positioning tool, the positioning tool is fixedly connected to the carrier plate, and the positioning tool has a plurality of openings; A heat sink, wherein a plurality of the heat sinks are respectively embedded in the plurality of openings and placed on the carrier; Field effect transistor, multiple field effect transistors are respectively embedded in multiple openings, the orthographic projection of each field effect transistor on the plane where the positioning tool is located is located in one of the openings, at least one field effect transistor is placed on the side surface of the heat sink facing away from the carrier and is indirectly in contact with the carrier through the heat sink, and at least one field effect transistor is in direct contact with the carrier.

2. The field effect transistor positioning system according to claim 1, characterized in that: The orthographic projection of each heat sink on the plane where the positioning tool is located is located in one of the openings, and the orthographic projection of at least one heat sink at least partially overlaps with the orthographic projection of the field effect transistor.

3. The field effect transistor positioning system according to claim 2, characterized in that: The substrate contour of at least one of the field effect transistors is rectangular, the outer contour of at least one of the heat sinks is rectangular, and the inner contour of at least one of the openings is rectangular.

4. The field effect transistor positioning system according to claim 1, characterized in that: The thickness of the positioning tool is greater than the thickness of the heat sink.

5. The field effect transistor positioning system according to claim 1, characterized in that: The positioning tooling is made of transparent material.

6. The field effect transistor positioning system according to claim 1, characterized in that: It also includes a first bolt, the positioning tool has a first through hole, the carrier plate has a first blind hole, the first bolt passes through the first through hole and is threadedly connected to the first blind hole, and the positioning tool is detachably connected to the carrier plate.

7. The field effect transistor positioning system according to claim 1, characterized in that: It also includes a second bolt, the field effect transistor has a second through hole, the carrier has a second blind hole, the second bolt passes through the second through hole and is threadedly connected to the second blind hole, and the field effect transistor is detachably connected to the carrier.

8. The field effect transistor positioning system according to claim 1, characterized in that: It also includes a tooling pick-up and placement armrest, which is arranged on a side of the positioning tooling that is away from the carrier plate.

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